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Dr Choong-Un Kim

[Dr Choong-Un Kim]

Academic Staff, Materials Science and Engineering
Last Updated: October 24, 2021
about me

Research Interests

Research Interests
interconnects for microelectronic devices
reliability of devices
electromigration
alloy design

Teaching Interests

Teaching Interests
Thermodynamics of materials;
Materials Analysis
Diffusion and kinetics
Reliability engineering and failure analysis

Biography

Biography

Graduated with BS and MS from Seoul Nation University in the field of Metallurgical Engineering, and PhD from Univ. California, Berkeley at 1993. After 2-yr postdoc research at LBNL joined MSE/UTA as an assistant Professor at 1996. Promoted to Professor at 2008.
Initiated a number of project since joining UTA, establishing UTA as a research place known to microelectronics industry with funding from SRC and continued collaboration with major industries like TI and Intel.

Education

Education

    • 1993 PhD in Materials Science & Engineering
      University of California Berkeley
    • 1987 MS in Metallurgical Engineering
      Seoul National University
    • 1985 BS in Metallurgical Engineering
      Seoul National University

Appointments

Appointments

    • Sept 2014 to Present Associate Chair
      Materials Science and Engineering, Univ. Texas at Arlington (Arlington)
    • Sept 2008 to Present Professor
      Materials Science and Engineering, Univ. Texas at Arlington (Arlington)
    • Sept 2007 to Aug 2013 Graduate Advisor
      Materials Science and Engineering, Univ. Texas at Arlington (Arlington)
    • Sept 2002 to Aug 2008 Associate Professor
      Materials Science and Engineering, Univ. Texas at Arlington (Arlington)
    • Sept 1996 to Aug 2002 Assistant Professor
      Materials Science and Engineering, Univ. Texas at Arlington (Arlington, TX, United States)
    • Nov 1993 to July 1996 Research Associate
      Center for Advanced Materials Lawrence Berkeley National Laboratory

Memberships

    • Jan 1996 to 2018 The Minerals, Metals and Materials Society (TMS)
      Member
    • Jan 2002 to 2017 American Society of Materials International (ASM)
      Member
    • Jan 2009 to 2014 International Physics Symposium (IRPS/IEEE)
      Member
    • Jan 1997 to 2007 Materials Research Society (MRS)
      Member
    • Jan 2002 to 2005 American Society of Mechanical Engineers (ASME)
      Member

Awards and Honors

    • Jan  2015 Invited to 2015 Ultraforum (KOFST) sponsored by 2015 Ultraforum (KOFST)
    • Jan  2013 Best Paper Award sponsored by 64th ECTC conference
    • Jan  2007 Excellent in Research award in Engineering sponsored by UT Arlington
    • Jan  2002 Outstanding Young faculty award in Engineering sponsored by UT Arlington

Support & Funding

Support & Funding

This data is entered manually by the author of the profile and may duplicate data in the Sponsored Projects section.
    • Jan 2020 to Dec 2022 Metallurgical Exploration of UBM/Solder Microstructure for Suppression of Early Electromigration Failures sponsored by  -  $130000
      Choong-un Kim (Funded)
    • Apr 2020 to July 2021 Advanced Electrical Measurement Technique for Nondestructive Damage Detection of Silicon and Package Interconnects sponsored by  -  $83000
      Choong-un Kim (Funded)
    • Aug 2019 to Aug 2022 SRC/ Texas-Instrument research fellowship for Allison Osmanson sponsored by  -  $140784
      Choong-un Kim (Funded)
    • Apr 2019 to June 2020 Study of Interface Reaction and Electromigration Failure Mechanism in Cu Wirebonds sponsored by  -  $64000
      Choong-un Kim (Funded)
    • Oct 2017 to Sept 2021 Nb3Sn Superconducting Cavities by Bronze Routes for Accelerator Stewardship sponsored by  -  $230000
      Choong-un Kim (Funded)
    • Aug 2017 to Oct 2020 Comprehensive evaluation of Electromigration Failure in Electronic Packaging for Enhanced Reliability Prediction and Design sponsored by  -  $237000
      Choong-un Kim (Funded)
    • Aug 2017 to Aug 2018 Powdered Metal Study Scope of Work – Phase 1 sponsored by  -  $6000
      Choong-un Kim (Funded)
    • Sept 2016 to Aug 2020 GOALI: Nanomanufacturing of acceptor dopant constituents for atomically precise 2D bipolar devices sponsored by  -  $200000
      (Funded)
    • Mar 2015 to Oct 2016 Corrosion Risk Assessment Study of Cooling System for Data Center sponsored by  -  $45000
      Choong-un Kim (Funded)
    • Apr 2012 to Aug 2015 Investigation on the Impact of Cu Ion Injection and Migration on the TDDB Failure Mechanism in Cu/PLK Interconnects sponsored by  -  $150000
      Choong-un Kim (Funded)
    • Apr 2011 to July 2014 Control of Viscoplasticity of Porous Ultralow-k Dielectrics sponsored by  -  $150000
      Choong-un Kim (Funded)
    • Apr 2010 to Mar 2011 Study of thermo-mechanical instability of porous low-k dielectrics sponsored by  -  $66140
      Choong-un Kim (Funded)
    • Mar 2009 to Dec 2010 Ultra High Sensitive Magnetoelectric Nanocomposite Current Sensors sponsored by  -  $74954
      Choong-un Kim (Funded)
    • July 2007 to June 2010 Ultra High Sensitive Magnetoelectric Nanocomposite Current Sensor sponsored by  -  $155287
      (Funded)
    • June 2007 to May 2008 Study of electromigration failure kinetics in Au wire bond interface and search for electromigration resistant Au alloys sponsored by  -  $50000
      Choong-un Kim (Funded)
    • Feb 2008 to Mar 2010 Study of Thermo-mechanical Instability of Porous-low-k Dielectrics: Impacts to Electrical and Mechanical Reliability of Interconnects and Possible Route to Air gap Technology sponsored by  -  $146641
      (Funded)
    • Sept 2008 to Aug 2009 MRI:Acquistion of a High-Resolution Transmission Electron Microscope to Enhance Interdisciplinary sponsored by  -  $320000
      (Funded)
    • May 2006 to Jan 2009 Development of quantum-dot mediated thermometry for biomedical application sponsored by  -  $100000
      (Funded)
    • Apr 2006 to Apr 2008 MRCEDM Infrastructure Support: Repair and Improvement of X-Ray and TEM Facilities at UT Arlington sponsored by  -  $20000
      Choong-un Kim (Funded)
    • May 2006 to Apr 2007 Exploration of New Barrier Materials for Future Generation Microelectronic Devices sponsored by  -  $10000
      Choong-un Kim (Funded)
    • May 2006 to July 2006 Grant for High School Science and Math Teachers: Risk assessment and Development of Diagnostic methodologies for low-k dielectrics sponsored by  -  $8100
      Choong-un Kim (Funded)
    • Jan 2005 to Sept 2008 Fabrication of Single Electron Devices within the Framework of CMOS Technology sponsored by  -  $319620
      (Funded)
    • June 2005 to May 2006 Flexible Interconnect Development sponsored by  -  $36920
      Choong-un Kim (Funded)
    • May 2005 to July 2005 Risk Assessment and Development of Diagnostic Methodology for Integration of Ultra Low-K Dielectrics sponsored by  -  $8100
      Choong-un Kim (Funded)
    • May 2004 to Apr 2007 Investigation of Stability of the Diffusion Barrier and its Impact on Low-K/Cu Integration Reliability sponsored by  -  $150000
      Choong-un Kim (Funded)
    • Jan 2004 to Aug 2006 ATP: Risk Assessment and Development of Diagnostic Methodology for Integration of Ultra Low-K Dielectrics sponsored by  -  $173610
      Choong-un Kim (Funded)
    • June 2004 to July 2005 Characterization of Electromigration Properties of Agere Systems AFR5Metallization Structures sponsored by  -  $89614
      (Funded)
    • June 2001 to May 2004 Mechanism of Thermal Fatigue in Cu Interconnects sponsored by  -  $150000
      Choong-un Kim (Funded)
    • July 2001 to Dec 2003 Integration and Packaging of Sensor Module sponsored by  -  $125000
      (Funded)
    • Dec 2001 to Nov 2003 Thermochemical and Mechanical Properties of Ag-Cu Sn Lead Free Solder Alloys with the Addition of Minor sponsored by  -  $238887
      (Funded)
    • July 2001 to Dec 2002 Charaterization of Electrical, Electromigration and Electro Thermal Fatique Properties of Ultra fine Cu sponsored by  -  $142000
      Choong-un Kim (Funded)
    • Mar 2001 to Sept 2001 Development of thin film deposition method for phase transition alloys sponsored by  -  $49000
      Choong-un Kim (Funded)
    • Sept 1998 to July 2003 NSF Graduate Fellowship Program sponsored by  -  $76835
      Choong-un Kim (Funded)

Publications


      2014
      • Book
        Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability
        [Lee, T. K., Bieler, T., Kim, Choong-Un, Ma, H.]. " Springer".

      2010
      • Book
        Electromigration in thin films and electronics devices: Materials and Reliability
        [Kim, Choong-Un]. London: "Woodhead Publishing Ltd.".

      Unknown
      • Book
        Abnormal growth of Cu-Sn Intermetallic Compounds”, Scripta Mater
        [Kim, M. Y., Chen, Z., Kim, Choong-Un] (1925).

      2020
      • Journal Article
        Current Crowding and Stress Effects in WCSP Solder Interconnects: A Simulative and Practical Study About the Effects of Major Electromigration Failure Mechanisms in DC and Pulsed-DC Conditions
        [Osmanson, AllsonT., Kim, Yi-ram, Madanipour, Hossein, Kim, Choong-Un]. Journal of Surface Mount Technology. "IEEE/SMTA".

      In Process
      • Journal Article
        Study of Electromigration in Sn-Ag-Cu Micro Solder Joint with Ni Interfacial Layer
        [Madanipour, H., Kim, Yi-ram, Kim, Choong-Un, Mishara, D., Thompson, P.]. Journal of Alloys and Compounds. Accepted.
      • Journal Article
        Impact of In-Situ Current Stressing on Sn Based Solder Joint Shear Stability
        [Fuller, Scott , Sheikh, Mohamed , Baty, Greg , Kim, Choong-Un, Lee, Tae-Kyu ]. Journal of Materials Science: Materials in Electronics. "Springer". Published.

