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Ankur Jain

[Ankur Jain]

Associate Professor
Last Updated: September 29, 2020
about me

Research Interests

Research Interests
Energy Conversion Devices, Microscale Thermal Transport, BioMEMS, Microfabricated Sensors and Actuators, Thermal Management of Microelectronics, Three-Dimensional Integrated Circuits.

Teaching Interests

Teaching Interests
Thermodynamics, Heat Transfer, Applied Mathematics, Microscale Thermal Transport

Biography

Biography

Ankur Jain is an Associate Professor in the Mechanical and Aerospace Engineering Department at the University of Texas, Arlington. His research interests include heat transfer in Li-ion batteries, microscale thermal transport, bioheat transfer, microelectromechanical systems, etc. He received the UT Arlington College of Engineering Lockheed Martin Aeronautics Excellence in Teaching Award (2018), UT Arlington College of Engineering Outstanding Early Career Award (2017), NSF CAREER Award (2016) and the ASME EPP Division Young Engineer of the Year Award (2013). In 2017, he was invited by the US National Academy of Sciences to participate in the 5th Arab-American Frontiers of Science, Engineering, and Medicine Symposium in Rabat, Morocco. He received his Ph.D. (2007) and M.S. (2003) in Mechanical Engineering from Stanford University, and his B.Tech. (2001) in Mechanical Engineering from the Indian Institute of Technology (IIT), Delhi with top honors. His research has been supported by National Science Foundation, Department of Energy, Office of Naval Research, Indo-US Science & Technology Forum, etc.

Education

Education

    • 2007 PhD in Mechanical Engineering
      Stanford University, 2007
    • 2003 MS in Mechanical Engineering
      Stanford University, 2003
    • 2001 BS in Mechanical Engineering
      Delhi Institute Of Technology, 2001

Appointments

Appointments

    • Jan 2013 to Present Associate Editor
      IEEE Transactions on Components, Packaging and Manufacturing Technologies
    • 2013 to 2013 Visiting Researcher
      Aerospace Systems Directorate, Air Force Research Laboratory, Wright-Patterson Air Force Base
    • 2012 to 2012 Visiting Researcher
      Materials and Sensors Branch, Naval Research Laboratories
    • 2011 to 2011 Member
      Advanced Micro Devices (AMD)
    • Jan 2009 to 2011 Senior Research Engineer
      Molecular Imprints
    • Jan 2006 to 2009 Senior Staff Scientist
      Freescale Semiconductor
    • Jan 2001 to 2006 Graduate Research Assistant
      Microscale Heat Transfer Laboratory
    • 2005 to 2005 Summer Intern
      Components Research, Intel Corporation

Memberships

    • Sept 2017 to Present American Society of Mechanical Engineers
      Secretary, K16 Committee on Heat Transfer in Electronic Equipment, Heat Transfer Division
    • Sept 2011 to Present American Society of Mechanical Engineers
      Member

Awards and Honors

    • Feb  2018 Lockheed Martin Aeronautics Excellence in Teaching Award sponsored by College of Engineering, University of Texas at Arlington
    • Oct  2017 Invited Participant sponsored by 5th Arab-American Frontiers of Science, Engineering, and Medicine Symposium, organized by U.S. National Academy of Sciences
    • Mar  2017 Outstanding Early Career Award sponsored by College of Engineering, University of Texas at Arlington
    • Feb  2016 Faculty Early Career Development Program (CAREER) Award sponsored by National Science Foundation
    • Nov  2013 Outstanding Contributions as a Young Engineer to the Field of Electronic and Photonic Packaging Demonstrated through Papers, Patents, or Product Development sponsored by ASME Electronics & Photonics Packaging Division (EPPD)
    • Jun  2013 Summer Faculty Fellow sponsored by AFOSR
    • Jun  2012 Summer Faculty Fellow sponsored by ONR
    • Sep  2001 Stanford Graduate Fellow sponsored by Stanford University
    • May  2001 Silver Medal for highest GPA in graduate class of Mechanical Engineering sponsored by Indian Institute of Technology (IIT), Delhi
    • Jul  2000 Summer Research Fellow sponsored by Indian Institute of Science (IISc)

Support & Funding

Support & Funding

This data is entered manually by the author of the profile and may duplicate data in the Sponsored Projects section.
    • Mar 2016 to Feb 2022 CAREER: Safe, High-Performance Li-Ion Batteries Through a Fundamental Investigation of Thermal Transport in Electrochemical Materials and Interfaces sponsored by  -  $593499
      Ankur Jain (Funded)
    • Mar 2016 to Feb 2021 RET Supplement: CAREER: Safe, High-Performance Li-Ion Batteries Through a Fundamental Investigation of Thermal Transport in Electrochemical Materials and Interfaces sponsored by  -  $7000
      Ankur Jain (Funded)
    • Mar 2016 to Feb 2018 Indo-US Workshop on Multiscale, Multiphysics Analysis of Energy Conversion in Li-ion Batteries sponsored by  -  $22651
      Ankur Jain (Funded)
    • Feb 2016 to Jan 2017 Characterization of the Thermal Properties of Electrochemical Energy Storage Devices and their Impact on Cell Degradation under High Pulsed Loading sponsored by  -  $32224
      (Funded)
    • Jan 2020 to Dec 2021 Travel Support for 5th Thermal and Fluids Engineering Conference (TFEC) 2020 sponsored by  -  $40000
      Ankur Jain (Funded)
    • Oct 2018 to Apr 2019 Modeling of Thermal Runaway Propagation in Li-ion Battery Pack sponsored by  -  $50000
      Ankur Jain (Funded)
    • Jan 2015 to Dec 2018 Distributed Wireless Antenna Sensors for Boiler Condition Monitoring sponsored by  -  $399311
      (Funded)
    • Sept 2015 to Aug 2018 Collaborative Research: EAGER: Enhancing Pyroelectric Effects in Nanostructured Materials for High-Efficiency Energy Conversion sponsored by  -  $82500
      Ankur Jain (Funded)
    • Oct 2015 to Apr 2016 Rolled-Ribbon Thermal Model Development sponsored by  -  $21810
      Ankur Jain (Funded)
    • June 2014 to Nov 2015 Multiscale Thermal Characterization and Evaluation of Electrochemical Energy storage Materials, Cells and Modules at Monimal and High C Rates sponsored by  -  $288601
      (Funded)
    • Aug 2014 to Oct 2015 Evaluation and Characterization of the Thermal Properties of Electrochemical Energy Storage Devices through Analytical and Experimental Methods sponsored by  -  $99960
      (Funded)
    • Sept 2012 to Aug 2015 GOALI: Experimental and Theoretical Investigation of Thermal Transport in Three-Dimensional Integrated Circuits (3D ICs) sponsored by  -  $0
      (Funded)
    • June 2012 to Aug 2013 REP: Thermal Management of Micro-PhotoVoltaic (Miceo-PV) Devices for High-Efficiency Energy Generation sponsored by  -  $9850
      Ankur Jain (Funded)
    • June 2013 to Oct 2014 Thermal Characterization of Cylindrical Electrochemical Energy Storage through Analytical and Experimental Methods sponsored by  -  $152078
      (Funded)

Publications


      2015
      • Book Chapter
        Microelectronics Thermal Sensing: Future Trends
        Thermal Sensors
        [Jha, ChandraMohan, Choobineh, Leila, Jain, Ankur]. 97--106. "Springer New York".

      2020
      • Journal Article
        Analytical model based prediction of state-of-charge (SoC) of a Lithium-ion cell under time-varying charge/discharge currents
        [Parhizi, Mohammad, Pathak, Manan, Jain, Ankur]. Journal of Electrochemical Society. 167, 120544:1-10. "ECS". DOI: http://dx.doi.org/10.1149/1945-7111/abb34d
      • Journal Article
        Semi-analytical thermal modeling of transverse and longitudinal fins in a cylindrical phase change energy storage system
        [Mostafavi, Amirhossein, Parhizi, Mohammad, Jain, Ankur]. International Journal of Thermal Sciences. 153, 106352:1-12. "Elsevier". DOI: http://dx.doi.org/10.1016/j.ijthermalsci.2020.106352
      • Journal Article
        Analytical modeling of solid phase diffusion in single-layer and composite electrodes under time-dependent galvanostatic flux boundary condition
        [Parhizi, Mohammad, Jain, Ankur]. Journal of Electrochemical Society. 167, 060528:1-11. "ECS". DOI: http://dx.doi.org/10.1149/1945-7111/ab847c
      • Journal Article
        Early design stage evaluation of thermal performance of Battery Heat Acquisition System (BHAS) of a hybrid electric aircraft
        [MacDonald, Malcolm, Annapragada, Ravi, Sur, Aritra, Mahmoudi, Reza, Lents, Chuck, Jain, Ankur]. Journal of Electrochemical Energy Conversion and Storage. 17, 021107:1-9. "ASME". DOI: http://dx.doi.org/10.1115/1.4046159
      • Journal Article
        Post-Process Effects of Isothermal Annealing and Static Uniaxial Loading on the Ultimate Tensile Strength of FDM parts
        [Rane, Rhugdhrivya, Kulkarni, A, Prajapati, Hardikkumar, Taylor, Robert, Jain, Ankur, Chen, Victoria]. Materials. 13, 352:1-18. DOI: http://dx.doi.org/10.3390/ma13020352

      In Process
      • Journal Article
        Analytical modeling of solution phase diffusion in porous composite electrodes under time-dependent flux boundary conditions using Green’s function method
        [Parhizi, Mohammad, Jain, Ankur]. Ionics. DOI: http://dx.doi.org/10.1007/s11581-020-03777-1 Accepted.
      • Journal Article
        Molecular Dynamics Simulations of Separator-Cathode Interfacial Thermal Transport in a Li-ion Cell
        [Dhakane, Abhijeet, Varshney, Vikas, Liu, Juan, Heinz, Hendrik, Jain, Ankur]. Surfaces & Interfaces. "Elsevier". DOI: http://dx.doi.org/10.1016/j.surfin.2020.100674 Accepted.

