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Dereje Agonafer

  • Professor, Mechanical and Aerospace Engineering

Education

    • 1984 PhD in Mechanical Engineering
      Howard University, 1984
    • 1978 MS in Mechanical Engineering
      Howard University, 1978
    • 1972 BS in Aerospace Engineering
      University of Colorado Boulder, 1972

Appointments

    • 1984 to 1999 Director
      IBM
      Directed the development/application of Computer Aided Thermal Engineering (CATE). Also introduced commercial CFD codes to IBM which included 1) training engineers in the use of both finite element and finite control volume commercial codes for solving electronic packaging problems; 2) providing consultation for product design analysis; 3) working with vendors to incorporate electronic cooling models in commercial codes; and 4) creative ideas for electronic cooing as evidenced by 8 patents and over 80 invention disclosures. Developed the IBM Center of Competence for Computer Aided Thermal Engineering. During this time also worked in promoting a concurrent engineering methodology for thermo/mechanical design and modeling of electronic packaging (had a patent issued on the subject matter in July 1997).

Memberships

    • Feb 2018 to Present National Academy of Engineering
      Fellow
    • Mar 2014 to Present National Society of Black Engineers
      Member
    • May 2006 to Present American Association of the Advancement of Science
      Fellow
    • May 1995 to Present International American Society of Mechanical Engineers
      Member
    • May 1992 to Present Institute of Electrical and Electronics Engineers
      Member
    • Jan 1980 to Present American Society of Mechanical Engineering
      Life Fellow

Awards and Honors

    • Dec  2016 2016 Compendium: Successful Industry-Nominated Technological Breakthroughs for NSF I/UCRCs in More Efficient Data Centers: Maximizing Airside Cooling sponsored by NSF
    • Dec  2015 2015 IBM Faculty Award sponsored by IBM
    • Dec  2014 2014 iTherm Best Poster Award (1 of 83) sponsored by Institute of Electrical and Electronics Engineers (IEEE)
    • Oct  2014 Best Paper Award sponsored by International Microelectronics Assembly and Packaging Society (IMAPS)
    • Oct  2014 Best Paper Award sponsored by International Microelectronics Assembly and Packaging Society (IMAPS)
    • Oct  2014 Best Paper Award sponsored by International Microelectronics Assembly and Packaging Society (IMAPS)
    • May  2014 2014 iTherm Achievement Award sponsored by Institute of Electrical and Electronics Engineers (IEEE)
    • Mar  2014 Golden Torch Legacy Award sponsored by Annual National Society of Black Engineers
    • Dec  2013 2013 Phi Kappa Phi Recognized Professor sponsored by Phi Kappa Phi
    • Dec  2012 Dean's Centennial Award for Distinguished Engineering Scholarship and Service sponsored by Howard University College of Engineering, Architecture and Computer Science
    • Dec  2012 Jenkins Garrett Endowed Professorship sponsored by University of Texas at Arlington
    • Jul  2012 Certificate of Recognition, Plenary Speaker sponsored by American Society of Mechanical Engineers (ASME) 10th International Conference on Nanochannels, Microchannels and Minichannels (ICNMM 2012),
    • Jul  2009 InterPACK Achievement Award sponsored by InterPACK
    • Mar  2008 THERMI Award for Significant Contributions in the Thermal Sciences sponsored by Institute of Electrical and Electronics Engineers (IEEE)
    • Dec  2006 Research Excellence Award sponsored by College of Engineering (UTA)
    • Oct  2006 Elected Fellow sponsored by The American Association for the Advancement of Science (AAAS)
    • Dec  2005 Research Excellence Award sponsored by College of Engineering (UTA)
    • Jul  2005 Keynote Speaker Chair Recognition Award sponsored by InterPACK
    • Jul  2005 Panel Co-Moderator Recognition Award sponsored by InterPACK
    • Dec  2004 McNair Scholar Mentor sponsored by University of Texas at Arlington
    • May  2004 Keynote Speaker Chair Recognition Award sponsored by Institute of Electrical and Electronics Engineers (IEEE)
    • May  2004 Panel Co-Moderator Recognition Award sponsored by Institute of Electrical and Electronics Engineers (IEEE)
    • Dec  2003 McNair Scholar Mentor sponsored by University of Texas at Arlington
    • May  2003 UT Arlington Libraries Learning Partnership Award sponsored by UT Arlington Libraries
    • Dec  2002 IMECE 2002 Achievement Award For “Outstanding Contributions to the Area of the Application of the Science and Engineering of Heat Transfer to Electronic and Photonic Packaging” sponsored by The American Society of Mechanical Engineers' (ASME) International Mechanical Engineering Congress and Exposition (IMECE)
    • Dec  2002 IMECE 2002 Recognition Award for being Division Chair, 2000-2001 and Executive Committee Member, 1997 - 2002 of the Electronic and Photonic Packaging Division of ASME. sponsored by The American Society of Mechanical Engineers' (ASME) International Mechanical Engineering Congress and Exposition (IMECE)
    • May  2002 Keynote Speaker Chair Recognition Award sponsored by Institute of Electrical and Electronics Engineers (IEEE)
    • Jul  2001 InterPACK ’01 Recognition Award for Moderator sponsored by InterPACK
    • Jul  2001 InterPACK ’01 Recognition Award for Track Co-Chair sponsored by InterPACK
    • Jul  2001 InterPACK ’01 Recognition Award for Track Co-Chair sponsored by InterPACK
    • Jun  1999 General Chair sponsored by InterPACK
    • Dec  1998 ASME K-16/EEPD Clock Award for Outstanding Contribution in Computer Aided Thermal Management of Electronic Packages sponsored by American Society of Mechanical Engineers (ASME)
    • Dec  1998 Distinguished Ph.D. Alumni Award sponsored by Howard University
    • Apr  1998 University of Colorado School of Engineering Distinguished Engineering Alumni Award (DEAA) sponsored by University of Colorado School of Engineering
    • Dec  1997 Industry Advisory Board Member sponsored by University of Texas at Arlington
    • Jul  1997 United Negro College Meritorious Service Award sponsored by United Negro College
    • May  1996 General Chair sponsored by Institute of Electrical and Electronics Engineers (IEEE)
    • Apr  1996 Advisory Council sponsored by Howard University School of Engineering
    • Mar  1996 Alumni Extension Technologist of the Year Award sponsored by National Society of Black Engineers
    • Dec  1995 Fifth Publication Achievement Award sponsored by Unspecified
    • Dec  1995 Sixth Publication Achievement Award sponsored by Unspecified
    • Aug  1995 American Society of Mechanical Engineers International Fellow sponsored by American Society of Mechanical Engineers International
    • Aug  1995 Interim Technical Editor sponsored by ASME Journal of Electronic Packaging
    • Jun  1995 Associate Technical Editor sponsored by Journal of Electronic Packaging
    • Jun  1995 Editor in Chief sponsored by Gordon & Breach Book Series in Electronic Packaging
    • Dec  1994 Fourth Publication Achievement Award sponsored by Unspecified
    • Aug  1994 US Organizer and Invited Lecturer sponsored by World Congress in Computational Mechanics (WCCM)
    • May  1994 Program Chair sponsored by Institute of Electrical and Electronics Engineers (IEEE)
    • Dec  1993 Third Publication Achievement Award sponsored by Unspecified
    • Dec  1992 IBM First Level Invention Achievement Award sponsored by IBM
    • Dec  1992 Informal Awards (Several) sponsored by IBM
    • Dec  1992 Marquis Who's Who in the East sponsored by Marquis Who's Who Ventures LLC
    • Dec  1992 Second Publication Achievement Award sponsored by Unspecified
    • Dec  1991 IBM Outstanding Technical Achievement Award sponsored by IBM
    • Oct  1990 Best Presenter sponsored by Institute of Electrical and Electronics Engineers (IEEE)/National Society of Black Engineers (NSBE)
    • Dec  1989 Certificate of Appreciation sponsored by Poughkeepsie City School District
    • Dec  1984 ASME Most Outstanding Graduate Student sponsored by American Society of Mechanical Engineers (ASME)
    • Dec  1983 Howard University ASME Award, sponsored by American Society of Mechanical Engineers (ASME)

Publications

      Journal Article 2017 2017 2017 2017
      • Qualitative Study of Cumulative Corrosion Damage of Information Technology Equipment in a Data Center Utilizing Air-Side Economizer Operating in Recommended and Expanded ASHRAE Envelope
        [Shah, JimilM., Awe, Oluwaseun, Gebrehiwot, Betsegaw, Agonafer, Dereje, Singh, Prabjit, Kannan, Naveen, Kaler, Mike]. 139(2), 020903 [.] "ASME International". DOI http://dx.doi.org/10.1115/1.4036363
        http://dx.doi.org/10.1115/1.4036363
      2017
      • Qualitative Study of Cumulative Corrosion Damage of Information Technology Equipment in a Data Center Utilizing Air-Side Economizer Operating in Recommended and Expanded ASHRAE Envelope
        [Shah, JimilM., Awe, Oluwaseun, Gebrehiwot, Betsegaw, Agonafer, Dereje, Singh, Prabjit, Kannan, Naveen, Kaler, Mike]. 139(2), 020903 [.] "ASME International". DOI http://dx.doi.org/10.1115/1.4036363
        http://dx.doi.org/10.1115/1.4036363

      Conference Proceeding 2017
      • A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing with Package Power Supply
        [Rahangdale, Unique, Rajmane, Pavan, Misrak, Abel, Agonafer, Dereje].
      2017
      • CHARACTERIZATION OF AN ISOLATED HYBRID COOLED SERVER WITH FAILURE SCENARIOS USING WARM WATER COOLING
        [Chowdhury, Uschas, Sahini, Manasa, Siddarth, Ashwin, Agonafer, Dereje, Branton, Steve].
      2017 2017 2017 2017 2017 2017
      • Comparative Study of High Ambient Inlet Temperature Effects on the Performance of Air vs. Liquid Cooled IT Equipment
        [Sahini, Manasa, Chowdhury, Uschas, Siddarth, Ashwin, Pradip, Tanmay, Agonafer, Dereje, Zeighami, Roy, Metcalf, Jeff, Branton, Steve]. 544-+ [.]
      2017 2017 2017
      • Comparison of the Effect of Elastic and Viscoelastic Modeling of PCBs on the Assessment of Board Level Reliability
        [Misrak, Abel, Anaskure, Avinash, Sakib, A. R. Nazmus, Rahangdale, Unique, Lohia, Alok, Agonafer, Dereje]. 1106-1110 [.]
      2017
      • Damage Progression Study of 3D TSV Package during Reflow, Thermal Shocks and Thermal Cycling
        [Rahangdale, Unique, Rajmane, Pavan, Doiphode, Aniruddha, Sakib, A.R., Misrak, Abel, Lohia, Alok, Agonafer, Dereje]. 1119-1125 [.]
      2017 2017
      • Design Considerations Relating to Non-Thermal Aspects of Oil Immersion Cooling
        [Shah, JimilM., Rizvi, Syed Haider I., Kota, InduSravani, Nagilla, SahithiReddy, Thakkar, Dhaval, Agonafer, Dereje].
      2017 2017 2017 2017 2017 2017 2017 2017
      • Effect of PCB Thickness on Solder Joint Reliability of Quad Flat No-Lead Assembly under Power Cycling and Thermal Cycling
        [Rahangdale, Unique, Srinivas, Rahul, Krishnamurthy, S., Rajmane, Pavan, Misrak, Abel, Sakib, A.R., Agonafer, Dereje, Lohia, Alok, Kummerl, Steven, Nguyen, LuuT.]. 70-76 [.]
      2017
      • Failure Mechanisms of Boards in a Thin Wafer Level Chip Scale Package
        [Rajmane, Pavan, Khan, HassaanAhmad, Doiphode, Aniruddha, Rahangdale, Unique, Agonafer, Dereje, Lohia, Alok, Kummerl, Steven, Nguyen, Luu]. 1099-1105 [.]
      2017
      • Mechanical Characterization of RCC and FR4 Laminated PCBs and Assessment of their Board Level Reliability
        [Rahangdale, Unique, Sakib, A.R., Chaudhari, Mugdha, Misrak, Abel, Dave, Chaitanya, Agonafer, Dereje, Lohia, Alok, Kummerl, Steven, Nguyen, LuuT.]. 1111-1118 [.]
      2017
      • NiyanTron - An Approach to Develop a Control System App for Data Center Cooling
        [Rahul, Varun, Darekar, Anay, Kasukurthy, Rajesh, Sidharth, Ashwin, Agonafer, Dereje]. 952-959 [.]
      2017
      • Power Consumption Minimization in Hybrid Cooled Server by Fan Reduction
        [Islam, MdMalekkul, Chowdhury, Uschas, Inamdar, Neha, Agonafer, Dereje]. 850-856 [.]
      2017
      • Qualitative Study of Cumulative Corrosion Damage of IT Equipment in a Data Center Utilizing Air-side Economizer
        [Shah, JimilM., Awe, Oluwaseun, Agarwal, Pavan, Akhigbe, Iziren, Agonafer, Dereje, Singh, Prabjit, Kannan, Naveen, Kaler, Mike].
      2017
      • Rack-Level Study of Hybrid Cooled Servers using Warm Water Cooling For Distributed vs. Centralized Pumping Systems
        [Sahini, Manasa, Kshirsagar, Chinmay, Kumar, Mathan, Agonafer, Dereje, Fernandes, John, Na, Jacob, Mulay, Veerendra, McGinn, Patrick, Soares, Michael]. 155-162 [.]
      2017 2017
      • Reliability Analysis of Ultra-Low-k Large-Die Package & Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading
        [Rahangdale, Unique, Rajmane, Pavan, Misrak, Abel, Agonafer, Dereje].
      2017
      • Solder Ball Reliability Assessment of WLCSP - Power Cycling Versus Thermal Cycling
        [Rahangdale, Unique, Conjeevaram, B., Doiphode, Aniruddha, Rajmane, Pavan, Misrak, Abel, Sakib, A.R., Agonafer, Dereje, Nguyen, LuuT., Lohia, Alok, Kummerl, Steven]. 1361-1368 [.]
      2017
      • THERMAL PERFORMANCE EVALUATION OF THREE TYPES OF NOVEL END-OF AISLE COOLING SYSTEMS
        [Sahini, Manasa, Agonafer, Dereje, Pandiyan, Vijayalan].

      Conference Proceeding 2016
      • IMPACT OF PCB LAYER ORIENTATION ON THE DROP RELIABILITY OF WCSP BOARDS
        [Mahmood, Anik, Barua, Trina, Sakib, A. R. Nazmus, Agonafer, Dereje]. 2040-2045 [.] DOI http://dx.doi.org/10.1109/ECTC.2016.236
      2016
      • A Computational Study of PCB Layer Orientation of WCSP Assembly under Temperature Dependent Drop Impact Loading
        [Mahmood, Anik, Barua, Trina, Sabne, Sayalee, Sakib, AR Nazmus, Agonafer, Dereje]. Las Vegas, NV.
      2016
      • Costs and Benefits of Thermal Energy Storage for Augmenting Indirect/Direct Evaporative Cooling Systems
        [Luttrell, Jeff, Guhe, Abhishek, Agonafer, Dereje]. Las Vegas, NV.
      2016
      • Effect of Removal of Layers of WCSP Assembly under Thermal Cyclic Loading: A Computational Approach
        [Barua, Trina, Mahmood, Anik, Rajashekar, Karthik, Sabne, Sayalee, Sakib, A R Nazmus, Agonafer, Dereje]. Las Vegas, NV.
      2016
      • Effects of Mineral Oil Immersion Cooling on IT Equipment Reliability and Reliability Enhancements to Data Center Operations
        [Shah, Jimil, Eiland, Richard , Siddarth, Ashwin, Agonafer, Dereje]. Las Vegas, NV.
      2016
      • Multi Design Variable Optimization of QFN Package on Thick Boards for Enhanced Board Level Reliability
        [Krishnamurthy, Sumanth, Deshpande, Abhishek, Islam, Md Malekkul, Agonafer, Dereje]. Las Vegas, NV.
      2016
      • Parametric Study of the QFN Mounted PCB-Cu Layer Thickness Effect on the Stress Induced During Drop Testing
        [Sabne, Sayalee , Mahmood, Anik , Barua, Trina, Agonafer, Dereje, Kansara, Nachiket]. Las Vegas, NV.
      2016
      • Expanding the envelope for indirect/direct evaporative data center cooling using thermal energy storage
        [Luttrell, Jeff, Guhe, Abhishek, Agonafer, Dereje].

      Book 2016
      • Thermal Management of Telecommunications Equipment
        [Agonafer, Dereje, Tuu, Lian, Richard, C].

      Conference Proceeding 2015
      • Computational Study of Behavior of Gas Absorption in Data Center Equipment and Its Effects on The Rate of Corrosion/Contamination
        [Bagul, Tejeshkumar, Pujara, Kanan, Shah, Jimil, Awe, Oluwaseun, Agonafer, Dereje].
      2015
      • Effect of Relative Humidity, Temperature and Gaseous and Particulate Contaminations on Information Technology Equipment Reliability
        [Singh, Prabjit, Klein, Levente, Agonafer, Dereje, Shah, JimilM., Pujara, KananD.].
      2015
      • Factors that Affect the Performance Characteristics of Wet Cooling Pads for Data Center Applications
        [Sreeram, Vishnu, Gebrehiwot, Betsegaw, Sathyanarayan, Suhas, Sawant, Digvijay, Agonafer, Dereje, Kannan, Naveen, Hoverson, James, Kaler, Mike]. 195-202 [.]
      2015
      • Steady State CFD Modeling of an IT Pod and its Cooling System
        [Sathyanarayan, Suhas, Gebrehiwot, Betsegaw, Sreeram, Vishnu, Sawant, Digvijay, Agonafer, Dereje, Kannan, Naveen, Hoverson, James, Kaler, Mike]. 189-194 [.]
      2015
      • THERMAL MODELING OF REMOTE RADIO HEAD UNITS
        [Sahini, Manasa, Gebrehiwot, Betsegaw, Agonafer, Dereje, Colapietro, Rocky].
      2015
      • Effect of Relative Humidity, Temperature and Gaseous and Particulate Contaminations on IT Equipment Reliability
        [Singh, P, Klein, L, Agonafer, Dereje, Pujara, K, Shah , JM]. San Francisco, CA.
      2015
      • Chip Package Interaction Study to Analyze the Mechanical Integrity of a 3-D TSV Package
        [Rajmane, P, Mirza, F, Khan, HA, Agonafer, Dereje]. San Francisco , CA.
      2015
      • Computational Study of Behaviour of Gas Absorption In Data Center Equipment and Its Effects on the Rate of Corrosion/Contamination
        [Bagul, T, Pujara, K, Agonafer, Dereje, Shah, JM, Awe, O]. San Francisco , CA.
      2015
      • Design of the Next Generation Antenna Mounts
        [Puthota Dominic Savi, R, Gebrehiwot, B, Agonafer, Dereje, Skrepcinski, A, Palmer, T].

      Other 2015
      • A Brief Overview of Recent Developments in Thermal Management in Data Centers
        [Alkharabsheh, Sami, Fernandes, John, Gebrehiwot, Betsegaw, Agonafer, Dereje, Ghose, Kanad, Ortega, Alfonso, Joshi, Yogendra, Sammakia, Bahgat]. 137(4), DOI http://dx.doi.org/10.1115/1.4031326

      Book 2014
      • Encyclopedia of Thermal Packaging, Set 2: “Volume 1: Thermal Management of Data Centers,”
        [Sammakia, Bahgat, Joshi, Yogendra, Agonafer, Dereje, Samadiani, Emad].

      Book Chapter 2014
      • A REVIEW OF COOLING ROAD MAPS FOR 3D CHIP PACKAGES
        [Agonafer, Dereje].

      Conference Proceeding 2014
      • Effectiveness of Rack-Level Containment in Removing Data Center Hot-spots
        [Onyiorah, Chris, Eiland, Richard, Agonafer, Dereje, Schmidt, Roger]. 798-806 [.]
      2014
      • Flow Rate and Inlet Temperature Considerations for Direct Immersion of a Single Server in Mineral Oil
        [Eiland, Richard, Fernandes, John, Vallejo, Marianna, Agonafer, Dereje, Mulay, Veerendra]. 706-714 [.]
      2014
      • Global-Local Finite Element Optimization Study to Minimize BGA Damage Under Thermal Cycling
        [Deshpande, Abhishek, Khan, Hassan, Mirza, Fahad, Agonafer, Dereje]. 483-502 [.]
      2014
      • Impact of Replacing Sn-Ag Bumps with Cu Pillars on the BEoL Cu/Low-k Fracture Under Reflow - A Computational Study
        [Baig, Zaeem, Shetty, TejasS., Sakib, A. R. Nazmus, Mirza, Fahad, Agonafer, Dereje]. 473-477 [.]
      2014
      • Improving Cooling Efficiency of Servers by Replacing Smaller Chassis Enclosed Fans with Larger Rack-Mount Fans
        [Nagendran, Bharath, Nagaraj, Shreyas, Fernandes, John, Eiland, Richard, Agonafer, Dereje, Mulay, Veerendra]. 574-582 [.]
      2014
      • Multi Objective Optimization of BEoL and fBEOL Structure in Flip Chip Package During Die Attach Process
        [Parekh, Hardik, Mirza, Fahad, Agonafer, Dereje]. 478-482 [.]
      2014
      • Feasibility study of Cu wire bonds in 3D Wire Bonded Packages
        [Naware, G, Mirza, F, Agonafer, Dereje]. Raleigh , North Carolina.
      2014
      • Improved Thermal Path in 3D Packages Using Higher Conductivity Molding Compounds
        [Mirza, F, Shetty, T, Akhter, R, Hossain, M, Agonafer, Dereje]. Raleigh , North Carolina.
      2014
      • Finite Element Study to Analyze the Effect of Solder Ball Depopulation on the Thermo-Mechanical Damage in Pb-Free Assemblies
        [Khan, HA, Deshpande, A, Mirza, F, Agonafer, Dereje]. Raleigh , NC.
      2014
      • Assessment of the Mechanical Integrity of the Si/TSV Interfacial Region in 3D Stacked Die Packages – A Hierarchical Approach
        [Mirza, F, Sakib, AR, Rajamane, P, Agonafer, Dereje]. Los Gatos , California.
      2014
      • Effect of Warm Water Cooling for an Isolated Hybrid Liquid Cooled Server
        [Addagatla, A, Mani, D, Fernandes, J, Eiland, R, Agonafer, Dereje, Mulay, V]. Los Gatos, California.
      2014
      • Evaluating Liquid Cooling at the Rack: Comparing Distributed and Centralized Pumping
        [Fernandes, J, Sahini, M, Agonafer, Dereje, Mulay, V, Na, J, Soares, M, Turner, C]. Los Gatos, California.
      2014
      • Improving Ducting to Increase Cooling Performance of High-End Web Servers subjected to significant Thermal Shadowing An Experimental and Computational Study
        [Mani, D, Fernandes, J, Eiland, R, Agonafer, Dereje, Mulay, V]. Los Gatos, California.
      2014
      • Thermal Performance of a High Density Mineral Oil Immersion Cooled Server System
        [Eiland, R, Vallejo, M, Fernandes, J, Agonafer, Dereje, Mulay, V]. Los Gatos, California.
      2014
      • Thermodynamic Analysis of Data Center Power and Water Utilization Across ASHRAE Environmental Envelopes for Different Cooling Technologies
        [Vallejo, M, Fernandes, J, Eiland, R, Agonafer, Dereje, Mulay, V]. Los Gatos, California.
      2014 2014 2014

      Journal Article 2014
      • Effect of Through-Silicon-Via Joule Heating on Device Performance for Low-Powered Mobile Applications
        [Mirza, F, Naware, G, Jain, A, Agonafer, Dereje]. 136(4), 10091-10097 [.] DOI http://dx.doi.org/10.1115/1.4028076
      2014
      • 3-D Fracture Analysis of the BEoL Region of a Flip Chip Package during Die Attach Process
        [Baig, Z, Mirza, F, Parekh, H, Agonafer, Dereje]. 27(2), 19-24 [.]
      2014
      • Multi-Variable and Multi-Objective Design Optimization of BEoL/fBEoL Structure in a Flip Chip Package during Chip Attachment to Substrate
        [Mirza, F, Parekh, H, Shetty, T, Agonafer, Dereje]. 27(4),

      Technical Report 2014
      • Influence of variation in CPU utilization on the rack level fan configuration as a cooling technique for high end servers
        [Nagaraj, S, Nagendran, B, Fernandes, J, Eiland, R, Agonafer, Dereje, Mulay, V]. Orlando, FL.

      Other 2014
      Journal Article In Preparation; Not Yet Submitted
      • Development of an Impact Reliability Prediction Model for Pb-free BGA Assemblies
        [Mirza, F, Agonafer, Dereje, Roggeman, B, Pitarresi, J].

      Conference Proceeding Submitted
      • A Comparative Study of Larger Rack-Mount Fans and Chassis Enclosed Fans to reduce Server Cooling Power
        [Agonafer, Dereje, Nagendran, B, Nagaraj, S, Fernandes, J, Eiland, R, Mulay, V]. Orlando, FL.
      Published
      • Methodology for Detailed CFD Modeling of High-End Web Servers
        [Agonafer, Dereje, Mani, D, Fernandes, J, Eiland, R, Mulay, V]. Orlando, FL.
      Published
      • Comparative analysis of different air containment configurations widely used in commercial datacenters
        [Agonafer, Dereje, Rajagopalan, K, Gebrehiwot, B]. San Diego , CA.
      Published
      • Gaseous Corrosion in Hard Disk Drive: A Computational Study
        [Agonafer, Dereje, Shah, H, Seun, A]. San Diego , CA.
      Published
      • Utilization of Phase Change Material for the Optimization of Evaporative Cooling Technology
        [Agonafer, Dereje, Shah, J, Dhiman, N, Kaler, M, Kannan, N, Hoverson, J]. San Diego ,CA.
      Published
      • Characterizing metal-dielectric Interfacial Delamination Failure in the Die BEoL Using Molecular Dynamics and Finite Element Method
        [Agonafer, Dereje, Sakib, A, Mirza, F, Shetty, T, Mohan, M]. Orlando, FL.
      Published
      • Feasibility Study of Solder Bump Depopulation on the BEoL Thermo-mechanical Response for a Flip-Chip Package
        [Agonafer, Dereje, Baig, Z, Parekh, H, Mirza, F]. Las Vegas, NV.
      Published
      • Coupled Thermal and Structural Parametric Analysis of Through Silicon Vias in 3D Electronics
        [Agonafer, Dereje]. Vancouver, British Columbia.
      Published
      • Novel Approaches for Extending Air Cooling Limits for Processors
        [Agonafer, Dereje, Tran, A, Avila, M, Dekeyser, N, Wang, M, Lam, T, Karajgikar, S, Refai-Ahmed, G].
      Published
      • Solder Joint Reliability of Package on Package
        [Agonafer, Dereje, Menon, A, Lakhakar, N, Karajgikar, S].
      Published
      • Rapid Thermo-cycling using Thermoelectric Device: Part I - Hot spot cooling
        [Agonafer, Dereje, Lakhakar, N, Hossain, M]. Orlando, FL.
      Published
      • Analytical Approach To Temperature Distribution Of A First Level Package With A Non-Uniformly Powered Die
        [Agonafer, Dereje, Kaisare, A, Haji-Sheikh, A, Chrysler, G, Mahajan, R].
      Published
      • Flexible PDMS Chip with Embedded In-plane Valves for Microfluidic Manipulations
        [Agonafer, Dereje, Paruchuri, Srikar, Sin, Jeoungsik, Graff, Mason]. Pueblo , Mexico.
      Published
      • Analytical approach to temperature distribution of a first level package with a non- uniformly powered processor
        [Agonafer, Dereje, Kaisare, A, Haji-Sheik, A, Mahajan, Ravi, Chrysler, Greg]. Sheraton San Diego Hotel and Marina.
      Published
      • Design of Polymer Tube Embedded In-Plane Micropump
        [Agonafer, Dereje, Kole, Ashutosh, Sin, Jeongsik, Lee, WooHo, Popa, Dan]. Sheraton San Diego Hotel and Marina, San Diego, CA.
      Published
      • Effect of Under-Floor Blockages on Data Center Performance
        [Agonafer, Dereje, Bhopte, Siddharth, Sammakia, Bahgat, Iyengar, Madhusudan, Schmidt, Roger ]. Sheraton San Diego Hotel and Marina , San Diego, CA.
      Published
      • Robust Multiphysics FEA Methodology for Extracting a Reduced-Order Model of MEMS Thermal Actuators
        [Agonafer, Dereje, Borovic, Bruno, Lewis, Frank L, Hossain, MM]. Sheraton San Diego Hotel and Marina, San Diego, CA..
      Published
      • Thermal Management of Stacked Die that Includes Memory and Logic Processors
        [Agonafer, Dereje, Sandur, Bhavani, Kaisare, Abhijit]. Sheraton San Diego Hotel and Marina, San Diego, CA..
      Published
      • A Parametric Multi-Level Finite Element Study to Minimize BEoL Damage in a Flip Chip Package
        [Agonafer, Dereje, Parekh, H, Mirza, F, Baig, Z]. Fort Worth ,TX.
      Published
      • Multi-Physics Optimization of TSV Placement in Low-Powered 3D ICs to Mitigate Effects of Joule Heating and Temperature Gradients
        [Agonafer, Dereje, Mirza, F, Ali, W, Iqbal, S]. Orlando, FL.

      Conference Proceeding 2013
      • Feasibility of Non-Linear Analysis of the BEoL Structure in a Flip Chip Package under Thermal Shock
        [Raman, Thiagarajan, Mirza, Fahad, Agonafer, Dereje, Lawrence, KentL]. 130-136 [.]
      2013
      • REMOVING THE HOT-SPOTS IN HIGH POWER DEVICES USING THE THERMOELECTRIC COOLER AND MICRO HEAT PIPE
        [Hirachan, Agat, Agonafer, Dereje]. 1189-1195 [.]
      2013
      • Fracture Analysis of the BEoL Region of a Package Subjected to Accelerated Thermal Cycling
        [Agonafer, Dereje, Baig, Z, Parekh, H, Mirza, F]. Fort Worth, TX .
      2013
      • Experimental Validation of Detailed Server Level CFD Model
        [Agonafer, Dereje, Sampath, S, Pandiyan, V, Eiland, R, Fernandes, J, Mulay, V]. Burlingame, CA.

      Journal Article 2013
      • Solving Thermal Issues in a Three-Dimensional-Stacked-Quad-Core Processor by Microprocessor Floor Planning, Microchannel Cooling, and Insertion of Through-Silicon-Vias
        [Chauhan, Anjali, Sammakia, Bahgat, Afram, FuratF., Ghose, Kanad, Refai-Ahmed, Gamal, Agonafer, Dereje]. 135(4), DOI http://dx.doi.org/10.1115/1.4025531
      2013 2013 2013 2013 2013 2013 2013

      Journal Article 2012 2012
      Conference Proceeding 2012 2012
      • Coupled Thermal and Structural Parametric Analysis of TSVs in 3D Electronics
        [Mirza, Fahad, Muralidharan, Bharathkrishnan, Mynampati, Poornima, Karajgikar, Saket, Agonafer, Dereje]. 675-680 [.]
      2012
      • DESIGN, OPTIMIZATION AND THERMAL ANALYSIS OF MOTOR-CONTROLLERS IN A QUADRUPED ROBOT
        [Kannan, Naveen, Shah, Niket, Agonafer, Dereje, Bowling, AlanP]. 257-262 [.]
      2012
      • Multi-Design Variable Optimization for a Fixed Pumping Power of a Water-Cooled Cold Plate for High Power Electronics Applications
        [Fernandes, John, Ghalambor, Saeed, Agonafer, Dereje, Kamath, Vinod, Schmidt, Roger]. 684-692 [.]
      2012 2012 2012 2012
      • REAR DOOR HEAT EXCHANGER COOLING PERFORMANCE IN TELECOMMUNICATION DATA CENTERS
        [Mynampati, Venkata Naga Poornima, Karajgikar, Saket, Sheerah, Ibraheem, Agonafer, Dereje, Novotny, Shlomo, Schmidt, Roger]. 417-+ [.]
      2012
      • SINGLE-PHASE LIQUID COOLING OF A QUAD-CORE PROCESSOR
        [Chauhan, Anjali, Sammakia, Bahgat, Afram, FuratF., Ghose, Kanad, Refai-Ahmed, Gamal, Agonafer, Dereje]. 235-+ [.]
      2012
      • SINGLE-PHASE MICROCHANNEL COOLING FOR STACKED SINGLE CORE CHIP AND DRAM
        [Chauhan, Anjali, Sammakia, Bahgat, Ghose, Kanad, Refai-Ahmed, Gamal, Agonafer, Dereje]. 225-+ [.]
      2012
      • THERMAL-AWARE POWER MIGRATION IN MANY-CORE PROCESSORS
        [Raghu, Avinash, Karajgikar, Saket, Agonafer, Dereje, Sammakia, Bahgat]. 397-404 [.]
      2012
      • THERMALLY BASED DESIGN OPTIMIZATION OF TELECOMMUNICATION SHELTER
        [Mynampati, Venkata Naga Poornima, Mariam, Feroz Ahamed Iqbal, Muralidharan, Bharathkrishnan, Menon, AbhilashRamachandran, Agonafer, Dereje, Hendrix, Mark]. 433-+ [.]

      Conference Proceeding 2008
      • CFD modeling of a thermoelectric device for electronics cooling applications
        [Lakhkar, Nikhil, Hossain, Mohammad, Agonafer, Dereje]. 889-+ [.]
      2008
      • Comparison of overhead supply and underfloor supply with rear heat exchanger in high density data center clusters
        [Udakeri, Ravi, Mulay, Veerendra, Agonafer, Dereje]. 166-173 [.]
      2008
      • Development of an analytical model to a temperature distribution of first level package with a non-uniformly powered die
        [Kaisare, Abhijit, Agonafer, Dereje, Haji-Sheikh, Abdolhossein, Chrysler, Greg, Mahajan, Ravi]. 443-449 [.]
      2008
      • Multi-objective optimization entailing computer architecture and thermal design for non-uniformly powered microprocessors
        [Raju, Uthaman, Kaisare, Abhijit, Agonafer, Dereje, Haji-Sheikh, Abdolhossein, Chrysler, Greg, Mahajan, Ravi]. 432-+ [.]
      2008 2008
      • Multi-objective parametrization of graphite heat spreader for portable systems applications
        [Banerjee, Arijit, Lakhkar, Nikhil, Riaz, Shahi, Refai-Ahmed, Gamal, Agonafer, Dereje]. 79-85 [.]
      2008
      • Thermomechanical Challenges in Electronic Packaging
        [Agonafer, Dereje, Kaisare, A, Mulay, V, Karajgikar, S, Lakhkar, N]. San jose , CA.

      Journal Article 2008 2008 2008 2008
      Book Chapter 2002
      • Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods, and Design Practices
        [Yeh, Lian-Tuu, Chu, RichardC, Agonafer, Dereje].

      Conference Proceeding 2002 2002
      • Prediction of effect of heat sink adhesive on mechanical reliability of a wire bonded plastic ball grid array package
        [Kaisare, A., Han, Zhenxue, Agonager, D., Ramakrishna, K.]. 926-931 [.] DOI http://dx.doi.org/10.1109/ITHERM.2002.1012555

      Journal Article 2002
      • Design and analysis of a scheme to mitigate condensation on an assembly used to cool a processor module
        [Ellsworth, M.J., Schmidt, R.R., Agonafer, Dereje]. 46(6), 753-761 [.] DOI http://dx.doi.org/10.1147/rd.466.0753

      Other 1996
      • Application of CAE/CAD To Electronic Systems
        [Agonafer, Dereje, Fulton, R, Kowalski, G].

      Other 1994
      • Heat Transfer in Electronic Equipment - 1994
        [Agonafer, Dereje, Amon, C, Wirtz, R].
      1994
      • CAE/CAD Application to Electronic Packaging
        [Agonafer, Dereje, Fulton, RE].

      Journal Article 1994
      Book 1993
      • Computer Aided Thermal Engineering For The Development Of Future Electronic Cooling Systems
        [Agonafer, Dereje, Chu, RC]. "CRC Press".

      Other 1993
      • Solutions to CFD Benchmark Problems in Electronic Packaging
        [Agonafer, Dereje, Amon, C].

      Other 1992
      • Computer Aided Design in Electronic Packaging
        [Agonafer, Dereje, Fulton, RE].

      Other 1991
      • Heat Transfer in Electronic Equipment - 1991
        [Agonafer, Dereje, Ortega, A, Webb, B].

      Other 1990
      • Numerical and Experimental Investigationof Heat Transfer Phenomena Over an Electronic Module
        [D. A International Business Machines Corp. Advanced Thermal Laboratory PO, 390, B, Poughkeepsie, B, 12602, NY]. DOI http://dx.doi.org/10.1109/STHERM.1990.68498

      Other 1989
      • Numerical Simulation of Convection in Electronic Cooling Equipment
        [Agonafer, Dereje, Ortega, A].

      Book 1989
      • Numerical simulation of convection in electronic equipment cooling - Presented at the winter annual meeting of ASME, San Fransisco, California, December 10-15, 1989
        [Ortega, Alfonso, Asme, Amer Soc of Mechanical Engineering, Agonafer, Dereje]. "ASME".
        https://infoscience.epfl.ch/record/60614

Presentations

    • June  2018
      Agonafer, Dereje (Panelist), "The Coming of Age of Data Centers Built Using Stock Components: Intelligent Self-Sensing, Self-Regulating Data Centers", Orlando, FL. (June 6, 2018).
    • November  2017
      Agonafer, Dereje, "Thermal and Reliability Challenges of Immersion Cooling", Huawei Japan, Tokyo, Japan. (November 1, 2017).
    • October  2017
      Agonafer, Dereje, "Experimental and Computational Thermal and Reliability Considerations in Containerized Data Center", http://www.impact.org.tw/, Taiwan. (October 24, 2017).
    • November  2016
      Agonafer, Dereje, "“Birth-to-death (from Die Metal/Passivation Processing to Board Assembly) Modeling Methodology for the Optimization of Custom Board-Level Reliability.”". (November , 2016).
    • September  2016
      Agonafer, Dereje, "“Experimental and Computational Thermal and Reliability Considerations in Data Centers.”". (September 23, 2016).
    • June  2016
      Agonafer, Dereje, "“Air-Side Economization, Direct And Indirect Evaporative Cooling For Energy Efficient Data Centers: Thermal Management and Contamination Challenges.”". (June , 2016).
    • September  2015
      Agonafer, Dereje, "“Thermal and Mechanical Challenges in Data Center.”", Los Gatos, California. (September , 2015).
    • May  2014
      Agonafer, Dereje, ""Thermal and Mechanical Challenges in Microelectronics: From Device to Data-Center-Room Level."", May 28, 2014, Walt Disney World Swan & Dolphin Hotel, Lake Buena Vista (Orlando), FL. (May 28, 2014).
    • July  2012
      Agonafer, Dereje, "“Thermal Challenges in 3D Packaging”", Puerto Rico. (July , 2012).
    • October  2011
      Agonafer, Dereje, "“Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers,”", Binghamton University. (October , 2011).
    • July  2009
      Agonafer, Dereje, ""Thermal Challenges in Electronics Systems: Devices to Systems."", Westin St Francis Hotel, San Francisco. (July 23, 2009).
    • August  2008
      Agonafer, Dereje, "“Challenges in Thermal Management of Electronic Systems”". (August 20, 2008).
    • July  2008
      Agonafer, Dereje, "“Thermomechanical Challenges In Electronic Packaging: Part II Lytron Seminar”", Lytron Inc.. (July 17, 2008).
    • June  2008
      Agonafer, Dereje, "“Electronics Cooling: Challenges at the Device and System Level.”", Harvard School of Engineering and Applied Sciences, Harvard University. (June 18, 2008).
    • March  2008
      Agonafer, Dereje, ""Thermomechanical Challenges in Electronic Packaging."", IEEE. (March 20, 2008).
    • February  2008
      Agonafer, Dereje, "Challenges in Microelectronics Systems", MIT Mechanical Engineering Department. (February 29, 2008).
    • February  2008
      Agonafer, Dereje, "“Challenges in Electronic Cooling.”", Tufts University Medford/Somerville. (February 7, 2008).
    • October  2007
      Agonafer, Dereje, "“Challenges in Electronic Cooling.”". (October 10, 2007).
    • October  2006
      Agonafer, Dereje, "“Thermo-Mechanical Reliability Challenges in Stacked Packaging”", GE Global Research Center, Niskayuna, NY. (October , 2006).
    • September  2006
      Agonafer, Dereje, "Keynote Address", Toyama, Japan. (September , 2006).
    • September  2006
      Agonafer, Dereje, "Oral Presentation Not Otherwise Specified", Santa Clara, CA. (September 1, 2006).
    • August  2006
      Agonafer, Dereje, "Challenges in Electronic Packaging", ATI Technologies, Toronto, Canada. (August , 2006).
    • August  2006
      Agonafer, Dereje, "Invited Seminar on microelectronics, cooling and energy related issues", Raytheon, Co.. (August 25, 2006).
    • December  2005
      Agonafer, Dereje, "Electronic Packaging", American Society of Mechanical Engineers, Plano, TX. (December 6, 2005).
    • October  2005
      Agonafer, Dereje, "Opportunities Around Computer Sciences and High Tech", The College of Engineering, Architecture and Computer Sciences, Howard University, Washington, D.C.. (October 14, 2005).
    • October  2005
      Agonafer, Dereje, Hossain, MdSahadat, "Effect of Surface Finish on Lead Free Solder Joint", Surface Mount Technology Association, Dallas, TX. (October 11, 2005).
    • January  2005
      Agonafer, Dereje, "Electronic Packaging", Cape Town, South Africa. (January , 2005).
    • May  2002
      Agonafer, Dereje, "Computer Aided Thermo/Mechanical Modeling of Electronic Systems", International Microelectronics And Packaging Society (IMAPS) & Surface Mount Technology Association (SMTA). (May 16, 2002).
    • August  2001
      Agonafer, Dereje, "Keynote Address". (August , 2001).
    •  1997
      Agonafer, Dereje, "Keynote Address", Brooklyn, New York. ( , 1997).
    • September  1997
      Agonafer, Dereje, "Cooling Requirements for Future High Performance Electronic Components", Stuggart, Germany. (September 25, 1997).
    • September  1997
      Agonafer, Dereje, "Thermo-Mechanical Analysis in Electronic Packaging", Cannes, France. (September 23, 1997).
    • April  1995
      Agonafer, Dereje, "Application of Computational Techniques To Electronic Cooling", Aspen, Colorado. (April 22, 1995).
    • August  1994
      Agonafer, Dereje, "Application of Computational Modeling to Large Scale Computer Systems", International Association for Computational Mechanics (IACM), Chiba, Japan. (August , 1994).

Support & Funding

This data is entered manually by the author of the profile and may duplicate data in the Sponsored Projects section.
    • Past to Present GOALI: Experimental and Theoretical Investigation of Thermal Transport in Three-Dimensional Integrated Circuits (3D ICs) sponsored by  - $
      (Funded)
    • Aug 2017 to July 2022 Phase II IUCRC University of Texas at Arlington: Center for Energy Smart Electronic Systems sponsored by  - $591456
      Dereje Agonafer (Funded)
    • Aug 2017 to July 2022 Collaborative Center: I/UCRC in Energy-Efficient Electronic Systems E3S sponsored by  - $25000
      Dereje Agonafer (Funded)
    • July 2019 to July 2020 Testing and Analysis Services on Material Samples sponsored by  - $30000
      Dereje Agonafer (Funded)
    • Jan 2014 to Nov 2017 7x24 Exchange ES2 Research sponsored by  - $13750
      Dereje Agonafer (Funded)
    • Jan 2014 to Nov 2017 Collaborative Center I/UCRC: Dynamic Effects Due to Air Flow and Power Variations in Data Center Using Photovoltaic (PV) Technology sponsored by  - $50000
      Dereje Agonafer (Funded)
    • Aug 2012 to Nov 2017 Membership to NSF I/UCRC sponsored by  - $125000
      Dereje Agonafer (Funded)
    • June 2012 to Nov 2017 Spray Cooling and PCM Technology for Data Center sponsored by  - $165000
      Dereje Agonafer (Funded)
    • Aug 2011 to Nov 2017 Collaborative Center: I/UCRC in Energy-Efficient Electronic Systems with Tuition sponsored by  - $293000
      Dereje Agonafer (Funded)
    • Aug 2011 to Nov 2017 Collaborative Center: I/UCRC in Energy-efficient Electronic Systems- with Tuition (Facebook) sponsored by  - $312500
      Dereje Agonafer (Funded)
    • Aug 2011 to Nov 2017 Collaborative Center: I/UCRC in Energy-efficient Electronic Systems-with Tuition (CommScope) sponsored by  - $250000
      Dereje Agonafer (Funded)
    • Feb 2014 to July 2017 Birth-to-death ( from Die Metal/Passivation Processing to Board Assembly) Modeling Methodology for the Optimization of Custom Board-level Reliabilty sponsored by  - $240000
      Dereje Agonafer (Funded)
    • Feb 2013 to Feb 2015 Concealed RRH Thermal Simulation sponsored by  - $48000
      Dereje Agonafer (Funded)
    • Jan 2012 to June 2014 I/UCRC for Energy -Efficient Electronics Systems, Project #5 - Dynamic Thermal Management and Controls in a Data Center sponsored by  - $60000
      Dereje Agonafer (Funded)
    • June 2011 to June 2013 A Wireless Micro Gastro-Stimulator for Treatment of Severe Gastric Dysmotility sponsored by  - $50000
      (Funded)
    • Oct 2008 to Jan 2012 Experimental and Model Developments of Interfacial Mechanical Integrity of Layered Stacks sponsored by  - $90760
      Dereje Agonafer (Funded)
    • Aug 2010 to Aug 2011 Collaborative Planning Grant: I/UCRC for Energy Efficient Systems sponsored by  - $10000
      Dereje Agonafer (Funded)
    • Feb 2008 to Aug 2011 Developing of a Best Known Method (BKM) for Design of Microprocessors used in Stacked Packages Based on Power and Thermal-Architectural Co-Design sponsored by  - $90000
      Dereje Agonafer (Funded)
    • Sept 2009 to Oct 2010 CommScope Enterprise Cabinets Thermal Program sponsored by  - $65100
      Dereje Agonafer (Funded)
    • Sept 2008 to Aug 2009 CommScope Enterprise Cabinets Thermal Program sponsored by  - $67858
      Dereje Agonafer (Funded)
    • Aug 2008 to July 2009 Grand Challenges in Thermal Management of Electronic Systems from Device to Systems Workshop Funding Request sponsored by  - $10000
      Dereje Agonafer (Funded)
    • Sept 2002 to Nov 2007 Industrial Assessment Center sponsored by  - $813271
      Dereje Agonafer (Funded)
    • Apr 2005 to Mar 2007 Development of Consititutive Equations and Novel Methodology for Failure Prediction Models for ACS Lead sponsored by  - $79749.080078125
      Dereje Agonafer (Funded)
    • Apr 2002 to May 2005 The Impact of Board Layout and Layup on PWB Warpage during Fabrication and due to Reflow and Wave Soldering Process sponsored by  - $76000
      Dereje Agonafer (Funded)
    • Sept 2002 to Aug 2004 Application of Masterflux Compressor in Modular Refrigeration Unit sponsored by  - $50000
      Dereje Agonafer (Funded)
    • Dec 2001 to Nov 2003 Thermochemical and Mechanical Properties of Ag-Cu Sn Lead Free Solder Alloys with the Addition of Minor sponsored by  - $238887
      (Funded)

Students Supervised

    • Present
      (Mech and Aero Engineering)
    • Present

      PhD Student Dissertation Committee Advisor
    • Present

      Masters Student Advisor
    • May 2018
    • Apr 2018
    • 2017
      (Mech and Aero Engineering)
    • 2016
      Jeff Luttrell, Thermal Energy Storage for Expanded Use of Data Center Indirect/Direct Evaporative Cooling
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Aug 2016
      A R Nazmus Sakib, On the Enhancement of Thermo-Mechanical and Impact Reliability of Passive and Active Microelectronic Devices
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Aug 2016
      Awe Oluwaseun, Exposure of Legacy and Future Hardware, under Real Data Center Conditions in an ANSI/ISA Classified G2 Environment
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Yasir Modak, CFD Analysis of Vapor Chamber with Micro Pillars as Heat Spreader for High Power Electronic Devices
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Neha Inamdar,
      Masters Student Advisor
    • May 2016
      Abhishek Guhe, Control Strategies for Air-side Economization, Direct & Indirect Evaporative Cooling And Artificial Neural Network Applications For Energy Efficient Data Centers
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Anik Mahmood, Computational Analysis of Impact Loading on Wafer Level Chip Scale Packages Mounted on Two Boards of Varying Thickness
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Avinash Kumar Ray, Design And Optimizing Louver Blade Angles To Enhance Better Air Flow Distribution And Improve Thermal Efficiency In Data Centers Using CFD Analysis
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Avinash Veluturla, Design and parametric analysis of flow control device for dynamic cold plate to optimize the temperature fluctuations of the Multi-chip module
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Betsegaw Gebrehiwot, MAXIMIZING USE OF AIR-SIDE ECONOMIZATION, DIRECT AND INDIRECT EVAPORATIVE COOLING FOR ENERGY EFFICIENT DATA CENTERS
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Dhaval Thakkar, Performance Enhancement of Raspberry Pi Server for The Application Of Oil Immersion Cooling
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Dhruva Chandra Gaibola,
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Jaykishankumar Patel, Evaluation of cooling architectures and control strategies in airflow provisioning of a modular data center
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Jimil Shah, RELIABILITY CHALLENGES IN AIRSIDE ECONOMIZATION AND OIL IMMERSION COOLING
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Koushik Epuri, CFD Analysis and Design optimization of parallel plate heat sink for immersion cooling
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      MD Malekkul Islam, Experimental Characterization of Hybrid Cooled Cisco Servers Including the Effect of Warm Water Cooling
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Parth Soni, Performance evaluation of plate fin and pin fin heat sinks and design optimization of cold plate
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Rajesh Kasukurthy, Developing and Validating Energy Models for (Direct/ Indirect) Evaporative Cooling used for Data Centres
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Shivang Desai, CFD modelling of wet cooling pad and customization of parallel plate heat sink for data center application
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Subramanian Ramachandran Gowtham,
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Sumanth Krishnamurthy, Experimental and Computational Board Level Reliability Assessment of Thick Board QFN Assemblies Under Power Cycling
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Trina Barua, A comparative study of the thermo-mechanical behavior of WCSP assembly due to difference in PCBs’ layer thickness
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Aniket Ram Kalambe, Two Phase Flow CFD Analysis of Refrigerants in a Condenser Pipe for Prediction of Pressure Drop & Pumping Power
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Deekshith Pittala, Computational Analysis of Enhancing Heat Transfer in 3-D Stacked Die Using Different Finned Heat Sink
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Dhanraj Arun Patil, CFD MODELING AND PARAMETRIC STUDY OF VAPOR CHAMBER FOR HIGH-POWER ELECTRONIC DEVICES
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      FRAMROZ BHARUCHA, COMPUTATIONAL ANALYSIS OF I.T. RACK UNDER VIBRATION LOAD
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Guruprasad Shrikant Shinde, Board level reliability and failure analysis of custom printed circuit boards with WCSP packages
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Kanan Pujara, Experimental Study to find the Effect of Temperature and Humidity on the Corrosion rates of Copper and Silver in an IT Equipment
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Karthik Rajashekar, Impact of Viscoelastic Material Characterization of PCBs on the Thermo-Mechanical and Solder Joint Reliability of QFN Thick Package
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Kota Venkata Naga Indu Sravani, DEVELOPMENT OF A METHODOLOGY AND SAMPLE PREPARATION TO EVALUATE RELIABILITY OF OIL COOLED DATA CENTER
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Marianna Vallejo, Energy and Water Impacts of Data Center Cooling Systems: A Triple Bottom Line Assessment for Facility Design
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Monisha Mohan, Benchmarking of modified bend test fixture and the relationship of life prediction between monotonic cyclic bending test and thermal cycling test for QFN package
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Niravkumar Dodia, Developing and Validating Thermodynamic Models For Evaporative Cooling Employed In Data Centers
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      PRITAM KARMOKAR, A Study on Evaporative Cooling for Data Centers & Artificial Neural Network Modeling.
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Ruturaj Kiran Kokate, Experimental Analysis Validating a Control Scheme to Develop a Dynamic Cooling Solution for Non-Uniform High Powered Electronic Devices in Data Center.
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Sahithi Reddy Nagilla, NON-THERMAL DESIGN CONSIDERATION FOR OIL COOLED DATA-CENTERS AND ITS SERVICEABILITY
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      SAYALEE PRADEEP SABNE, EXPERIMENTAL STUDY TO FIND THE EFFECT OF TEMPERATURE AND HUMIDITY ON THE CORROSION RATES OF COPPER AND SILVER IN AN IT EQUIPMENT
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Shiva Keralapura, CAE ANALYSIS ON A FORD ECOBOOST MUSTANG CONNECTING ROD FOR STRUCTURAL STEEL, ALUMINUM ALLOY
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2015
      ASHWIN SIDDARTH, EXPERIMENTAL STUDY ON EFFECTS OF SEGREGATED COOLING PROVISIONING ON THERMAL PERFORMANCE OF INFORMATION TECHNOLOGY
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2015
      Devi Prasad Gorrepati, CFD BASED DESIGN AND MODELLING OF WIND FENCE TO MITIGATE HIGHSPEED WIND LOADING ON A MODULAR DATA CENTER
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2015
      John Fernandes, Minimizing Power Consumption at Module, Server and Rack-Levels within a Data Center through Design and Energy-Efficient Operation of Dynamic Cooling Solutions
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2015
      Krishna Desai, Efficient Method to cool the datacenter using Solar Energy
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2015
      Mohammed Shahid Ali, ESTIMATION OF FRACTURE MECHANICS PARAMETERS IN 3D TSV PACKAGE DURING CHIP ATTACHMENT PROCESS
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2015
      Palak Patel, Optimal Design of Cooling and Ventilation of a Telecommunication Shelter at High Altitude
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2015
      Parinda Patel, Structural Integrity of TSVs in 3D Package Under Thermal Loading
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2015
      Richard Eiland, Thermo-Mechanical Design Considerations at the Server and Rack Level to Achieve Maximum Data Center Energy Efficiency
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2015
      Sanjay Revathi, Methodology to determine the Effect of PCB layer Copper Thickness and Prepreg layer stiffness on Solder Joint Reliability
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2015
      Vignesh Balasubramanian, Sustainable Methodology for the Use of Fuel Cells in Data Centers
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Aakash Patel, Thermal Analysis of QFN Package
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Gowtham Pedapudi, Performance study of thermal interface material in Generation-3 Intel server motherboard
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Alekhya Addagatla, Effect of warm water cooling for an isolated hybrid liquid cooled server
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Divya Mani, Improving Ducting to Increase Cooling Performance of High-End Web Servers Subjected to Significant Thermal Shadowing - An Experimental and Computational Study
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Fahad Mirza, Compact modeling methodology development for thermomechanical assessment in high-end mobile applications-planar and 3D TSV packages
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      G Naware, Thermo-Mechanical Study of Copper And Gold Wirebonds in 3D Electronic Package
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Harshal Gujarathi, Use of Nanoparticle Enhanced Phase change Material(NEPCM) For Data Center Cooling Improving ducting to increase cooling performance
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Prasad Revankar, Use Of A Windbreaker To Mitigate High Speed Wind Loading On A Modular Data Center
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Pratik Kekre, Multi-variable design optimization of a contemporary cold plate for a fixed pumping power forminimizing the thermal resistance
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Ravi Mutyala, Improving air cooling efficiency of 2OU High-end server by using bigger rack level fans and controlling flow using bimetallic strips
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Ruddhi Deshmukh, Data center cooling augmentation using micro-encapsulated phase change material
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Saeed Ghalambor, Analytical solutions of steady-state heat conduction in multi-layer stack packaging
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Shreyas Nagara, Influence of variation in CPU utilization on the rack level fan configuration as a cooling technique for high end servers
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Suhas Sathyanarayan, Experimental And Computational Study Of An It Pod And Its Cooling System
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Tejas Shetty, Board level reliability assessment of thick FR-4 QFN assemblies under thermal cycling
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Tejeshkumar Bagul, Computational study of behavior of gas absorption in data center equipment and its effects on the rateof corrosion/contamination
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Trevor McWilliams, Evaluating heat sink performance in an immersion -cooled server system
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Vishnu Sreeram, Factors Affecting The Performance Characteristics Of Wet Cooling Pads For Data Center Applications
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2014
      Mahdi Haghshenas-Jaryani, Dissertation: A New Multiscale Approach For Dynamic Modeling and Simulation of Micro-Nano Biomolecular Systems Characterized By A Low Reynolds Number
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2014
      Moinuddin Ahmed, Dissertation: (EE) “Flexible MEMS Sensors and Pyroelectric Thin Film”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2014
      Namrata Kamte, Thesis: Microwave-Based Navigation of Femtosatellites Using On-Off Keying
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2014
      Bharat Nagendran, Improving Server Efficiency by Replacing Smaller Chassis Enclosed Fans with Larger Rack-Mount Fans : An Experimental and Computational Study
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2014
      Chinmay Date, