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Ankur Jain

  • Associate Professor, Mechanical and Aerospace Engineering

Education

    • 2007 PhD in Mechanical Engineering
      Stanford University, 2007
    • 2003 MS in Mechanical Engineering
      Stanford University, 2003
    • 2001 BS in Mechanical Engineering
      Delhi Institute Of Technology, 2001

Appointments

    • Jan 2013 to Present Associate Editor
      IEEE Transactions on Components, Packaging and Manufacturing Technologies
    • 2013 to 2013 Visiting Researcher
      Aerospace Systems Directorate, Air Force Research Laboratory, Wright-Patterson Air Force Base
    • 2012 to 2012 Visiting Researcher
      Materials and Sensors Branch, Naval Research Laboratories
    • 2011 to 2011 Member
      Advanced Micro Devices (AMD)
    • Jan 2009 to 2011 Senior Research Engineer
      Molecular Imprints
    • Jan 2006 to 2009 Senior Staff Scientist
      Freescale Semiconductor
    • Jan 2001 to 2006 Graduate Research Assistant
      Microscale Heat Transfer Laboratory
    • 2005 to 2005 Summer Intern
      Components Research, Intel Corporation

Memberships

    • Sept 2017 to Present American Society of Mechanical Engineers
      Secretary, K16 Committee on Heat Transfer in Electronic Equipment, Heat Transfer Division
    • Sept 2011 to Present American Society of Mechanical Engineers
      Member

Awards and Honors

    • Feb  2018 Lockheed Martin Aeronautics Excellence in Teaching Award sponsored by College of Engineering, University of Texas at Arlington
    • Oct  2017 Invited Participant sponsored by 5th Arab-American Frontiers of Science, Engineering, and Medicine Symposium, organized by U.S. National Academy of Sciences
    • Mar  2017 Outstanding Early Career Award sponsored by College of Engineering, University of Texas at Arlington
    • Feb  2016 Faculty Early Career Development Program (CAREER) Award sponsored by National Science Foundation
    • Nov  2013 Outstanding Contributions as a Young Engineer to the Field of Electronic and Photonic Packaging Demonstrated through Papers, Patents, or Product Development sponsored by ASME Electronics & Photonics Packaging Division (EPPD)
    • Jun  2013 Summer Faculty Fellow sponsored by AFOSR
    • Jun  2012 Summer Faculty Fellow sponsored by ONR
    • Sep  2001 Stanford Graduate Fellow sponsored by Stanford University
    • May  2001 Silver Medal for highest GPA in graduate class of Mechanical Engineering sponsored by Indian Institute of Technology (IIT), Delhi
    • Jul  2000 Summer Research Fellow sponsored by Indian Institute of Science (IISc)

Publications

      Journal Article 2019 2019 2019
      • Nozzle-integrated pre-deposition and post-deposition heating of previously deposited layers in polymer extrusion based additive manufacturing
        [Ravoori, Darshan, Prajapati, Hardikkumar, Tulluru, Viswajit, Adnan, Ashfaq, Jain, Ankur]. 28, 719-726 [.] DOI http://dx.doi.org/10.1016/j.addma.2019.06.006
      2019 2019
      • Improvement in build-direction thermal conductivity in extrusion-based polymer additive manufacturing through thermal annealing
        [Prajapati, Hardikkumar, Chalise, Divya, Ravoori, Darshan, Taylor, RobertM, Jain, Ankur]. 26, 242-249 [.] DOI http://dx.doi.org/10.1016/j.addma.2019.01.004
      2019
      • Prediction of thermal runaway and thermal management requirements in cylindrical Li-ion cells in realistic scenarios
        [Shah, Krishna]. 43, 1827-1838 [.] DOI http://dx.doi.org/10.1002/er.4411
      2019
      • Experimental and numerical investigation of heat transfer in Li‐ion battery pack of a hoverboard
        [Prasad, Abhinav, Parhizi, Mohammad, Jain, Ankur]. 43, 1802-1814 [.]
      2019 2019
      • Experimental and theoretical investigation of heat transfer in platform bed during polymer extrusion based additive manufacturing
        [Ravoori, Darshan, Lowery, Christian, Prajapati, Hardikkumar, Jain, Ankur]. 73, 439-446 [.] DOI http://dx.doi.org/10.1016/j.polymertesting.2018.11.025
      2019
      • Solution of the phase change Stefan problem with time-dependent heat flux using perturbation method
        [Parhizi, Mohammad, Jain, Ankur]. 141, 024503:1-5 [.] DOI http://dx.doi.org/10.1115/1.4041956

      Journal Article 2018
      • Measurement and modeling of filament temperature distribution in the standoff gap between nozzle and bed in polymer-based additive manufacturing
        [Prajapati, Hardikkumar, Ravoori, Darshan, Jain, Ankur]. 24, 224-231 [.] DOI http://dx.doi.org/10.1016/j.addma.2018.09.030
      2018 2018
      • Investigation of process-structure-property relationships in polymer extrusion based additive manufacturing through in situ high speed imaging and thermal conductivity measurements
        [Jain, Ankur, Ravoori, Darshan, Prajapati, Hardikkumar]. 23, 132-139 [.] DOI http://dx.doi.org/10.1016/j.addma.2018.07.011
      2018
      • Measurement of radial thermal conductivity of a cylinder using a time-varying heat flux method
        [Shaik, Salwa, Ahmed, MuhammadB, Jain, Ankur]. 129, 301-308 [.]
      2018
      • Measurement of anisotropic thermal conductivity and inter-layer thermal contact resistance in polymer fused deposition modeling (FDM)
        [Prajapati, Hardikkumar, Ravoori, Darshan, Woods, Robert, Jain, Ankur]. 21, DOI http://dx.doi.org/10.1016/j.addma.2018.02.019
      2018
      • Conjugate heat transfer analysis of thermal management of a Li-ion battery pack
        [Chalise, Divya, Shah, Krishna, Prasher, Ravi, Jain, Ankur]. 15, 011008:1-8 [.] "American Society of Mechanical Engineers".

      Journal Article 2017 2017 2017 2017 2017
      • Steady state and transient analytical modeling of non-uniform convective cooling of a microprocessor chip due to jet impingement
        [Luhar, S, Sarkar, D, Jain, Ankur]. 110, 768--777 [.] "Pergamon".
      2017
      • Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits
        [Choobineh, Leila, Jones, Jared, Jain, Ankur]. 139(2), 020908 [.] "American Society of Mechanical Engineers".
      2017
      • State of the Art and Future Research Needs for Multiscale Analysis of Li-Ion Cells
        [Shah, K, Balsara, N, Banerjee, S, Chintapalli, M, Cocco, AP, Chiu, WKS, Lahiri, I, Martha, S, Mistry, A, Mukherjee, PP, Ramadesigan, V, Sharma, C, Subramanian, VR, Mitra, S, Jain, Ankur]. 14(2), 020801 [.] "American Society of Mechanical Engineers".
      2017
      • Improved Thermal Performance of a Li-Ion Cell through Heat Pipe Insertion
        [Anthony, Dean, Wong, Derek, Wetz, DavidAlan, Jain, Ankur]. 164(6), A961--A967 [.] "The Electrochemical Society". DOI http://dx.doi.org/10.1149/2.0191706jes
      2017
      • Measurement Sensitivity Analysis of the Transient Hot Source Technique applied to Flat and Cylindrical Samples
        [Ostanek, Jason, Shah, Krishna, Jain, Ankur]. 9, 011002:1-12 [.] DOI http://dx.doi.org/10.1115/1.4034178

      Conference Proceeding 2016
      • Thermal Modeling of Memory Access Operations in Microprocessors
        [Raj, Ratnesh, Sarkar, Daipayan, Jain, Ankur]. V010T13A056--V010T13A056 [.]
      2016
      • Experimental Measurement of Inter-Die Thermal Resistance in a Two Die 3D IC
        [Choobineh, Leila, Jones, Jared, Jain, Ankur]. V010T13A001--V010T13A001 [.]

      Journal Article 2016 2016
      • Non-invasive, transient determination of the core temperature of a heat-generating solid body
        [Anthony, Dean, Sarkar, Daipayan, Jain, Ankur]. 6, "Nature Publishing Group". DOI http://dx.doi.org/10.1038/srep35886
      2016 2016 2016 2016
      • Far-Field Interrogation of Microstrip Patch Antenna for Temperature Sensing Without Electronics
        [Yao, Jun, Tchafa, FranckMbanya, Jain, Ankur, Tjuatja, Saibun, Huang, Haiying]. 16(19), 7053--7060 [.] "IEEE". DOI http://dx.doi.org/10.1109/JSEN.2016.2597739
      2016
      • Measurement of Multiscale Thermal Transport Phenomena in Li-Ion Cells: A Review
        [Shah, Krishna, Vishwakarma, Vivek, Jain, Ankur]. 13(3), 030801 [.] "American Society of Mechanical Engineers". DOI http://dx.doi.org/10.1115/1.4034413
      2016
      • Spatial temperature gradients guide axonal outgrowth
        [Black, Bryan, Vishwakarma, Vivek, Dhakal, Kamal, Bhattarai, Samik, Pradhan, Prabhakar, Jain, Ankur, Kim, Young-Tae, Mohanty, SamarendraK]. 6, 29876 [.] "Nature Publishing Group". DOI http://dx.doi.org/10.1038/srep29876
      2016

      Journal Article 2015
      • Heat transfer enhancement in a lithium-ion cell through improved material-level thermal transport
        [Vishwakarma, Vivek, Waghela, Chirag, Wei, Zi, Prasher, Ravi, Nagpure, ShrikantC, Li, Jianlin, Liu, Fuqiang, Daniel, Claus, Jain, Ankur]. 300, 123--131 [.] "Elsevier". DOI http://dx.doi.org/10.1016/j.jpowsour.2015.09.028
      2015 2015 2015
      • Heat generation rate measurement in a Li-ion cell at large C-rates through temperature and heat flux measurements
        [Drake, StephenJ, Martin, Matt, Wetz, DavidA, Ostanek, JasonK, Miller, SP, Heinzel, JohnM, Jain, Ankur]. 285, 266--273 [.] "Elsevier". DOI http://dx.doi.org/10.1016/j.jpowsour.2015.03.008
      2015
      • Measurement of out-of-plane thermal conductivity of substrates for flexible electronics and displays
        [Vishwakarma, Vivek, Waghela, Chirag, Jain, Ankur]. 142, 36--39 [.] "Elsevier". DOI http://dx.doi.org/10.1016/j.mee.2015.06.008
      2015
      • Modeling of steady-state and transient thermal performance of a Li-ion cell with an axial fluidic channel for cooling
        [Shah, Krishna, Jain, Ankur]. 39(4), 573--584 [.] DOI http://dx.doi.org/10.1002/er.3274
      2015

      Book Chapter 2015
      • Microelectronics Thermal Sensing: Future Trends
        [Jha, ChandraMohan, Choobineh, Leila, Jain, Ankur]. 97--106 [.] "Springer New York".

      Conference Proceeding 2015
      • Theoretical Analysis of Transient Bioheat Transfer in Multi-Layer Tissue
        [Sarkar, Daipayan, Haji-Sheikh, Abdolhossein, Jain, Ankur]. V003T03A101--V003T03A101 [.]

      Journal Article 2014
      • An experimentally validated transient thermal model for cylindrical Li-ion cells
        [Shah, Krishna, Drake, StephenJ, Wetz, DA, Ostanek, JK, Miller, SP, Heinzel, JM, Jain, Ankur]. 271, 262--268 [.] "Elsevier". DOI http://dx.doi.org/10.1016/j.jpowsour.2014.07.118
      2014
      • Analytical modeling of temperature distribution in an anisotropic cylinder with circumferentially-varying convective heat transfer
        [Sarkar, Daipayan, Shah, Krishna, Haji-Sheikh, Abdolhossein, Jain, Ankur]. 79, 1027--1033 [.] "Pergamon". DOI http://dx.doi.org/10.1016/j.ijheatmasstransfer.2014.08.060
      2014
      • Effect of Through-Silicon-Via Joule Heating on Device Performance for Low-Powered Mobile Applications
        [Mirza, Fahad, Naware, Gaurang, Jain, Ankur, Agonafer, Dereje]. 136(4), 041008 [.] "American Society of Mechanical Engineers". DOI http://dx.doi.org/10.1115/1.4028076
      2014
      • Measurement of in-plane thermal conductivity and heat capacity of separator in Li-ion cells using a transient DC heating method
        [Vishwakarma, Vivek, Jain, Ankur]. 272, 378--385 [.] "Elsevier". DOI http://dx.doi.org/10.1016/j.jpowsour.2014.08.066
      2014
      • Microfluidic control of axonal guidance
        [Gu, Ling, Black, Bryan, Ordonez, Simon, Mondal, Argha, Jain, Ankur, Mohanty, SamarendraK]. 4, 6457 [.] "Nature Publishing Group". DOI http://dx.doi.org/10.1038/srep06457
      2014
      • Modeling of steady-state convective cooling of cylindrical Li-ion cells
        [Shah, Krishna, Drake, Stephen, Wetz, DA, Ostanek, JK, Miller, SP, Heinzel, JM, Jain, Ankur]. 258, 374--381 [.] "Elsevier". DOI http://dx.doi.org/10.1016/j.jpowsour.2014.01.115
      2014
      • Experimental investigation of electromigration failure in Cu--Sn--Cu micropads in 3D integrated circuits
        [Huang, Zhihong, Jones, RobertE, Jain, Ankur]. 122, 46--51 [.] "Elsevier". DOI http://dx.doi.org/10.1016/j.mee.2014.03.003
      2014
      • Measurement of anisotropic thermophysical properties of cylindrical Li-ion cells
        [Drake, StephenJ, Wetz, DA, Ostanek, JK, Miller, SP, Heinzel, JM, Jain, Ankur]. 252, 298--304 [.] "Elsevier". DOI http://dx.doi.org/10.1016/j.jpowsour.2013.11.107

      Conference Proceeding 2014
      • Investigation of Two-Phase, Vapor Chamber Based Thermal Management of Multiple Microserver Chips
        [Parhizi, Mohammad, Merrikh, AliAkbar, Jain, Ankur]. V010T13A070--V010T13A070 [.]
      2014
      • Measurement of thermal conductivity of a flexible substrate
        [Vishwakarma, Vivek, Jain, Ankur]. V003T03A101--V003T03A101 [.]
      2014
      • Experimental thermal characterization of various high power cylindrical Li-ion energy storage devices
        [Drake, SJ, Martin, M, Wetz, DA, Ostanek, JK, Miller, SP, Heinzel, JM, Jain, Ankur].

      Journal Article 2013
      • Thermal Modeling of Ultraviolet Nanoimprint Lithography
        [Patel, BhavikC, Jain, Ankur]. 135(6), 064501 [.] "American Society of Mechanical Engineers". DOI http://dx.doi.org/10.1115/1.4025564
      2013
      • Nano/Microscale pyroelectric energy harvesting: Challenges and opportunities
        [Lingam, Devashish, Parikh, AnkitR., Huang, Jiacheng, Jain, Ankur, Minary-Jolandan, Majid]. 4, 1--17 [.] "Taylor \& Francis".
      2013
      • Thermally assisted spatially directed pore formation in poly-dimethylsiloxane (PDMS)
        [Banait, A, Vishwakarma, V, Choobineh, L, Jain, Ankur]. 103(15), 153702 [.] "AIP Publishing".
      2013

      Conference Proceeding 2013
      • Analytical Modeling of Temperature Distribution in Interposer-Based Microelectronic Systems
        [Choobineh, Leila, Agonafer, Dereje, Jain, Ankur]. V001T03A004--V001T03A004 [.]
      2013
      • Analytical Temperature Distribution in a Multi-Layer Tissue Structure in the Presence of a Tumor
        [Sarkar, Daipayan, Jain, Ankur, Haji-Sheikh, Abdolhossein]. V08AT09A060--V08AT09A060 [.]
      2013
      • Effect of TSV Joule heating on device performance
        [Mirza, Fahad, Naware, G, Raman, T, Agonafer, Dereje, Jain, Ankur].
      2013
      • Experimental Measurement of the Thermal Performance of a Two-Die 3D Integrated Circuit (3D IC)
        [Choobineh, Leila, Vo, Nick, Uehling, Trent, Jain, Ankur]. V002T08A034--V002T08A034 [.]
      2013
      • Growth of Patterned Micropores in Poly-Dimethylsiloxane (PDMS) Using the Thermocapillary Effect
        [Banait, Arya, Vishwakarma, Vivek, Choobineh, Leila, Jain, Ankur]. V07AT08A006--V07AT08A006 [.]

      Conference Proceeding 2012
      • Space Cooling Using the Concept of Nanofluids-Based Direct Absorption Solar Collectors
        [Vishwakarma, Vivek, Singhal, Nitin, Khullar, Vikrant, Tyagi, Himanshu, Taylor, RobertA, Otanicar, ToddP, Jain, Ankur]. 2769--2777 [.]
      2012
      • Thermal Modeling of Memory Access Operations in Microprocessors
        [Vishwakarma, Vivek, Singhal, N., Khullar, V., Tyagi, H., Taylor, R., Otanicar, T., Jain, Ankur].

      Journal Article 2012 2012
      • Analytical solution for steady-state and transient temperature fields in vertically stacked 3-D integrated circuits
        [Choobineh, Leila, Jain, Ankur]. 2(12), 2031--2039 [.] "IEEE".
      2012
      • Microheater platform for selective detachment of DNA
        [Javed, Annas, Iqbal, SamirM, Jain, Ankur]. "American Institute of Physics".

      Journal Article 2011
      • Thermal microdevices for biological and biomedical applications
        [Jain, Ankur, Goodson, KennethE]. 36(4), 209--218 [.] "Pergamon".
      2011
      • Thermal–electrical co-optimisation of floorplanning of three-dimensional integrated circuits under manufacturing and physical design constraints
        [Jain, Ankur, Alam, Syed, Pozder, Scott, Jones, Robert].(5), 169-178 [.] DOI http://dx.doi.org/10.1049/iet-cdt.2009.0107

      Conference Proceeding 2010
      • Thermal characteristics of multi-die, three-dimensional integrated circuits with unequally sized die
        [Jain, Ankur]. 1--6 [.]

      Journal Article 2010
      • Analytical and numerical modeling of the thermal performance of three-dimensional integrated circuits
        [Jain, Ankur, Jones, RobertE, Chatterjee, Ritwik, Pozder, Scott]. 33(1), 56--63 [.] "IEEE".
      2010
      • Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits
        [Savidis, Ioannis, Alam, SyedM, Jain, Ankur, Pozder, Scott, Jones, RobertE, Chatterjee, Ritwik]. 41(1), 9--16 [.] "Elsevier".
      2010
      • Interstratum connection design considerations for cost-effective 3-D system integration
        [Alam, SyedM, Jones, RobertE, Pozder, Scott, Chatterjee, Ritwik, Rauf, Shahid, Jain, Ankur]. 18(3), 450--460 [.] "IEEE".

      Conference Proceeding 2009
      • Die/wafer stacking with reciprocal design symmetry (RDS) for mask reuse in three-dimensional (3D) integration technology
        [Alam, SyedM, Jones, RobertE, Pozder, Scott, Jain, Ankur]. 569--575 [.]
      2009
      • Reliability Considerations in 3D Stacked Strata Systems
        [Pozder, Scott, Jain, Ankur, Jones, Robert, Huang, Zhihong, Justison, Patrick, Chatterjee, Ritwik]. 1143(1), 213--223 [.]
      2009
      • Thermal-Electrical co-optimization of block-level floorplanning in 3D integrated circuits
        [Jain, Ankur, Alam, Syed, Pozder, Scott, Jones, RobertE]. 95--101 [.]

      Journal Article 2009
      • Heat Conduction through a DNA- Gold Composite
        [Kodama, Takashi, Jain, Ankur, Goodson, KennethE]. 9(5), 2005--2009 [.] "ACS Publications".
      2009
      • Theoretical and experimental investigation of spatial temperature gradient effects on cells using a microfabricated microheater platform
        [Jain, Ankur, Ness, Kevin, Goodson, KennethE]. 143(1), 286--294 [.] "Elsevier".

      Conference Proceeding 2008
      • 3D die-to-wafer Cu/Sn microconnects formed simultaneously with an adhesive dielectric bond using thermal compression bonding
        [Pozder, Scott, Jain, Ankur, Chatterjee, Ritwik, Huang, Zhihong, Jones, RobertE, Acosta, Eddie, Marlin, Bill, Hillmann, Gerhard, Sobczak, Martin, Kreindl, Gerald, others]. 46--48 [.]
      2008
      • Electromigration of Cu-Sn-Cu micropads in 3D interconnect
        [Huang, Zhihong, Chatterjee, Ritwik, Justison, Patrick, Hernandez, Richard, Pozder, Scott, Jain, Ankur, Acosta, Eddie, Gajewski, DonaldA, Mathew, Varughese, Jones, RobertE]. 12--17 [.]
      2008
      • Thermal modeling and design of 3D integrated circuits
        [Jain, Ankur, Jones, RobertE, Chatterjee, Ritwik, Pozder, Scott, Huang, Zhihong]. 1139--1145 [.]

      Journal Article 2008
      • Investigation of the natural convection boundary condition in microfabricated structures
        [Hu, XJack, Jain, Ankur, Goodson, KennethE]. 47(7), 820--824 [.] "Elsevier".
      2008
      • Measurement of the thermal conductivity and heat capacity of freestanding shape memory thin films using the 3$\omega$ method
        [Jain, Ankur, Goodson, KennethE]. 130(10), 102402 [.] "American Society of Mechanical Engineers".
      2008
      • Thermal conductivity measurement and sedimentation detection of aluminum oxide nanofluids by using the 3-omega method
        [Oh, Dong-Wook, Jain, Ankur, Eaton, JohnK, Goodson, KennethE, Lee, JoonSik]. 29(5), 1456--1461 [.] "Elsevier".

      Conference Proceeding 2007
      • Nonmetallic conduction property of a DNA templated gold nanowire
        [Kodama, Takashi, Jain, Ankur, Goodson, KennethE]. 999--1005 [.]
      2007
      • Progress of 3D integration technologies and 3D interconnects
        [Pozder, Scott, Chatterjee, Ritwik, Jain, Ankur, Huang, Zhihong, Jones, RobertE, Acosta, Eddie]. 213--215 [.]

      Other 2007
      • Thermal phenomena in free standing thin films and biological microsystems
        [Jain, Ankur]. "Stanford University".

      Conference Proceeding 2006
      • Theoretical investigation of sub-ambient on-chip microprocessor cooling
        [Jain, Ankur, Ramanathan, Shriram]. 765--770 [.]
      2006
      • Thermal Conductivity Measurement of Aluminum Oxide Nanofluids Using the 3-Omega Method
        [Oh, D, Jain, Ankur, Eaton, JK, Goodson, KE, Lee, JS]. 377(3), 343 [.] "ASME; 1998".

      Conference Proceeding 2005
      • A Theoretical Model for Temperature Gradient Effects on Cells
        [Jain, Ankur, Goodson, K.].
      2005
      • Investigation of temperature gradient effects on neurite outgrowth in nerve cells using a microfabricated heater structure
        [Jain, Ankur, Ness, KD, Fishman, HA, Goodson, KE]. 398--399 [.]
      2005
      • Investigation of the Natural Convection Boundary Condition in Microfabricated Structures
        [Jain, Ankur, Goodson, K., Hu, X.].
      2005
      • Measurement of Thermophysical Properties of Thin Film Shape Memory Alloys Using the 3-Omega Method
        [Jain, Ankur, Goodson, KennethE]. 537--541 [.]

      Conference Proceeding 2004
      • A Microheater Device for Study of Temperature Gradient Effects A Microheater Device for Study of Temperature Gradient Effects on Neurite Outgrowth in Retinal Ganglion Cells on Neurite Outgrowth in Retinal Ganglion Cells
        [Jain, Ankur, Ness, Kevin, Mehenti, Neville, Fishman, Harvey, Goodson, Kenneth].
      2004
      • Experimental investigation of the flow field of a ceiling fan
        [Jain, Ankur, Upadhyay, RochanRaj, Chandra, Samarth, Saini, Manish, Kale, Sunil]. 93--99 [.]

      Conference Proceeding 2003
      • Design, fabrication and thermal characterization of a MEMS device for control of nerve cell growth
        [Jain, Ankur, Ness, Kevin, McConnell, Angie, Jiang, Linan, Goodson, Kenneth]. 251--257 [.]

Presentations

    • October  2019
      Jain, Ankur, "Investigation of heat transfer in Li-ion battery pack of a hoverboard", Alexandria, VA. (October 25, 2019).
    • October  2019
      Jain, Ankur, "Theoretical and Numerical Methods for Prediction of Li-ion Cell Temperature Distribution During Thermal Runaway", Alexandria, VA. (October 23, 2019).
    • October  2019
      Jain, Ankur, "Thermo-electrochemical coupling and interactions in Li-ion cells", American Society of Mechanical Engineers, Anaheim, CA. (October 8, 2019).
    • May  2019
      Jain, Ankur, "Direct and Inverse Heat Transfer Problems in Electrochemical Energy Conversion and Storage in Li-ion Batteries", Purdue University, West Lafayette IN. (May 30, 2019).
    • May  2019
      Jain, Ankur, "Exact and Approximate Methods for Analytical Modeling of Thermal and Electrochemical Transport in Li-ion Cells", m, Dallas TX. (May 29, 2019).
    • November  2018
      Jain, Ankur, "Thermal Conduction in Li-ion Battery Materials", Institute for Materials Science and Engineering, Washington University at St. Louis. (November 26, 2018).
    • July  2018
      Jain, Ankur, "Heat Transfer in Electrochemical Energy Conversion and Storage Systems", Amritapuri, India. (July 30, 2018).
    • May  2018
      Jain, Ankur, "Analytical Methods for Understanding Multiscale Thermal Transport in Li-Ion Batteries Towards Improved Safety and Performance", Electrochemical Society, Seattle, WA. (May 16, 2018).
    • February  2018
      Jain, Ankur, "Thermal Transport in Li-ion Cells: Materials, Processes and Metrology", Mechanical Engineering Department, University of Houston, Houston, TX. (February 16, 2018).
    • November  2017
      Jain, Ankur, "Fundamental Study of Thermal Transport in a Li-ion Cell for Enhanced Renewable Energy Conversion", 5th Arab-American Frontiers of Science, Engineering, and Medicine Symposium, organized by U.S. National Academy of Sciences, Rabat, Morocco. (November 2, 2017).
    • August  2017
      Jain, Ankur, "Industry and Academic Careers for Graduate Students", Graduate Student Careers Workshop, ASME InterPACK, San Francisco. (August 29, 2017).
    • June  2017
      Jain, Ankur, "Leveraging Industry Experience for Success in an Academic Career", ASME Power & Energy Conference & Exhibition, Charlotte, NC. (June 26, 2017).
    • June  2017
      Jain, Ankur, "Measurement and Modeling of Thermal Transport Processes in Li-ion Cells for Improved Safety and Performance", ASME 15th International Conference on Fuel Cell Science, Engineering and Technology. (June 26, 2017).
    • June  2017
      Jain, Ankur, "The Role of Temperature Measurement and Modeling in Battery Diagnostics and Health Management", 8th IEEE International Conference on Prognostics and Health Management, Dallas, TX,. (June 19, 2017).
    • May  2017
      Jain, Ankur, "Analytical Methods for Understanding Multiscale Thermal Transport in Li-Ion Batteries", International Symposium on Advances in Computational Heat Transfer, Napoli, Italy. (May 28, 2017).
    • February  2017
      Jain, Ankur, "Safety of Li-ion Batteries – A Thermal Engineering Perspective", Energy Storage System Safety Forum, Santa Fe, NM. (February 22, 2017).
    • February  2017
      Jain, Ankur, "Experimental and Analytical Research on Heat Transfer in Li-ion Cells", Department of Mechanical & Aerospace Engineering, New Mexico State University, Las Cruces, NM. (February 21, 2017).
    • January  2017
      Jain, Ankur, "Thermal Transport in Li-ion Cells – Measurements and Modeling", Department of Mechanical Engineering, Indian Institute of Technology, Delhi (IITD), India. (January 11, 2017).
    • November  2016
      Jain, Ankur, "Thermal Transport in Li-ion Cells: Materials, Processes and Metrology", NSF Nanosystems Engineering Research Center, University of Texas, Austin, TX. (November 11, 2016).
    • June  2016
      Jain, Ankur, "Thermal Transport in Li-ion Cells: Materials, Processes and Metrology", Indo-US Workshop on Recent Advances in Multiscale, Multiphysics Analysis of Energy Conversion in Li-ion Batteries, Indian Institute of Technology Bombay, India. (June 19, 2016).
    • November  2015
      Jain, Ankur, "Measurement and Optimization of Thermal Transport in Li-Ion Cells for Improved Performance and Safety", 6th Annual Battery Safety Conference, Baltimore, MD. (November 19, 2015).
    • June  2015
      Jain, Ankur, "Thermal Engineering of Three-Dimensional Integrated Circuits (3D ICs)", AMD Research, Austin, TX. (June 29, 2015).
    • December  2014
      Jain, Ankur, "Thermal Phenomena in Biological Microsystems", Conclave on Nano-Biotechnology 2014, Institute of Nano Science and Technology, Chandigarh, India. (December 22, 2014).
    • December  2014
      Jain, Ankur, "Thermal Phenomena in Biological Microsystems", Indo-US Workshop on Nanoengineering in Medicine, New Delhi, India, Dec 17-19, 2014. (December 19, 2014).
    • November  2014
      Jain, Ankur, "Research Careers in Industry and Academia: Transitions from One to the Other", Invited Presentation, Session 13-20-1: “Preparing for Success - Careers in Industry, Academia and Government”, ASME International Mechanical Engineering Congress and Exposition (IMECE), Montreal, Canada, Nov 17, 2014. (November 17, 2014).
    • November  2014
      Jain, Ankur, "Thermal Transport Phenomena in Engineering and Biomedical Microdevices", Invited Talk, Nanotechnology and Integrated Microsystems Student Association (NIMSA), University of Michigan, Nov 6, 2014.. (November 6, 2014).
    • October  2014
      Jain, Ankur, "Thermal Microdevices for Energy and Biomedical Applications", Invited Talk, Arlington Technology Association (ATA), Arlington, TX, Oct 1, 2014.. (October 1, 2014).
    • September  2014
      Jain, Ankur, "Thermal Transport Phenomena in Li-ion Batteries", Invited Talk, National Transportation Research Center (NTRC), Oak Ridge National Laboratory, Oak Ridge, TN, Sep 25, 2014.. (September 25, 2014).
    • March  2014
      Jain, Ankur, "Thermal and Electrical Modeling of Three-Dimensional Integrated Circuits", Invited Short Course, co-taught with I. Savidis, IEEE SEMI-THERM 2014, San Jose, CA, March 9, 2014.. (March 9, 2014).
    • December  2013
      Jain, Ankur, "Thermal Phenomena in Biological Microdevices", Invited Talk, Indo-US Workshop on Micro/Nanoscale Thermal Transport, Indian Institute of Technology (IIT) Ropar, India, Dec 21- 22, 2013.. (December 22, 2013).
    • July  2013
      Jain, Ankur, "Experimental and Analytical Characterization of Thermal Transport in Li-ion Batteries", Invited Talk, Aerospace Vehicles Directorate, Air Force Research Labs (AFRL), Wright Patterson Air Force Base (WPAFB), OH, July 30, 2013.. (July 30, 2013).
    • February  2013
      Jain, Ankur, "Thermal Modeling and Design of Three-Dimensional Integrated Circuits: Challenges and Opportunities", Invited Talk, Information Science Institute (ISI), University of Southern California, Feb 6, 2013. (February 6, 2013).
    • September  2012
      Jain, Ankur, "Temperature Measurement in Semiconductor Devices", Invited Talk, Advanced Micro Devices (AMD), Austin, TX, Sep 14, 2012. (September 14, 2012).
    • February  2012
      Jain, Ankur, "Challenges in Packaging of Three-Dimensional Integrated Circuits", Invited Talk, Freescale Semiconductor, Austin, TX, Feb 17, 2012. (February 17, 2012).
    • September  2011
      Jain, Ankur, "Thermal Management of Advanced Microelectronics", Invited Talk, SVTC Technologies, San Jose, CA, Sep 6, 2011.. (September 6, 2011).
    • May  2011
      Jain, Ankur, "Microscale Heat Transfer & Fluid Mechanics: Applications in Energy and Bioengineering", Invited Talk, Mechanical and Aerospace Engineering Department, University of Texas, Arlington, May 16, 2011. (May 16, 2011).
    • June  2010
      Jain, Ankur, "Thermal Management of Three-Dimensional Integrated Circuits: Challenges and Opportunities", Invited Tutorial at IEEE ITherm-2010, Las Vegas, NV, June 2, 2010.. (June 2, 2010).
    • April  2010
      Jain, Ankur, "Microscale Heat Transfer & Fluid Mechanics: Applications in Energy and Bioengineering", Invited Talk, School of Mechanical Engineering, Nanyang Technological University, Singapore, April 19, 2010.. (April 19, 2010).
    • January  2010
      Jain, Ankur, "Microscale Heat Transfer & Fluid Mechanics", Invited Talk, Department of Mechanical Engineering, University of Canterbury, Christchurch, New Zealand, January 12, 2010. (January 12, 2010).
    • July  2009
      Jain, Ankur, "Thermal and Fluidic Microdevices: Applications in Energy and Bioengineering", Invited Talk, Department of Mechanical Engineering, Texas A&M University, College Station, TX, July 6, 2009.. (July 6, 2009).
    • March  2009
      Jain, Ankur, "Three-Dimensional Microelectronics Packaging", Invited Talk, Austin IEEE CPMT Workshop on 3D Packaging, Austin, TX, March 27, 2009. . (March 27, 2009).
    • February  2009
      Jain, Ankur, "Thermal Phenomena in Thin Films and Biological Microsystems", Invited Talk, Mechanical, Materials and Aerospace Department, Illinois Institute of Technology (IIT), Chicago, IL, February 24, 2009.. (February 24, 2009).
    • January  2009
      Jain, Ankur, "Thermal-Electrical-Mechanical Co-Design in 3D Microelectronics", Invited Talk, Micron Research Center, Utah State University, Logan, UT, Jan 30, 2009.. (January 30, 2009).
    • November  2008
      Jain, Ankur, "Thermal Challenges and Opportunities in 3D Integrated Circuits", Invited Talk, 5 th International Conference for Semiconductor Integration and Packaging, San Francisco, CA, Nov 17-19, 2008.. (November 19, 2008).
    • November  2008
      Jain, Ankur, "Needs and Opportunities in Thermal Modeling and CAD of Three-Dimensional (3D) Integrated Circuits", Invited Talk, Workshop on Integrated CAD Tools for Next Generation Thermal Management Methodologies and Devices: Status and Needs, Georgia Institute of Technology, Atlanta, GA, Nov 17, 2008.. (November 17, 2008).
    • September  2008
      Jain, Ankur, "Three-dimensional (3D) Technology: An Overview of Challenges and Opportunities", Invited Talk, 3D Design & Architecture Workshop, National Tsing Hua University, Hsin-Chu, Taiwan, Sep 9, 2008.. (September 9, 2008).

Support & Funding

This data is entered manually by the author of the profile and may duplicate data in the Sponsored Projects section.
    • Past to Present sponsored by  - $152078
    • Past to Present sponsored by  - $2800
    • Past to Present sponsored by  - $21600
    • Past to Present sponsored by  - $21810
    • Past to Present sponsored by  - $216641
    • Past to Present sponsored by  - $22651
    • Past to Present sponsored by  - $232500
    • Past to Present sponsored by  - $25000
    • Past to Present sponsored by  - $288601
    • Past to Present sponsored by  - $29958
    • Past to Present sponsored by  - $35223
    • Past to Present sponsored by  - $399311
    • Past to Present sponsored by  - $510000
    • Past to Present sponsored by  - $800
    • Past to Present sponsored by  - $9850
    • Past to Present sponsored by  - $99960
    • Mar 2016 to Feb 2021 CAREER: Safe, High-Performance Li-Ion Batteries Through a Fundamental Investigation of Thermal Transport in Electrochemical Materials and Interfaces sponsored by  - $565999
      Ankur Jain (Funded)
    • Mar 2016 to Feb 2021 RET Supplement: CAREER: Safe, High-Performance Li-Ion Batteries Through a Fundamental Investigation of Thermal Transport in Electrochemical Materials and Interfaces sponsored by  - $7000
      Ankur Jain (Funded)
    • June 2019 to July 2020 Measurement of Thermal Properties of Thermal Paste sponsored by  - $1000
      Ankur Jain (Funded)
    • Apr 2019 to Aug 2019 Measurement of Thermal Properties of Novel Thermal Interface Materials sponsored by  - $1500
      Ankur Jain (Funded)
    • Apr 2019 to Apr 2019 Measurement of Thermal Properties of Heat Spreader Material sponsored by  - $2000
      Ankur Jain (Funded)
    • Oct 2018 to Apr 2019 Modeling of Thermal Runaway Propagation in Li-ion Battery Pack sponsored by  - $50000
      Ankur Jain (Funded)
    • Jan 2015 to Dec 2018 Distributed Wireless Antenna Sensors for Boiler Condition Monitoring sponsored by  - $399311
      (Funded)
    • Sept 2015 to Aug 2018 Collaborative Research: EAGER: Enhancing Pyroelectric Effects in Nanostructured Materials for High-Efficiency Energy Conversion sponsored by  - $82500
      Ankur Jain (Funded)
    • Mar 2016 to Feb 2018 Indo-US Workshop on Multiscale, Multiphysics Analysis of Energy Conversion in Li-ion Batteries sponsored by  - $22651
      Ankur Jain (Funded)
    • Dec 2016 to Sept 2017 Exploratory Visit for UTA-NMSU Collaboration on Thermal Management of Energy Conversion Systems sponsored by  - $800
      Ankur Jain (Funded)
    • Feb 2016 to Jan 2017 Characterization of the Thermal Properties of Electrochemical Energy Storage Devices and their Impact on Cell Degradation under High Pulsed Loading sponsored by  - $32224
      (Funded)
    • Oct 2015 to Apr 2016 Rolled-Ribbon Thermal Model Development sponsored by  - $21810
      Ankur Jain (Funded)
    • June 2014 to Nov 2015 Multiscale Thermal Characterization and Evaluation of Electrochemical Energy storage Materials, Cells and Modules at Monimal and High C Rates sponsored by  - $288601
      (Funded)
    • Aug 2014 to Oct 2015 Evaluation and Characterization of the Thermal Properties of Electrochemical Energy Storage Devices through Analytical and Experimental Methods sponsored by  - $99960.400390625
      (Funded)
    • Sept 2012 to Aug 2015 GOALI: Experimental and Theoretical Investigation of Thermal Transport in Three-Dimensional Integrated Circuits (3D ICs) sponsored by  - $
      (Funded)
    • Oct 2014 to Dec 2014 Thermal Management of Electronic Devices Using High Precision Additive Manufacturing sponsored by  - $2800
      Ankur Jain (Funded)
    • June 2013 to Oct 2014 Thermal Characterization of Cylindrical Electrochemical Energy Storage through Analytical and Experimental Methods sponsored by  - $152078
      (Funded)
    • Sept 2014 to Sept 2014 Exploratory Visit for ORNL-UTA Collaboration on Thermally Enhanced Li-Ion Batteries sponsored by  - $800
      Ankur Jain (Funded)
    • June 2012 to Aug 2013 REP: Thermal Management of Micro-PhotoVoltaic (Miceo-PV) Devices for High-Efficiency Energy Generation sponsored by  - $9850
      Ankur Jain (Funded)

Students Supervised

    • Mar 2019
      Christian Lowery, (Mech and Aero Engineering)
      Imaging and measurement of transient evolution of the cross-section of an extruded polymer filament in additive manufacturing
    • May 2018
      Abhinav Prasad, (Mech and Aero Engineering)
      Experimental and numerical investigation of heat transfer in battery pack of a hoverboard
    • Dec 2017
      Divya Chalise, (Mech and Aero Engineering)
      Conjugate heat transfer analysis of thermal management of a Li-ion battery pack
    • Dec 2017
      Iretomiwa Esho, (Mech and Aero Engineering)
      Measurements and modeling to determine the critical temperature for preventing thermal runaway in Li-ion cells
    • Aug 2017
      Ratnesh Raj, (Mech and Aero Engineering)
      Thermal modeling of 3D memory
    • Aug 2017
      Krishna Shah, (Mech and Aero Engineering)
      Modeling and measurements of thermal transport in Li-ion based energy conversion and storage devices
    • Aug 2017
      Vivek Vishwakarma, (Mech and Aero Engineering)
      Thermal measurement and optimization of materials and processes in a Li-ion cell
    • May 2017
      Salwa Shaik, (Mech and Aero Engineering)
      An improved method for measurement of radial thermal conductivity of cylindrical bodies
    • May 2017
      Swapnil Luhar, (Mech and Aero Engineering)
      Steady state and transient analytical modeling of non-uniform convective cooling of a microprocessor due to jet impingement
    • Dec 2016
      Dean Anthony, (Mech and Aero Engineering)
      Non-Invasive Measurement of the Internal Temperature of Heat-Generating Bodies
    • Aug 2016
      Daipayan Sarkar, (Mech and Aero Engineering)
      General Temperature Solutions in Orthotropic Systems subject to Variable Heat Transfer and Biological Systems during Hyperthermia Therapy
    • May 2015
      Mohammad Parhizi, (Mech and Aero Engineering)
      Numerical Investigation of Steady State and Transient Thermal Performance of a Multi-Chip Vapor Chamber
    • Dec 2014
      Arya Banait, (Mech and Aero Engineering)
      Experimental Analysis of Growth of Micro-pores in Soft Polymer Poly-dimethylsiloxane using Thermocapillary Effect
    • Dec 2014
      Stephen Drake, (Mech and Aero Engineering)
      Thermal Conduction and Heat Generation Phenomena in Li-ion Cells
    • Aug 2014
      Leila Choobineh, (Mech and Aero Engineering)
      Analytical and Experimental Investigation of Thermal Transport in Three-Dimensional Integrated Circuits (3D ICs)
    • Aug 2013
      Annas Javed, (Electrical Engineering)
      Design, Microfabrication and Characterization of a Microheater Platform for Studying DNA-Surface Interactions
    • Aug 2013
      Bhavik Patel, (Mech and Aero Engineering)
      Thermo-Mechanical Optimization of Nano-Imprint Lithography

Courses

      • AE 5101-001 GRADUATE SEMINAR
        (Course Id: 101917)
        Fall - Regular Academic Session - 2019 Download Syllabus
      • AE 5101-002 GRADUATE SEMINAR
        (Course Id: 101917)
        Fall - Regular Academic Session - 2019
      • ME 5101-001 GRADUATE SEMINAR
        (Course Id: 101917)
        Fall - Regular Academic Session - 2019
      • ME 5101-002 GRADUATE SEMINAR
        (Course Id: 101917)
        Fall - Regular Academic Session - 2019
      • ME 6297-041 RESEARCH
        (Course Id: 103464)
        Fall - Regular Academic Session - 2019
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2019
      • ME 6697-041 RESEARCH
        (Course Id: 103489)
        Fall - Regular Academic Session - 2019
      • ME 5316-001 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2019 Download Syllabus
      • ME 5316-002 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2019
      • ME 5398-041 THESIS
        (Course Id: 103460)
        Fall - Regular Academic Session - 2019
      • ME 6196-041 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2019
      • ME 6197-041 RESEARCH
        (Course Id: 103463)
        Summer - 2019
      • ME 6697-041 RESEARCH
        (Course Id: 103489)
        Summer - 2019
      • ME 5698-041 THESIS
        (Course Id: 103461)
        Summer - 2019
      • ME 6196-041 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Spring - Regular Academic Session - 2019
      • ME 6297-041 RESEARCH
        (Course Id: 103464)
        Spring - Regular Academic Session - 2019
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2019
      • ME 6697-041 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2019
      • MAE 4391-041 SPEC PROB MECH & AERO ENGR
        (Course Id: 103689)
        Spring - Regular Academic Session - 2019
      • MAE 4301-006 SPEC TOPICS MECH & AERO ENGR
        (Topic: Power Plant Engineering | Course Id: 103659)
        Spring - Regular Academic Session - 2019
      • MAE 3310-002 THERMODYNAMICS I
        (Course Id: 103631)
        Spring - Regular Academic Session - 2019
      • ME 5398-041 THESIS
        (Course Id: 103460)
        Spring - Regular Academic Session - 2019
      • ME 5698-041 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2019
      • ME 6196-041 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Fall - Regular Academic Session - 2018
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2018
      • ME 6697-041 RESEARCH
        (Course Id: 103489)
        Fall - Regular Academic Session - 2018
      • ME 5316-001 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2018
      • ME 5316-002 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2018
      • ME 5398-041 THESIS
        (Course Id: 103460)
        Fall - Regular Academic Session - 2018
      • ME 6196-041 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2018
      • ME 6697-041 RESEARCH
        (Course Id: 103489)
        Summer - Eleven Week - 2018
      • ME 6297-041 RESEARCH
        (Course Id: 103464)
        Spring - Regular Academic Session - 2018
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2018
      • AE 6397-041 RESEARCH AEROSPACE ENGINEERING
        (Course Id: 101994)
        Spring - Regular Academic Session - 2018
      • ME 5390-006 SPEC TOPICS MECH ENGR
        (Topic: Thermal Phenomena Microsystems | Course Id: 103456)
        Spring - Regular Academic Session - 2018 Download Syllabus
      • MAE 3310-002 THERMODYNAMICS I
        (Course Id: 103631)
        Spring - Regular Academic Session - 2018 Download Syllabus
      • ME 5698-041 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2018
      • ME 6297-041 RESEARCH
        (Course Id: 103464)
        Fall - Regular Academic Session - 2017
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2017
      • AE 6397-041 RESEARCH AEROSPACE ENGINEERING
        (Course Id: 101994)
        Fall - Regular Academic Session - 2017
      • MAE 4391-041 SPEC PROB MECH & AERO ENGR
        (Course Id: 103689)
        Fall - Regular Academic Session - 2017
      • ME 5316-001 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2017 Download Syllabus
      • ME 5316-002 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2017 Download Syllabus
      • ME 6699-041 DISSERTATION
        (Course Id: 103490)
        Summer - Eleven Week - 2017
      • ME 7399-041 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Summer - Eleven Week - 2017
      • ME 5698-041 THESIS
        (Course Id: 103461)
        Summer - Eleven Week - 2017
      • ME 6699-041 DISSERTATION
        (Course Id: 103490)
        Spring - Regular Academic Session - 2017
      • ME 7399-041 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Spring - Regular Academic Session - 2017
      • ME 6196-041 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Spring - Regular Academic Session - 2017
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2017
      • ME 6697-041 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2017
      • AE 6397-041 RESEARCH AEROSPACE ENGINEERING
        (Course Id: 101994)
        Spring - Regular Academic Session - 2017
      • ME 5390-007 SPEC TOPICS MECH ENGR
        (Topic: Thermal Phenom in Microsystems | Course Id: 103456)
        Spring - Regular Academic Session - 2017 Download Syllabus
      • MAE 3310-002 THERMODYNAMICS I
        (Course Id: 103631)
        Spring - Regular Academic Session - 2017 Download Syllabus
      • ME 5398-041 THESIS
        (Course Id: 103460)
        Spring - Regular Academic Session - 2017
      • ME 5698-041 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2017
      • ME 6699-041 DISSERTATION
        (Course Id: 103490)
        Fall - Regular Academic Session - 2016
      • ME 6196-041 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Fall - Regular Academic Session - 2016
      • ME 5316-001 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2016 Download Syllabus
      • ME 5316-002 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2016 Download Syllabus
      • ME 5698-041 THESIS
        (Course Id: 103461)
        Fall - Regular Academic Session - 2016
      • ME 7399-041 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Summer - Eleven Week - 2016
      • ME 6196-041 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2016
      • MAE 4391-041 SPEC PROB MECH & AERO ENGR
        (Course Id: 103689)
        Summer - Eleven Week - 2016
      • ME 6399-041 DISSERTATION
        (Course Id: 103486)
        Spring - Regular Academic Session - 2016
      • ME 6297-041 RESEARCH
        (Course Id: 103464)
        Spring - Regular Academic Session - 2016
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2016
      • ME 6697-041 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2016
      • MAE 4301-007 SPEC TOPICS MECH & AERO ENGR
        (Topic: Power Plant Engineering | Course Id: 103659)
        Spring - Regular Academic Session - 2016 Download Syllabus
      • ME 5390-007 SPEC TOPICS MECH ENGR
        (Topic: Power Plant Engineering | Course Id: 103456)
        Spring - Regular Academic Session - 2016 Download Syllabus
      • MAE 3310-002 THERMODYNAMICS I
        (Course Id: 103631)
        Spring - Regular Academic Session - 2016 Download Syllabus
      • ME 6299-041 DISSERTATION
        (Course Id: 111984)
        Fall - Regular Academic Session - 2015
      • ME 6399-041 DISSERTATION
        (Course Id: 103486)
        Fall - Regular Academic Session - 2015
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2015
      • ME 5316-001 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2015 Download Syllabus
      • ME 5316-002 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2015 Download Syllabus
      • ME 6196-041 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2015
      • MAE 4391-041 SPEC PROB MECH & AERO ENGR
        (Course Id: 103689)
        Summer - Eleven Week - 2015
      • ME 6297-041 RESEARCH
        (Course Id: 103464)
        Spring - Regular Academic Session - 2015
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2015
      • ME 5390-006 SPEC TOPICS MECH ENGR
        (Topic: ThermalPhenomena Microsystems | Course Id: 103456)
        Spring - Regular Academic Session - 2015 Download Syllabus
      • MAE 3310-002 THERMODYNAMICS I
        (Course Id: 103631)
        Spring - Regular Academic Session - 2015 Download Syllabus
      • ME 5698-041 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2015
      • ME 6699-041 DISSERTATION
        (Course Id: 103490)
        Fall - Regular Academic Session - 2014
      • ME 6297-041 RESEARCH
        (Course Id: 103464)
        Fall - Regular Academic Session - 2014
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2014
      • ME 5316-001 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2014 Download Syllabus
      • ME 5316-002 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2014 Download Syllabus
      • ME 5398-041 THESIS
        (Course Id: 103460)
        Fall - Regular Academic Session - 2014
      • ME 7399-041 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Summer - Eleven Week - 2014
      • ME 6697-041 RESEARCH
        (Course Id: 103489)
        Summer - Eleven Week - 2014
      • MAE 4391-041 SPEC PROB MECH & AERO ENGR
        (Course Id: 103689)
        Summer - Eleven Week - 2014
      • ME 5391-041 ADV STUDIES MECH ENGR
        (Course Id: 103457)
        Spring - Regular Academic Session - 2014
      • ME 6699-041 DISSERTATION
        (Course Id: 103490)
        Spring - Regular Academic Session - 2014
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2014
      • ME 6697-041 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2014
      • ME 6997-041 RESEARCH
        (Course Id: 103493)
        Spring - Regular Academic Session - 2014
      • MAE 3310-002 THERMODYNAMICS I
        (Course Id: 103631)
        Spring - Regular Academic Session - 2014 Download Syllabus
      • ME 6299-041 DISSERTATION
        (Course Id: 111984)
        Fall - Regular Academic Session - 2013
      • ME 6399-041 DISSERTATION
        (Course Id: 103486)
        Fall - Regular Academic Session - 2013
      • AE 5101-001 GRADUATE SEMINAR
        (Course Id: 101917)
        Fall - Regular Academic Session - 2013
      • AE 5101-002 GRADUATE SEMINAR
        (Course Id: 101917)
        Fall - Regular Academic Session - 2013
      • AE 5101-003 GRADUATE SEMINAR
        (Course Id: 101917)
        Fall - Regular Academic Session - 2013
      • ME 5101-001 GRADUATE SEMINAR
        (Course Id: 101917)
        Fall - Regular Academic Session - 2013
      • ME 5101-002 GRADUATE SEMINAR
        (Course Id: 101917)
        Fall - Regular Academic Session - 2013
      • ME 6297-041 RESEARCH
        (Course Id: 103464)
        Fall - Regular Academic Session - 2013
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2013
      • ME 6697-041 RESEARCH
        (Course Id: 103489)
        Fall - Regular Academic Session - 2013
      • MAE 4301-007 SPEC TOPICS MECH & AERO ENGR
        (Topic: Power Plant Engineering | Course Id: 103659)
        Fall - Regular Academic Session - 2013 Download Syllabus
      • ME 5316-001 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2013 Download Syllabus
      • ME 5316-002 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2013 Download Syllabus
      • ME 6697-041 RESEARCH
        (Course Id: 103489)
        Summer - Eleven Week - 2013
      • MAE 4391-041 SPEC PROB MECH & AERO ENGR
        (Course Id: 103689)
        Summer - Eleven Week - 2013
      • ME 5698-041 THESIS
        (Course Id: 103461)
        Summer - Eleven Week - 2013
      • ME 6297-041 RESEARCH
        (Course Id: 103464)
        Spring - Regular Academic Session - 2013
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2013
      • MAE 3310-001 THERMODYNAMICS I
        (Course Id: 103631)
        Spring - Regular Academic Session - 2013 Download Syllabus
      • ME 5698-041 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2013
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2012
      • ME 6697-041 RESEARCH
        (Course Id: 103489)
        Fall - Regular Academic Session - 2012
      • ME 5316-001 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2012 Download Syllabus
      • ME 5316-002 THERMAL CONDUCTION
        (Course Id: 103410)
        Fall - Regular Academic Session - 2012 Download Syllabus
      • ME 6397-041 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2012
      • MAE 3310-001 THERMODYNAMICS I
        (Course Id: 103631)
        Spring - Regular Academic Session - 2012 Download Syllabus
      • EE 5698-032 THESIS
        (Course Id: 103044)
        Spring - Regular Academic Session - 2012
      • ME 5398-041 THESIS
        (Course Id: 103460)
        Spring - Regular Academic Session - 2012
      • ME 6197-041 RESEARCH
        (Course Id: 103463)
        Fall - Regular Academic Session - 2011

Service to the University

    • Sept 2018 to  Present University Senate Service
      Faculty Senate
    • Jan 2014 to  Present Committee Member
      Mechanical Engineering Ph.D. Qualifying Examination Committee
    • Sept 2011 to  Present Committee Member
      Thermal science and energy discipline committee
    • Jan 2011 to  Present Committee Member
      Mechanical Engineering Committee on Graduate Studies (MECOGS)
    • Jan 2018 to  May 2018 Committee Member
      Mechanical and Aerospace Engineering Department
      Member, MAE Department Faculty Workload Guidelines Committee
    • Sept 2017 to  Dec 2017 Committee Member
      Freshmen Interest Group (FIG) Steering Committee
    • Jan 2017 to  May 2017 Committee Member
      Committee on Faculty Workload Guidelines
    • Jan 2014 to  2016 Faculty Mentor
      Freshmen Interest Group
    • Sept 2013 to  Dec 2013 Program Coordinator
      Graduate Seminar Series (ME/AE 5101)
    • Jan 2013 to  May 2013 Committee Member
      Strategic Planning Committee
    • Jan 2012 to  May 2012 Committee Member
      Committee for the Annual Review Evaluation Criteria

Service to the Profession

    • Sept 2018 to  Present
      Conference-Related
      ASME International Technical Conference on Packaging and Intergration of Electronic and Photonic Microsystems Conference and Exhibition (InterPACK), 2019
    • Sept 2018 to  Present
      Editor, Associate Editor
      ASME Journal of Electrochemical Energy Conversion and Storage
    • Sept 2017 to  Present
      Officer, Secretary
      K16 Committee on Heat Transfer in Electronic Equipment
    • 2017 to  Present
      Editor, Guest Editor
      ASME Journal of Electronic Packaging
    • Jan 2013 to  Present
      Editor, Associate Editor
      IEEE Transactions on Components, Packaging and Manufacturing Technologies
    • 2018 to  2018
      Moderator, Invited Panel
      ASME International Technical Conference on Packaging and Intergration of Electronic and Photonic Microsystems Conference and Exhibition (InterPACK), 2018
      Moderator of Invited Panel on 'Challenges in Advanced Packaging for Harsh Environments'
    • Sept 2017 to  Aug 2018
      Conference-Related
      ASME International Technical Conference on Packaging and Intergration of Electronic and Photonic Microsystems Conference and Exhibition (InterPACK), 2018
    • June 2018 to  June 2018
      Reviewer, Grant Proposal
      American Chemical Society Petroleum Research Fund (ACSPRF)
    • May 2018 to  May 2018
      Best Paper Awards Committee
      IEEE ITherm 2018 Conference
    • Apr 2018 to  Apr 2018
      Reviewer, Grant Proposal
      Center for Transportation Equity, Decisions and Dollars (C-TEDD)
    • Mar 2018 to  Mar 2018
      Reviewer, Grant Proposal
      National Aeronautics and Space Administration (NASA)
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      Applied Energy
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      Applied Thermal Engineering
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      Bioelectrochemistry
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      Energy Conversion and Management
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      Frontiers in Heat and Mass Transfer
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      International Journal of Energy Research
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      International Journal of Heat and Mass Transfer
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      International Journal of Thermal Sciences
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      Inverse Methods in Science and Engineering
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      Journal of Applied Physics
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      Journal of Biomechanical Engineering
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      Journal of Electronics Packaging
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      Journal of Energy Storage
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      Journal of Heat Transfer
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      Materials Energy
    • Jan 2018 to  Jan 2018
      Reviewer, Journal Article
      Solar Energy
    • Jan 2013 to  2017
      Reviewer, Grant Proposal
      National Science Foundation
    • Sept 2016 to  Aug 2017
      Conference-Related
      ASME International Technical Conference on Packaging and Intergration of Electronic and Photonic Microsystems Conference and Exhibition (InterPACK), 2017
    • June 2016 to  June 2016
      Workshop Organizer
      Indo-US Workshop on Recent Advances in Multiscale
    • Jan 2016 to  Jan 2016
      Topic Organizer
      Symposium on Emerging Technologies ASME IMECE
    • Jan 2016 to  Jan 2016
      Session Chair
      Thermal Transport, IEEE ITherm
    • Jan 2015 to  Jan 2015
      Reviewer, Grant Proposal
      American Chemical Society Petroleum Research Fund (ACSPRF)
    • Jan 2015 to  Jan 2015
      Track Organizer
      Micro- and Nano-Systems Engineering and Packaging (EPPD), ASME IMECE
    • Jan 2015 to  Jan 2015
      Session Chair
      Plenary Session: Electronics & Photonics Packaging, ASME IMECE
    • Jan 2015 to  Jan 2015
      Topic Organizer
      Stacked Die and Multi-Chip-Module and Packaging
    • Jan 2015 to  Jan 2015
      Session Chair
      Thermal Management of Stacked Die and Packages ASME InterPACK
    • Jan 2015 to  Jan 2015
      Reviewer, Grant Proposal
      US Department of Energy Bonneville Power Administration
    • Jan 2015 to  Jan 2015
      Committee Member
      Working Group for Modeling, Simulation and Design Tools for the 2015 Roadmap for iNEMI (International Electronics Manufacturing Initiative)
    • Jan 2014 to  Jan 2014
      Session Chair
      '3D: Back-Side & Interlayer Two-Phase Cooling,’ IEEE ITherm
    • Jan 2014 to  Jan 2014
      Session Chair
      'Advanced Electrochemical Storage Concepts,’ ASME IMECE
    • Jan 2014 to  Jan 2014
      Session Chair
      'Preparing for Success - Careers in Industry, Academia and Government,’ ASME IMECE
    • Jan 2014 to  Jan 2014
      Program Organizer
      Heat and Mass Transfer in Biotechnology and Biodevices’, ASME IMECE
    • Jan 2014 to  Jan 2014
      Topic Organizer
      Manufacturing, Materials and Processes ASME IMECE
    • Jan 2014 to  Jan 2014
      Track Co-Chair
      Micro and Nano Systems Engineering and Packaging (EPPD)’, ASME IMECE
    • Dec 2013 to  Dec 2013
      Workshop Co-Organizer
      Indo-US Workshop on Recent Advances in Micro/Nanoscale Thermal Transport
    • Jan 2013 to  Jan 2013
      External Examiner
      Department of Mechanical and Aerospace Engineering, University of Pretoria, South Africa
    • Jan 2013 to  Jan 2013
      Session Chair
      Electric, Magnetic and Thermal Phenomena in Micro and Nano Scale Systems II,’ ASME IMECE
    • Jan 2013 to  Jan 2013
      Session Chair
      Micro/Nano-Scale Heat Transfer’, ASME InterPACK
    • Jan 2013 to  Jan 2013
      Committee Member
      Technical Program Committee, ASEE GSW Conference
    • Jan 2012 to  Jan 2012
      Session Chair
      '3D Chips – Stacked Die Cooling,’ IEEE ITherm
    • Jan 2012 to  Jan 2012
      Topic Organizer
      'Heat and Mass Transfer in Biotechnology,’ ASME IMECE
    • Jan 2012 to  Jan 2012
      Session Chair
      'Nanoscale Phenomena in Biological Systems,’ ASME IMECE
    • Jan 2012 to  Jan 2012
      Reviewer, Grant Proposal
      US Department of Energy ARPA-E
    • Jan 2011 to  Jan 2011
      Session Chair
      Micro- and Nano-Scale Heat Transfer,’ ASME InterPack
    • Jan 2011 to  Jan 2011
      Committee Member
      Technical Program Committee, Design, Automation & Test
    • Jan 2010 to  Jan 2010
      Session Chair
      Data Center Thermal Management,’ IEEE ITherm
    • Jan 2009 to  Jan 2009
      Session Chair
      'Advanced Packaging,’ ASME InterPack
    • Jan 2008 to  Jan 2008
      Session Chair
      'Thermal Modeling and Experimental Characterization (IV),’ IEEE ITherm
    • Jan 2008 to  Jan 2008
      Session Chair
      Microchannel Heat Sinks - Topics of recent interest: dielectric fluids, microscale characterization, novel materials,’ IEEE ITherm
    • Jan 2007 to  Jan 2007
      Session Chair
      'Micro- and Nano-Scale Heat Transfer,’ ASME IMECE