      2019
      • Journal Article
        Theoretical modeling and optimization of fin-based enhancement of heat transfer into a phase change material
        [Mostafavi, Amirhossein, Parhizi, Mohammad, Jain, Ankur]. International Journal of Heat and Mass Transfer. 145, 118698:1-10. DOI: http://dx.doi.org/10.1016/j.ijheatmasstransfer.2019.118698
      • Journal Article
        Nozzle-integrated pre-deposition and post-deposition heating of previously deposited layers in polymer extrusion based additive manufacturing
        [Ravoori, Darshan, Prajapati, Hardikkumar, Tulluru, Viswajit, Adnan, Ashfaq, Jain, Ankur]. Additive Manufacturing. 28, 719-726. DOI: http://dx.doi.org/10.1016/j.addma.2019.06.006
      • Journal Article
        Improvement in build-direction thermal conductivity in extrusion-based polymer additive manufacturing through thermal annealing
        [Prajapati, Hardikkumar, Chalise, Divya, Ravoori, Darshan, Taylor, RobertM, Jain, Ankur]. Additive Manufacturing. 26, 242-249. DOI: http://dx.doi.org/10.1016/j.addma.2019.01.004
      • Journal Article
        Prediction of thermal runaway and thermal management requirements in cylindrical Li-ion cells in realistic scenarios
        [Shah, Krishna]. 43, 1827-1838. DOI: http://dx.doi.org/10.1002/er.4411
      • Journal Article
        Experimental and numerical investigation of heat transfer in Li‐ion battery pack of a hoverboard
        [Prasad, Abhinav, Parhizi, Mohammad, Jain, Ankur]. 43, 1802-1814.
      • Journal Article
        Experimental and theoretical investigation of heat transfer in platform bed during polymer extrusion based additive manufacturing
        [Ravoori, Darshan, Lowery, Christian, Prajapati, Hardikkumar, Jain, Ankur]. Polymer Testing. 73, 439-446. DOI: http://dx.doi.org/10.1016/j.polymertesting.2018.11.025
      • Journal Article
        Solution of the phase change Stefan problem with time-dependent heat flux using perturbation method
        [Parhizi, Mohammad, Jain, Ankur]. Journal of Heat Transfer. 141, 024503:1-5. DOI: http://dx.doi.org/10.1115/1.4041956

      2018
      • Journal Article
        Measurement and modeling of filament temperature distribution in the standoff gap between nozzle and bed in polymer-based additive manufacturing
        [Prajapati, Hardikkumar, Ravoori, Darshan, Jain, Ankur]. Additive Manufacturing. 24, 224-231. DOI: http://dx.doi.org/10.1016/j.addma.2018.09.030
      • Journal Article
        Measurements and modeling to determine the critical temperature for preventing thermal runaway in Li-ion cells
        [Esho, Iretomiwa, Shah, Krishna, Jain, Ankur]. Applied Thermal Engineering. 145, 287-294. DOI: http://dx.doi.org/10.1016/j.applthermaleng.2018.09.016
      • Journal Article
        Investigation of process-structure-property relationships in polymer extrusion based additive manufacturing through in situ high speed imaging and thermal conductivity measurements
        [Jain, Ankur, Ravoori, Darshan, Prajapati, Hardikkumar]. Additive Manufacturing. 23, 132-139. DOI: http://dx.doi.org/10.1016/j.addma.2018.07.011
      • Journal Article
        Measurement of radial thermal conductivity of a cylinder using a time-varying heat flux method
        [Shaik, Salwa, Ahmed, MuhammadB, Jain, Ankur]. International Journal of Thermal Sciences. 129, 301-308.
      • Journal Article
        Measurement of anisotropic thermal conductivity and inter-layer thermal contact resistance in polymer fused deposition modeling (FDM)
        [Prajapati, Hardikkumar, Ravoori, Darshan, Woods, Robert, Jain, Ankur]. Additive Manufacturing. 21, DOI: http://dx.doi.org/10.1016/j.addma.2018.02.019
      • Journal Article
        Conjugate heat transfer analysis of thermal management of a Li-ion battery pack
        [Chalise, Divya, Shah, Krishna, Prasher, Ravi, Jain, Ankur]. Journal of Electrochemical Energy Conversion and Storage. 15, 011008:1-8. "American Society of Mechanical Engineers".

      2017
      • Journal Article
        Enhancement of thermal transport in Gel Polymer Electrolytes with embedded BN/Al2O3 nano-and micro-particles
        [Vishwakarma, Vivek, Jain, Ankur]. Journal of Power Sources. 362, 219--227. "Elsevier". DOI: http://dx.doi.org/10.1016/j.jpowsour.2017.07.035
      • Journal Article
        An experimentally validated method for temperature prediction during cyclic operation of a Li-ion cell
        [Chalise, Divya, Shah, Krishna, Halama, Tobias, Komsiyska, Lidiya, Jain, Ankur]. International Journal of Heat and Mass Transfer. 112, 89-96. DOI: http://dx.doi.org/10.1016/j.ijheatmasstransfer.2017.04.115
      • Journal Article
        Non-invasive measurement of internal temperature of a cylindrical Li-ion cell during high-rate discharge
        [Anthony, Dean, Wong, Derek, Wetz, DavidAlan, Jain, Ankur]. International Journal of Heat and Mass Transfer. 111, 223--231. "Pergamon". DOI: http://dx.doi.org/10.1016/j.ijheatmasstransfer.2017.03.095
      • Journal Article
        Steady state and transient analytical modeling of non-uniform convective cooling of a microprocessor chip due to jet impingement
        [Luhar, S, Sarkar, D, Jain, Ankur]. International Journal of Heat and Mass Transfer. 110, 768--777. "Pergamon".
      • Journal Article
        Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits
        [Choobineh, Leila, Jones, Jared, Jain, Ankur]. Journal of Electronic Packaging. 139(2), 020908. "American Society of Mechanical Engineers".
      • Journal Article
        State of the Art and Future Research Needs for Multiscale Analysis of Li-Ion Cells
        [Shah, K, Balsara, N, Banerjee, S, Chintapalli, M, Cocco, AP, Chiu, WKS, Lahiri, I, Martha, S, Mistry, A, Mukherjee, PP, Ramadesigan, V, Sharma, C, Subramanian, VR, Mitra, S, Jain, Ankur]. Journal of Electrochemical Energy Conversion and Storage. 14(2), 020801. "American Society of Mechanical Engineers".
      • Journal Article
        Improved Thermal Performance of a Li-Ion Cell through Heat Pipe Insertion
        [Anthony, Dean, Wong, Derek, Wetz, DavidAlan, Jain, Ankur]. Journal of the Electrochemical Society. 164(6), A961--A967. "The Electrochemical Society". DOI: http://dx.doi.org/10.1149/2.0191706jes
      • Journal Article
        Measurement Sensitivity Analysis of the Transient Hot Source Technique applied to Flat and Cylindrical Samples
        [Ostanek, Jason, Shah, Krishna, Jain, Ankur]. Journal of Thermal Science and Engineering Applications. 9, 011002:1-12. DOI: http://dx.doi.org/10.1115/1.4034178

      2016
      • Journal Article
        Corrections for lateral conduction error in steady state heat transfer measurements
        [Sarkar, D, Goldstein, RJ, Srinivasan, V, Jain, Ankur]. International Journal of Thermal Sciences. 109, 413--423. DOI: http://dx.doi.org/10.1016/j.ijthermalsci.2016.05.031
      • Journal Article
        Non-invasive, transient determination of the core temperature of a heat-generating solid body
        [Anthony, Dean, Sarkar, Daipayan, Jain, Ankur]. Scientific Reports. 6, "Nature Publishing Group". DOI: http://dx.doi.org/10.1038/srep35886
      • Journal Article
        Experimental and numerical investigation of core cooling of Li-ion cells using heat pipes
        [Shah, Krishna, McKee, Cody, Chalise, Divya, Jain, Ankur]. Energy. 113, 852--860. DOI: http://dx.doi.org/10.1016/j.energy.2016.07.076
      • Journal Article
        Experimental and theoretical analysis of a method to predict thermal runaway in Li-ion cells
        [Shah, Krishna, Chalise, Divya, Jain, Ankur]. Journal of Power Sources. 330, 167-174. DOI: http://dx.doi.org/10.1016/j.jpowsour.2016.08.133
      • Journal Article
        Far-Field Interrogation of Microstrip Patch Antenna for Temperature Sensing Without Electronics
        [Yao, Jun, Tchafa, FranckMbanya, Jain, Ankur, Tjuatja, Saibun, Huang, Haiying]. IEEE Sensors Journal. 16(19), 7053--7060. "IEEE". DOI: http://dx.doi.org/10.1109/JSEN.2016.2597739
      • Journal Article
        Measurement of Multiscale Thermal Transport Phenomena in Li-Ion Cells: A Review
        [Shah, Krishna, Vishwakarma, Vivek, Jain, Ankur]. Journal of Electrochemical Energy Conversion and Storage. 13(3), 030801. "American Society of Mechanical Engineers". DOI: http://dx.doi.org/10.1115/1.4034413
      • Journal Article
        Spatial temperature gradients guide axonal outgrowth
        [Black, Bryan, Vishwakarma, Vivek, Dhakal, Kamal, Bhattarai, Samik, Pradhan, Prabhakar, Jain, Ankur, Kim, Young-Tae, Mohanty, SamarendraK]. Scientific Reports. 6, 29876. "Nature Publishing Group". DOI: http://dx.doi.org/10.1038/srep29876
      • Journal Article
        Thermal conduction in an orthotropic sphere with circumferentially varying convection heat transfer
        [Sarkar, Daipayan, Haji-Sheikh, Abdolhossein, Jain, Ankur]. International Journal of Heat and Mass Transfer. 96, 406--412. DOI: http://dx.doi.org/10.1016/j.ijheatmasstransfer.2016.01.027

      2015
      • Journal Article
        Heat transfer enhancement in a lithium-ion cell through improved material-level thermal transport
        [Vishwakarma, Vivek, Waghela, Chirag, Wei, Zi, Prasher, Ravi, Nagpure, ShrikantC, Li, Jianlin, Liu, Fuqiang, Daniel, Claus, Jain, Ankur]. Journal of Power Sources. 300, 123--131. "Elsevier". DOI: http://dx.doi.org/10.1016/j.jpowsour.2015.09.028
      • Journal Article
        Heat generation rate measurement in a Li-ion cell at large C-rates through temperature and heat flux measurements
        [Drake, StephenJ, Martin, Matt, Wetz, DavidA, Ostanek, JasonK, Miller, SP, Heinzel, JohnM, Jain, Ankur]. Journal of Power Sources. 285, 266--273. "Elsevier". DOI: http://dx.doi.org/10.1016/j.jpowsour.2015.03.008
      • Journal Article
        Measurement of out-of-plane thermal conductivity of substrates for flexible electronics and displays
        [Vishwakarma, Vivek, Waghela, Chirag, Jain, Ankur]. Microelectronic Engineering. 142, 36--39. "Elsevier". DOI: http://dx.doi.org/10.1016/j.mee.2015.06.008
      • Journal Article
        Modeling of steady-state and transient thermal performance of a Li-ion cell with an axial fluidic channel for cooling
        [Shah, Krishna, Jain, Ankur]. Int. J. Energy Research. 39(4), 573--584. DOI: http://dx.doi.org/10.1002/er.3274
      • Journal Article
        An explicit analytical model for rapid computation of temperature field in a three-dimensional integrated circuit (3D IC)
        [Choobineh, Leila, Jain, Ankur]. International Journal of Thermal Sciences. 87, 103--109. DOI: http://dx.doi.org/10.1016/j.ijthermalsci.2014.08.012

      2014
      • Journal Article
        An experimentally validated transient thermal model for cylindrical Li-ion cells
        [Shah, Krishna, Drake, StephenJ, Wetz, DA, Ostanek, JK, Miller, SP, Heinzel, JM, Jain, Ankur]. Journal of Power Sources. 271, 262--268. "Elsevier". DOI: http://dx.doi.org/10.1016/j.jpowsour.2014.07.118
      • Journal Article
        Analytical modeling of temperature distribution in an anisotropic cylinder with circumferentially-varying convective heat transfer
        [Sarkar, Daipayan, Shah, Krishna, Haji-Sheikh, Abdolhossein, Jain, Ankur]. International Journal of Heat and Mass Transfer. 79, 1027--1033. "Pergamon". DOI: http://dx.doi.org/10.1016/j.ijheatmasstransfer.2014.08.060
      • Journal Article
        Effect of Through-Silicon-Via Joule Heating on Device Performance for Low-Powered Mobile Applications
        [Mirza, Fahad, Naware, Gaurang, Jain, Ankur, Agonafer, Dereje]. Journal of Electronic Packaging. 136(4), 041008. "American Society of Mechanical Engineers". DOI: http://dx.doi.org/10.1115/1.4028076
      • Journal Article
        Measurement of in-plane thermal conductivity and heat capacity of separator in Li-ion cells using a transient DC heating method
        [Vishwakarma, Vivek, Jain, Ankur]. Journal of Power Sources. 272, 378--385. "Elsevier". DOI: http://dx.doi.org/10.1016/j.jpowsour.2014.08.066
      • Journal Article
        Microfluidic control of axonal guidance
        [Gu, Ling, Black, Bryan, Ordonez, Simon, Mondal, Argha, Jain, Ankur, Mohanty, SamarendraK]. Scientific Reports. 4, 6457. "Nature Publishing Group". DOI: http://dx.doi.org/10.1038/srep06457
      • Journal Article
        Modeling of steady-state convective cooling of cylindrical Li-ion cells
        [Shah, Krishna, Drake, Stephen, Wetz, DA, Ostanek, JK, Miller, SP, Heinzel, JM, Jain, Ankur]. Journal of Power Sources. 258, 374--381. "Elsevier". DOI: http://dx.doi.org/10.1016/j.jpowsour.2014.01.115
      • Journal Article
        Experimental investigation of electromigration failure in Cu--Sn--Cu micropads in 3D integrated circuits
        [Huang, Zhihong, Jones, RobertE, Jain, Ankur]. Microelectronic Engineering. 122, 46--51. "Elsevier". DOI: http://dx.doi.org/10.1016/j.mee.2014.03.003
      • Journal Article
        Measurement of anisotropic thermophysical properties of cylindrical Li-ion cells
        [Drake, StephenJ, Wetz, DA, Ostanek, JK, Miller, SP, Heinzel, JM, Jain, Ankur]. Journal of Power Sources. 252, 298--304. "Elsevier". DOI: http://dx.doi.org/10.1016/j.jpowsour.2013.11.107

      2013
      • Journal Article
        Thermal Modeling of Ultraviolet Nanoimprint Lithography
        [Patel, BhavikC, Jain, Ankur]. Journal of Manufacturing Science and Engineering. 135(6), 064501. "American Society of Mechanical Engineers". DOI: http://dx.doi.org/10.1115/1.4025564
      • Journal Article
        Nano/Microscale pyroelectric energy harvesting: Challenges and opportunities
        [Lingam, Devashish, Parikh, AnkitR., Huang, Jiacheng, Jain, Ankur, Minary-Jolandan, Majid]. Int. J. Smart Nano. Mater.. 4, 1--17. "Taylor \& Francis".
      • Journal Article
        Thermally assisted spatially directed pore formation in poly-dimethylsiloxane (PDMS)
        [Banait, A, Vishwakarma, V, Choobineh, L, Jain, Ankur]. Applied Physics Letters. 103(15), 153702. "AIP Publishing".
      • Journal Article
        Determination of temperature distribution in three-dimensional integrated circuits (3D ICs) with unequally-sized die
        [Choobineh, Leila, Jain, Ankur]. Applied Thermal Engineering. 56(1), 176-184. "Pergamon". DOI: http://dx.doi.org/10.1016/j.applthermaleng.2013.03.006

      2012
      • Journal Article
        Analytical solution for steady-state and transient temperature fields in vertically stacked 3-D integrated circuits
        [Choobineh, Leila, Jain, Ankur]. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2(12), 2031--2039. "IEEE".
      • Journal Article
        Microheater platform for selective detachment of DNA
        [Javed, Annas, Iqbal, SamirM, Jain, Ankur]. Applied Physics Letters. "American Institute of Physics".

      2011
      • Journal Article
        Thermal microdevices for biological and biomedical applications
        [Jain, Ankur, Goodson, KennethE]. Journal of Thermal Biology. 36(4), 209--218. "Pergamon".
      • Journal Article
        Thermal–electrical co-optimisation of floorplanning of three-dimensional integrated circuits under manufacturing and physical design constraints
        [Jain, Ankur, Alam, Syed, Pozder, Scott, Jones, Robert]. IET Computers and Digital Techniques.(5), 169-178. DOI: http://dx.doi.org/10.1049/iet-cdt.2009.0107

      2010
      • Journal Article
        Analytical and numerical modeling of the thermal performance of three-dimensional integrated circuits
        [Jain, Ankur, Jones, RobertE, Chatterjee, Ritwik, Pozder, Scott]. 33(1), 56--63. "IEEE".
      • Journal Article
        Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits
        [Savidis, Ioannis, Alam, SyedM, Jain, Ankur, Pozder, Scott, Jones, RobertE, Chatterjee, Ritwik]. 41(1), 9--16. "Elsevier".
      • Journal Article
        Interstratum connection design considerations for cost-effective 3-D system integration
        [Alam, SyedM, Jones, RobertE, Pozder, Scott, Chatterjee, Ritwik, Rauf, Shahid, Jain, Ankur]. IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 18(3), 450--460. "IEEE".

      2009
      • Journal Article
        Heat Conduction through a DNA- Gold Composite
        [Kodama, Takashi, Jain, Ankur, Goodson, KennethE]. Nano Letters. 9(5), 2005--2009. "ACS Publications".
      • Journal Article
        Theoretical and experimental investigation of spatial temperature gradient effects on cells using a microfabricated microheater platform
        [Jain, Ankur, Ness, Kevin, Goodson, KennethE]. Sensors and Actuators. B, Chemical. 143(1), 286--294. "Elsevier".

      2008
      • Journal Article
        Investigation of the natural convection boundary condition in microfabricated structures
        [Hu, XJack, Jain, Ankur, Goodson, KennethE]. International Journal of Thermal Sciences. 47(7), 820--824. "Elsevier".
      • Journal Article
        Measurement of the thermal conductivity and heat capacity of freestanding shape memory thin films using the 3$\omega$ method
        [Jain, Ankur, Goodson, KennethE]. Journal of Heat Transfer. 130(10), 102402. "American Society of Mechanical Engineers".
      • Journal Article
        Thermal conductivity measurement and sedimentation detection of aluminum oxide nanofluids by using the 3-omega method
        [Oh, Dong-Wook, Jain, Ankur, Eaton, JohnK, Goodson, KennethE, Lee, JoonSik]. International Journal of Heat and Fluid Flow. 29(5), 1456--1461. "Elsevier".