      2019
      2018
      • Journal Article
        High-temperature magnetic properties of exchange-coupled SmCo/NdFeB hybrid nanocomposite magnets
        [Kim, Choong-Un, ]. IEEE Magentics Letters. 9, 1. "IEEE". DOI: http://dx.doi.org/10.1109/LMAG.2017.2788892

      2016
      • Journal Article
        Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance
        [Lee, Tae-Kyu, Chen, Zhiqiang, Baty, Greg, Bieler, ThomasR., Kim, Choong-Un]. Journal of Electronic Materials. 45(12), 6177-6183. DOI: http://dx.doi.org/10.1007/s11664-016-4902-x
      • Journal Article
        Impact of Cooling Rate-Induced Recrystallization on High G Mechanical Shock and Thermal Cycling in Sn-Ag-Cu Solder Interconnects
        [Lee, Tae-Kyu, Bieler, ThomasR., Kim, Choong-Un]. Journal of Electronic Materials. 45(1), 172-181. DOI: http://dx.doi.org/10.1007/s11664-015-4186-6
      • Journal Article
        Influence of defects and nanoscale strain on the photovoltaic properties of CdS/CdSe nanocomposite co-sensitized ZnO nanowire solar cells
        [Jung, Kyungeun, Lee, Jeongwon, Kim, Young-Min, Kim, Joosun, Kim, Choong-Un, Lee, Man-Jong]. Electrochimica Acta. 220, 500-510. DOI: http://dx.doi.org/10.1016/j.electacta.2016.10.144

      2015
      • Journal Article
        Impact of Cooling Rate-Induced Recrystallization on High G Mechanical Shock and Thermal cycling in Sn-Ag-Cu Solder
        Journal of Electronic Materials
        [Lee, T. K., Belier, T. R., Kim, Choong-Un]. DOI: http://dx.doi.org/10.1007/s11664-015-4186-6

      2014
      • Journal Article
        A Model-Inspired Phenomenology Constitutive Equation for the Temperature-Dependence of Flow Stress at Confined Dimension I
        [Saptono, Rahmat, Kim, Choong-Un]. Applied Mechanics and Materials. 534, 83-92. "Trans Tech Publ".
      • Journal Article
        A Model-inspired Phenomenology Constitutive Equation for the Temperature-dependence of Flow Stress at Confined Dimension II
        [Duryat, RahmatSaptono, Kim, Choong-Un]. IOP Conference Series: Materials Science and Engineering. 58, DOI: http://dx.doi.org/10.1088/1757-899X/58/1/012021

      2013
      • Journal Article
        Characterization of Solder Joint Reliability Using Cyclic Mechanical Fatigue Testing
        [Kim, Choong-Un, Bang, Woong-Ho, Xu, Huili, Lee, Tae-Kyu]. JOM. 65(10), 1362-1373. DOI: http://dx.doi.org/10.1007/s11837-013-0720-2
      • Journal Article
        Influence of High-G Mechanical Shock and Thermal Cycling on Localized Recrystallization in Sn-Ag-Cu Solder Interconnects
        [Lee, Tae-Kyu, Kim, Choong-Un, Bieler, ThomasR.]. Journal of Electronic Materials. 43(1), 69-79. DOI: http://dx.doi.org/10.1007/s11664-013-2736-3
      • Journal Article
        Misfit management for reduced dislocation formation in epitaxial quantum-dot-based devices
        [Gandhi, JateenS., Kim, Choong-Un, Kirk, WileyP]. Journal of Crystal Growth. 364, 169-177. DOI: http://dx.doi.org/10.1016/j.jcrysgro.2012.11.016
      • Journal Article
        Study of viscoplastic deformation in porous organosilicate thin films for ultra low-k applications
        [Zin, EmilH., Bang, W.H., Ryan, E.Todd, King, SeanW., Kim, Choong-Un]. Applied Physics Letters. 102(22), DOI: http://dx.doi.org/10.1063/1.4809827
      • Journal Article
        Influence of High-G Mechanical Shock and Thermal Cycling on Localized Recrystallization in Sn-Ag-Cu Solder Interconnects
        Journal of Electronic Materials
        [Lee, T.-K., Kim, Choong-Un, Bieler, T. R]. DOI: http://dx.doi.org/10.1007/s11664-013-2736-3

      2010
      • Journal Article
        Observation of space charge limited current by Cu ion drift in porous low-k/Cu interconnects
        [Chen, Lin, Bang, W.H., Park, Young-Joon, Ryan, E.Todd, King, Sean, Kim, Choong-Un]. Applied Physics Letters. 96(9), DOI: http://dx.doi.org/10.1063/1.3337102

      2009
      • Journal Article
        Fracture Mechanics of Solder Bumps During Ball Shear Testing: Effect of Bump Size
        [Bang, WoongHo, Kim, Choong-Un, Kang, SukHoon, Oh, KyuHwan]. Journal of Electronic Materials. 38(9), 1896-1905. DOI: http://dx.doi.org/10.1007/s11664-009-0842-z

      2008
      • Journal Article
        Analysis of barrier defects in low-k/Cu interconnects based on electrochemical response and simulation cell
        [Meng, DongMei, Michael, NancyL, Park, Young-Joon, Kim, Choong-Un]. Journal of Electronic Materials. 37(4), 429-438.
      • Journal Article
        CMOS-compatible fabrication of room-temperature single-electron devices
        [Ray, Vishva, Subramanian, Ramkumar, Bhadrachalam, Pradeep, Ma, Liang-Chieh, Kim, Choong-Un, Koh, SeongJ]. Nature Nanotechnology. 3(10), 603-608. DOI: http://dx.doi.org/10.1038/nnano.2008.267
      • Journal Article
        Study of thermo-mechanical instability of pores in porous low-k/Cu interconnects
        [Chen, Lin, Bang, W.H., Kang, S.H., Zin, E., Oh, K.H., Park, Yeonho, Kim, Choong-Un].

      2007
      • Journal Article
        Electrostatic funneling for precise nanoparticle placement: A route to wafer-scale integration
        [Ma, Liang-Chieh, Subramanian, Ramkumar, Huang, Hong-Wen, Ray, Vishva, Kim, Choong-Un, Koh, SeongJ]. Nano Letters. 7(2), 439-445. DOI: http://dx.doi.org/10.1021/nl062727c

      2006
      • Journal Article
        Study of pore structure and stability in porous low-k interconnects using electrolyte voltammetry
        [Meng, D.M., Michael, NancyL, Kim, Choong-Un, Park, Young-Joon]. Applied Physics Letters. 88(26), 261911.

      2003
      • Journal Article
        Crystallization and pyroelectric effect of semiconducting YBaCuO thin films deposited at different temperatures
        [Yildiz, Ali, Butler, DonaldP., Zeynep �elik-Butler, Kim, Choong-Un]. 21(2), 837-842.
      • Journal Article
        Formation of HgTe nanodisks embedded in PbTe matrix by precipitation phenomena
        [Lee, Man-Jong, Kim, Choong-Un]. Nano Letters. 3(11), 1607-1610.
      • Journal Article
        Influence of Au addition on the phase equilibria of near-eutectic Sn-3.8 Ag-0.7 Cu Pb-free solder alloy
        [Park, Jae-Yong, Kabade, Rajendra, Kim, Choong-Un, Carper, Ted, Dunford, Steven, Puligandla, Viswanadham]. Journal of Electronic Materials. 32(12), 1474-1482.
      • Journal Article
        Mechanism of reliability failure in Cu interconnects with ultralow-κ materials
        [Michael, NancyL, Kim, Choong-Un, Gillespie, P., Augur, R.]. Applied Physics Letters. 83(10), 1959-1961.
      • Journal Article
        Phase equilibria studies of Sn-Ag-Cu eutectic solder using differential cooling of Sn-3.8 Ag-0.7 Cu alloys
        [Park, Jae-Yong, Kim, Choong-Un, Carper, Ted, Puligandla, Viswanadham]. Journal of Electronic Materials. 32(11), 1297-1302.
      • Journal Article
        Study of electron-scattering mechanism in nanoscale Cu interconnects
        [Kim, Choong-Un, Park, Jaeyong, Michael, NancyL, Gillespie, Paul, Augur, Rod]. Journal of Electronic Materials. 32(10), 982-987.

      2002
      • Journal Article
        Analysis of the reservoir length and its effect on electromigration lifetime
        [Le, H.A., Ting, Larry, Tso, N.C., Kim, Choong-Un]. Journal of Materials Research. 17(1), 167-171.
      • Journal Article
        Investigation of temperature coefficient of resistance and crystallization of semiconducting YBaCuO thin films using pulsed laser annealing
        [Yildiz, A., Celik-Butler, Zeynep, Butler, D.P., Kim, Choong-Un]. 20(2), 548-553.
      • Journal Article
        Kinetics of self-annealing in electroplated Cu thin films
        [Yang, C.W., Kim, Choong-Un]. 40(1), 21-25.
      • Journal Article
        Mechanism of electromigration failure in submicron Cu interconnects
        [Michael, NancyL, Kim, Choong-Un, Jiang, Qing-Tang, Augur, R.A., Gillespie, P.]. Journal of Electronic Materials. 31(10), 1004-1008.

      2001
      • Journal Article
        Efficient electromigration testing with a single current source
        [Kim, Choong-Un, Michael, NancyL, Jiang, Qing-Tang, Augur, Rod]. Review of Scientific Instruments. 72(10), 3962-3967.
      • Journal Article
        Electromigration in Cu thin films with Sn and Al cross strips
        [Michael, NancyL, Kim, Choong-Un]. Journal of Applied Physics. 90(9), 4370-4376.
      • Journal Article
        Investigation of interfacial reaction between Sn-Ag eutectic solder and Au/Ni/Cu/Ti thin film metallization
        [Park, J.Y., Yang, C.W., Ha, J.S., Kim, C-U, Kwon, E.J., Jung, Sungyong, Kang, C.S.]. Journal of Electronic Materials. 30(9), 1165-1170.
      • Journal Article
        Investigation on self-aligned HgTe nano-crystals induced by controlled precipitation in PbTe–HgTe quasi-binary compound semiconductor alloys
        [Lee, Manjong, Kim, Choong-Un]. Physica. B, Condensed Matter. 304(1), 267-275.

      1999
      • Journal Article
        Investigation of the phase equilibria in the Sn-Bi-In alloy system
        [Yoon, SeungWook, Rho, Byung-Sup, Lee, HyuckMo, Kim, Choong-Un, Lee, Byeong-Joo]. 30(6), 1503-1515.

      1998
      • Journal Article
        Electromigration Failure Kinetics in Al Alloy Lines: A Microstructure-Based Constitutive Equation
        [Kang, S.H., Morris, J.W., Kim, C-U]. 516,
      • Journal Article
        Influence of W via on the mechanism of electromigration failure in Al–0.5 Cu interconnects
        [Le, H.A., Tso, N.C., Rost, T.A., Kim, C-U]. Applied Physics Letters. 72(22), 2814-2816.
      • Journal Article
        TEM Observations on the Evolution of Grain Structure in Pressurized Al-0.5 Cu Thin Films
        [Yang, H.D., Kim, C-U, Saran, M., Le, H.A.]. 516,

      1997
      • Journal Article
        Kinetics of electromigration-induced edge drift in Al–Cu thin-film interconnects
        [Kim, Choong-Un, Morris, Jr, J.W., Lee, Hyuck-Mo]. Journal of Applied Physics. 82(4), 1592-1598.

      1996
      • Journal Article
        Effect of current reversal on the failure mechanism of Al-Cu-Si narrow interconnects
        [Kim, Choong-Un, Kang, S.H., Morris, J.W.]. Journal of Electronic Materials. 25(2), 293-296.
      • Journal Article
        Effect of post‐pattern annealing on the grain structure and reliability of Al‐based interconnects
        [Kang, S.H., Kim, Choong-Un, Morris, Jr, J.W., Genin, F.Y.]. Journal of Applied Physics. 79(11), 8330-8335.
      • Journal Article
        Further Investigations of the Microstructural Mechanism of Electromigration Failure in Al-Cu Lines with Quasi-Bamboo Microstructures
        [Kang, S.H., F. Y. G�nin, Kim, Choong-Un, Morris, J.W.]. 428,

      1995
      • Journal Article
        Mechanism of electromigration failure in Al thin film interconnects containing Sc
        [Kim, Choong-Un, Kang, S.H., Genin, F.Y., Morris, J.W.]. 391,
      • Journal Article
        Microstructural control of internal electromigration failure in narrow Al-Cu-Si lines
        [Morris, J.W., Kim, Choong-Un, Kang, S.H.]. 391,
      • Journal Article
        The influence of grain structure on the reliability of narrow Al-based interconnects
        [Kang, S.H., Kim, Choong-Un, Genin, FrancoisY., Morris, J.W.]. 391,

      1994
      • Journal Article
        Influence of microstructure on the resistivity of Al‐Cu‐Si thin‐film interconnects
        [Kim, Choongun, Selitser, S.I., Morris, Jr, J.W.]. Journal of Applied Physics. 75(2), 879-884.

      1993
      • Journal Article
        Microstructural Mechanism of Electromigration Failure in Narrow Interconnects
        [Kim, Choongun, Selister, S.I., Morris, J.W.]. 309,
      • Journal Article
        The mechanism of electromigration failure of narrow Al‐2Cu‐1Si thin‐film interconnects
        [Kim, Choongun, Morris, Jr, J.W.]. Journal of Applied Physics. 73(10), 4885-4893.

      1992
      • Journal Article
        The influence of Cu precipitation on electromigration failure in Al‐Cu‐Si
        [Kim, Choongun, Morris, Jr, J.W.]. Journal of Applied Physics. 72(5), 1837-1845.

      Unknown
      • Journal Article
        Journal of Emerging Materials
        [Sa, Y. K., Pandey, A., Ryan, T., Kim, Choong-Un] (1925).

      2020
      • Conference Proceeding
        Ratcheting Failure, A New Failure Mode in SAC Solder Interconnects under Pulsed Electromigration
        [Kim, Yi Ram, Osmanson, Allison, Tajedini, Mohsen, Kim, Choong-Un, Thompson, Patrick]. conference . "TECHCON/SRC".
      • Conference Proceeding
        Study of Electromigration Failure in Cu Based Wirebond
        [Osmanson, AllisonT., Tajedini, Mohsen, Kim, Yi Ram, Madanipour, Hossein , Kim, Choong-Un, Glasscock, Bradley, Khan, Muhammad]. TECHCON/SRC. "TECHCON/SRC".
      • Conference Proceeding
        Effect of Joint Geometry on Electromigration Failure Mechanism in Micro Solder Joint
        [ Madanipour, Hossein, Kim, Yi Ram, Osmanson, AllisonT., Tajedini, Mohsen, Kim, Choong-Un, Mishra, Dibyajat, Thompson, Patrick]. TECHCON . "TECHCON/SRC".
      • Conference Proceeding
        Effects of UBM Thickness and Current Flow Configuration on Electromigration Failure Mechanisms in Solder Interconnects
        [Kim, Yiram, Osmanson, Allison, Madanipour, Hossein, Kim, Choong-Un, Thompson, Patrick]. "IRPS conference/ IEEE". DOI: http://dx.doi.org/10.1109/IRPS45951.2020.9129337
      • Conference Proceeding
        Study of Electromigration Failure in Solder Interconnects under Low Frequency Pulsed Direct Current Condition
        [Kim, Yiram , Osmanson, Allison , Madanipour, Hossein, Kim, Choong-Un, Thompson, Patrick]. "70th ECTC conference/IEEE". DOI: http://dx.doi.org/10.1109/ECTC32862.2020.00119
      • Conference Proceeding
        Corrosion in liquid cooling systems with water-based coolant – Part 2: Corrosion reliability testing and failure model
        [Kim, Choong-Un, Ni, Geng, Kini, Girish, Chang, je-young, Saha, Amitesh`]. confernece proceedings. "2020 ITHERM/IEEE".
      • Conference Proceeding
        Corrosion in liquid cooling systems with water-based coolant - Part 1: Flow loop design for reliability tests
        [Kini, Girish , Kim, Choong-Un, Madanipour, Hossein, Saha, Amitesh, Antoniswamy, Aravindha , Klein, Iolanda ]. conference. 310. "2020 ITHERM/IEEE".

      2019
      • Conference Proceeding
        Study on the Pulsed Current Effect on Electromigration Failure Mechanism in WCSP Solder Interconnects
        [Kim, YiRam, Osmanson, Allison, Madnipour, Hossin, Thompson, Patrick, Chen, Qaio]. 2019 TECHCON Conference. Austin, Texas: "SRC".
      • Conference Proceeding
        Effect of Intermetallic Compound Growth on Electromigration Failure Mechanism in Low-profile Solder Joint
        [Madanipour, Hossein, Kim, Choong-Un, ]. 69th ECTC conference. 1316-1323. "69th ECTC conference/IEEE". DOI: http://dx.doi.org/10.1109/ECTC.2019.00204
        714 UT Arlington

      2017
      • Conference Proceeding
        Corrosion in closed loop electronic cooling system with water as coolant and its detection
        [Kim, Choong-Un, Chang, Je-Young]. 258. "16th Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM)". DOI: http://dx.doi.org/10.1109/ITHERM.2017.7992536

      2016
      • Conference Proceeding
        Temperature-dependence of Threshold Current Density-Length Product in Metallization Lines: A Revisit
        Journal of Physics Conference Series
        [Duryat, RahmatSaptono, Kim, Choong-Un]. 710, DOI: http://dx.doi.org/10.1088/1742-6596/710/1/012044

      2015
      • Conference Proceeding
        Mechanism of Void Formation in Cu Post Solder Joint under Electromigration
        [Kim, Min-Young, Chen, Liang-Shan, Chae, Seung-Hyun, Kim, Choong-Un]. 135-141. "ECTC/IEEE".
      • Conference Proceeding
        Enhanced Electromigration Reliability of Wafer Chip Scale Packages for High Current Applications
        [Chae, S.H., Liu, J., Patricia, R., Kim, Choong-Un]. 312-319.. "ECTC/IEEE".

      2014
      • Conference Proceeding
        Fatigue properties of lead-free solder joints in electronic packaging assembly investigated by isothermal cyclic shear fatigue
        Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
        [Xu, Huili, Lee, Tae-Kyu, Kim, Choong-Un]. 133-138. "ECTC/IEEE".
      • Conference Proceeding
        DEVELOPMENT OF ALUMINUM-WATER HEAT PIPES
        [Kuroda, Masahiro, Chang, Je-Young, Gwin, Paul, Mongia, Rajiv, Kim, Choong-Un, Cabusao, GeraldP., Goto, Kazuhiko, Mochizuki, Masataka]. 5(1-4), 50-54. "proceedings of 17Th International Heat Pipe Conference".
      • Conference Proceeding
        Restoration of Mechanical Stability and Dielectric Constants of Porous Low-k Dielectrics by using Non-Oxidizing Plasma
        [Sa, Y.K., Ryan, Todd, King, Sean, Kim, Choong-Un]. 2014 TECHCON (SRC, Austin, Aug. 2014). 53-58. Austin.
      • Conference Proceeding
        Space Charge Generation in Low-k Dielectrics and Its Effect on the Electron Conduction in Cu Interconnects
        [Lu, Po-Cheng, Ryan, Todd, King, Sean, Kim, Choong-Un]. Proceedings of 2014 TECHCON. 5-9. Austin.

      2013
      • Conference Proceeding
        Grain structure evolution and its impact on the fatigue reliability of lead-free solder joints in BGA packaging assembly
        Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
        [Xu, Huili, Lee, Tae-Kyu, Kim, Choong-Un]. 740-747. "IEEE".
      • Conference Proceeding
        Grain Structure Evolution and its Impact on the Fatigue Reliability of Lead-free Solder Joints in BGA Packaging Assembly
        [Xu, Huili, Lee, Tae-Kyu, Kim, Choong-Un]. 740-747.
      • Conference Proceeding
        Improving photonic-electronic characteristics in quantum-dot solar cells via lattice strain mechanisms
        Proc. of SPIE Vol
        [Kirk, WileyP, Gandhi, Jateen, Kim, Choong-Un]. 8620, 1.
      • Conference Proceeding
        Improving photonic-electronic characteristics in quantum-dot solar cells via lattice strain mechanisms
        Proc. of SPIE Vol
        [Kirk, WileyP, Gandhi, Jateen, Kim, Choong-Un]. 8620, 1.
      • Conference Proceeding
        Improving Photonic-electronic Characteristics in Quantum-dot Solar Cells via Lattice Strain Mechanisms
        Proceedings of SPIE
        [Kirk, WileyP, Gandhi, Jateen, Kim, Choong-Un]. 8620, DOI: http://dx.doi.org/10.1117/12.2005123
      • Conference Proceeding
        Island-Cap Interface Misfit Modulated Carrier Mechanisms in p-i-n Epitaxial Quantum Dot Photovoltaic Devices
        IEEE Photovoltaic Specialists Conference
        [Gandhi, JateenS., Kim, Choong-Un, Kirk, WileyP]. 281-283.
      • Conference Proceeding
        Island-cap interface misfit modulated carrier mechanisms in pin epitaxial quantum dot photovoltaic devices
        Photovoltaic Specialists Conference (PVSC), 2013 IEEE 39th
        [Gandhi, JateenS., Kim, Choong-Un, Kirk, WileyP]. 281. "IEEE".
      • Conference Proceeding
        Island-cap interface misfit modulated carrier mechanisms in pin epitaxial quantum dot photovoltaic devices
        Photovoltaic Specialists Conference (PVSC), 2013 IEEE 39th
        [Gandhi, JateenS., Kim, Choong-Un, Kirk, WileyP]. 281. "IEEE".

      2012
      • Conference Proceeding
        Enhanced V oc in InAs quantum-dot Based pin solar cells using a non-alternating strain-balancing epitaxial growth method
        Photovoltaic Specialists Conference (PVSC), 2012 38th IEEE
        [Gandhi, JateenS., Kim, Choong-Un, Kirk, WileyP]. 789. "IEEE".
      • Conference Proceeding
        Enhanced V-oc in InAs Quantum-dot Based p-i-n Solar Cells Using a Non-Alternating Strain-Balancing Epitaxial Growth Method
        [Gandhi, JateenS., Kim, Choong-Un, Kirk, WileyP]. 789-793.
      • Conference Proceeding
        Influence of process conditions on the viscoplasticity of PLK films
        [Sa, Ya, Zin, E., Kim, Choong-Un, Ryan, T.]. TECHCON. 12.
      • Conference Proceeding
        Isothermal Shear Fatigue Mechanism of Lead Free Solder Joints
        [Xu, Huili, Bang, WoongHo, Ma, Hong-Tao, Lee, Tae-Kyu, Liu, Kuo-Chuan, Kim, Choong-Un]. 1299-1303.
      • Conference Proceeding
        Isothermal shear fatigue mechanism of lead free solder joints
        Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
        [Xu, Huili, Bang, WoongHo, Ma, Hong-Tao, Lee, Tae-Kyu, Liu, Kuo-Chuan, Kim, Choong-Un]. 1299-1303. "IEEE".
      • Conference Proceeding
        Sensitivity of Grain Structure and Fatigue Reliability of Pb-Free Solder Joint on the Position in PBGA Packaging Assembly
        [Xu, Huili, Bang, WoongHo, Lee, Tae-Kyu, Kim, Choong-Un]. 500-504.
      • Conference Proceeding
        Sensitivity of grain structure and fatigue reliability of Pb-free solder joint on the position in PBGA packaging assembly
        Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
        [Xu, Huili, Bang, WoongHo, Lee, Tae-Kyu, Kim, Choong-Un]. 500--504.

      2011
      • Conference Proceeding
        Development of Voltammetry-based Techniques for Characterization of Porous Low-k/Cu Interconnect Integration Reliability
        ECS Transactions
        [Kim, Choong-Un, Chen, Lin, Michael, NancyL, Bang, W.H., Park, Young-Joon, Ryan, E.Todd., King, S.]. 35(4), 757-771. DOI: http://dx.doi.org/10.1149/1.3572318
      • Conference Proceeding
        Study of Thermo-Mechanical Instability of Porous Low-k Dielectric using Indentation Test
        [Zin, EmilH., Bang, W.H., Kim, Choong-Un, King, S., Ryan, T.]. 2011 TECHCON (2011, SRC). 42.

      2010
      • Conference Proceeding
        Fracture Mechanics of Lead-Free Solder Joints under Cyclic Shear Load
        Electronic Components and Technology Conference
        [Xu, Huili, Bang, WoongHo, Ma, Hong-Tao, Lee, Tae-Kyu, Liu, Kuo-Chuan, Kim, Choong-Un]. 484-489.

      2009
      • Conference Proceeding
        Mechanism of electromigration in Au/Al wirebond and its effects
        Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
        [Zin, E., Michael, NancyL, Kang, S.H., Oh, K.H., Chul, U., Cho, J.S., Moon, J.T., Kim, C-U]. 943-947. "IEEE".
      • Conference Proceeding
        Rate Dependence of Bending Fatigue Failure Characteristics of Lead-Free Solder Joint
        [Bang, WoongHo, Chen, Liang-Shan, Kim, Choong-Un, Lee, Tae-Kyu, Liu, Kuo-Chuan]. 2070-+.
      • Conference Proceeding
        Rate dependence of bending fatigue failure characteristics of lead-free solder joint
        Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
        [Bang, WoongHo, Chen, Liang-Shan, Kim, Choong-Un, Lee, Tae-Kyu, Liu, Kuo-Chuan]. 2070-2074. "IEEE".

      2008
      • Conference Proceeding
        Mechanism of Thermal Instability of pores in porous low-k dielectrics
        [Kim, Choong-Un, Chen, L.S., Bang, W.H., Kang, S.H., Oh, K.]. TECHCON. 124.
      • Conference Proceeding
        X-ray Diffraction Microscopy for Detection of Subsurface Defects in Si
        [Kang, S.H., Michael, N., Koh, SeongJ, Kim, Choong-Un]. Proceedings of the 2008 SEM XI International Congress and Exposition on Experimental and Applied Mechanics. 125-130. Orlando.

      2007
      • Conference Proceeding
        Development of quantum dot-embedded nanoparticles for biothermal imaging
        [Hanson, WillardL., Michael, NancyL, Kim, Choong-Un, Han, Bumsoo]. 75-76.
      • Conference Proceeding
        Trapped impurities in low-k dielectrics and their characterization method
        .
        [Kim, Choong-Un, Chen, L.S., Bang, W.H., Michael, N.L., Park, Y.J., Martz, L.]. Proceedings of 2007 TECHON. 154.

      2006
      • Conference Proceeding
        Characterization of Defective Diffusion Barrier using Voltammetry
        Advanced Metallization Conference 2005(AMC 2005)
        [Meng, D.M., Kim, Choong-Un]. 463-467.
      • Conference Proceeding
        Nanocomposite Semiconductors for Advanced Functionalities and Applications
        [Kim, Choong-Un, Michael, N.L., Yang, C.W.]. Proceeding of UKC 2006: Nanoscale materials. 21-15.
      • Conference Proceeding
        New electrochemical cell and test methods for corrosion testing of the components in integrated circuit liquid cooling system
        [Chang, J.Y., Kim, Choong-Un, Michael, N., Pathangey, B., Gwin, P., Prasher, R.]. Proceedings of 2006 IMECE (ASME Mechanical Engineering Congress and Exposition) (ASME, 2006). 1-8.
      • Conference Proceeding
        New method of probing barrier integrity and low-k stability
        Extended abstracts of the... Conference on Solid State Devices and Materials
        [Choong-Un, KIM, Meng, D.M.]. 2006, 1034-1035.

      2005
      • Conference Proceeding
        Characterization of Defective Diffusion Barrier using Voltammetry
        [Kim, Choong-Un, Meng, D.M., Michael, N.L., Park, Y.J., Satyanarayana, S.]. AMC 2005 Conference Proceeding (MRS, 2005).
      • Conference Proceeding
        Detection of barrier failure in interconnects with ultralow-k materials: ICV voltammogram
        Proc. Advanced Metallization Conference
        [Kim, Choong-Un, Park, J.Y., Michael, NancyL, Park, Yeonho, Kang, S.H.]. 679-685.
      • Conference Proceeding
        Study of Barrier Instability and Voltammetry Methodology
        [Meng, D.M., Kim, Choong-Un, Michael, N., Park, Y.J., Satyanarayana, S.]. Techcon (2005). 172.

      2004
      • Conference Proceeding
        Detection of Barrier Failure in Interconnect with Ultralow-k dielectrics
        [Kim, Choong-Un, Meng, D.M., Michael, N., Park, Y.J., Satyanarayana, S.]. Proceedings of Advanced Metallization Conference, (MRS, 2004). 679-685.
      • Conference Proceeding
        Kinetic Mechanism of Cu Interconnect failure in porous dielecitric
        [Kim, Choong-Un, Michael, N.L., Meng, D.M., Kang, S.H., Park, Y.J.]. Proceedings of Advanced Metallization Conference, (MRS, 2004). 269-273.
      • Conference Proceeding
        New reliability failure mechanism in porous low-k dual damascene interconnects
        Proc. Advanced Metallization Conference (AMC)
        [Augur, R.A., Kim, Choong-Un, Blaschke, V., Michael, NancyL, Gillespie, P., Rasco, M., Lin, J.C., Kim, Sok Ju, Pfeifer, K.]. 277-281.

      2003
      • Conference Proceeding
        Study of side seal/bond pad integrity in ultra low-k dielectric/Cu integration
        Array
        [Kim, Choong-Un, Michael, N.L., Meng, D.M., Rasco, M., Gillespie, P., Augur, R.]. Proceedings of 2003 Advanced Metallization Conference (MRS, 2002). 185-188.

      2001
      • Conference Proceeding
        Kinetic Mechanism of Self-Annealing in electroplated Cu thin films
        H.D. Yang, C.-U. K,
        [Yang, H.D., Kim, Choong-Un]. Advanced Metallization Conference 2000. 187-191.

      1996
      • Conference Proceeding
        Effect of Solute Additions on the Electromigration of Al Thin Films, Proceeding of Materials Reliability Issues
        [Kim, Choong-Un, Morris, J.W., Genin, F., Fluss, M.J.]. Microelectronics VI vol. 428, 1996, MRS Spring Meeting. 255-260.

      1991
      • Conference Proceeding
        Effect of Cu at Al grain boundaries on electromigration behavior in Al thin films
        Metallization: Performance and Reliability Issues for VLSI and ULSI
        [Frear, DarrelR, Michael, JosephR, Kim, Choong-Un, Romig, AD, Morris, JW]. 1596, 72--83.

      2009
      • Other
        Improved magnetoelectric properties of piezoelectric-magnetostrictive nanocomposites synthesized using high-pressure compaction technique
        [Bedekar, Vishwas, Poudyal, Narayan, Rong, Chuan-bing, Liu, J.Ping, Kim, Choong-Un, Priya, Shashank]. Journal of Materials Science. 44(8), 2162-2166. DOI: http://dx.doi.org/10.1007/s10853-009-3370-6

      Unknown
      • Material Regarding New Courses/Curricula
        Electrical Properties of Materials (Graduate level)
        [Kim, Choong-Un] (1925).
      • Material Regarding New Courses/Curricula
        Failure Analysis and Reliability Engineering (Graduate level)
        [Kim, Choong-Un] (1925).
      • Material Regarding New Courses/Curricula
        Materials Analysis (Graduate and Undergraduate level)
        [Kim, Choong-Un] (1925).
      • Material Regarding New Courses/Curricula
        Solid State Physics and Thermodynamics (Graduate level)
        [Kim, Choong-Un] (1925).
      • Material Regarding New Courses/Curricula
        Transmission Electron Microscopy (Graduate level)
        [Kim, Choong-Un] (1925).

Presentations

    • September  2021
      Tajedini, Mohsen (Author & Presenter), Kim, Choong-Un, Osmanson, Allison (Author), Kim, Yi-ram (Author), Glasscock, Bradley (Author), Khan, Muhammad (Author), "fStudy of Electromigration Failure in Wirebonds Formed by Cu, Palladium Coated Cu and Au Wirebonds Wire on Al pad", SRC, online. (September 16, 2021).
    • September  2021
      Bao, Jimmy Le (Author & Presenter), Kim, Choong-Un (Author), Tajedini, Mohsen (Author), Thompson, Patrick (Author), Lin, Hung-Yun (Author), "Low Frequency Impedance in Detection of Interconnect Damages", SRC, online. (September 16, 2021).
    • September  2021
      Osmanson, Allison (Author & Presenter), Kim, Choong-Un, Kim, Yi-ram (Author), "Stress Development in WCSP solder joints ", online. (September 16, 2021).
    • August  2020
      Kim, Y. (Author & Presenter), Kim, Choong-Un (Author), Madanipour, H. (Author), Osmanson, A. (Author), "Ratcheting Failure, A New Failure Mode in SAC Solder Interconnects under Pulsed Electromigration", SRC, online. (August , 2020).
    • August  2020
      Osmanson, A. (Author & Presenter), Madanipour, H. (Author), Kim, Y. (Author), Kim, Choong-Un, Mishra, D. (Author), Thompson, P. (Author), Nguyen, L. (Author), "Current Crowding and Stress Effects in WCSP Solder Interconnects: A Simulative and Practical Study About the Effects of Major Electromigration Failure Mechanisms in DC and Pulsed-DC Conditions", IEEE/SMTA, online. (August 28, 2020).
    • August  2020
      Madanipour, H. (Author & Presenter), Kim, Choong-Un (Author), Kim, Y. (Author), Osmanson, A. (Author), "Effect of Joint Geometry on Electromigration Failure Mechanism in Micro Solder Joint", SRC, online. (August 20, 2020).
    • August  2020
      Osmanson, A. (Author & Presenter), Madanipour, H. (Author), Kim, Choong-Un (Author), kim, Y. (Author), Tajedini, M (Author), "Study of Electromigration Failure in Cu Based Wirebond", SRC, online. (August 20, 2020).
    • July  2020
      Kini, Girini (Author), Kim, Choong-Un (Author), Madanipour, H. (Author), Chmag, J. (Author), , "Corrosion in liquid cooling systems with water-based coolant – Part 1: Flow loop design for reliability tests", IEEE, online. (July 21, 2020).
    • July  2020
      Kim, Choong-Un (Author), Ni, Geng (Author), Kini, G. (Author), Chang, J. (Author), "Corrosion in liquid cooling systems with water-based coolant – Part 2: Corrosion reliability testing and failure model", IEEE, online. (July 21, 2020).
    • May  2020
      Kim, Yiram (Author & Presenter), Kim, Choong-Un, Osmanson, A. (Author), Madanipour, H. (Author), Thompson, P. (Author), Chen, Q. (Author), "Study of Electromigration Failure in Solder Interconnects under Low Frequency Pulsed Direct Current Condition", IEE, online. (May 26, 2020).
    • April  2020
      Madanipour, H. (Author & Presenter), Kim, Choong-Un (Author), Kim, Y. (Author), Osmansom, A. (Author), Thompson, P. (Author), Chen, Q. (Author), (Author), "Effects of UBM Thickness and Current Flow Configuration on Electromigration Failure Mechanisms in Solder Interconnects", IEEE, online. (April 28, 2020).
    • April  2020
      Cooley, LanceD (Author & Presenter), Balachandran, Shreyas (Author), Buttles, John (Author), Kim, Choong-Un (Author), Lee, Peter (Author), Ni, Geng (Author), Park, Wan Kyu (Author), Su, Yi-Feng (Author), Withanage, Wenura (Author), Zhang, Shengzhi (Author), "Overview of Bronze Routes for Nb3Sn SRF Cavities", DOE/CBB, Cornell University, Ithaca. (April 1, 2020).
    • April  2020
      Withanage, WenuraK (Author & Presenter), Shreyas , Balachandran (Author), Reis, Christopher (Author), Zhang, Shengzhi (Author), Park, Wan Kyu (Author), Su, Feng (Author), Buttles, John (Author), Kim, Choong-Un, Lee, Peter (Author), Cooley, Lance (Author), "Physical Vapor Deposition Bronze-Route Nb3Sn for SRF Cavities", DOE/CBB, Cornell University, Ithaca. (April 1, 2020).
    • March  2020
      Kim, Choong-Un (Author & Presenter), Ni, Geng (Author), Buttles, John (Author), Wenura, WithanageK (Author), Cooley, LanceD (Author), "Electrochemical Bronze-Route Nb3Sn for SRF Cavities", DOE/CBB, Cornell University, Ithaca, NY . (March 30, 2020).
    • February  2020
      Kim, Choong-Un (Author & Presenter), Osmanson, A. (Author), Kim, Y. (Author), Madanipour, H. (Author), "A Comprehensive Approach on Understanding Electromigration Failure Kinetics with Varying UBM Thickness and Joint Geometry in WCSP Solder Interconnects", TMS, San Diego. (February 25, 2020).
    • February  2020
      Madanipour, H. (Author & Presenter), Kim, Y. (Author), Osmanson, A. (Author), Kim, Choong-Un, "Effect of Solder Joint Geometry on Electromigration Failure Mechanism in Micro Solder Joint", TMS, San Diego. (February 25, 2020).
    • February  2020
      Kim, Y. (Author & Presenter), Madanipour, H. (Author), Osmanson, A. (Author), Kim, Choong-Un (Author), "Study on the UBM Thickness and Current Flow Configuration Effects on Electromigration Failure Mechanism in Solder Interconnect", TMS, San Diego. (February 25, 2020).
    • November  2019
      Kim, Choong-Un (Author), "Roughening of Bi‐metal Interface by Inhomogeneous Plastic Deformation: Observations and Modeling Challenges", US-Korea-Japan Berkeley Symposium, Tokyo, Japan. (November 22, 2019).
    • October  2019
      Kim, Choong-Un, "Study of Interface Microstructure of Bi-metal Plates Prepared by Cold Rolling: Modeling Challenge", TMS, Portland, OR. (October 2, 2019).
    • October  2019
      Kim, Choong-Un (Author), "Understanding Reliability Failure Mechanisms in Pb Free Solder Joint with Micro-gap Configuration", TMS, Portland, OR. (October 2, 2019).
    • July  2019
      Kim, Choong-Un (Author), "Understanding the Mechanism of Electromigration Failure in Pb Free Solder Joints:", SRC, Chapel Hill, NC. (July 23, 2019).
    • July  2019
      Kim, Choong-Un, Ni, Geng (Author), Cooley, LanceD. (Author), Lee, PeterJ. (Author), "Understanding Electrochemistry of Nb in Thin Film Deposition Process ", Dresden, Germany. (July 2, 2019).
    • July  2019
      Kim, Choong-Un, Ni, Geng (Author), Cooley, Lance (Author), Lee, Peter (Author), Leis, Christoper (Author), Buttles, John (Author), "Surface Preparation of Single Phase Bronze and Cu cavity: Electrochemical Routes ", Dresden, Germany. (July 01, 2019).
    • April  2019
      Kim, Choong-Un (Author), "Electromigration Failure Mechanisms in Packaging Interconnects: solder joints, Cu wirebond", SRC, Austin, TX. (April 18, 2019).
    • March  2019
      Kim, Choong-Un (Author & Presenter), Ni, Geng (Author), "Growth of Nb3Sn and Cu3Al Intermetallic Phases by Reactive Diffusion Process", Univ. of Texas at Arlington, San Antonio. (March 11, 2019).
    • November  2018
      Kim, Choong-Un, "Leading Frontiers of Materials Revolution: University of Texas at Arlington". (November 12, 2018).
    • October  2018
      Kim, Choong-Un, "Comprehensive evaluation of Electromigration Failure in Electronic Packaging for Enhanced Reliability Prediction:", Samsung Electronics: packaging research institute, Soowon, Korea. (October 24, 2018).
    • October  2018
      Kim, Choong-Un, "Electromigration Induced Failure in Interconnects in Electronic Packaging under Harsh Environment:", Korea Institute of Welding and Microjoining, COEX, Seoul. (October 23, 2018).
    • October  2018
      Kim, Choong-Un, "Frontier research in Materials Science and Engineering at UT Arlington", San Antonio. (October 11, 2018).
    • September  2018
      Kim, Choong-Un, "Study Electromigration Reliability of Solder Interconnects in TI’s WCSP and HOtRod", Texas Instruments, Santa Clara. (September 12, 2018).
    • August  2018
      Kim, Choong-Un, "Metallurgically Engineered New Materials for Emerging Applications ", New York. (August 4, 2018).
    • June  2018
      Kim, Choong-Un, "Research on Advanced Solder Interconnect Technology: Reliability and Electromigration ", Korea Electronic technology Institute. (June 29, 2018).
    • June  2018
      Kim, Choong-Un, "Characterization and Simulation of Dynamic Ordering of D022 Phase in Cu rich-Al Alloys", Pohang, S. Korea. (June 22, 2018).
    • March  2018
      Kim, Choong-Un, "On the Existence of a Two-phase Field in Binary α-Cu(Al) Solid Solutions: ", TMS, Phoenix. (March 14, 2018).
    • November  2017
      Kim, Choong-Un, "Nanostructured Materials for Enhanced Photo-absorption and Photocatalytic Properties", Changwon, Korea. (November 09, 2017).
    • September  2017
      Kim, Choong-Un, "Nanostructured Materials for Enhanced Photo-absorption and Photocatalytic Properties", Mexican Vacuum Society, Juarez, Mexico. (September 27, 2017).
    • July  2017
      Kim, Choong-Un, "Predicting the unpredictable", UTARI, Forthworth. (July 19, 2017).
    • June  2017
      Kim, Choong-Un, Chang, Je-Youn, "Corrosion in a Closed-Loop Electronic Device Cooling System w/ Water as Coolant and Its Detection", IEEE, Orlando. (June 21, 2017).
    • June  2017
      Kim, Choong-Un, "Phase Equilibria in Al-Cu Binary Alloy System: Revisit", 8th Internation Berkeley Symposium: Advanced materials. (June 21, 2017).
    • January  2016
      Kim, Choong-Un, "2016 UKC-Advanced Materials Symposium", Dallas. (January 1, 2016).
    • January  2015
      Kim, Choong-Un, "2015 International Symposium on Microelectronics and Packaging (ISMP) conference". (January 1, 2015).
    • January  2013
      Kim, Choong-Un, "2013 IEEE-IRPS conference ", Monterey, CA. (January 1, 2013).
    • January  2010
      Kim, Choong-Un, "6th Lead-free solder materials and technology workshop". (January 1, 2010).

Students Supervised

    • Present
      Dissertation Committee Chair
      Allison Osmanson, (Material Science and Engineer)
    • Present
      Dissertation Committee Chair
      Geng Ni, (Material Science and Engineer)
      Interdiffusion in Nb and bronze: route for Nb3Sn superconductivity
    • Present
      Dissertation Committee Chair
      Hossein Madanipour, (Material Science and Engineer)
    • Present
      Dissertation Committee Chair
      Yi Ram Kim, (Material Science and Engineer)
      Mechanism of electromigration in WCSP solder structure
    • Dec 2018
      Dissertation Committee Chair
      Pocheng Lu, (Material Science and Engineer)
      STUDY OF ELECTRIC CONDUCTION IN DIELECTRICS IN CHIP LEVEL INTERCONNECTS: DETECTION OF DEFECTS IN AL/SIO2 INTERCONNECTS
    • Aug 2018
      Dissertation Committee Chair
      H. Khaled, (Material Science and Engineer)
      COMPUTATIONAL STUDY ON THE CU-RICH SIDE OF ALUMINUM-COPPER PHASE DIAGRAM
    • Dec 2017
      Dissertation Committee Chair
      Valery Ouvarov-Bancalero , (Material Science and Engineer)
    • Feb 2017
      Postdoctoral Research Supervision
      Min Young Kim, (Material Science and Engineer)
    • Dec 2016
      Dissertation Committee Chair
      P. Rodriguez , (Material Science and Engineer)
      Rodriguez (PhD): Mechanism of Electromigration Failure in Cu wire/Al pad
    • Dec 2015
      Master's Thesis Committee Chair
      Mishler C. Michael , (Material Science and Engineer)
      Intermetallic Growth and Stress Development in Al-Cu Diffusion Couple
    • May 2015
      Master's Thesis Committee Chair
      A. Pandey, (Material Science and Engineer)
      Enhanced Mechanical Stability of Ultralow-k Interlayer Dielectrics with Self-organized Molecular Pores
    • May 2015
      Dissertation Committee Chair
      Yoonki Sa , (Material Science and Engineer)
      Mechanical Reliability of Porous Low-k Dielectrics for Advanced Interconnect: Understanding of Backbone Structure in Porous Low-k
    • May 2014
      Master's Thesis Committee Chair
      W. Gu, (Material Science and Engineer)
      Interfacial Reaction of Sn-based Solder Joint in the Package System
    • May 2014
      Dissertation Committee Chair
      R. Saptono, (Material Science and Engineer)
      Temperature dependence of stress related phenomena in confined dimension
    • Dec 2013
      Dissertation Committee Chair
      Huili Xu, (Material Science and Engineer)
      Grain structure evolution of Sn-based lead free solder joint in electronic packaging assembly and its impacts on the fatigue reliability
    • May 2013
      Dissertation Committee Chair
      Soo Kim, (Material Science and Engineer)
      Nano-morphology of polymer bulk heterojunctions studied by time-resolved synchrotron x-ray scattering
    • May 2012
      Dissertation Committee Chair
      Jateen Gandhi, (Material Science and Engineer)
      An Innovative Epitaxial Growth Method for Minimizing Dislocations in Thin-Film Quantum-Dot Optoelectronic and Photovoltaic Device Applications
    • May 2012
      Dissertation Committee Chair
      Emil Zin, (Material Science and Engineer)
      Mechanism of Viscoplasticity in porous low-k dielectrics
    • Dec 2010
      Dissertation Committee Chair
      LinagShan Chen, (Material Science and Engineer)
      Study on the leakage current behavior and conduction mechanism of porous low-k in Cu/Porous low-k interconnects: the influence of extrinsic factors
    • Dec 2006
      Dissertation Committee Chair
      D. M. Meng, (Material Science and Engineer)
      Metrology for Cu/Barrier low-k integration: voltammetry method for reliability assessment of fully fabricated interconnect structure
    • May 2006
      Dissertation Committee Chair
      C. Clark , (Electrical Engineering)
    • May 2006
      Dissertation Committee Chair
      Ji Yong Kim ,
      Investigation on the mechanism of interface electromigration in copper thin films
    • Dec 2004
      Master's Thesis Committee Chair
      G. Gbetibouo ,
      Design of a low power Tin Oxide Gas Sensor
    • May 2004
      Dissertation Committee Chair
      H. D. Yang ,
      Microstructural Characterization of Ultrathin Cu interconnects
    • Dec 2002
      Dissertation Committee Chair
      N. Michael , (Material Science and Engineer)
      Mechanism of electromigration failure in damascene processed Copper interconnects
    • May 2002
      Master's Thesis Committee Chair
      Ji-Yong Kim ,
      The study of interface electromigration in Cu interconnects
    • May 2002
      Master's Thesis Committee Chair
      R. Kabade ,
      Metallurgical Investigation of Ag-Cu-Sn Lead-free solder with Addition of Au
    • May 2002
      Master's Thesis Committee Chair
      T. Rao ,
      The study of grain growth in Cu interconnects
    • Dec 2001
      Master's Thesis Committee Chair
      Man Jong Lee, (Material Science and Engineer)
      Mechanism of Precipitation and Shape evolution of HgTe Nanocrystalines in HgTe-PbTe induced by Controlled Precipitation Technique
    • Dec 2000
      Dissertation Committee Chair
      E. L. Shoemaker , (Material Science and Engineer)
      CO2 sensing mechanisms of an Electrocatalytic Sensor/cell based on a Tungsten Stabilized Bismuth Oxide Solid Electrolyte
    • Dec 2000
      Master's Thesis Committee Chair
      H. Le , (Electrical Engineering)
      A Study of Electromigration in ULSI circuit
    • May 1999
      Master's Thesis Committee Chair
      S. Naik , (Material Science and Engineer)
      Microstructural and Electrical Characterization of Ge-Ni Eutectic Alloy
    • May 1999
      Master's Thesis Committee Chair
      N. L. Michael ,
      Electromigration Study of Cu thin film with Cu(Sn) and Cu(Al) Cross strips

Courses

      • MSE 5304-001 ANALYSIS MATL
        (Topic: Analysis of Materials | Course Id: 103507)
        Fall - Regular Academic Session - 2021
      • MSE 5304-002 ANALYSIS MATL
        (Course Id: 103507)
        Fall - Regular Academic Session - 2021
      • MSE 6699-036 DISSERTATION
        (Course Id: 103552)
        Fall - Regular Academic Session - 2021
      • MSE 7399-036 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Fall - Regular Academic Session - 2021
      • MSE 6196-036 MSE INTERNSHIP
        (Course Id: 103537)
        Fall - Regular Academic Session - 2021
      • MSE 6298-036 RESEARCH IN MSE
        (Course Id: 103540)
        Fall - Regular Academic Session - 2021
      • MSE 6398-036 RESEARCH IN MSE
        (Course Id: 103546)
        Fall - Regular Academic Session - 2021
      • MSE 6196-036 MSE INTERNSHIP
        (Course Id: 103537)
        Summer - Eleven Week - 2021
      • MSE 6198-036 RESEARCH IN MSE
        (Course Id: 103539)
        Summer - Eleven Week - 2021
      • MSE 6698-036 RESEARCH IN MSE
        (Course Id: 103551)
        Summer - Eleven Week - 2021
      • MSE 6399-036 DISSERTATION
        (Course Id: 103547)
        Spring - Regular Academic Session - 2021
      • MSE 6999-036 DISSERTATION
        (Course Id: 103557)
        Spring - Regular Academic Session - 2021
      • MSE 7399-036 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Spring - Regular Academic Session - 2021
      • MSE 4359-001 FAILURE ANALYSIS & RELIABILITY
        (Course Id: 112355)
        Spring - Regular Academic Session - 2021 Download Syllabus
      • MSE 5339-001 Failure Analysis & Reliability
        (Course Id: 112096)
        Spring - Regular Academic Session - 2021 Download Syllabus
      • MSE 5339-900 Failure Analysis & Reliability
        (Course Id: 112096)
        Spring - Regular Academic Session - 2021
      • MSE 5394-036 MASTER'S RESEARCH PROJECT
        (Course Id: 111990)
        Spring - Regular Academic Session - 2021
      • MSE 6298-036 RESEARCH IN MSE
        (Course Id: 103540)
        Spring - Regular Academic Session - 2021
      • MSE 6398-036 RESEARCH IN MSE
        (Course Id: 103546)
        Spring - Regular Academic Session - 2021
      • MSE 6698-036 RESEARCH IN MSE
        (Course Id: 103551)
        Spring - Regular Academic Session - 2021
      • MSE 6998-036 RESEARCH IN MSE
        (Course Id: 103556)
        Spring - Regular Academic Session - 2021
      • MSE 5698-036 THESIS
        (Course Id: 103535)
        Spring - Regular Academic Session - 2021
      • MSE 6197-036 ADV STUDIES IN MSE
        (Course Id: 103538)
        Fall - Regular Academic Session - 2020
      • MSE 5304-001 ANALYSIS MATL
        (Topic: Analysis of Materials | Course Id: 103507)
        Fall - Regular Academic Session - 2020
      • MSE 5304-002 ANALYSIS MATL
        (Course Id: 103507)
        Fall - Regular Academic Session - 2020
      • MSE 5304-900 ANALYSIS MATL
        (Topic: Analysis of Materials | Course Id: 103507)
        Fall - Regular Academic Session - 2020
      • MSE 5304-901 ANALYSIS MATL
        (Course Id: 103507)
        Fall - Regular Academic Session - 2020
      • MSE 4304-001 ANALYSIS OF MATERIALS
        (Course Id: 113832)
        Fall - Regular Academic Session - 2020
      • MSE 4304-002 ANALYSIS OF MATERIALS
        (Course Id: 113832)
        Fall - Regular Academic Session - 2020
      • MSE 6298-036 RESEARCH IN MSE
        (Course Id: 103540)
        Fall - Regular Academic Session - 2020
      • MSE 6698-036 RESEARCH IN MSE
        (Course Id: 103551)
        Fall - Regular Academic Session - 2020
      • MSE 6998-036 RESEARCH IN MSE
        (Course Id: 103556)
        Fall - Regular Academic Session - 2020
      • MSE 5394-036 MASTER'S RESEARCH PROJECT
        (Course Id: 111990)
        Summer - Eleven Week - 2020
      • MSE 4359-001 FAILURE ANALYSIS & RELIABILITY
        (Course Id: 112355)
        Spring - Regular Academic Session - 2020 Download Syllabus
      • MSE 5339-001 Failure Analysis & Reliability
        (Course Id: 112096)
        Spring - Regular Academic Session - 2020 Download Syllabus
      • MSE 5394-036 MASTER'S RESEARCH PROJECT
        (Course Id: 111990)
        Spring - Regular Academic Session - 2020
      • MSE 6298-036 RESEARCH IN MSE
        (Course Id: 103540)
        Spring - Regular Academic Session - 2020
      • MSE 6398-036 RESEARCH IN MSE
        (Course Id: 103546)
        Spring - Regular Academic Session - 2020
      • MSE 6698-036 RESEARCH IN MSE
        (Course Id: 103551)
        Spring - Regular Academic Session - 2020
      • MSE 6998-036 RESEARCH IN MSE
        (Course Id: 103556)
        Spring - Regular Academic Session - 2020
      • MSE 5190-002 SPEC TOPICS MSE
        (Course Id: 103497)
        Spring - Regular Academic Session - 2020
      • MSE 5698-036 THESIS
        (Course Id: 103535)
        Spring - Regular Academic Session - 2020
      • MSE 5304-001 ANALYSIS MATL
        (Topic: Analysis of Materials | Course Id: 103507)
        Fall - Regular Academic Session - 2019
      • MSE 5304-002 ANALYSIS MATL
        (Course Id: 103507)
        Fall - Regular Academic Session - 2019
      • MSE 4359-001 FAILURE ANALYSIS & RELIABILITY
        (Course Id: 112355)
        Fall - Regular Academic Session - 2019
      • MSE 5339-001 Failure Analysis & Reliability
        (Course Id: 112096)
        Fall - Regular Academic Session - 2019
      • MSE 6298-036 RESEARCH IN MSE
        (Course Id: 103540)
        Fall - Regular Academic Session - 2019
      • MSE 6398-036 RESEARCH IN MSE
        (Course Id: 103546)
        Fall - Regular Academic Session - 2019
      • MSE 6998-036 RESEARCH IN MSE
        (Course Id: 103556)
        Fall - Regular Academic Session - 2019
      • MSE 6698-036 RESEARCH IN MSE
        (Course Id: 103551)
        Summer - Eleven Week - 2019
      • MSE 6198-036 RESEARCH IN MSE
        (Course Id: 103539)
        Spring - Regular Academic Session - 2019
      • MSE 6298-036 RESEARCH IN MSE
        (Course Id: 103540)
        Spring - Regular Academic Session - 2019
      • MSE 6398-036 RESEARCH IN MSE
        (Course Id: 103546)
        Spring - Regular Academic Session - 2019
      • MSE 5341-001 TRAN ELEC MICRSCPY MATL SCI
        (Course Id: 103521)
        Spring - Regular Academic Session - 2019 Download Syllabus
      • MSE 5141-001 TRANS ELECTRON MICROSCOPY LAB
        (Course Id: 103495)
        Spring - Regular Academic Session - 2019
      • MSE 6699-036 DISSERTATION
        (Course Id: 103552)
        Fall - Regular Academic Session - 2018
      • MSE 4359-001 FAILURE ANALYSIS & RELIABILITY
        (Course Id: 112355)
        Fall - Regular Academic Session - 2018
      • MSE 5339-001 Failure Analysis & Reliability
        (Course Id: 112096)
        Fall - Regular Academic Session - 2018 Download Syllabus
      • MSE 6298-036 RESEARCH IN MSE
        (Course Id: 103540)
        Fall - Regular Academic Session - 2018
      • MSE 6698-036 RESEARCH IN MSE
        (Course Id: 103551)
        Fall - Regular Academic Session - 2018
      • MAE 3324-002 STRUC & MECH BEHAVIOR MATERIAL
        (Course Id: 111317)
        Fall - Regular Academic Session - 2018 Download Syllabus
      • MSE 7399-036 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Summer - Eleven Week - 2018
      • MSE 6196-036 MSE INTERNSHIP
        (Course Id: 103537)
        Summer - Eleven Week - 2018
      • MSE 5698-036 THESIS
        (Course Id: 103535)
        Summer - Eleven Week - 2018
      • MSE 6699-036 DISSERTATION
        (Course Id: 103552)
        Spring - Regular Academic Session - 2018
      • MSE 7399-036 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Spring - Regular Academic Session - 2018
      • MSE 5300-001 INTRO MATERIALS SCIENCE & ENGR
        (Course Id: 103503)
        Spring - Regular Academic Session - 2018 Download Syllabus
      • MSE 5394-036 Master's Research Project I
        (Course Id: 111990)
        Spring - Regular Academic Session - 2018
      • MSE 3300-001 MATERIALS SCIENCE
        (Course Id: 110905)
        Spring - Regular Academic Session - 2018
      • MSE 6298-036 RESEARCH IN MSE
        (Course Id: 103540)
        Spring - Regular Academic Session - 2018
      • MSE 6398-036 RESEARCH IN MSE
        (Course Id: 103546)
        Spring - Regular Academic Session - 2018
      • MSE 5304-001 ANALYSIS MATL
        (Topic: Analysis of Materials | Course Id: 103507)
        Fall - Regular Academic Session - 2017 Download Syllabus
      • MSE 5304-002 ANALYSIS MATL
        (Course Id: 103507)
        Fall - Regular Academic Session - 2017 Download Syllabus
      • MSE 6399-036 DISSERTATION
        (Course Id: 103547)
        Fall - Regular Academic Session - 2017
      • MSE 6699-036 DISSERTATION
        (Course Id: 103552)
        Fall - Regular Academic Session - 2017
      • MSE 4359-001 FAILURE ANALYSIS & RELIABILITY
        (Course Id: 112355)
        Fall - Regular Academic Session - 2017
      • MSE 5339-001 Failure Analysis & Reliability
        (Course Id: 112096)
        Fall - Regular Academic Session - 2017 Download Syllabus
      • MSE 6298-036 RESEARCH IN MSE
        (Course Id: 103540)
        Fall - Regular Academic Session - 2017
      • MSE 6398-036 RESEARCH IN MSE
        (Course Id: 103546)
        Fall - Regular Academic Session - 2017
      • MSE 6698-036 RESEARCH IN MSE
        (Course Id: 103551)
        Fall - Regular Academic Session - 2017
      • MSE 4336-001 ADV MECH BEHAVIOR OF MATERIALS
        (Course Id: 110911)
        Spring - Regular Academic Session - 2017
      • MSE 6699-036 DISSERTATION
        (Course Id: 103552)
        Spring - Regular Academic Session - 2017
      • MSE 5394-036 Master's Research Project I
        (Course Id: 111990)
        Spring - Regular Academic Session - 2017
      • MSE 5312-001 MECH BEHAV MATL
        (Course Id: 103510)
        Spring - Regular Academic Session - 2017
      • MSE 6298-036 RESEARCH IN MSE
        (Course Id: 103540)
        Spring - Regular Academic Session - 2017
      • MSE 6398-036 RESEARCH IN MSE
        (Course Id: 103546)
        Spring - Regular Academic Session - 2017
      • MSE 6698-036 RESEARCH IN MSE
        (Course Id: 103551)
        Spring - Regular Academic Session - 2017
      • MSE 5698-036 THESIS
        (Course Id: 103535)
        Spring - Regular Academic Session - 2017
      • MSE 5304-001 ANALYSIS MATL
        (Topic: Analysis of Materials | Course Id: 103507)
        Fall - Regular Academic Session - 2016
      • MSE 5304-002 ANALYSIS MATL
        (Course Id: 103507)
        Fall - Regular Academic Session - 2016
      • MSE 7399-036 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Fall - Regular Academic Session - 2016
      • MSE 4359-001 FAILURE ANALYSIS & RELIABILITY
        (Course Id: 112355)
        Fall - Regular Academic Session - 2016
      • MSE 5339-001 Failure Analysis & Reliability
        (Course Id: 112096)
        Fall - Regular Academic Session - 2016
      • MSE 5394-036 Master's Research Project I
        (Course Id: 111990)
        Fall - Regular Academic Session - 2016
      • MSE 6298-036 RESEARCH IN MSE
        (Course Id: 103540)
        Fall - Regular Academic Session - 2016
      • MSE 6698-036 RESEARCH IN MSE
        (Course Id: 103551)
        Fall - Regular Academic Session - 2016
      • MSE 6998-036 RESEARCH IN MSE
        (Course Id: 103556)
        Fall - Regular Academic Session - 2016
      • MSE 4390-003 SPEC TOPS MATERIALS SCI & ENGR
        (Topic: Analysis of Materials | Course Id: 111048)
        Fall - Regular Academic Session - 2016
      • MSE 6298-036 RESEARCH IN MSE
        (Course Id: 103540)
        Summer - Eleven Week - 2016
      • MSE 6698-036 RESEARCH IN MSE
        (Course Id: 103551)
        Summer - Eleven Week - 2016
      • MSE 5341-001 TRAN ELEC MICRSCPY MATL SCI
        (Course Id: 103521)
        Summer - Eleven Week - 2016
      • MSE 5141-001 TRANS ELECTRON MICROSCOPY LAB
        (Course Id: 103495)
        Summer - Eleven Week - 2016
      • MSE 4336-001 ADV MECH BEHAVIOR OF MATERIALS
        (Course Id: 110911)
        Spring - Regular Academic Session - 2016
      • MSE 5312-001 MECH BEHAV MATL
        (Course Id: 103510)
        Spring - Regular Academic Session - 2016
      • MSE 6298-036 RESEARCH IN MSE
        (Course Id: 103540)
        Spring - Regular Academic Session - 2016
      • MSE 6398-036 RESEARCH IN MSE
        (Course Id: 103546)
        Spring - Regular Academic Session - 2016
      • MSE 6698-036 RESEARCH IN MSE
        (Course Id: 103551)
        Spring - Regular Academic Session - 2016
      • MSE 6998-036 RESEARCH IN MSE
        (Course Id: 103556)
        Spring - Regular Academic Session - 2016
      • MSE 5304-001 ANALYSIS MATL
        (Topic: Analysis of Materials | Course Id: 103507)
        Fall - Regular Academic Session - 2015
      • MSE 5304-002 ANALYSIS MATL
        (Course Id: 103507)
        Fall - Regular Academic Session - 2015
      • MSE 4338-001 FAILURE ANALYSIS
        (Course Id: 110912)
        Fall - Regular Academic Session - 2015
      • MSE 5339-001 Failure Analysis & Reliability
        (Course Id: 112096)
        Fall - Regular Academic Session - 2015
      • MSE 5394-036 Master's Research Project I
        (Course Id: 111990)
        Fall - Regular Academic Session - 2015
      • MSE 6298-036 RESEARCH IN MSE
        (Course Id: 103540)
        Fall - Regular Academic Session - 2015
      • MSE 6398-036 RESEARCH IN MSE
        (Course Id: 103546)
        Fall - Regular Academic Session - 2015
      • MSE 6698-036 RESEARCH IN MSE
        (Course Id: 103551)
        Fall - Regular Academic Session - 2015
      • MSE 5698-036 THESIS
        (Course Id: 103535)
        Fall - Regular Academic Session - 2015
      • MSE 7399-036 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Summer - Eleven Week - 2015
      • MSE 5698-036 THESIS
        (Course Id: 103535)
        Summer - Eleven Week - 2015
      • MSE 6699-036 DISSERTATION
        (Course Id: 103552)
        Spring - Regular Academic Session - 2015
      • MSE 5312-001 MECH BEHAV MATL
        (Topic: Mechanical Behavior Materials | Course Id: 103510)
        Spring - Regular Academic Session - 2015
      • MSE 6398-036 RESEARCH IN MSE
        (Course Id: 103546)
        Spring - Regular Academic Session - 2015
      • MSE 6698-036 RESEARCH IN MSE
        (Course Id: 103551)
        Spring - Regular Academic Session - 2015
      • MSE 6998-036 RESEARCH IN MSE
        (Course Id: 103556)
        Spring - Regular Academic Session - 2015
      • MSE 5392-036 Research Project in MSE I
        (Course Id: 111988)
        Spring - Regular Academic Session - 2015
      • MSE 5304-001 ANALYSIS MATL
        (Course Id: 103507)
        Fall - Regular Academic Session - 2014
      • MSE 5304-002 ANALYSIS MATL
        (Course Id: 103507)
        Fall - Regular Academic Session - 2014
      • MSE 6399-036 DISSERTATION
        (Course Id: 103547)
        Fall - Regular Academic Session - 2014
      • MSE 4338-001 FAILURE ANALYSIS
        (Course Id: 110912)
        Fall - Regular Academic Session - 2014
      • MSE 5339-001 Failure Analysis & Reliability
        (Course Id: 112096)
        Fall - Regular Academic Session - 2014
      • MSE 6196-036 MSE INTERNSHIP
        (Course Id: 103537)
        Fall - Regular Academic Session - 2014
      • MSE 6298-036 RESEARCH IN MSE
        (Course Id: 103540)
        Fall - Regular Academic Session - 2014
      • MSE 6398-036 RESEARCH IN MSE
        (Course Id: 103546)
        Fall - Regular Academic Session - 2014
      • MSE 6698-036 RESEARCH IN MSE
        (Course Id: 103551)
        Fall - Regular Academic Session - 2014
      • MSE 6998-036 RESEARCH IN MSE
        (Course Id: 103556)
        Fall - Regular Academic Session - 2014
      • MSE 6399-036 DISSERTATION
        (Course Id: 103547)
        Summer - Eleven Week - 2014
      • MSE 6196-036 MSE INTERNSHIP
        (Course Id: 103537)
        Summer - Eleven Week - 2014
      • MSE 6298-036 RESEARCH IN MSE
        (Course Id: 103540)
        Summer - Eleven Week - 2014
      • MSE 6398-036 RESEARCH IN MSE
        (Course Id: 103546)
        Summer - Eleven Week - 2014
      • MSE 5698-036 THESIS
        (Course Id: 103535)
        Summer - Eleven Week - 2014
      • MSE 5341-001 TRAN ELEC MICRSCPY MATL SCI
        (Course Id: 103521)
        Summer - Eleven Week - 2014
      • MSE 5141-001 TRANS ELECTRON MICROSCOPY LAB
        (Course Id: 103495)
        Summer - Eleven Week - 2014
      • MAE 4336-001 ADV MECH BEHAVIOR OF MATERIALS
        (Course Id: 103676)
        Spring - Regular Academic Session - 2014
      • MSE 6699-036 DISSERTATION
        (Course Id: 103552)
        Spring - Regular Academic Session - 2014
      • MSE 5312-001 MECH BEHAV MATL
        (Course Id: 103510)
        Spring - Regular Academic Session - 2014
      • MSE 6398-036 RESEARCH IN MSE
        (Course Id: 103546)
        Spring - Regular Academic Session - 2014
      • MSE 6998-036 RESEARCH IN MSE
        (Course Id: 103556)
        Spring - Regular Academic Session - 2014
      • MSE 5698-036 THESIS
        (Course Id: 103535)
        Spring - Regular Academic Session - 2014
      • MSE 6197-036 ADV STUDIES IN MSE
        (Course Id: 103538)
        Fall - Regular Academic Session - 2013
      • MSE 5304-001 ANALYSIS MATL
        (Course Id: 103507)
        Fall - Regular Academic Session - 2013
      • MSE 5304-002 ANALYSIS MATL
        (Course Id: 103507)
        Fall - Regular Academic Session - 2013
      • MSE 6399-036 DISSERTATION
        (Course Id: 103547)
        Fall - Regular Academic Session - 2013
      • MSE 6699-036 DISSERTATION
        (Course Id: 103552)
        Fall - Regular Academic Session - 2013
      • MSE 7399-036 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Fall - Regular Academic Session - 2013
      • MSE 5339-001 Failure Analysis & Reliability
        (Course Id: 112096)
        Fall - Regular Academic Session - 2013
      • MSE 5394-036 Master's Research Project I
        (Course Id: 111990)
        Fall - Regular Academic Session - 2013
      • MSE 6298-036 RESEARCH IN MSE
        (Course Id: 103540)
        Fall - Regular Academic Session - 2013
      • MSE 6398-036 RESEARCH IN MSE
        (Course Id: 103546)
        Fall - Regular Academic Session - 2013
      • MSE 5392-036 Research Project in MSE I
        (Course Id: 111988)
        Fall - Regular Academic Session - 2013
      • MSE 4390-001 SPEC TOPS MATERIALS SCI & ENGR
        (Topic: Failure Analysis | Course Id: 111048)
        Fall - Regular Academic Session - 2013
      • MSE 6399-036 DISSERTATION
        (Course Id: 103547)
        Summer - Eleven Week - 2013
      • MSE 7399-036 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Summer - Eleven Week - 2013
      • MSE 5192-036 MASTER'S COMPREHENSIVE EXAM
        (Course Id: 103499)
        Summer - Eleven Week - 2013
      • MSE 6398-036 RESEARCH IN MSE
        (Course Id: 103546)
        Summer - Eleven Week - 2013
      • MSE 5341-001 TRAN ELEC MICRSCPY MATL SCI
        (Course Id: 103521)
        Summer - Eleven Week - 2013
      • MSE 5141-001 TRANS ELECTRON MICROSCOPY LAB
        (Course Id: 103495)
        Summer - Eleven Week - 2013
      • MSE 6699-036 DISSERTATION
        (Course Id: 103552)
        Spring - Regular Academic Session - 2013
      • MSE 5336-001 ELECTRICAL PROPERTIES MATERIAL
        (Course Id: 103518)
        Spring - Regular Academic Session - 2013
      • MSE 6398-036 RESEARCH IN MSE
        (Course Id: 103546)
        Spring - Regular Academic Session - 2013
      • MSE 6998-036 RESEARCH IN MSE
        (Course Id: 103556)
        Spring - Regular Academic Session - 2013
      • MSE 5304-001 ANALYSIS MATL
        (Course Id: 103507)
        Fall - Regular Academic Session - 2012
      • MSE 5304-002 ANALYSIS MATL
        (Course Id: 103507)
        Fall - Regular Academic Session - 2012
      • MSE 6298-036 RESEARCH IN MSE
        (Course Id: 103540)
        Fall - Regular Academic Session - 2012
      • MSE 6398-036 RESEARCH IN MSE
        (Course Id: 103546)
        Fall - Regular Academic Session - 2012
      • MSE 6998-036 RESEARCH IN MSE
        (Course Id: 103556)
        Fall - Regular Academic Session - 2012
      • MSE 6699-036 DISSERTATION
        (Course Id: 103552)
        Summer - Eleven Week - 2012
      • MSE 6298-036 RESEARCH IN MSE
        (Course Id: 103540)
        Summer - Eleven Week - 2012
      • MSE 5341-001 TRAN ELEC MICRSCPY MATL SCI
        (Course Id: 103521)
        Summer - Eleven Week - 2012
      • MSE 5141-001 TRANS ELECTRON MICROSCOPY LAB
        (Course Id: 103495)
        Summer - Eleven Week - 2012
      • MSE 7399-038 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Spring - Regular Academic Session - 2012
      • MSE 5336-001 ELECTRICAL PROPERTIES MATERIAL
        (Course Id: 103518)
        Spring - Regular Academic Session - 2012
      • MSE 5192-036 MASTER'S COMPREHENSIVE EXAM
        (Course Id: 103499)
        Spring - Regular Academic Session - 2012
      • MSE 6398-036 RESEARCH IN MSE
        (Course Id: 103546)
        Spring - Regular Academic Session - 2012
      • MSE 6698-036 RESEARCH IN MSE
        (Course Id: 103551)
        Spring - Regular Academic Session - 2012
      • MSE 6998-036 RESEARCH IN MSE
        (Course Id: 103556)
        Spring - Regular Academic Session - 2012
      • MSE 5391-036 ADV STUDIES MSE
        (Course Id: 103532)
        Fall - Regular Academic Session - 2011
      • MSE 5304-001 ANALYSIS MATL
        (Course Id: 103507)
        Fall - Regular Academic Session - 2011
      • MSE 5304-002 ANALYSIS MATL
        (Course Id: 103507)
        Fall - Regular Academic Session - 2011
      • MSE 6699-036 DISSERTATION
        (Course Id: 103552)
        Fall - Regular Academic Session - 2011
      • MSE 6999-036 DISSERTATION
        (Course Id: 103557)
        Fall - Regular Academic Session - 2011
      • MSE 5192-036 MASTER'S COMPREHENSIVE EXAM
        (Course Id: 103499)
        Fall - Regular Academic Session - 2011
      • MSE 6298-036 RESEARCH IN MSE
        (Course Id: 103540)
        Fall - Regular Academic Session - 2011
      • MSE 6398-036 RESEARCH IN MSE
        (Course Id: 103546)
        Fall - Regular Academic Session - 2011
      • MSE 6698-036 RESEARCH IN MSE
        (Course Id: 103551)
        Fall - Regular Academic Session - 2011
      • MSE 7399-036 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Summer - Eleven Week - 2011
      • MSE 6196-036 MSE INTERNSHIP
        (Course Id: 103537)
        Summer - Eleven Week - 2011
      • MSE 5341-001 TRAN ELEC MICRSCPY MATL SCI
        (Course Id: 103521)
        Summer - Eleven Week - 2011
      • MSE 5141-001 TRANS ELECTRON MICROSCOPY LAB
        (Course Id: 103495)
        Summer - Eleven Week - 2011
      • MSE 6999-036 DISSERTATION
        (Course Id: 103557)
        Spring - Regular Academic Session - 2011
      • MSE 5336-001 ELECTRICAL PROPERTIES MATERIAL
        (Course Id: 103518)
        Spring - Regular Academic Session - 2011
      • MSE 6398-036 RESEARCH IN MSE
        (Course Id: 103546)
        Spring - Regular Academic Session - 2011
      • MSE 6698-036 RESEARCH IN MSE
        (Course Id: 103551)
        Spring - Regular Academic Session - 2011
      • MSE 6998-036 RESEARCH IN MSE
        (Course Id: 103556)
        Spring - Regular Academic Session - 2011
      • MSE 6999-036 DISSERTATION
        (Course Id: 103557)
        Fall - Regular Academic Session - 2010
      • MSE 6298-036 RESEARCH IN MSE
        (Course Id: 103540)
        Fall - Regular Academic Session - 2010
      • MSE 6698-036 RESEARCH IN MSE
        (Course Id: 103551)
        Fall - Regular Academic Session - 2010
      • MSE 6998-036 RESEARCH IN MSE
        (Course Id: 103556)
        Fall - Regular Academic Session - 2010
      • MSE 6999-036 DISSERTATION
        (Course Id: 103557)
        Summer - Eleven Week - 2010
      • MSE 5192-036 MASTER'S COMPREHENSIVE EXAM
        (Course Id: 103499)
        Summer - Eleven Week - 2010
      • MSE 6298-036 RESEARCH IN MSE
        (Course Id: 103540)
        Summer - Eleven Week - 2010
      • MSE 5341-001 TRAN ELEC MICRSCPY MATL SCI
        (Course Id: 103521)
        Summer - Eleven Week - 2010
      • MSE 5141-001 TRANS ELECTRON MICROSCOPY LAB
        (Course Id: 103495)
        Summer - Eleven Week - 2010
      • MSE 6999-036 DISSERTATION
        (Course Id: 103557)
        Spring - Regular Academic Session - 2010
      • MSE 5336-001 ELECT PROP MATL
        (Course Id: 103518)
        Spring - Regular Academic Session - 2010
      • MSE 6698-036 RESEARCH IN MSE
        (Course Id: 103551)
        Spring - Regular Academic Session - 2010
      • MSE 6998-036 RESEARCH IN MSE
        (Course Id: 103556)
        Spring - Regular Academic Session - 2010
      • MSE 5304-001 ANALYSIS MATL
        (Course Id: 103507)
        Fall - Regular Academic Session - 2009
      • MSE 5304-002 ANALYSIS MATL
        (Course Id: 103507)
        Fall - Regular Academic Session - 2009
      • MSE 6999-036 DISSERTATION
        (Course Id: 103557)
        Fall - Regular Academic Session - 2009
      • MSE 5192-036 MASTER'S COMPREHENSIVE EXAM
        (Course Id: 103499)
        Fall - Regular Academic Session - 2009
      • MSE 6198-036 RESEARCH IN MSE
        (Course Id: 103539)
        Fall - Regular Academic Session - 2009
      • MSE 6298-036 RESEARCH IN MSE
        (Course Id: 103540)
        Fall - Regular Academic Session - 2009
      • MSE 6398-036 RESEARCH IN MSE
        (Course Id: 103546)
        Fall - Regular Academic Session - 2009
      • MSE 6698-036 RESEARCH IN MSE
        (Course Id: 103551)
        Fall - Regular Academic Session - 2009
      • MSE 4390-001 SPEC TOPS MATERIALS SCI & ENGR
        (Topic: Analysis of Materials | Course Id: 111048)
        Fall - Regular Academic Session - 2009
      • MSE 5698-036 THESIS
        (Course Id: 103535)
        Fall - Regular Academic Session - 2009

Service to the University

    • Apr 2021 to  Present Committee Member
      COE Academic Programs Committee
    • Oct 2020 to  Present Committee Member
      multidisciplinary position committee
    • Sept 2020 to  Present Committee Member
      2021 Spring Planning Committee
      Planning COE's spring 2021 q/ COVID19 ready
    • Jan 2018 to  Present Committee Member
      NTT Ranking committee
      set policy of NTT faculty promotion policy
    • 2017 to  Present Attendee, Meeting
      Faculty Senate
    • Sept 2014 to  Present Committee Member
      COE T&P Committee
      Review Tenure and promotion matters of COE
    • Sept 2014 to  Present Chairperson
      MSE T&P committee
      Manage T&P matters of MSE
    • May 2014 to  Present Committee Member
      Undergraduate Curriculum Committee
      manage COE undergraduate curriculum issues
    • 2012 to  Present Chairperson
      ASM-International/UTA Advisor Faculty
    • Mar 2020 to  Sept 2020 Task Force Member
      CoE2020 Fall Planning Committee
      Planning COE's Fall2020 with COVID19
    • Sept 2019 to  Aug 2020 Committee Chair
      COE Tenure and Promotion
    • Mar 2020 to  Aug 2020 Task Force Member
      COE re-population committee
      make preparation of 2020 Fall re-population schedule and make ready for COVD19
    • Sept 2006 to  July 2015 Committee Member
      COE award committee
      review award packages of COE award applicant and select the awardee

Service to the Profession

    • May 2019 to  Present
      Editorial Review Board Member
      Journal of Microscopy
    • Mar 2019 to  Feb 2022
      Officer, Other OfficerUSA)
      TMS, Functional Materials Division
      develop FMD (functional materials division) programs including symposium at annual meetings and also interface with the main office of TMS
    • Jan 2011 to  2013
      Chairperson
      CPI track for IRPS
      CPI track for IRPS,
    • Jan 2010 to  2012
      Chairperson
      Thin Films committee" of TMS
    • Jan 2007 to  2009
      Section editor
      JOM
    • Jan 2005 to  2009
      Vice Chair
      Thin Films" committee of TMS
    • Jan 2006 to  2006
      Officer, Other Officer (New York,
      UKC 2006
      Functional Materials and devices", UKC 2006 (NewYork, 2006).
    • Jan 2005 to  2005
      Board of Advisors
      Electronic Materials Letters
    • Jan 2003 to  2004
      Secretary
      Thin Films" committee of TMS

Service to the Community

Service to the Community

    • Sept 2017 to  Present
      Board Member (Arlington, TX,
      Asian Advisory Board Member to Congressman Barton