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Ankur Jain

Name

[Jain, Ankur]
  • Associate Professor, Mechanical & Aerospace Engineering

Biography

Ankur Jain is an Associate Professor in the department of Mechanical and Aerospace Engineering at the University of Texas at Arlington. He is a recipient of the NSF CAREER Award in 2016, and the UTA College of Engineering Outstanding Early Career Award in 2017. In 2017, he was invited by the US National Academy of Sciences to participate in the 5th US-Arab Symposium on Frontiers of Science, Engineering and Medicine in Rabat, Morocco.

Dr. Jain directs the Microscale Thermophysics Laboratory, where he and his students conduct research on thermal transport in Li-ion batteries, energy conversion systems, semiconductor thermal management, bioheat transfer and related topics. Dr. Jains research and education activities have been supported by grants from National Science Foundation (NSF), Office of Naval Research (ONR), Department of Energy (DoE), Indo-US Science & Technology Forum (IUSSTF) and UT Arlington Research Enhancement Grant. Dr. Jain received his Ph.D. (2007) and M.S. (2003) from Stanford University, and B.Tech. (2001) with top honors from the Indian Institute of Technology (IIT), Delhi.

Professional Preparation

    • 2007 Ph.D. in Mechanical EngineeringStanford University
    • 2003 M.S. in Mechanical EngineeringStanford University
    • 2001 B.Tech. in Mechanical EngineeringIndian Institute of Technology (IIT), Delhi

Appointments

    • Sept 2017 to Present Associate Professor
      University of Texas at Arlington
    • Sept 2011 to Sept 2017 Assistant Professor
      University of Texas at Arlington
    • Feb 2011 to Aug 2011 Member of Technical Staff
      Advanced Micro Devices (AMD)
    • June 2013 to Aug 2013 AFOSR Summer Faculty Fellow
      Air Force Research Laboratories (AFRL), Wright-Patterson Air Force Base
    • June 2012 to Aug 2012 ONR Summer Faculty Fellow
      Department of Defense (DoD)   Naval Research Laboratory (NRL)
    • June 2009 to Feb 2011 Senior Research Engineer
      Molecular Imprints Inc.
    • Dec 2006 to May 2009 Senior Staff Scientist
      Freescale Semiconductor

Memberships

  • Membership
    • Aug 2011 to Present American Society of Mechanical Engineers (ASME)

Awards and Honors

    • Feb  2018 Lockheed Martin Aeronautics Excellence in Teaching Award, University of Texas at Arlington, 2018. sponsored by Lockheed Martin Aeronautics Company
    • Mar  2017 UTA College of Engineering Outstanding Early Career Award sponsored by UT Arlington College of Engineering
    • Feb  2016 NSF CAREER Award sponsored by National Science FoundationUnknown
    • Jan  2014 National Science Foundation Workshop Travel Award sponsored by NSF Workshop Travel Grant
    • Nov  2013 ASME EPP Division Young Engineer Award 2013 sponsored by ASME
    • Mar  2013 AFOSR Summer Faculty Fellow, 2013 sponsored by Air Force Office of Scientific Research (AFOSR)Air Force Research Laboratory (AFRL)Department of Defense (DoD)
    • Mar  2012 ONR Summer Faculty Fellow, 2012 sponsored by Office of Naval Research (ONR)
    • Aug  2001 Stanford Graduate Fellowship, 2001-2004 sponsored by Stanford University
    • May  2001 Institute Silver Medal sponsored by Indian Institute of Technology, Delhi
    • May  1999 Summer Research Fellow, 1999 sponsored by Indian Institute of Science, Bangalore, India

Research and Expertise

  • Li ion batteries

    Li ion Batteries

  • Microscale thermal transport

    Microscale thermal transport

  • Semiconductor thermal management

    Semiconductor thermal management

  • Bioheat transfer

    Bioheat transfer

Publications

      Journal Article 2018
      • Prajapati, H., Ravoori, D., Jain, A., ‘Measurement and modeling of filament temperature distribution in the standoff gap between nozzle and bed in polymer-based additive manufacturing,’ Additive Manufacturing, 24, pp. 224-231, 2018. 

        {Journal Article }
      2018
      • Prajapati, H., Ravoori, D., Jain, A., ‘Measurement and modeling of filament temperature distribution in the standoff gap between nozzle and bed in polymer-based additive manufacturing,’ Additive Manufacturing, 24, pp. 224-231, 2018.

        {Journal Article }
      2018
      • Esho, I., Shah, K., Jain, A., ‘Measurements and modeling to determine the critical temperature for preventing thermal runaway in Li-ion cells,’ Appl. Therm. Eng., 145, pp. 287-294, 2018. 

        {Journal Article }
      2018
      • Ravoori, D., Alba, L., Prajapati, H., Jain, A., ‘Investigation of process-structure-property relationships in polymer extrusion based additive manufacturing through in situ high speed imaging and thermal conductivity measurements,’ Additive Manufacturing, 23, pp. 132-139, 2018. 

        {Journal Article }
      2018
      • Ahmed, M.B., Shaik, S., Jain, A., ‘Measurement of radial thermal conductivity of a cylinder using a time-varying heat flux method,’ Int. J. Therm. Sci., 129, pp. 301-308, 2018. 

        {Journal Article }
      2018
      • Prajapati, H., Ravoori, D., Woods, R.*, Jain, A., ‘Measurement of anisotropic thermal conductivity and inter-layer thermal contact resistance in polymer Fused Deposition Modeling (FDM),’ Additive Manufacturing, 21, pp. 84-90, 2018. 

        {Journal Article }
      2018
      • Chalise, D., Shah, K., Prasher, R., Jain, A., ‘Conjugate heat transfer analysis of thermal management of a Li-ion battery pack,’ Invited Article, Special Issue on Emerging Investigators in Electrochemical Energy Storage and Conversion, ASME J. Electrochem. Energy Conversion & Storage, 15, pp. 011008:1-8, 2018. 

        {Journal Article }

      Journal Article 2017
      • Ostanek, J., Shah, K., Heinzel, J., Jain, A., ‘Measurement sensitivity analysis of transient hot source sensors,’ J. Therm. Sci. Eng. Appl., 9, pp. 011002:1-12, 2017.

        {Journal Article }
      2017
      • Parhizi, M., Ahmed, M.B., Jain, A., ‘Determination of the core temperature of a Li-ion cell during thermal runaway,’ J. Power Sources, 370, pp. 27-35, 2017. 

        {Journal Article }
      2017
      • Vishwakarma, V., Jain, A., ‘Enhancement of thermal transport in Gel-Polymer Electrolytes with embedded BN/Al2O3 nano- and micro-particles,’ J. Power Sources, 362, pp. 219-227, 2017. 

        {Journal Article }
      2017
      • Chalise, D., Shah, K., Halama, T., Komsiyska, L.*, Jain, A., ‘An experimentally validated method for temperature prediction during cyclic operation of a Li-ion cell,’ Int. J. Heat Mass Transfer, 112, pp. 89-96, 2017. 

        {Journal Article }
      2017
      • Shah, K., Balsara, N.*, Banerjee, S.*, Chintapalli, M., Cocco, A.P., Chiu, W.K.S.*, Lahiri, I.*, Martha, S.*, Mistry, A., Mukherjee, P.*, Ramadesigan, V.*, Sharma, C.*, Subramanian, V.R.*, Mitra, S.*, Jain, A., ‘State-of-the-art and future research needs for multiscale analysis of Li-ion cells,’ ASME J. Electrochem. Energy Storage Conversion., in press, 2017. 

        {Journal Article }
      2017
      • Anthony, D., Wong, D., Wetz, D.*, Jain, A., ‘Improved thermal performance of a Li-ion cell through heat pipe insertion,’ J. Electrochem. Soc., 164, pp. A961-967, 2017. 

        {Journal Article }
      2017
      • Luhar, S., Sarkar, D., Jain, A., ‘Steady state and transient analytical modelling of non-uniform convective cooling of a microprocessor chip due to jet impingement,’ Int. J. Heat Mass Transfer, 110, pp. 768-777, 2017.

        {Journal Article }
      2017
      • Choobineh, L.,  Jones, J., Jain, A., ‘Experimental and numerical investigation of inter-die thermal resistance in 3D ICs,’ ASME J. Electronic Packaging, 139, pp. 020908:1-6, 2017. 

        {Journal Article }
      2017
      • Anthony, D., Wong, D., Wetz, D.*, Jain, A., ‘Non-invasive measurement of internal temperature of a cylindrical Li-ion cell during high-rate discharge,’ Int. J. Heat Mass Transfer, 111, pp. 223-231, 2017. 

        {Journal Article }

      Journal Article 2016
      • Shah, K., Chalise, D., Jain, A., ‘Experimental and theoretical analysis of a method to predict thermal runaway in Li-ion cells,’ J. Power Sources, 330, pp. 167-174, 2016. 

        {Journal Article }
      2016
      • Anthony, D., Sarkar, D., Jain, A., ‘Non-invasive, transient determination of the core temperature of a heat-generating solid body,’ Scientific Reports, 6:35886, 2016.

        {Journal Article }
      2016
      • Yao, J., Tchafa, F.E.M., Jain, A., Tjuatja, S., Huang, H., ‘Far-field interrogation of microstrip patch antenna for temperature sensing without electronics,’ IEEE Sensors J., 16, pp. 7053-7060, 2016.

        {Journal Article }
      2016
      • Shah, K., Vishwakarma, V., Jain, A., ‘Measurement of multiscale thermal transport phenomena in Li-ion cells: A review,’ in press, ASME J. Electrochem. Energy Conversion & Storage, 13:030801, 2016.  (* = Equal Contribution)

        {Journal Article }
      2016
      • Anthony, D., Sarkar, D., Jain, A., ‘Contactless, non-intrusive core temperature measurement of a solid body in steady-state,’ Int. J. Heat Mass Transfer, 101, pp. 779-788, 2016. 

        {Journal Article }
      2016
      • Black, B., Vishwakarma, V., Dhakal, K., Bhattarai, S., Pradhan, P., Jain, A., Kim, Y-T., Mohanty, S., ‘Spatial temperature gradients guide axonal outgrowth,’ Scientific Reports, 6, 29876:1-12, 2016. 

        {Journal Article }
      2016
      • Sarkar, D., Haji-Sheikh, A., Jain, A., ‘Thermal conduction in an orthotropic sphere with circumferentially varying convection heat transfer,’ Int. J. Heat Mass Transfer, 96, pp. 406-412, 2015.

        {Journal Article }
      2016
      • Sarkar, D., Jain, A., Goldstein, R.J., Srinivasan, V., ‘A general approach to corrections for lateral conduction error in steady-state heat transfer measurements,’ Int. J. Therm. Sci., 109, pp. 413-423, 2016.

        {Journal Article }
      2016
      • Shah, K., McKee, K., Chalise, D., Jain, A., ‘Experimental and numerical investigation of core cooling of Li-ion cells using heat pipes,’ Energy, 113, pp. 852-860, 2016. 

        {Journal Article }

      Journal Article 2015
      • Shah, K., Jain, A., ‘Modeling of steady-state and transient thermal performance of a Li-ion cell with an axial fluidic channel for cooling,’ Int. J. Energy Research, 39, pp. 573-584, 2014.

        {Journal Article }
      2015
      • Drake, S., Martin, M., Wetz, D.A, Ostanek, J.K., Miller, S.P., Heinzel, J.M., Jain, A., ‘Heat generation rate measurement in a Li-ion cell at large C-rates through temperature and heat flux measurements,’  J. Power Sources, 285, pp. 266-273, 2015.

        {Journal Article }
      2015
      • Choobineh, L., Jain, A., ‘An explicit analytical model for rapid computation of temperature field in a three-dimensional integrated circuit (3D IC),’ Int. J. Therm. Sci., 87, 103-109, 2015. 

        {Journal Article }
      2015
      • Vishwakarma, V., Waghela, C., Wei, Z., Prasher, R., Nagpure, S.C., Li, J., Liu, F., Daniel, C., Jain, A., ‘Heat transfer enhancement in a Lithium-ion cell through improved material-level thermal transport,’ J. Power Sources, 300, pp. 123-131, 2015. (DOI: 10.1016/j.jpowsour.2015.09.028).

        {Journal Article }
      2015
      • Vishwakarma, V., Waghela, C.Jain, A., ‘Measurement of out-of-plane thermal conductivity of substrates for flexible electronics and displays,’ Microelectronic Eng.142, pp. 36-39, 2015. (DOI: 10.1016/j.mee.2015.06.008).

        {Journal Article }
      2015
      • Shah, K., Jain, A., ‘An iterative, analytical method for solving conjugate heat transfer problems,’ Int. J. Heat Mass Transfer90, pp. 1232-1240, 2015. (DOI: 10.1016/j.ijheatmasstransfer.2015.07.056). 

        {Journal Article }
      2015
      • Vishwakarma, V., Waghela, C., Jain, A., ‘Measurement of out-of-plane thermal conductivity of substrates for flexible electronics and displays,’ Microelectronic. Eng., 142, pp. 36-39, 2015.

        {Journal Article }
      2015
      • Sarkar, D., Haji-Sheikh, A., Jain, A., ‘Temperature distribution in multi-layer skin tissue in presence of a tumor,’ Int. J. Heat Mass Transfer, 91, pp. 602-610, 2015. (DOI: 10.1016/j.ijheatmasstransfer.2015.07.089). 

        {Journal Article }

      Journal Article 2014
      • Huang, Z., Jones, R.E., Jain, A., ‘Experimental investigation of electromigration failure in Cu-Sn-Cu micropads in 3D integrated circuits,’ in press, Microelectronics Engineering, 2014.

        {Journal Article }
      2014
      • Shah, K., Drake, S.J., Wetz, D.A.*, Ostanek, J.K.*, Miller, S.P.*, Heinzel, J.M.*, Jain, A., ‘An experimentally validated transient thermal model for cylindrical Li-ion cells,’ J. Power Sources, 271, pp. 262-268, 2015. 

        {Journal Article }
      2014
      • Drake, S.J., Wetz, D.A., Ostanek, J.K., Miller, S.P., Heinzel, J.M., Jain, A., ‘Measurement of anisotropic thermophysical properties of cylindrical Li-ion cells,’ J. Power Sources, 252, 298-304, 2014.

        {Journal Article }
      2014
      • Vishwakarma, V., Jain, A., ‘Measurement of in-plane thermal conductivity and heat capacity of separator in Li-ion cells using a transient DC heating method,’ J. Power Sources, 272, pp. 378-385, 2014. 

        {Journal Article }
      2014
      • Gu, L., Black, B., Ordonez, S., Mondal, A., Jain, A., Mohanty, S., ‘Microfluidic control of axonal guidance,’ Scientific Reports, 4, 6457:1-6, 2014.

        {Journal Article }
      2014
      • Sarkar, D., Shah, K., Haji-Sheikh, A.*, Jain, A., ‘Analytical modeling of temperature distribution in an anisotropic cylinder with circumferentially-varying convective heat transfer,’ Int. J. Heat Mass Transfer, 79, pp. 1027-1033, 2014. 

        {Journal Article }
      2014
      • Mirza, F., Naware, G., Jain, A., Agonafer, D.*, ‘Effect of through-silicon-via Joule heating on device performance for low-powered mobile applications,’ ASME J. Electron. Packag., 136, 041009, 2014. (DOI: 10.1115/1.4028076).

        {Journal Article }
      2014
      • Shah, K., Drake, S.J., Wetz, D.A., Ostanek, J.K., Miller, S.P., Heinzel, J.M., Jain, A., ‘Modeling of steady-state convective cooling of cylindrical Li-ion cells’, J. Power Sources, 258, pp. 374-381, 2014.

        {Journal Article }

      Conference Paper 2014
      • Drake, S.J., Martin, M., Robinson, M., Jain, A., Wetz, D.A., Ostanek, J., Miller, S., Heinzel, J.M., 'Experimental thermal characterization of various high power cylindrical Lithium ion energy storage devices', Proc. Electrical Machines Technology Symposium (EMTS), 2014, Philadelphia, PA.

        {Conference Paper }

      Conference Paper 2013
      • Banait, A., Vishwakarma, V., Choobineh, L., Jain, A., 'Growth of patterned micropores in poly-dimethylsiloxane (PDMS) using the thermocapillary effect',  Proc. ASME IMECE 2013, San Diego, CA.

        {Conference Paper }
      2013
      • Sarkar, D., Haji-Sheikh, A., Jain, A., 'Analytical temperature distribution in a multi-layer tissue structure in the presence of a tumor', Proc. ASME IMECE 2013, San Diego, CA.

        {Conference Paper }
      2013
      • Mirza, F., Naware, G., Raman, T., Jain, A., Agonafer, D., 'Effect of TSV Joule Heating on Device Performance', Proc. ASME/IEEE InterPACK 2013, San Francisco, CA.

        {Conference Paper }
      2013
      • Choobineh, L., Agonafer, D., Jain, A., 'Analytical modeling of temperature distribution in interposer-based microelectronic systems', Proc. ASME/IEEE InterPACK 2013, San Francisco, CA. 

        {Conference Paper }
      2013
      • Choobineh, L., Vo, N., Uehling, T., Jain, A., 'Experimental Measurement of the Thermal Performance of a Two-Die 3D Integrated Circuit (3D IC)', Proc. ASME/IEEE InterPACK 2013, San Francisco, CA.

        {Conference Paper }

      Journal Article 2013
      • Lingam, D., Parikh, A.R., Huang, J., Jain, A., Minary-Jolandan, M.*, ‘Nano/Microscale pyroelectric energy harvesting: Challenges and opportunities,’Int. J. Smart Nano. Mater., 4, pp. 1-17, 2013.

        {Journal Article }
      2013
      • Patel, B., Jain, A., 'Thermal modeling of ultra-violet nanoimprint lithography,' ASME J. Manufac. Sc. Engg. (Special Issue on Thermally Assisted Manufacturing), 135(6), pp. 064501, 2013.

        {Journal Article }
      2013
      • Banait, A., Vishwakarma, V., Choobineh, L., Jain, A., 'Thermally-assisted spatially-directed pore formation in Poly-dimethylsiloxane (PDMS),' Appl. Phys. Lett., 103, 153702, 2013.

        {Journal Article }
      2013
      • Choobineh, L., Jain, A., 'Determination of temperature distribution in three-dimensional integrated circuits (3D ICs) with unequally-sized die', Applied Thermal Engineering, 56, 2013, pp. 176-184.

        {Journal Article }

      Journal Article 2012
      • Javed, A., Iqbal, S., Jain, A., ‘Microheater Platform for Selective Detachment of DNA’, Appl. Phys. Lett., 101, 093707, 2012.
        {Journal Article }
      2012
      • Choobineh, L., Jain, A., 'Analytical solution for steady-state and transient temperature field in vertically integrated three-dimensional integrated circuits (3D ICs)', IEEE Transactions on Components, Packaging and Manufacturing Technology, 2(12), 2012, pp. 2031-2039.

        {Journal Article }

      Conference Paper 2012
      • Vishwakarma, V., Singhal, N., Khullar, V., Tyagi, H., Taylor, R.A., Otanicar, T.P., Jain, A., 'Space cooling using the concept of nanofluids-based direct absorption solar collectors', Proc. ASME Intl Mech Engg Conf Expo (IMECE), Houston, TX, 2012

        {Conference Paper }

      Journal Article 2011
      • Jain, A., Alam, S.M., Pozder, S., Jones, R.E., ‘Thermal-electrical co-optimization of block-level floorplanning in 3D integrated circuits’, 5(3), IET Computers & Digital Techniques, pp. 169-178, 2011.
        {Journal Article }
      2011
      • Jain, A., Goodson, K.E., ‘Thermal phenomena in biological microdevices’, 36, 209–218, J Thermal Biol, 2011.
        {Journal Article }

      Conference Paper 2010
      • Jain, A., ‘Thermal characteristics of multi-die, three-dimensional integrated circuits with unequally sized die’, IEEE ITherm, Las Vegas, 2010.
        {Conference Paper }

      Journal Article 2010
      • Savidis, I., Alam, S.M., Jain, A., Pozder, S., Jones, R.E., Chatterjee, R., ‘Electrical modeling and characterization of through-silicon vias (TSVs) for 3D integrated circuits’, Microelectronics J, 41(2), pp. 9-16, 2010.
        {Journal Article }
      2010
      • Alam, S.M., Jones, R.E., Pozder, S., Chatterjee, R., Jain, A., ‘New design considerations for cost effective three-dimensional (3D) system integration’, IEEE Trans VLSI Systems, 18(3), pp. 450-460, 2010.
        {Journal Article }
      2010
      • Jain, A., Jones, R.E., Chatterjee, R., Pozder, S., Huang, Z., ‘Analytical and Numerical Modeling of the ThermalPerformance of Three-Dimensional Integrated Circuits’, IEEE Trans Components & Packaging Technologies, 33(1), pp. 56-63, 2010.
        {Journal Article }

      Conference Paper 2009
      • Jain, A., Alam, S., Pozder, S., Jones, R.E., ‘Thermal-electrical co-optimization of block-level floorplanning in 3D integrated circuits’, IEEE/ASME Interpack, San Francisco, 2009.
        {Conference Paper }
      2009
      • Alam, S., Jones, R.E., Pozder, S., Jain, A., ‘Die/Wafer stacking with reciprocal design symmetry (RDS) for mask reuse in three-dimensional (3D) integration technology’, IEEE ISQED, San Jose, CA, 2009.
        {Conference Paper }

      Journal Article 2009
      • Kodama, T., Jain, A., Goodson, K.E., ‘Heat conduction through a DNA-Gold composite’, Nano Lett, 9, pp. 2005-2009, 2009.
        {Journal Article }
      2009
      • Jain, A., Ness, K., Goodson, K.E., ‘Theoretical and experimental investigation of spatial temperature gradient effects on cells’, Sensors & Actuators B: Chemical, 143, pp. 286-294, 2009.
        {Journal Article }

      Conference Paper 2008
      • Huang, Z., Chatterjee, R., Justison, P., Gajewski, D., Hernandez, R., Pozder, S., Jain, A., Acosta, E., Jones, R.E., ‘Electromigration of Cu-Sn-Cu micropads in 3D interconnect’, IEEE ECTC, Lake Buena Vista, FL, 2008.
        {Conference Paper }
      2008
      • Pozder, S., Jain, A., Chatterjee, R., Huang, Z., Jones, R.E., Sobczak, M., Kanagavel, S., Wilson, M., Hillmann, G., Kostner, H., Kreindl, G., Pargfreider, S., ‘Evaluation of Adhesive Fill of Thermally Compression Bonded Die on Wafer Parts Having an Inter Die Gap of 10 µm’, IEEE ECTC, Lake Buena Vista, FL, 2008.
        {Conference Paper }
      2008
      • Savidis, I., Alam, S.M., Jain, A., Pozder, S., Jones, R.E., Chatterjee, R., ‘Electrical modeling & characterization of through-silicon vias (TSVs) for 3D integrated circuits’, Invited Paper at Vertical Multi-level Interconnect Conference (VMIC), Fremont, CA, Oct 27-30, 2008.
        {Conference Paper }
      2008
      • Jain, A., Jones, R.E., Chatterjee, R., Pozder, S., Huang, Z., ‘Thermal modeling and design of 3D integrated circuits’, IEEE ITherm, Lake Buena Vista, FL, 2008 (currently the Top Accessed Paper in IEEExplore for ITherm-2008).
        {Conference Paper }
      2008
      • Pozder, S., Jain, A., Chatterjee, R., Huang, Z., Jones, R.E., Hillmann, G., Sobczak, M., Kriendl, G., Kanagavel, S., Kostner, H., Pargfrieder, S., ‘3D die on wafer Cu/Sn microconnects formed simultaneously with an adhesive dielectric bond using thermal compression bonding’, IEEE IITC, San Francisco, CA, 2008.
        {Conference Paper }
      2008
      • Pozder, S., Jain, A., Jones, R.E., Huang, Z., Chatterjee, R., ‘Reliability considerations in 3D stacked strata systems’, Invited Paper at 10th International Workshop on Stress-Induced Phenomena in Metallization, University of Texas, Austin, TX, Nov 5-7, 2008.
        {Conference Paper }

      Journal Article 2008
      • Hu, X., Jain, A., Goodson, K.E., ‘Investigation of the natural convection boundary condition in microfabricated structures’, Intl J Thermal Sciences, 47, pp. 820-824, 2008.
        {Journal Article }
      2008
      • Jain, A., Goodson, K.E., ‘Measurement of thermal conductivity and heat capacity of free-standing thin films using the 3-ω method’, ASME J Heat Transfer, 130 (10), pp. 1-7, 2008.
        {Journal Article }
      2008
      • Oh, D.-W., Jain, A., Eaton, J.K., Goodson, K.E., Lee, J.S., ‘Thermal conductivity measurement and sedimentation detection of aluminum oxide nanofluids by using the 3-omega method’, Intl J Heat and Fluid Flow, 29 (5), pp. 1456-1461, 2008.
        {Journal Article }

      Conference Paper 2007
      • Kodama, T., Jain, A., Goodson, K.E., ‘Nonmetallic conduction property of a DNA templated Gold Nanowire’, ASME InterPACK, Vancouver, Canada, July 2007.
        {Conference Paper }
      2007
      • Pozder, S., Chatterjee, R., Jain, A., Huang, Z., Jones, R.E., Acosta, E., ‘Progress of 3D integration technologies and 3D interconnects’, Invited Paper at IEEE International Interconnect Technology Conference (IITC), San Francisco, CA, June 2007.
        {Conference Paper }

      Conference Paper 2006
      • Oh, D., Jain, A., Eaton, J.K., Goodson, K.E., Lee, J.S., ‘Thermal Conductivity Measurement of Aluminum Oxide Nanofluids using the 3-Omega Method’, ASME-IMECE, Chicago, Nov 2006.
        {Conference Paper }
      2006
      • Jain, A., Ramanathan, S., ‘Theoretical investigation of sub-ambient on-chip microprocessor cooling’, IEEE ITherm, San Diego, 2006.
        {Conference Paper }
      2006
      • Jain, A., Hu, X., Goodson, K.E., ‘A new formulation for thermal transport property measurement of a two-dimensional thin film using the 3-Omega method’, ASME-ISHMT Heat & Mass Transfer Conference, Guwahati, India, Jan 2006.
        {Conference Paper }
      2006
      • Jain, A., Goodson, K.E., ‘Thermal phenomena in biological microdevices’, Invited Paper at ASME-ISHMT Heat & Mass Transfer Conference, Indian Institute of Technology (IIT), Guwahati, India, Jan 2006.
        {Conference Paper }

      Conference Paper 2005
      • Jain, A., Goodson, K.E., ‘Measurement of Thermophysical Properties of Thin Film Shape Memory Alloys using the 3-Omega Method’, ASME-IMECE, Orlando, FL, Nov 2005.
        {Conference Paper }
      2005
      • Jain, A., Goodson, K.E., ‘A Theoretical Model for Temperature Gradient Effects on Cells’, ASME National Heat Transfer Conference, San Francisco, 2005.
        {Conference Paper }
      2005
      • Hu, X., Jain, A., Goodson, K.E., ‘Investigation of the Natural Convection Boundary Condition in Microfabricated Structures’, ASME National Heat Transfer Conference, San Francisco, 2005.
        {Conference Paper }
      2005
      • Jain, A., Ness, K., Fishman, H.A., Goodson, K.E., ‘Investigation of Temperature Gradient Effects on Neurite Outgrowth in Nerve Cells using a Microfabricated Heater Structure’, 3rd International IEEE-EMBS Conference on Microtechnologies in Medicine and Biology, Oahu, HI, 2005.
        {Conference Paper }

      Conference Paper 2004
      • Jain, A., Ness, K., Mehenti, N., Fishman, H., Goodson, K.E., 'A Microheater Device for Study of Temperature Gradient Effects on Neurite Outgrowth in Retinal Ganglion Cells', ARVO Annual Meeting, Ft. Lauderdale, FL, 2004.
        {Conference Paper }
      2004
      • Jain, A., Upadhyay, R.R., Chandra, S., Saini, M., Kale, S., 'Experimental investigation of the flow field of a ceiling fan', ASME Heat Transfer/Fluids Engineering Summer Conference, Charlotte, NC, 2004.
        {Conference Paper }

      Conference Paper 2003
      • Jain, A., Ness, K., McConnell, A., Jiang, L., Goodson, K.E., 'Design, fabrication and thermal characterization of a MEMS device for control of nerve cell growth', ASME-IMECE, Washington DC, 2003.
        {Conference Paper }

Presentations

    • July  2018
      Heat Transfer in Electrochemical Energy Conversion and Storage Systems
      Distinguished Seminar, Department of Mechanical Engineering, Amrita University, Amritapuri, India, July 30, 2018.
    • May  2018
      Analytical Methods for Understanding Multiscale Thermal Transport in Li-Ion Batteries Towards Improved Safety and Performance
      Invited Talk, Symposium on Multiscale Modeling, Simulation and Design, 233rd Electrochemical Society Meeting, Seattle, WA, May 16, 2018. 
    • February  2018
      Thermal Transport in Li-ion Cells: Materials, Processes and Metrology
      Mechanical Engineering Department, University of Houston, Houston, TX, Feb 16, 2018.
    • November  2017
      Fundamental Study of Thermal Transport in a Li-ion Cell for Enhanced Renewable Energy Conversion
      Invited Participant, 5th Arab-American Frontiers of Science, Engineering, and Medicine Symposium, organized by U.S. National Academy of Sciences, Rabat, Morocco, Nov 2-4, 2017
    • August  2017
      Industry and Academic Careers for Graduate Students
      Invited Panelist, Graduate Student Careers Workshop, ASME InterPACK, San Francisco, August 29-31, 2017
    • June  2017
      Analytical Methods for Understanding Multiscale Thermal Transport in Li-Ion Batteries
      Invited Presentation, International Symposium on Advances in Computational Heat Transfer, Napoli, Italy, May 28 – June 1, 2017
    • June  2017
      The Role of Temperature Measurement and Modeling in Battery Diagnostics and Health Management
      Invited Panel Talk, 8th IEEE International Conference on Prognostics and Health Management, Dallas, TX, June 19-21, 2017
    • June  2017
      Leveraging Industry Experience for Success in an Academic Career
      Invited FutureME Mini-Talk, ASME Power & Energy Conference & Exhibition, Charlotte, NC, June 26-30, 2017
    • June  2017
      Measurement and Modeling of Thermal Transport Processes in Li-ion Cells for Improved Safety and Performance
      Plenary Talk, ASME 15th International Conference on Fuel Cell Science, Engineering and Technology, Charlotte, NC, June 26-30, 2017
    • February  2017
      Experimental and Analytical Research on Heat Transfer in Li-ion Cells
      Invited Talk, Department of Mechanical & Aerospace Engineering, New Mexico State University, Las Cruces, NM, Feb 21, 2017.
    • February  2017
      Safety of Li-ion Batteries – A Thermal Engineering Perspective
      Invited Talk, Energy Storage System Safety Forum 2017, Santa Fe, NM, Feb 22-23, 2017.         
    • January  2017
      Thermal Transport in Li-ion Cells – Measurements and Modeling
      Invited Talk, Department of Mechanical Engineering, Indian Institute of Technology, Delhi (IITD), India, Jan 11, 2017.
    • November  2016
      Thermal Transport in Li-ion Cells: Materials, Processes and Metrology
      Invited Talk, NSF Nanosystems Engineering Research Center, University of Texas, Austin, TX, Nov 11, 2016.
    • June  2016
      Thermal Transport in Li-ion Cells: Materials, Processes and Metrology

      Invited Talk, Indo-US Workshop on Recent Advances in Analysis of Multiphysics Phenomena in Li-ion Cells, Indian Institute of Technology (IIT) Bombay, Mumbai, India, June 17-19, 2016.

    • November  2015
      Measurement and Optimization of Thermal Transport in Li-Ion Cells for Improved Performance and Safety

      Invited Talk, 6th Annual Battery Safety Conference, Baltimore, MD, Nov 17-19, 2015.

    • June  2015
      Thermal Engineering of Three-Dimensional Integrated Circuits (3D ICs)

      Invited Talk, AMD Research, Austin, TX, June 29, 2015.

    • December  2014

      Thermal Phenomena in Biological Microsystems

      Invited Talk, Indo-US Workshop on Nanotechnology in Medicine, New Delhi, Dec 17-19, 2014.

    • December  2014
      Thermal Phenomena in Biological Microsystems

      Invited Talk, Conclave on Nano-Biotechnology 2014, Institute of Nano Science and Technology, Chandigarh, India, Dec 22, 2014.

    • November  2014
      Research Careers in Industry and Academia: Transitions from One to the Other

      Invited Presentation, Session 13-20-1: “Preparing for Success - Careers in Industry, Academia and Government”, ASME International Mechanical Engineering Congress and Exposition (IMECE), Montreal, Canada, Nov 17, 2014

    • November  2014
      Thermal Transport Phenomena in Engineering and Biomedical Microdevices

      Invited Talk, Nanotechnology and Integrated Microsystems Student Association (NIMSA), University of Michigan, Nov 6, 2014

    • October  2014
      Thermal Microdevices for Energy and Biomedical Applications

      Invited Talk, Arlington Technology Association, Arlington, TX, Oct 1, 2014.

    • September  2014
      Thermal Transport Phenomena in Li-ion Batteries

      Invited Talk, Oak Ridge National Laboratory, Oak Ridge, TN, Sep 25, 2014.

    • March  2014

      Thermal and Electrical Modeling of Three-Dimensional Integrated Circuits

      Invited Short Course at IEEE SEMI-THERM conference, San Jose, CA, March 9, 2014.

    • December  2013

      Thermal Phenomena in Biological Microdevices.

      Invited Seminar, Indo-US Workshop on Micro/Nanoscale Heat Transfer, Indian Institute of Technology (IIT), Ropar, India, Dec 21-22, 2013.

    • August  2013

      Experimental and Analytical Characterization of Thermal Transport in Li-ion Batteries

      Invited Seminar, Aerospace Vehicles Directorate, Air Force Research Labs (AFRL), Wright Patterson Air Force Base (WPAFB), OH, July 30, 2013.

    • February  2013

      Thermal Modeling and Design of Three-Dimensional Integrated Circuits: Challenges and Opportunities

      Invited Seminar, Information Science Institute (ISI), University of Southern California, Feb 6, 2013.

    • September  2012

      Temperature measurement in semiconductor devices

      Invited Seminar, Advanced Micro Devices (AMD), Austin, TX, Sep 14, 2012.

    • February  2012

      Challenges in Packaging of Three-Dimensional Integrated Circuits

      Invited Seminar, Freescale Semiconductor, Austin, TX, Feb 17, 2012.

    • September  2011

      Thermal Management of Advanced Microelectronics

      Invited Seminar, SVTC Technologies, San Jose, CA, Sep 6, 2011.

    • May  2011

      Microscale Heat Transfer & Fluid Mechanics: Applications in Energy and Bioengineering'

      Invited Seminar, University of Texas, Arlington, May 16, 2011.

    • June  2010

      Thermal management of three-dimensional integrated circuits: Challenges and opportunities

      Invited Tutorial, IEEE ITherm-2010, Las Vegas, NV, June 2, 2010.

    • April  2010

      Microscale heat transfer & fluid mechanics: Applications in energy and bioengineering

      Invited Seminar, School of Mechanical Engineering, Nanyang Technological University, Singapore, April 19, 2010.

    • January  2010

      Microscale heat transfer & fluid mechanics

      Invited Seminar, Department of Mechanical Engineering, University of Canterbury, Christchurch, New Zealand, January 12, 2010.

    • July  2009

      Thermal and fluidic microdevices: Applications in energy and bioengineering

      Invited Seminar, Department of Mechanical Engineering, Texas A&M University, College Station, TX, July 6, 2009.

    • March  2009

      Three-dimensional microelectronics packaging

      Invited Seminar, Austin IEEE CPMT Workshop on 3D Packaging, Austin, TX, March 27, 2009.

    • February  2009

      Thermal phenomena in thin films and biological microsystems

      Invited Seminar, Mechanical, Materials and Aerospace Department, Illinois Institute of Technology (IIT), Chicago, IL, February 24, 2009.

    • January  2009

      Thermal-electrical-mechanical co-design in 3D microelectronics

      Invited Seminar, Micron Research Center, Utah State University, Logan, UT, Jan 30, 2009.

    • November  2008

      Needs and opportunities in thermal modeling and CAD of three-dimensional (3D) integrated circuits

      Invited Seminar, Workshop on Integrated CAD Tools for Next Generation Thermal Management Methodologies and Devices: Status and Needs, Georgia Institute of Technology, Atlanta, GA, Nov 17, 2008.

    • November  2008

      Thermal challenges and opportunities in 3D integrated circuits

      Invited Seminar, 5th International Conference for Semiconductor Integration and Packaging, San Francisco, CA, Nov 17-19, 2008.

    • September  2008

      Three-dimensional (3D) technology: An overview of challenges and opportunities

      Invited Seminar, 3D Design & Architecture Workshop, National Tsing Hua University, Hsin-Chu, Taiwan, Sep 9, 2008.

Support & Funding

This data is entered manually by the author of the profile and may duplicate data in the Sponsored Projects section.
    • Mar 2016 to Feb 2021 CAREER: Safe, High-Performance Li-Ion Batteries Through a Fundamental Investigation of Thermal Transport in Electrochemical Materials and Interfaces sponsored by  - $500000
    • Jan 2015 to Dec 2017 Distributed Wireless Antenna Sensors for Boiler Condition Monitoring sponsored by  - $399311
    • Sept 2015 to Aug 2017 Collaborative Research: EAGER: Enhancing Pyroelectric Effects in Nanostructured Materials for High-Efficiency Energy Conversion sponsored by  - $225000
    • Oct 2015 to Apr 2016 Rolled-Ribbon Thermal Model Development sponsored by  - $21810
    • Aug 2013 to Jan 2016 Veteran's Research Supplement: GOALI: Experimental and Theoretical Investigation of Thermal Transport in Three-Dimensional Integrated Circuits (3D ICs) - sponsored by  - $10000
    • June 2013 to Jan 2016 REU Supplement: GOALI: Experimental and Theoretical Investigation of Thermal Transport in Three-Dimensional Integrated Circuits (3D ICs) - sponsored by  - $6000
    • June 2013 to Aug 2014 Thermal Characterization of Cylindrical Electrochemical Energy Storage Devices through Analytical and Experimental Methods sponsored by  - $152078
    • Feb 2013 to Feb 2014 Indo-US Workshop: Recent Advances in Micro/Nano-scale Heat Transfer and Applications in Clean Energy Technologies sponsored by  - $25000
    • July 2013 to Dec 2013 Cylindrical Geometry Energy Storage Cooling Architectures sponsored by  - $21600
    • Sept 2012 to Jan 2016 GOALI: Experimental and Theoretical Investigation of Thermal Transport in Three-Dimensional Integrated Circuits (3D ICs) sponsored by  - $200641
    • June 2012 to May 2013 Thermal Management of MicroPhotoVoltaic (micro-PV) Devices for High Efficiency Energy Generation sponsored by  - $9850
    • July 2014 to June 2015 Multiscale Thermal Characterization and Evaluation of Electrochemical Energy Storage Materials, Cells and Modules at Nominal and High C Rates sponsored by  - $288601
    • Nov 2014 to Jan 2015 Thermal management of electronic devices using high precision additive manufacturing sponsored by  - $2800
    • Aug 2014 to Oct 2014 Evaluation and Characterization of the Thermal Properties of Electrochemical Energy Storage Devices Through Analytical and Experimental Methods sponsored by  - $99960
    • Sept 2014 to Sept 2014 Exploratory Visit for ORNL-UTA Collaboration on Thermally Enhanced Li-ion Batteries sponsored by  - $800

Students Supervised

  • Doctoral
    • Present
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      Vivek Vishwakarma is pursuing his Ph.D. under my supervision. He investigates thermal effects on DNA and proteins.

    • Present
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      Krishna Shah is pursuing his Ph.D. under my supervision. He investigates thermal transport in energy storage devices.

    • Aug 2016
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    • Dec 2014
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      Stephen Drake completed his Ph.D. under my supervision. He carried out research on energy storage devices. Stephen is now an R&D Manager at Thermon, Inc.

    • Aug 2014
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      Leila Choobineh worked on her Ph.D. degree under my supervision. She conducted experimental and theoretical research for understanding thermal phenomena in 3D integrated circuits. Leila is now an Assistant Professor at SUNY Polytechnic Institute, Utica, NY.

  • Master's
    • Present
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      Hardik is carrying out research on thermal property measurements.

    • Present
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      Salwa is an MS student carrying out research on thermal property measurements and thermal runaway in Li-ion cells.

    • Present
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      Ratnesh is carrying out research on analytical heat transfer modeling for 3D ICs.

    • Present

      Swapnil is carrying out research on analytical modeling of heat transfer with spatially varying convection, such as in an impinging jet.

    • Dec 2016

      Dean Anthony is an MS student who carried out research on non-invasive internal temperature measurement.

    • May 2015
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      Mohammad Parhizi completed his M.S. under my supervision. He worked on a research project on vapor chambers for electronic cooling. This project was mentored by a senior engineer from AMD, Austin, TX.

       

    • Aug 2013
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      Bhavik Patel completed his MS thesis in Mechanical Engineering under my supervision. His research investigated thermal and thermomechanical optimization of nanoimprint lithography.

    • May 2012
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      Annas Javed completed his MS in Electrical Engineering under my supervision. His research was focused on thermal dynamics of DNA attachment on inorganic surfaces. 

  • Undergraduate
    • Present
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      Nicolas is a undergraduate McNair scholar who is carrying out research on liquid thermal property measuerments. 

    • Present
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      Bilal is an undergrad student who carries out research on heat transfer in energy systems.

    • Present
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      Chirag contributed towards thermal characterization research in our laboratory.

    • Present
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      Divya is an undergraduate student who carries out research in our lab on thermal analysis and modeling of energy conversion devices.

    • Aug 2014
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      Laura is an undergraduate student who will carry out research in my lab during summer, 2014 under the AURAS program that seeks to attract and retain students from traditionally under-represented groups in STEM majors.

    • May 2014
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      Arya Banait is an undergraduate student majoring in Mechanical Engineering. She conducted her Honors thesis research in my laboratory on thermally-driven self-assembled pores in soft polymers. Upon completion of her degree, she joined the graduate program in Mechanical Engineering at Stanford University.

    • May 2014
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      Mark Robinson is an undergraduate student who carried out research on thermal measurements and energy storage devices in my laboratory.

    • Sept 2013
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      Jared is an undergraduate student majoring in Bioengineering. He spent his summer of 2013 in my laboratory conducting research on ultra-fast thermal data acquisition for 3D ICs.

Collaborators

    • thumbnail
      Duration : Aug 2013 to Present

      Research collaborator from Information Sciences Institute, University of Southern California

    • thumbnail
      Duration : Aug 2012 to Present

      Research Collaborator, Department of Electrical Engineering, UT Arlington

    • thumbnail
      Duration : Aug 2013 to Present

      Research Collaborator, Department of Mechanical and Aerospace Engineering, UT Arlington

    • thumbnail
      Duration : Aug 2012 to Present

      Research Collaborator, Department of Mechanical and Energy Engineering, Indian Institute of Technology (IIT), Ropar, India

    • thumbnail
      Duration : Feb 2013 to Present

      Research collaborator from US Navy

    • thumbnail
      Duration : Aug 2012 to Present

      Research Collaborator, Department of Mechanical Engineering, UT Dallas

    • thumbnail
      Duration : Aug 2011 to Present

      Research Collaborator, Department of Physics, UT Arlington

    • thumbnail
      Duration : Aug 2011 to Present

      Research Collaborator, Department of Electrical Engineering, UT Arlington

    • thumbnail
      Duration : Feb 2013 to Present

      Research collaborator from US Navy

Courses

      • ME 5316-001 THERMAL CONDUCTION

        Thermal Conduction is a fundamental graduate-level course that develops an understanding of the flow of heat by conduction. This course provides the basic skills and tools necessary for detailed design and analysis of engineering systems in which thermal conduction plays a significant. This course is based on and teaches a considerable amount of engineering mathematics, particularly the analysis of ordinary and partial differential equations. Concepts learnt in this class will be helpful for real-life applications in engineering as well as for advanced graduate-level research work.

        Fall - Regular Academic Session - 2018 Download Syllabus Contact info & Office Hours1 Document
      • ME 5316-002 THERMAL CONDUCTION

        Thermal Conduction is a fundamental graduate-level course that develops an understanding of the flow of heat by conduction. This course provides the basic skills and tools necessary for detailed design and analysis of engineering systems in which thermal conduction plays a significant. This course is based on and teaches a considerable amount of engineering mathematics, particularly the analysis of ordinary and partial differential equations. Concepts learnt in this class will be helpful for real-life applications in engineering as well as for advanced graduate-level research work.

        Fall - Regular Academic Session - 2018 Download Syllabus Contact info & Office Hours1 Document
      • MAE 3310-002 THERMODYNAMICS I

        Thermodynamics I is a fundamental course that teaches concepts of energy and thermodynamics. This course provides the basic skills and tools necessary in designing and analyzing real-life engineering systems. This course will also serve as preparation for other advanced courses in thermodynamics, energy conversion, heat transfer, etc. Emphasis in this course will be on engineering concepts.

        Spring - Regular Academic Session - 2018 Download Syllabus Contact info & Office Hours
      • ME 5390-006 Thermal Phenomena in Microsystems

        ‘Thermal Phenomena in Microsystems’ is an advanced graduate class that will introduce experimental methods for microscale and nanoscale thermal transport to interested graduate students. This course will introduce basic research methods, experimental measurement techniques, analytical tools, etc. Significant emphasis will be placed on reading recent research literature and carrying out mini-projects based on literature search. 

        Spring - Regular Academic Session - 2018 Download Syllabus Contact info & Office Hours
      • ME 5316-001 THERMAL CONDUCTION

        Thermal Conduction is a fundamental graduate-level course that develops an understanding of the flow of heat by conduction. This course provides the basic skills and tools necessary for detailed design and analysis of engineering systems in which thermal conduction plays a significant. This course is based on and teaches a considerable amount of engineering mathematics, particularly the analysis of ordinary and partial differential equations. Concepts learnt in this class will be helpful for real-life applications in engineering as well as for advanced graduate-level research work.

        Fall - Regular Academic Session - 2017 Download Syllabus Contact info & Office Hours
      • ME 5316-002 THERMAL CONDUCTION

        Thermal Conduction is a fundamental graduate-level course that develops an understanding of the flow of heat by conduction. This course provides the basic skills and tools necessary for detailed design and analysis of engineering systems in which thermal conduction plays a significant. This course is based on and teaches a considerable amount of engineering mathematics, particularly the analysis of ordinary and partial differential equations. Concepts learnt in this class will be helpful for real-life applications in engineering as well as for advanced graduate-level research work.

        Fall - Regular Academic Session - 2017 Download Syllabus Contact info & Office Hours
      • ME 5390-007 SPECIAL TOPICS IN MECHANICAL ENGINEERING

        ‘Thermal Phenomena in Microsystems’ is an advanced graduate class that will introduce experimental methods for microscale and nanoscale thermal transport to interested graduate students. This course will introduce basic research methods, experimental measurement techniques, analytical tools, etc. Significant emphasis will be placed on reading recent research literature and carrying out mini-projects based on literature search. 

        Spring - Regular Academic Session - 2017 Download Syllabus Contact info & Office Hours
      • MAE 3310-002 THERMODYNAMICS I

        Thermodynamics I is a fundamental course that teaches concepts of energy and thermodynamics. This course provides the basic skills and tools necessary in designing and analyzing real-life engineering systems. This course will also serve as preparation for other advanced courses in thermodynamics, energy conversion, heat transfer, etc. Emphasis in this course will be on engineering concepts.

        Spring - Regular Academic Session - 2017 Download Syllabus Contact info & Office Hours
      • ME 5316-001 THERMAL CONDUCTION

        Thermal Conduction is a fundamental graduate-level course that develops an understanding of the flow of heat by conduction. This course provides the basic skills and tools necessary for detailed design and analysis of engineering systems in which thermal conduction plays a significant. This course is based on and teaches a considerable amount of engineering mathematics, particularly the analysis of ordinary and partial differential equations. Concepts learnt in this class will be helpful for real-life applications in engineering as well as for advanced graduate-level research work.

        Fall - Regular Academic Session - 2016 Download Syllabus Contact info & Office Hours
      • ME 5316-002 THERMAL CONDUCTION

        Thermal Conduction is a fundamental graduate-level course that develops an understanding of the flow of heat by conduction. This course provides the basic skills and tools necessary for detailed design and analysis of engineering systems in which thermal conduction plays a significant. This course is based on and teaches a considerable amount of engineering mathematics, particularly the analysis of ordinary and partial differential equations. Concepts learnt in this class will be helpful for real-life applications in engineering as well as for advanced graduate-level research work.

        Fall - Regular Academic Session - 2016 Download Syllabus Contact info & Office Hours
      • MAE 3310-002 THERMODYNAMICS I

        Thermodynamics I is a fundamental course that teaches concepts of energy and thermodynamics. This course provides the basic skills and tools necessary in designing and analyzing real-life engineering systems. This course will also serve as preparation for other advanced courses in thermodynamics, energy conversion, heat transfer, etc. Emphasis in this course will be on engineering concepts.

        Spring - Regular Academic Session - 2016 Download Syllabus Contact info & Office Hours
      • MAE 4301-007 Power Plant Engineering

        Power Plant Engineering is a new elective class that teaches the fundamental thermodynamics and heat transfer principles behind design and optimization of power generation systems. There will be a significant emphasis on component and system design. This class will cover a number of power plant types, including coal/gas fired power plants, hydroelectric power plants, nuclear power plants, solar power plants, etc. Concepts learnt in this class may be helpful for an engineering career in power plants, oil, gas and other related industries.

        Spring - Regular Academic Session - 2016 Download Syllabus Contact info & Office Hours
      • ME 5390-007 Power Plant Engineering

        Power Plant Engineering is a new elective class that teaches the fundamental thermodynamics and heat transfer principles behind design and optimization of power generation systems. There will be a significant emphasis on component and system design. This class will cover a number of power plant types, including coal/gas fired power plants, hydroelectric power plants, nuclear power plants, solar power plants, etc. Concepts learnt in this class may be helpful for an engineering career in power plants, oil, gas and other related industries.

        Spring - Regular Academic Session - 2016 Download Syllabus Contact info & Office Hours
      • ME 5316-002 THERMAL CONDUCTION

        Thermal Conduction is a fundamental graduate-level course that develops an understanding of the flow of heat by conduction. This course provides the basic skills and tools necessary for detailed design and analysis of engineering systems in which thermal conduction plays a significant. This course is based on and teaches a considerable amount of engineering mathematics, particularly the analysis of ordinary and partial differential equations. Concepts learnt in this class will be helpful for real-life applications in engineering as well as for advanced graduate-level research work.

        Fall - Regular Academic Session - 2015 Download Syllabus Contact info & Office Hours
      • ME 5316-001 THERMAL CONDUCTION

        Thermal Conduction is a fundamental graduate-level course that develops an understanding of the flow of heat by conduction. This course provides the basic skills and tools necessary for detailed design and analysis of engineering systems in which thermal conduction plays a significant. This course is based on and teaches a considerable amount of engineering mathematics, particularly the analysis of ordinary and partial differential equations. Concepts learnt in this class will be helpful for real-life applications in engineering as well as for advanced graduate-level research work.

        Fall - Regular Academic Session - 2015 Download Syllabus Contact info & Office Hours
      • MAE 3310-002 THERMODYNAMICS I

        Thermodynamics I is a fundamental course that teaches concepts of energy and thermodynamics. This course provides the basic skills and tools necessary in designing and analyzing real-life engineering systems. This course will also serve as preparation for other advanced courses in thermodynamics, energy conversion, heat transfer, etc. Emphasis in this course will be on engineering concepts.

        Spring - Regular Academic Session - 2015 Download Syllabus Contact info & Office Hours
      • ME 5390-006 SPECIAL TOPICS IN MECHANICAL ENGINEERING (Thermal Phenomena in Microsystems)

        ‘Thermal Phenomena in Microsystems’ is a research-oriented advanced graduate class that will introduce research methods in microscale and nanoscale thermal transport to interested graduate students. It is expected that the students are already pursuing research in a related topic. This course will introduce basic research methods, experimental measurement techniques, analytical tools, etc. Significant emphasis will be placed on reading recent research literature and carrying out mini-projects based on literature search. 

        Spring - Regular Academic Session - 2015 Download Syllabus Contact info & Office Hours
      • ME 5316-001 Thermal Conduction

        Thermal Conduction is a fundamental graduate-level course that develops an understanding of the flow of heat by conduction. This course provides the basic skills and tools necessary for detailed design and analysis of engineering systems in which thermal conduction plays a significant. This course is based on and teaches a considerable amount of engineering mathematics, particularly the analysis of ordinary differential equations. Concepts learnt in this class will be helpful for real-life applications in engineering as well as for advanced graduate-level research work.

        Fall - Regular Academic Session - 2014 Download Syllabus Contact info & Office Hours
      • ME 5316-002 Thermal Conduction

        Thermal Conduction is a fundamental graduate-level course that develops an understanding of the flow of heat by conduction. This course provides the basic skills and tools necessary for detailed design and analysis of engineering systems in which thermal conduction plays a significant. This course is based on and teaches a considerable amount of engineering mathematics, particularly the analysis of ordinary differential equations. Concepts learnt in this class will be helpful for real-life applications in engineering as well as for advanced graduate-level research work.

        Fall - Regular Academic Session - 2014 Download Syllabus Contact info & Office Hours
      • MAE 3310-002 Thermodynamics I

        Thermodynamics I is a fundamental course that teaches concepts of energy and thermodynamics. Emphasis in this course will be on engineering concepts. This course provides the basic skills and tools necessary in designing and analyzing real-life engineering systems. This course will also serve as preparation for other advanced courses in thermodynamics, energy conversion, heat transfer, etc. At the end of this course offering, the material covered will enable the students to perform energy calculations of engineering systems and analyze the feasibility of the processes undergone by the systems. The students will have an understanding of the following key topics to be covered this semester. 1. Determining properties of real substances, such as steam and refrigerant 134-a, and ideal gases from either tabular data or equations of state. 2. Analyzing processes involving ideal gases and real substances as working fluids in both closed systems and open systems or control volumes to determine process diagrams. Applying the first law of thermodynamics to perform energy balances, and determining heat and work transfers. 3. Analyzing system, process feasibility and efficiency for open and closed systems.

        Spring - Regular Academic Session - 2014 Download Syllabus Contact info & Office Hours
      • ME 5316-001 Thermal Conduction

        Thermal Conduction is a fundamental graduate-level course that develops an understanding of the flow of heat by conduction. This course provides the basic skills and tools necessary for detailed design and analysis of engineering systems in which thermal conduction plays a significant. This course is based on and teaches a considerable amount of engineering mathematics, particularly the analysis of ordinary differential equations. Concepts learnt in this class will be helpful for real-life applications in engineering as well as for advanced graduate-level research work.

        Fall - Regular Academic Session - 2013 Download Syllabus Contact info & Office Hours
      • ME 5316-002 Thermal Conduction

        Thermal Conduction is a fundamental graduate-level course that develops an understanding of the flow of heat by conduction. This course provides the basic skills and tools necessary for detailed design and analysis of engineering systems in which thermal conduction plays a significant. This course is based on and teaches a considerable amount of engineering mathematics, particularly the analysis of ordinary differential equations. Concepts learnt in this class will be helpful for real-life applications in engineering as well as for advanced graduate-level research work.

        Fall - Regular Academic Session - 2013 Download Syllabus Contact info & Office Hours
      • ME 4301-007 Power Plant Engineering

        Power Plant Engineering is a new elective class that teaches the fundamental thermodynamics and heat transfer principles behind design and optimization of power generation systems. There will be a significant emphasis on component and system design. This class will cover a number of power plant types, including coal/gas fired power plants, hydroelectric power plants, nuclear power plants, solar power plants, etc. Concepts learnt in this class may be helpful for an engineering career in power plants, oil, gas and other related industries.

        Fall - Regular Academic Session - 2013 Download Syllabus Contact info & Office Hours
      • AE 5101-001 Ae 5101-001

        Graduate Seminar is a weekly seminar series featuring research presentations from students and external speakers. This class will help graduate students broaden their perspectives by learning about ongoing research at UT Arlington and outside. In addition, students who give presentations in the seminar will improve their oral communication skills. Graduate students enrolled in this class are expected to attend the seminars each week.

        Fall - Regular Academic Session - 2013 Download Syllabus Contact info & Office Hours
      • MAE 3310-001 Thermodynamics I
        Thermodynamics I is a fundamental course that teaches concepts of energy and thermodynamics. Emphasis in this course will be on engineering concepts. This course provides the basic skills and tools necessary in designing and analyzing real-life engineering systems. This course will also serve as preparation for other advanced courses in thermodynamics, energy conversion, heat transfer, etc. At the end of this course offering, the material covered will enable the students to perform energy calculations of engineering systems and analyze the feasibility of the processes undergone by the systems. The students will have an understanding of the following key topics to be covered this semester. 1. Determining properties of real substances, such as steam and refrigerant 134-a, and ideal gases from either tabular data or equations of state. 2. Analyzing processes involving ideal gases and real substances as working fluids in both closed systems and open systems or control volumes to determine process diagrams. Applying the first law of thermodynamics to perform energy balances, and determining heat and work transfers. 3. Analyzing system, process feasibility and efficiency for open and closed systems.
        Spring - Regular Academic Session - 2013 Download Syllabus 1 Link
      • MAE 5316-002 Thermal Conduction
        This is the online version of MAE5316 - Thermal Conduction. Thermal Conduction is a fundamental graduate-level course that develops an understanding of the flow of heat by conduction. This course provides the basic skills and tools necessary for detailed design and analysis of engineering systems in which thermal conduction plays a significant. This course is based on and teaches a considerable amount of engineering mathematics, particularly the analysis of ordinary differential equations. Concepts learnt in this class will be helpful for real-life applications in engineering as well as for advanced graduate-level research work. This is section 2 of the class, for students attending remotely.
        Fall - Regular Academic Session - 2012 Download Syllabus
      • MAE 5316-001 Thermal Conduction

        Thermal Conduction is a fundamental graduate-level course that develops an understanding of the flow of heat by conduction. This course provides the basic skills and tools necessary for detailed design and analysis of engineering systems in which thermal conduction plays a significant. This course is based on and teaches a considerable amount of engineering mathematics, particularly the analysis of ordinary differential equations. Concepts learnt in this class will be helpful for real-life applications in engineering as well as for advanced graduate-level research work.

        Fall - Regular Academic Session - 2012 Download Syllabus Contact info & Office Hours
      • MAE 3310-001 Thermodynamics I
        Thermodynamics I is a fundamental course that teaches concepts of energy and thermodynamics. Emphasis in this course will be on engineering concepts. This course provides the basic skills and tools necessary in designing and analyzing real-life engineering systems. This course will also serve as preparation for other advanced courses in thermodynamics, energy conversion, heat transfer, etc. At the end of this course offering, the material covered will enable the students to perform energy calculations of engineering systems and analyze the feasibility of the processes undergone by the systems. The students will have an understanding of the following key topics to be covered this semester. 1. Determining properties of real substances, such as steam and refrigerant 134-a, and ideal gases from either tabular data or equations of state. 2. Analyzing processes involving ideal gases and real substances as working fluids in both closed systems and open systems or control volumes to determine process diagrams. Applying the first law of thermodynamics to perform energy balances, and determining heat and work transfers. 3. Analyzing system, process feasibility and efficiency for open and closed systems.
        Spring - Regular Academic Session - 2012 Download Syllabus

Service to the Community

  • Other
    • Apr 2013 to  Present STEM outreach

      Conducted outreach during Engineering Saturday, April 2013 among middle school and high school students in Tarrant county. Delivered a seminar on Microsystems Engineering and conducted a hands-on laboratory tour.

Service to the Profession

  • Other
    • Aug 2012 to  Aug 2012 Topic Organizer, IMECE 2012

      Topic Organizer, ‘Heat and Mass Transfer in Biotechnology’ at ASME IMECE, Houston, 2012.

    • Aug 2012 to  Aug 2012 Session Chair, IMECE 2012

      Chair, ‘Nanoscale Phenomena in Biological Systems’ at ASME IMECE, Houston, 2012.

    • Aug 2012 to  Aug 2012 Session Chair, ITherm 2012

      Chair, ‘3D Chips – Stacked Die Cooling’, at IEEE ITherm 2012, San Diego, 2012.

    • Aug 2011 to  Aug 2011 Member, Technical Program Committee, DATE 2011

      Member, Technical Program Committee, Design, Automation & Test in Europe (DATE), 2011.

    • Aug 2011 to  Aug 2011 Session chair at InterPACK 2011

      Chair, ‘Micro- and nano-scale heat transfer’ at ASME InterPack, 2011, Portland, OR.

    • Aug 2010 to  Aug 2010 Session Chair, ITherm 2010

      Chair, ‘Data Center Thermal Management’ at IEEE ITherm, 2010, Las Vegas, NV.

    • Aug 2009 to  Aug 2009 Session Chair, InterPACK 2009

      Chair, ‘Advanced Packaging’ at ASME INTERPACK, 2009, San Francisco, CA.

    • Aug 2008 to  Aug 2008 Session Chair, ITherm 2008

      Chair, ‘Thermal Modeling and Experimental Characterization (IV)’ at IEEE ITherm, 2008, Lake Buena Vista, FL.

    • Aug 2008 to  Aug 2008 Session Chair, ITherm 2008

      Chair, ‘Microchannel Heat Sinks - Topics of recent interest: dielectric fluids, microscale characterization, novel materials’, at IEEE ITherm, Lake Buena Vista, FL, 2008.

    • Feb 2013 to  Aug 2013 Guest Editor

      Guest Editor, IEEE Transactions on Components, Packaging and Manufacturing Technologies, 2013-present.

    • Feb 2013 to  Feb 2013 Proposal Reviewer

      Proposal Reviewer, National Science Foundation, 2013.

    • Aug 2012 to  Aug 2012 Proposal Reviewer

      Proposal reviewer, ARPA-E, Department of Energy.

    • Mar 2013 to  Mar 2013 Member, Technical Program Committee

      Member, Technical Program Committee, ASEE GSW Conference, Arlington, TX, 2013.

    • Aug 2007 to  Aug 2007 Session Chair, IMECE 2007

      Co-chair, ‘Micro- and nano-scale heat transfer’ at ASME IMECE, Seattle, WA, 2007.

    • Aug 2006 to  Present Manuscript Reviewer

      Reviewer of manuscripts for Sensors & Actuators B, IEEE Transactions on Components and Packaging Technologies, ASME Journal of Electronics Packaging, ASME Journal of Bioengineering, Journal of Microlithography, Microfabrication and Microsystems, IET Computer & Digital Techniques, Microelectronics Journal, and numerous leading international conferences.

    • Aug 2013 to  Aug 2013 Session Chair, InterPACK 2013

      Co-chair, ‘Micro/nano-scale heat transfer’, ASME InterPACK 2013, San Francisco, CA, 2013.

    • Jan 2014 to  Jan 2014 Proposal Reviewer

      Proposal Reviewer, National Science Foundation, 2014

    • Nov 2013 to  Nov 2013 Session Chair, IMECE 2013

      Session Co-chair, ‘Electric, Magnetic and Thermal Phenomena in Micro and Nano Scale Systems II,’ ASME IMECE 2013, San Diego, CA, 2013.

    • May 2014 to  May 2014 Session Chair

      Session Chair, ‘3D: Back-Side & Interlayer Two-Phase Cooling,’ IEEE ITherm, Orlando, FL, 2014.

    • Nov 2014 to  Nov 2014 Topic Organizer

      Topic Organizer, ‘Heat and Mass Transfer in Biotechnology and Biodevices’, ASME IMECE, Montreal, 2014.

    • Nov 2014 to  Nov 2014 Topic Co-Organizer

      Topic Co-Organizer, ‘Manufacturing, Materials and Processes’, ASME IMECE, Montreal, 2014.

    • Nov 2013 to  Dec 2013 External Examiner

      External Examiner for the Department of Mechanical and Aerospace Engineering, University of Pretoria, South Africa, 2013.

    • Dec 2013 to  Dec 2013 Co-Organizer

      Co-Organizer, Indo-US Workshop on Micro/Nanoscale Thermal Transport, Dec. 2013.

    • Nov 2011 to  Present Technical Committee Member

      Member, ASME HTD K-16 Committee on Heat Transfer in Electronic Equipment, ASME BED/HTD K-17 Committee on Heat and Mass Transfer in Biotechnology, and ASME Electrochemical Energy Conversion and Storage technical committee.

Service to the University

  • Other
    • Aug 2012 to  Aug 2012 Departmental Committee

      Member, Committee for the Annual Review Evaluation Criteria, MAE Department, Fall 2012.

    • Aug 2011 to  Present Departmental Committee

      Member, Thermal science and energy discipline committee, MAE Department (Fall 2011 – present)

    • Aug 2011 to  Present Departmental Committee

      Member, Mechanical Engineering Committee on Graduate Students (MECOGS), MAE department.

    • Oct 2013 to  Dec 2013 Departmental Committee

      Member, Strategic Planning Committee, MAE Department, UTA, Fall 2013.

    • May 2014 to  Present Departmental Committee

      Member, Ph.D. Qualifying Examination Committee, (Spring 2014 – present)