      2016
      • Conference Proceeding
        Thermal Modeling of Memory Access Operations in Microprocessors
        ASME 2016 International Mechanical Engineering Congress and Exposition
        [Raj, Ratnesh, Sarkar, Daipayan, Jain, Ankur]. V010T13A056--V010T13A056.
      • Conference Proceeding
        Experimental Measurement of Inter-Die Thermal Resistance in a Two Die 3D IC
        ASME 2016 International Mechanical Engineering Congress and Exposition
        [Choobineh, Leila, Jones, Jared, Jain, Ankur]. V010T13A001--V010T13A001.

      2015
      • Conference Proceeding
        Theoretical Analysis of Transient Bioheat Transfer in Multi-Layer Tissue
        ASME 2015 International Mechanical Engineering Congress and Exposition
        [Sarkar, Daipayan, Haji-Sheikh, Abdolhossein, Jain, Ankur]. V003T03A101--V003T03A101.

      2014
      • Conference Proceeding
        Investigation of Two-Phase, Vapor Chamber Based Thermal Management of Multiple Microserver Chips
        ASME 2014 International Mechanical Engineering Congress and Exposition
        [Parhizi, Mohammad, Merrikh, AliAkbar, Jain, Ankur]. V010T13A070--V010T13A070.
      • Conference Proceeding
        Measurement of thermal conductivity of a flexible substrate
        ASME 2014 International Mechanical Engineering Congress and Exposition
        [Vishwakarma, Vivek, Jain, Ankur]. V003T03A101--V003T03A101.
      • Conference Proceeding
        Experimental thermal characterization of various high power cylindrical Li-ion energy storage devices
        [Drake, SJ, Martin, M, Wetz, DA, Ostanek, JK, Miller, SP, Heinzel, JM, Jain, Ankur].

      2013
      • Conference Proceeding
        Analytical Modeling of Temperature Distribution in Interposer-Based Microelectronic Systems
        ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
        [Choobineh, Leila, Agonafer, Dereje, Jain, Ankur]. V001T03A004--V001T03A004.
      • Conference Proceeding
        Analytical Temperature Distribution in a Multi-Layer Tissue Structure in the Presence of a Tumor
        ASME 2013 International Mechanical Engineering Congress and Exposition
        [Sarkar, Daipayan, Jain, Ankur, Haji-Sheikh, Abdolhossein]. V08AT09A060--V08AT09A060.
      • Conference Proceeding
        Effect of TSV Joule heating on device performance
        ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
        [Mirza, Fahad, Naware, G, Raman, T, Agonafer, Dereje, Jain, Ankur].
      • Conference Proceeding
        Experimental Measurement of the Thermal Performance of a Two-Die 3D Integrated Circuit (3D IC)
        ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
        [Choobineh, Leila, Vo, Nick, Uehling, Trent, Jain, Ankur]. V002T08A034--V002T08A034.
      • Conference Proceeding
        Growth of Patterned Micropores in Poly-Dimethylsiloxane (PDMS) Using the Thermocapillary Effect
        ASME 2013 International Mechanical Engineering Congress and Exposition
        [Banait, Arya, Vishwakarma, Vivek, Choobineh, Leila, Jain, Ankur]. V07AT08A006--V07AT08A006.

      2012
      • Conference Proceeding
        Space Cooling Using the Concept of Nanofluids-Based Direct Absorption Solar Collectors
        ASME 2012 International Mechanical Engineering Congress and Exposition
        [Vishwakarma, Vivek, Singhal, Nitin, Khullar, Vikrant, Tyagi, Himanshu, Taylor, RobertA, Otanicar, ToddP, Jain, Ankur]. 2769--2777.
      • Conference Proceeding
        Thermal Modeling of Memory Access Operations in Microprocessors
        ASME 2012 International Mechanical Engineering Congress and Exposition
        [Vishwakarma, Vivek, Singhal, N., Khullar, V., Tyagi, H., Taylor, R., Otanicar, T., Jain, Ankur].

      2010
      • Conference Proceeding
        Thermal characteristics of multi-die, three-dimensional integrated circuits with unequally sized die
        Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
        [Jain, Ankur]. 1--6.

      2009
      • Conference Proceeding
        Die/wafer stacking with reciprocal design symmetry (RDS) for mask reuse in three-dimensional (3D) integration technology
        Quality of Electronic Design, 2009. ISQED 2009. Quality Electronic Design
        [Alam, SyedM, Jones, RobertE, Pozder, Scott, Jain, Ankur]. 569--575.
      • Conference Proceeding
        Reliability Considerations in 3D Stacked Strata Systems
        STRESS-INDUCED PHENOMENA IN METALLIZATION: Tenth International Workshop on Stress-Induced Phenomena in Metallization
        [Pozder, Scott, Jain, Ankur, Jones, Robert, Huang, Zhihong, Justison, Patrick, Chatterjee, Ritwik]. 1143(1), 213--223.
      • Conference Proceeding
        Thermal-Electrical co-optimization of block-level floorplanning in 3D integrated circuits
        ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
        [Jain, Ankur, Alam, Syed, Pozder, Scott, Jones, RobertE]. 95--101.

      2008
      • Conference Proceeding
        3D die-to-wafer Cu/Sn microconnects formed simultaneously with an adhesive dielectric bond using thermal compression bonding
        Interconnect Technology Conference, 2008. IITC 2008. International
        [Pozder, Scott, Jain, Ankur, Chatterjee, Ritwik, Huang, Zhihong, Jones, RobertE, Acosta, Eddie, Marlin, Bill, Hillmann, Gerhard, Sobczak, Martin, Kreindl, Gerald, others]. 46--48.
      • Conference Proceeding
        Electromigration of Cu-Sn-Cu micropads in 3D interconnect
        Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
        [Huang, Zhihong, Chatterjee, Ritwik, Justison, Patrick, Hernandez, Richard, Pozder, Scott, Jain, Ankur, Acosta, Eddie, Gajewski, DonaldA, Mathew, Varughese, Jones, RobertE]. 12--17.
      • Conference Proceeding
        Thermal modeling and design of 3D integrated circuits
        Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
        [Jain, Ankur, Jones, RobertE, Chatterjee, Ritwik, Pozder, Scott, Huang, Zhihong]. 1139--1145.

      2007
      • Conference Proceeding
        Nonmetallic conduction property of a DNA templated gold nanowire
        ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
        [Kodama, Takashi, Jain, Ankur, Goodson, KennethE]. 999--1005.
      • Conference Proceeding
        Progress of 3D integration technologies and 3D interconnects
        International Interconnect Technology Conference, IEEE 2007
        [Pozder, Scott, Chatterjee, Ritwik, Jain, Ankur, Huang, Zhihong, Jones, RobertE, Acosta, Eddie]. 213--215.

      2006
      • Conference Proceeding
        Theoretical investigation of sub-ambient on-chip microprocessor cooling
        Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM'06. The Tenth Intersociety Conference on
        [Jain, Ankur, Ramanathan, Shriram]. 765--770.
      • Conference Proceeding
        Thermal Conductivity Measurement of Aluminum Oxide Nanofluids Using the 3-Omega Method
        ASME 2006 International Mechanical Engineering Congress and Exposition
        [Oh, D, Jain, Ankur, Eaton, JK, Goodson, KE, Lee, JS]. 377(3), 343. "ASME; 1998".

      2005
      • Conference Proceeding
        A Theoretical Model for Temperature Gradient Effects on Cells
        ASME 2005 Summer Heat Transfer Conference
        [Jain, Ankur, Goodson, K.].
      • Conference Proceeding
        Investigation of temperature gradient effects on neurite outgrowth in nerve cells using a microfabricated heater structure
        Microtechnology in Medicine and Biology, 2005. 3rd IEEE/EMBS Special Topic Conference on
        [Jain, Ankur, Ness, KD, Fishman, HA, Goodson, KE]. 398--399.
      • Conference Proceeding
        Investigation of the Natural Convection Boundary Condition in Microfabricated Structures
        ASME 2005 Summer Heat Transfer Conference
        [Jain, Ankur, Goodson, K., Hu, X.].
      • Conference Proceeding
        Measurement of Thermophysical Properties of Thin Film Shape Memory Alloys Using the 3-Omega Method
        ASME 2005 International Mechanical Engineering Congress and Exposition
        [Jain, Ankur, Goodson, KennethE]. 537--541.

      2004
      • Conference Proceeding
        A Microheater Device for Study of Temperature Gradient Effects A Microheater Device for Study of Temperature Gradient Effects on Neurite Outgrowth in Retinal Ganglion Cells on Neurite Outgrowth in Retinal Ganglion Cells
        [Jain, Ankur, Ness, Kevin, Mehenti, Neville, Fishman, Harvey, Goodson, Kenneth].
      • Conference Proceeding
        Experimental investigation of the flow field of a ceiling fan
        Proceedings of the ASME Heat Transfer/Fluids Engineering Summer Conference (HT/FED’04)
        [Jain, Ankur, Upadhyay, RochanRaj, Chandra, Samarth, Saini, Manish, Kale, Sunil]. 93--99.

      2003
      • Conference Proceeding
        Design, fabrication and thermal characterization of a MEMS device for control of nerve cell growth
        ASME 2003 International Mechanical Engineering Congress and Exposition
        [Jain, Ankur, Ness, Kevin, McConnell, Angie, Jiang, Linan, Goodson, Kenneth]. 251--257.

      2007
      • Other
        Thermal phenomena in free standing thin films and biological microsystems
        [Jain, Ankur]. "Stanford University".

Presentations

    • November  2020
      Jain, Ankur, "Thermal Conduction in Li-ion Battery Materials", Materials Research Society, Virtual due to COVID-19. (November 28, 2020).
    • August  2020
      Jain, Ankur, "Experimental Investigation of Heat Transfer Processes in Polymer Additive Manufacturing", Air Force Research Laboratory, Virtual due to COVID-19. (August 28, 2020).
    • July  2020
      Jain, Ankur, "Career Paths and Guidance for Student and Early Career Engineers", ASME, Virtual due to COVID-19. (July 15, 2020).
    • March  2020
      Jain, Ankur, "Heat Transfer and Thermal Management in Li-ion Materials, Cells and Battery Packs", Southwest Research Institute, San Antonio, TX. (March 3, 2020).
    • October  2019
      Jain, Ankur, "Investigation of heat transfer in Li-ion battery pack of a hoverboard", Alexandria, VA. (October 25, 2019).
    • October  2019
      Jain, Ankur, "Theoretical and Numerical Methods for Prediction of Li-ion Cell Temperature Distribution During Thermal Runaway", Alexandria, VA. (October 23, 2019).
    • October  2019
      Jain, Ankur, "Thermo-electrochemical coupling and interactions in Li-ion cells", American Society of Mechanical Engineers, Anaheim, CA. (October 8, 2019).
    • May  2019
      Jain, Ankur, "Direct and Inverse Heat Transfer Problems in Electrochemical Energy Conversion and Storage in Li-ion Batteries", Purdue University, West Lafayette IN. (May 30, 2019).
    • May  2019
      Jain, Ankur, "Exact and Approximate Methods for Analytical Modeling of Thermal and Electrochemical Transport in Li-ion Cells", m, Dallas TX. (May 29, 2019).
    • November  2018
      Jain, Ankur, "Thermal Conduction in Li-ion Battery Materials", Institute for Materials Science and Engineering, Washington University at St. Louis. (November 26, 2018).
    • July  2018
      Jain, Ankur, "Heat Transfer in Electrochemical Energy Conversion and Storage Systems", Amritapuri, India. (July 30, 2018).
    • May  2018
      Jain, Ankur, "Analytical Methods for Understanding Multiscale Thermal Transport in Li-Ion Batteries Towards Improved Safety and Performance", Electrochemical Society, Seattle, WA. (May 16, 2018).
    • February  2018
      Jain, Ankur, "Thermal Transport in Li-ion Cells: Materials, Processes and Metrology", Mechanical Engineering Department, University of Houston, Houston, TX. (February 16, 2018).
    • November  2017
      Jain, Ankur, "Fundamental Study of Thermal Transport in a Li-ion Cell for Enhanced Renewable Energy Conversion", 5th Arab-American Frontiers of Science, Engineering, and Medicine Symposium, organized by U.S. National Academy of Sciences, Rabat, Morocco. (November 2, 2017).
    • August  2017
      Jain, Ankur, "Industry and Academic Careers for Graduate Students", Graduate Student Careers Workshop, ASME InterPACK, San Francisco. (August 29, 2017).
    • June  2017
      Jain, Ankur, "Leveraging Industry Experience for Success in an Academic Career", ASME Power & Energy Conference & Exhibition, Charlotte, NC. (June 26, 2017).
    • June  2017
      Jain, Ankur, "Measurement and Modeling of Thermal Transport Processes in Li-ion Cells for Improved Safety and Performance", ASME 15th International Conference on Fuel Cell Science, Engineering and Technology. (June 26, 2017).
    • June  2017
      Jain, Ankur, "The Role of Temperature Measurement and Modeling in Battery Diagnostics and Health Management", 8th IEEE International Conference on Prognostics and Health Management, Dallas, TX,. (June 19, 2017).
    • May  2017
      Jain, Ankur, "Analytical Methods for Understanding Multiscale Thermal Transport in Li-Ion Batteries", International Symposium on Advances in Computational Heat Transfer, Napoli, Italy. (May 28, 2017).
    • February  2017
      Jain, Ankur, "Safety of Li-ion Batteries – A Thermal Engineering Perspective", Energy Storage System Safety Forum, Santa Fe, NM. (February 22, 2017).
    • February  2017
      Jain, Ankur, "Experimental and Analytical Research on Heat Transfer in Li-ion Cells", Department of Mechanical & Aerospace Engineering, New Mexico State University, Las Cruces, NM. (February 21, 2017).
    • January  2017
      Jain, Ankur, "Thermal Transport in Li-ion Cells – Measurements and Modeling", Department of Mechanical Engineering, Indian Institute of Technology, Delhi (IITD), India. (January 11, 2017).
    • November  2016
      Jain, Ankur, "Thermal Transport in Li-ion Cells: Materials, Processes and Metrology", NSF Nanosystems Engineering Research Center, University of Texas, Austin, TX. (November 11, 2016).
    • June  2016
      Jain, Ankur, "Thermal Transport in Li-ion Cells: Materials, Processes and Metrology", Indo-US Workshop on Recent Advances in Multiscale, Multiphysics Analysis of Energy Conversion in Li-ion Batteries, Indian Institute of Technology Bombay, India. (June 19, 2016).
    • November  2015
      Jain, Ankur, "Measurement and Optimization of Thermal Transport in Li-Ion Cells for Improved Performance and Safety", 6th Annual Battery Safety Conference, Baltimore, MD. (November 19, 2015).
    • June  2015
      Jain, Ankur, "Thermal Engineering of Three-Dimensional Integrated Circuits (3D ICs)", AMD Research, Austin, TX. (June 29, 2015).
    • December  2014
      Jain, Ankur, "Thermal Phenomena in Biological Microsystems", Conclave on Nano-Biotechnology 2014, Institute of Nano Science and Technology, Chandigarh, India. (December 22, 2014).
    • December  2014
      Jain, Ankur, "Thermal Phenomena in Biological Microsystems", Indo-US Workshop on Nanoengineering in Medicine, New Delhi, India, Dec 17-19, 2014. (December 19, 2014).
    • November  2014
      Jain, Ankur, "Research Careers in Industry and Academia: Transitions from One to the Other", Invited Presentation, Session 13-20-1: “Preparing for Success - Careers in Industry, Academia and Government”, ASME International Mechanical Engineering Congress and Exposition (IMECE), Montreal, Canada, Nov 17, 2014. (November 17, 2014).
    • November  2014
      Jain, Ankur, "Thermal Transport Phenomena in Engineering and Biomedical Microdevices", Invited Talk, Nanotechnology and Integrated Microsystems Student Association (NIMSA), University of Michigan, Nov 6, 2014.. (November 6, 2014).
    • October  2014
      Jain, Ankur, "Thermal Microdevices for Energy and Biomedical Applications", Invited Talk, Arlington Technology Association (ATA), Arlington, TX, Oct 1, 2014.. (October 1, 2014).
    • September  2014
      Jain, Ankur, "Thermal Transport Phenomena in Li-ion Batteries", Invited Talk, National Transportation Research Center (NTRC), Oak Ridge National Laboratory, Oak Ridge, TN, Sep 25, 2014.. (September 25, 2014).
    • March  2014
      Jain, Ankur, "Thermal and Electrical Modeling of Three-Dimensional Integrated Circuits", Invited Short Course, co-taught with I. Savidis, IEEE SEMI-THERM 2014, San Jose, CA, March 9, 2014.. (March 9, 2014).
    • December  2013
      Jain, Ankur, "Thermal Phenomena in Biological Microdevices", Invited Talk, Indo-US Workshop on Micro/Nanoscale Thermal Transport, Indian Institute of Technology (IIT) Ropar, India, Dec 21- 22, 2013.. (December 22, 2013).
    • July  2013
      Jain, Ankur, "Experimental and Analytical Characterization of Thermal Transport in Li-ion Batteries", Invited Talk, Aerospace Vehicles Directorate, Air Force Research Labs (AFRL), Wright Patterson Air Force Base (WPAFB), OH, July 30, 2013.. (July 30, 2013).
    • February  2013
      Jain, Ankur, "Thermal Modeling and Design of Three-Dimensional Integrated Circuits: Challenges and Opportunities", Invited Talk, Information Science Institute (ISI), University of Southern California, Feb 6, 2013. (February 6, 2013).
    • September  2012
      Jain, Ankur, "Temperature Measurement in Semiconductor Devices", Invited Talk, Advanced Micro Devices (AMD), Austin, TX, Sep 14, 2012. (September 14, 2012).
    • February  2012
      Jain, Ankur, "Challenges in Packaging of Three-Dimensional Integrated Circuits", Invited Talk, Freescale Semiconductor, Austin, TX, Feb 17, 2012. (February 17, 2012).
    • September  2011
      Jain, Ankur, "Thermal Management of Advanced Microelectronics", Invited Talk, SVTC Technologies, San Jose, CA, Sep 6, 2011.. (September 6, 2011).
    • May  2011
      Jain, Ankur, "Microscale Heat Transfer & Fluid Mechanics: Applications in Energy and Bioengineering", Invited Talk, Mechanical and Aerospace Engineering Department, University of Texas, Arlington, May 16, 2011. (May 16, 2011).
    • June  2010
      Jain, Ankur, "Thermal Management of Three-Dimensional Integrated Circuits: Challenges and Opportunities", Invited Tutorial at IEEE ITherm-2010, Las Vegas, NV, June 2, 2010.. (June 2, 2010).
    • April  2010
      Jain, Ankur, "Microscale Heat Transfer & Fluid Mechanics: Applications in Energy and Bioengineering", Invited Talk, School of Mechanical Engineering, Nanyang Technological University, Singapore, April 19, 2010.. (April 19, 2010).
    • January  2010
      Jain, Ankur, "Microscale Heat Transfer & Fluid Mechanics", Invited Talk, Department of Mechanical Engineering, University of Canterbury, Christchurch, New Zealand, January 12, 2010. (January 12, 2010).
    • July  2009
      Jain, Ankur, "Thermal and Fluidic Microdevices: Applications in Energy and Bioengineering", Invited Talk, Department of Mechanical Engineering, Texas A&M University, College Station, TX, July 6, 2009.. (July 6, 2009).
    • March  2009
      Jain, Ankur, "Three-Dimensional Microelectronics Packaging", Invited Talk, Austin IEEE CPMT Workshop on 3D Packaging, Austin, TX, March 27, 2009. . (March 27, 2009).
    • February  2009
      Jain, Ankur, "Thermal Phenomena in Thin Films and Biological Microsystems", Invited Talk, Mechanical, Materials and Aerospace Department, Illinois Institute of Technology (IIT), Chicago, IL, February 24, 2009.. (February 24, 2009).
    • January  2009
      Jain, Ankur, "Thermal-Electrical-Mechanical Co-Design in 3D Microelectronics", Invited Talk, Micron Research Center, Utah State University, Logan, UT, Jan 30, 2009.. (January 30, 2009).
    • November  2008
      Jain, Ankur, "Thermal Challenges and Opportunities in 3D Integrated Circuits", Invited Talk, 5 th International Conference for Semiconductor Integration and Packaging, San Francisco, CA, Nov 17-19, 2008.. (November 19, 2008).
    • November  2008
      Jain, Ankur, "Needs and Opportunities in Thermal Modeling and CAD of Three-Dimensional (3D) Integrated Circuits", Invited Talk, Workshop on Integrated CAD Tools for Next Generation Thermal Management Methodologies and Devices: Status and Needs, Georgia Institute of Technology, Atlanta, GA, Nov 17, 2008.. (November 17, 2008).
    • September  2008
      Jain, Ankur, "Three-dimensional (3D) Technology: An Overview of Challenges and Opportunities", Invited Talk, 3D Design & Architecture Workshop, National Tsing Hua University, Hsin-Chu, Taiwan, Sep 9, 2008.. (September 9, 2008).

Students Supervised

    • Aug 2019
      Master's Thesis Committee Chair
      Abhijeet Dhakane, (Mech and Aero Engineering)
      Molecular Dynamics (MD) thermal simulations of molecular bridging across the cathode-separator interface in Li-ion cell
    • May 2019
      Master's Thesis Committee Chair
      Aditya Krishna Ganesh Ram, (Mech and Aero Engineering)
      Design and optimization of additively manufactured heat sink and heat spreader for microelectronics cooling
    • May 2019
      Master's Thesis Committee Chair
      Dhananjay Mishra, (Mech and Aero Engineering)
      Modeling of Thermal Runaway Propagation in Li-ion Batteries
    • Mar 2019
      Undergraduate Honors Thesis
      Christian Lowery, (Mech and Aero Engineering)
      Imaging and measurement of transient evolution of the cross-section of an extruded polymer filament in additive manufacturing
    • May 2018
      Master's Thesis Committee Chair
      Abhinav Prasad, (Mech and Aero Engineering)
      Experimental and numerical investigation of heat transfer in battery pack of a hoverboard
    • Dec 2017
      Undergraduate Honors Thesis
      Divya Chalise, (Mech and Aero Engineering)
      Conjugate heat transfer analysis of thermal management of a Li-ion battery pack
    • Dec 2017
      Undergraduate Honors Thesis
      Iretomiwa Esho, (Mech and Aero Engineering)
      Measurements and modeling to determine the critical temperature for preventing thermal runaway in Li-ion cells
    • Aug 2017
      Master's Thesis Committee Chair
      Ratnesh Raj, (Mech and Aero Engineering)
      Thermal modeling of 3D memory
    • Aug 2017
      Dissertation Committee Chair
      Krishna Shah, (Mech and Aero Engineering)
      Modeling and measurements of thermal transport in Li-ion based energy conversion and storage devices
    • Aug 2017
      Dissertation Committee Chair
      Vivek Vishwakarma, (Mech and Aero Engineering)
      Thermal measurement and optimization of materials and processes in a Li-ion cell
    • May 2017
      Master's Thesis Committee Chair
      Salwa Shaik, (Mech and Aero Engineering)
      An improved method for measurement of radial thermal conductivity of cylindrical bodies
    • May 2017
      Master's Thesis Committee Chair
      Swapnil Luhar, (Mech and Aero Engineering)
      Steady state and transient analytical modeling of non-uniform convective cooling of a microprocessor due to jet impingement
    • Dec 2016
      Master's Thesis Committee Chair
      Dean Anthony, (Mech and Aero Engineering)
      Non-Invasive Measurement of the Internal Temperature of Heat-Generating Bodies
    • Aug 2016
      Dissertation Committee Chair
      Daipayan Sarkar, (Mech and Aero Engineering)
      General Temperature Solutions in Orthotropic Systems subject to Variable Heat Transfer and Biological Systems during Hyperthermia Therapy
    • May 2015
      Master's Thesis Committee Chair
      Mohammad Parhizi, (Mech and Aero Engineering)
      Numerical Investigation of Steady State and Transient Thermal Performance of a Multi-Chip Vapor Chamber
    • Dec 2014
      Undergraduate Honors Thesis
      Arya Banait, (Mech and Aero Engineering)
      Experimental Analysis of Growth of Micro-pores in Soft Polymer Poly-dimethylsiloxane using Thermocapillary Effect
    • Dec 2014
      Dissertation Committee Chair
      Stephen Drake, (Mech and Aero Engineering)
      Thermal Conduction and Heat Generation Phenomena in Li-ion Cells
    • Aug 2014
      Dissertation Committee Chair
      Leila Choobineh, (Mech and Aero Engineering)
      Analytical and Experimental Investigation of Thermal Transport in Three-Dimensional Integrated Circuits (3D ICs)
    • Aug 2013
      Master's Thesis Committee Chair
      Annas Javed, (Electrical Engineering)
      Design, Microfabrication and Characterization of a Microheater Platform for Studying DNA-Surface Interactions
    • Aug 2013
      Master's Thesis Committee Chair
      Bhavik Patel, (Mech and Aero Engineering)
      Thermo-Mechanical Optimization of Nano-Imprint Lithography

Courses

      • ME 6399-041 DISSERTATION
        (Course Id: 103486)
        Fall - Regular Academic Session - 2020
      • AE 5101-001 GRADUATE SEMINAR
        (Course Id: 101917)
        Fall - Regular Academic Session - 2020 Download Syllabus
      • AE 5101-002 GRADUATE SEMINAR
        (Course Id: 101917)
        Fall - Regular Academic Session - 2020
      • ME 5101-001 GRADUATE SEMINAR
        (Course Id: 101917)
        Fall - Regular Academic Session - 2020
      • ME 5101-002 GRADUATE SEMINAR
        (Course Id: 101917)
        Fall - Regular Academic Session - 2020
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2020
      • ME 6697-041 RESEARCH
        (Course Id: 103489)
        Fall - Regular Academic Session - 2020
      • ME 5316-001 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2020 Download Syllabus
      • ME 5316-002 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2020
      • ME 5316-900 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2020
      • ME 7399-041 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Summer - Eleven Week - 2020
      • ME 5398-041 THESIS
        (Course Id: 103460)
        Summer - 2020
      • ME 6399-041 DISSERTATION
        (Course Id: 103486)
        Spring - Regular Academic Session - 2020
      • ME 6699-041 DISSERTATION
        (Course Id: 103490)
        Spring - Regular Academic Session - 2020
      • AE 5101-001 GRADUATE SEMINAR
        (Course Id: 101917)
        Spring - Regular Academic Session - 2020
      • AE 5101-002 GRADUATE SEMINAR
        (Course Id: 101917)
        Spring - Regular Academic Session - 2020
      • ME 5101-001 GRADUATE SEMINAR
        (Course Id: 101917)
        Spring - Regular Academic Session - 2020
      • ME 5101-002 GRADUATE SEMINAR
        (Course Id: 101917)
        Spring - Regular Academic Session - 2020 Download Syllabus
      • ME 6297-041 RESEARCH
        (Course Id: 103464)
        Spring - Regular Academic Session - 2020
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2020
      • ME 6697-041 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2020
      • MAE 3310-002 THERMODYNAMICS I
        (Course Id: 103631)
        Spring - Regular Academic Session - 2020 Download Syllabus
      • ME 5698-041 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2020
      • AE 5101-001 GRADUATE SEMINAR
        (Course Id: 101917)
        Fall - Regular Academic Session - 2019 Download Syllabus
      • AE 5101-002 GRADUATE SEMINAR
        (Course Id: 101917)
        Fall - Regular Academic Session - 2019
      • ME 5101-001 GRADUATE SEMINAR
        (Course Id: 101917)
        Fall - Regular Academic Session - 2019
      • ME 5101-002 GRADUATE SEMINAR
        (Course Id: 101917)
        Fall - Regular Academic Session - 2019
      • ME 6297-041 RESEARCH
        (Course Id: 103464)
        Fall - Regular Academic Session - 2019
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2019
      • ME 6697-041 RESEARCH
        (Course Id: 103489)
        Fall - Regular Academic Session - 2019
      • ME 5316-001 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2019 Download Syllabus
      • ME 5316-002 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2019
      • ME 5398-041 THESIS
        (Course Id: 103460)
        Fall - Regular Academic Session - 2019
      • ME 6196-041 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2019
      • ME 6197-041 RESEARCH
        (Course Id: 103463)
        Summer - 2019
      • ME 6697-041 RESEARCH
        (Course Id: 103489)
        Summer - 2019
      • ME 5698-041 THESIS
        (Course Id: 103461)
        Summer - 2019
      • ME 6196-041 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Spring - Regular Academic Session - 2019
      • ME 6297-041 RESEARCH
        (Course Id: 103464)
        Spring - Regular Academic Session - 2019
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2019
      • ME 6697-041 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2019
      • MAE 4391-041 SPEC PROB MECH & AERO ENGR
        (Course Id: 103689)
        Spring - Regular Academic Session - 2019
      • MAE 4301-006 SPEC TOPICS MECH & AERO ENGR
        (Topic: Power Plant Engineering | Course Id: 103659)
        Spring - Regular Academic Session - 2019
      • MAE 3310-002 THERMODYNAMICS I
        (Course Id: 103631)
        Spring - Regular Academic Session - 2019
      • ME 5398-041 THESIS
        (Course Id: 103460)
        Spring - Regular Academic Session - 2019
      • ME 5698-041 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2019
      • ME 6196-041 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Fall - Regular Academic Session - 2018
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2018
      • ME 6697-041 RESEARCH
        (Course Id: 103489)
        Fall - Regular Academic Session - 2018
      • ME 5316-001 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2018
      • ME 5316-002 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2018
      • ME 5398-041 THESIS
        (Course Id: 103460)
        Fall - Regular Academic Session - 2018
      • ME 6196-041 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2018
      • ME 6697-041 RESEARCH
        (Course Id: 103489)
        Summer - Eleven Week - 2018
      • ME 6297-041 RESEARCH
        (Course Id: 103464)
        Spring - Regular Academic Session - 2018
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2018
      • AE 6397-041 RESEARCH AEROSPACE ENGINEERING
        (Course Id: 101994)
        Spring - Regular Academic Session - 2018
      • ME 5390-006 SPEC TOPICS MECH ENGR
        (Topic: Thermal Phenomena Microsystems | Course Id: 103456)
        Spring - Regular Academic Session - 2018 Download Syllabus
      • MAE 3310-002 THERMODYNAMICS I
        (Course Id: 103631)
        Spring - Regular Academic Session - 2018 Download Syllabus
      • ME 5698-041 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2018
      • ME 6297-041 RESEARCH
        (Course Id: 103464)
        Fall - Regular Academic Session - 2017
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2017
      • AE 6397-041 RESEARCH AEROSPACE ENGINEERING
        (Course Id: 101994)
        Fall - Regular Academic Session - 2017
      • MAE 4391-041 SPEC PROB MECH & AERO ENGR
        (Course Id: 103689)
        Fall - Regular Academic Session - 2017
      • ME 5316-001 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2017 Download Syllabus
      • ME 5316-002 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2017 Download Syllabus
      • ME 6699-041 DISSERTATION
        (Course Id: 103490)
        Summer - Eleven Week - 2017
      • ME 7399-041 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Summer - Eleven Week - 2017
      • ME 5698-041 THESIS
        (Course Id: 103461)
        Summer - Eleven Week - 2017
      • ME 6699-041 DISSERTATION
        (Course Id: 103490)
        Spring - Regular Academic Session - 2017
      • ME 7399-041 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Spring - Regular Academic Session - 2017
      • ME 6196-041 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Spring - Regular Academic Session - 2017
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2017
      • ME 6697-041 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2017
      • AE 6397-041 RESEARCH AEROSPACE ENGINEERING
        (Course Id: 101994)
        Spring - Regular Academic Session - 2017
      • ME 5390-007 SPEC TOPICS MECH ENGR
        (Topic: Thermal Phenom in Microsystems | Course Id: 103456)
        Spring - Regular Academic Session - 2017 Download Syllabus
      • MAE 3310-002 THERMODYNAMICS I
        (Course Id: 103631)
        Spring - Regular Academic Session - 2017 Download Syllabus
      • ME 5398-041 THESIS
        (Course Id: 103460)
        Spring - Regular Academic Session - 2017
      • ME 5698-041 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2017
      • ME 6699-041 DISSERTATION
        (Course Id: 103490)
        Fall - Regular Academic Session - 2016
      • ME 6196-041 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Fall - Regular Academic Session - 2016
      • ME 5316-001 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2016 Download Syllabus
      • ME 5316-002 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2016 Download Syllabus
      • ME 5698-041 THESIS
        (Course Id: 103461)
        Fall - Regular Academic Session - 2016
      • ME 7399-041 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Summer - Eleven Week - 2016
      • ME 6196-041 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2016
      • MAE 4391-041 SPEC PROB MECH & AERO ENGR
        (Course Id: 103689)
        Summer - Eleven Week - 2016
      • ME 6399-041 DISSERTATION
        (Course Id: 103486)
        Spring - Regular Academic Session - 2016
      • ME 6297-041 RESEARCH
        (Course Id: 103464)
        Spring - Regular Academic Session - 2016
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2016
      • ME 6697-041 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2016
      • MAE 4301-007 SPEC TOPICS MECH & AERO ENGR
        (Topic: Power Plant Engineering | Course Id: 103659)
        Spring - Regular Academic Session - 2016 Download Syllabus
      • ME 5390-007 SPEC TOPICS MECH ENGR
        (Topic: Power Plant Engineering | Course Id: 103456)
        Spring - Regular Academic Session - 2016 Download Syllabus
      • MAE 3310-002 THERMODYNAMICS I
        (Course Id: 103631)
        Spring - Regular Academic Session - 2016 Download Syllabus
      • ME 6299-041 DISSERTATION
        (Course Id: 111984)
        Fall - Regular Academic Session - 2015
      • ME 6399-041 DISSERTATION
        (Course Id: 103486)
        Fall - Regular Academic Session - 2015
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2015
      • ME 5316-001 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2015 Download Syllabus
      • ME 5316-002 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2015 Download Syllabus
      • ME 6196-041 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2015
      • MAE 4391-041 SPEC PROB MECH & AERO ENGR
        (Course Id: 103689)
        Summer - Eleven Week - 2015
      • ME 6297-041 RESEARCH
        (Course Id: 103464)
        Spring - Regular Academic Session - 2015
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2015
      • ME 5390-006 SPEC TOPICS MECH ENGR
        (Topic: ThermalPhenomena Microsystems | Course Id: 103456)
        Spring - Regular Academic Session - 2015 Download Syllabus
      • MAE 3310-002 THERMODYNAMICS I
        (Course Id: 103631)
        Spring - Regular Academic Session - 2015 Download Syllabus
      • ME 5698-041 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2015
      • ME 6699-041 DISSERTATION
        (Course Id: 103490)
        Fall - Regular Academic Session - 2014
      • ME 6297-041 RESEARCH
        (Course Id: 103464)
        Fall - Regular Academic Session - 2014
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2014
      • ME 5316-001 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2014 Download Syllabus
      • ME 5316-002 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2014 Download Syllabus
      • ME 5398-041 THESIS
        (Course Id: 103460)
        Fall - Regular Academic Session - 2014
      • ME 7399-041 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Summer - Eleven Week - 2014
      • ME 6697-041 RESEARCH
        (Course Id: 103489)
        Summer - Eleven Week - 2014
      • MAE 4391-041 SPEC PROB MECH & AERO ENGR
        (Course Id: 103689)
        Summer - Eleven Week - 2014
      • ME 5391-041 ADV STUDIES MECH ENGR
        (Course Id: 103457)
        Spring - Regular Academic Session - 2014
      • ME 6699-041 DISSERTATION
        (Course Id: 103490)
        Spring - Regular Academic Session - 2014
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2014
      • ME 6697-041 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2014
      • ME 6997-041 RESEARCH
        (Course Id: 103493)
        Spring - Regular Academic Session - 2014
      • MAE 3310-002 THERMODYNAMICS I
        (Course Id: 103631)
        Spring - Regular Academic Session - 2014 Download Syllabus
      • ME 6299-041 DISSERTATION
        (Course Id: 111984)
        Fall - Regular Academic Session - 2013
      • ME 6399-041 DISSERTATION
        (Course Id: 103486)
        Fall - Regular Academic Session - 2013
      • AE 5101-001 GRADUATE SEMINAR
        (Course Id: 101917)
        Fall - Regular Academic Session - 2013
      • AE 5101-002 GRADUATE SEMINAR
        (Course Id: 101917)
        Fall - Regular Academic Session - 2013
      • AE 5101-003 GRADUATE SEMINAR
        (Course Id: 101917)
        Fall - Regular Academic Session - 2013
      • ME 5101-001 GRADUATE SEMINAR
        (Course Id: 101917)
        Fall - Regular Academic Session - 2013
      • ME 5101-002 GRADUATE SEMINAR
        (Course Id: 101917)
        Fall - Regular Academic Session - 2013
      • ME 6297-041 RESEARCH
        (Course Id: 103464)
        Fall - Regular Academic Session - 2013
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2013
      • ME 6697-041 RESEARCH
        (Course Id: 103489)
        Fall - Regular Academic Session - 2013
      • MAE 4301-007 SPEC TOPICS MECH & AERO ENGR
        (Topic: Power Plant Engineering | Course Id: 103659)
        Fall - Regular Academic Session - 2013 Download Syllabus
      • ME 5316-001 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2013 Download Syllabus
      • ME 5316-002 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2013 Download Syllabus
      • ME 6697-041 RESEARCH
        (Course Id: 103489)
        Summer - Eleven Week - 2013
      • MAE 4391-041 SPEC PROB MECH & AERO ENGR
        (Course Id: 103689)
        Summer - Eleven Week - 2013
      • ME 5698-041 THESIS
        (Course Id: 103461)
        Summer - Eleven Week - 2013
      • ME 6297-041 RESEARCH
        (Course Id: 103464)
        Spring - Regular Academic Session - 2013
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2013
      • MAE 3310-001 THERMODYNAMICS I
        (Course Id: 103631)
        Spring - Regular Academic Session - 2013 Download Syllabus
      • ME 5698-041 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2013
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2012
      • ME 6697-041 RESEARCH
        (Course Id: 103489)
        Fall - Regular Academic Session - 2012
      • ME 5316-001 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2012 Download Syllabus
      • ME 5316-002 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2012 Download Syllabus
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2012
      • MAE 3310-001 THERMODYNAMICS I
        (Course Id: 103631)
        Spring - Regular Academic Session - 2012 Download Syllabus
      • EE 5698-032 THESIS
        (Course Id: 103044)
        Spring - Regular Academic Session - 2012
      • ME 5398-041 THESIS
        (Course Id: 103460)
        Spring - Regular Academic Session - 2012
      • ME 6197-041 RESEARCH
        (Course Id: 103463)
        Fall - Regular Academic Session - 2011

Service to the University

    • Sept 2018 to  Present University Senate Service
      Faculty Senate
    • Jan 2014 to  Present Committee Member
      Mechanical Engineering Ph.D. Qualifying Examination Committee
    • Sept 2011 to  Present Committee Member
      Thermal science and energy discipline committee
    • Jan 2011 to  Present Committee Member
      Mechanical Engineering Committee on Graduate Studies (MECOGS)
    • Sept 2019 to  Aug 2020 Committee Member
      Faculty Senate College of Engineering Budget Committee
    • Sept 2018 to  Aug 2019 Committee Member
      Faculty Senate Academic and Student Liaison Committee
    • Jan 2018 to  May 2018 Committee Member
      Mechanical and Aerospace Engineering Department
      Member, MAE Department Faculty Workload Guidelines Committee
    • Sept 2017 to  Dec 2017 Committee Member
      Freshmen Interest Group (FIG) Steering Committee
    • Jan 2017 to  May 2017 Committee Member
      Committee on Faculty Workload Guidelines
    • Jan 2014 to  2016 Faculty Mentor
      Freshmen Interest Group
    • Sept 2013 to  Dec 2013 Program Coordinator
      Graduate Seminar Series (ME/AE 5101)
    • Jan 2013 to  May 2013 Committee Member
      Strategic Planning Committee
    • Jan 2012 to  May 2012 Committee Member
      Committee for the Annual Review Evaluation Criteria

Service to the Profession

    • Sept 2019 to  Present
      Officer, Vice-Chair
      K16 Committee on Heat Transfer in Electronic Equipment
    • Sept 2018 to  Present
      Editor, Associate Editor
      ASME Journal of Electrochemical Energy Conversion and Storage
    • Jan 2013 to  Present
      Editor, Associate Editor
      IEEE Transactions on Components, Packaging and Manufacturing Technologies
    • Apr 2019 to  Apr 2020
      Conference Program Chair (New Orleans, LA, USA)
      ASTFE Thermal and Fluids Engineering Conference (TFEC) 2020
    • Sept 2018 to  Jan 2020
      Special Issue Guest Editor
      ASME Journal of Electrochemical Energy Conversion and Storage
    • Jan 2013 to  Nov 2019
      Reviewer, Grant Proposal
      National Science Foundation
    • Sept 2018 to  Oct 2019
      Conference Program Chair (Anaheim, CA, USA)
      ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (InterPACK), 2019
    • Sept 2018 to  Oct 2019
      Organizer, Professional Development Workshop (Anaheim, CA, USA)
      ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (InterPACK), 2019
    • Sept 2017 to  Aug 2019
      Officer, Secretary
      K16 Committee on Heat Transfer in Electronic Equipment
    • 2017 to  Aug 2019
      Editor, Guest Editor
      ASME Journal of Electronic Packaging
    • June 2018 to  May 2019
      Session Chair (Dallas, TX, USA)
      235th Electrochemical Society Meeting
      Session Chair for ‘Multiscale Modeling, Simulation and Design'
    • June 2018 to  May 2019
      Session Chair (Dallas, TX, USA)
      235th Electrochemical Society Meeting
      Session Chair for '‘Characterizing Cell Faults and Failure Modes'
    • June 2018 to  May 2019
      Symposium Co-Organizer (Dallas, TX, USA)
      235th Electrochemical Society Meeting
      Co-Organizer of Symposium on ‘Multiscale Modeling, Simulation and Design'
    • June 2018 to  May 2019
      Symposium Co-Organizer (Dallas, TX, USA)
      235th Electrochemical Society Meeting
      Co-Organizer of Symposium on ‘Battery Safety and Failure Modes’
    • Sept 2018 to  Oct 2018
      External Evaluator for Ph.D. Dissertation (Ropar, Punjab, India)
      Indian Institute of Technology Ropar
    • Sept 2017 to  Aug 2018
      Conference Track Chair
      ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (InterPACK), 2018
    • Aug 2018 to  Aug 2018
      Moderator, Invited Panel
      ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (InterPACK), 2018
      Moderator of Invited Panel on 'Challenges in Advanced Packaging for Harsh Environments'
    • June 2018 to  June 2018
      Reviewer, Grant Proposal
      American Chemical Society Petroleum Research Fund (ACSPRF)
    • May 2018 to  May 2018
      Best Paper Awards Committee
      IEEE ITherm 2018 Conference
    • Apr 2018 to  Apr 2018
      Reviewer, Grant Proposal
      Center for Transportation Equity, Decisions and Dollars (C-TEDD)
    • Mar 2018 to  Mar 2018
      Reviewer, Grant Proposal
      National Aeronautics and Space Administration (NASA)
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      Applied Energy
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      Applied Thermal Engineering
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      Bioelectrochemistry
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      Energy Conversion and Management
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      Frontiers in Heat and Mass Transfer
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      International Journal of Energy Research
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      International Journal of Heat and Mass Transfer
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      International Journal of Thermal Sciences
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      Inverse Methods in Science and Engineering
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      Journal of Applied Physics
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      Journal of Biomechanical Engineering
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      Journal of Electronics Packaging
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      Journal of Energy Storage
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      Journal of Heat Transfer
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      Materials Energy
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      Solar Energy
    • Sept 2016 to  Aug 2017
      Conference Track Chair
      ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (InterPACK), 2017
    • June 2016 to  June 2016
      Workshop Organizer
      Indo-US Workshop on Recent Advances in Multiscale
    • Jan 2016 to  Jan 2016
      Topic Organizer
      Symposium on Emerging Technologies ASME IMECE
    • Jan 2016 to  Jan 2016
      Session Chair
      Thermal Transport, IEEE ITherm
    • Jan 2015 to  Jan 2015
      Reviewer, Grant Proposal
      American Chemical Society Petroleum Research Fund (ACSPRF)
    • Jan 2015 to  Jan 2015
      Track Organizer
      Micro- and Nano-Systems Engineering and Packaging (EPPD), ASME IMECE
    • Jan 2015 to  Jan 2015
      Session Chair
      Plenary Session: Electronics & Photonics Packaging, ASME IMECE
    • Jan 2015 to  Jan 2015
      Topic Organizer
      Stacked Die and Multi-Chip-Module and Packaging
    • Jan 2015 to  Jan 2015
      Session Chair
      Thermal Management of Stacked Die and Packages ASME InterPACK
    • Jan 2015 to  Jan 2015
      Reviewer, Grant Proposal
      US Department of Energy Bonneville Power Administration
    • Jan 2015 to  Jan 2015
      Committee Member
      Working Group for Modeling, Simulation and Design Tools for the 2015 Roadmap for iNEMI (International Electronics Manufacturing Initiative)
    • Jan 2014 to  Jan 2014
      Session Chair
      '3D: Back-Side & Interlayer Two-Phase Cooling,’ IEEE ITherm
    • Jan 2014 to  Jan 2014
      Session Chair
      'Advanced Electrochemical Storage Concepts,’ ASME IMECE
    • Jan 2014 to  Jan 2014
      Session Chair
      'Preparing for Success - Careers in Industry, Academia and Government,’ ASME IMECE
    • Jan 2014 to  Jan 2014
      Program Organizer
      Heat and Mass Transfer in Biotechnology and Biodevices’, ASME IMECE
    • Jan 2014 to  Jan 2014
      Topic Organizer
      Manufacturing, Materials and Processes ASME IMECE
    • Jan 2014 to  Jan 2014
      Track Co-Chair
      Micro and Nano Systems Engineering and Packaging (EPPD)’, ASME IMECE
    • Dec 2013 to  Dec 2013
      Workshop Co-Organizer
      Indo-US Workshop on Recent Advances in Micro/Nanoscale Thermal Transport
    • Jan 2013 to  Jan 2013
      External Examiner
      Department of Mechanical and Aerospace Engineering, University of Pretoria, South Africa
    • Jan 2013 to  Jan 2013
      Session Chair
      Electric, Magnetic and Thermal Phenomena in Micro and Nano Scale Systems II,’ ASME IMECE
    • Jan 2013 to  Jan 2013
      Session Chair
      Micro/Nano-Scale Heat Transfer’, ASME InterPACK
    • Jan 2013 to  Jan 2013
      Committee Member
      Technical Program Committee, ASEE GSW Conference
    • Jan 2012 to  Jan 2012
      Session Chair
      '3D Chips – Stacked Die Cooling,’ IEEE ITherm
    • Jan 2012 to  Jan 2012
      Topic Organizer
      'Heat and Mass Transfer in Biotechnology,’ ASME IMECE
    • Jan 2012 to  Jan 2012
      Session Chair
      'Nanoscale Phenomena in Biological Systems,’ ASME IMECE
    • Jan 2012 to  Jan 2012
      Reviewer, Grant Proposal
      US Department of Energy ARPA-E
    • Jan 2011 to  Jan 2011
      Session Chair
      Micro- and Nano-Scale Heat Transfer,’ ASME InterPack
    • Jan 2011 to  Jan 2011
      Committee Member
      Technical Program Committee, Design, Automation & Test
    • Jan 2010 to  Jan 2010
      Session Chair
      Data Center Thermal Management,’ IEEE ITherm
    • Jan 2009 to  Jan 2009
      Session Chair
      'Advanced Packaging,’ ASME InterPack
    • Jan 2008 to  Jan 2008
      Session Chair
      'Thermal Modeling and Experimental Characterization (IV),’ IEEE ITherm
    • Jan 2008 to  Jan 2008
      Session Chair
      Microchannel Heat Sinks - Topics of recent interest: dielectric fluids, microscale characterization, novel materials,’ IEEE ITherm
    • Jan 2007 to  Jan 2007
      Session Chair
      'Micro- and Nano-Scale Heat Transfer,’ ASME IMECE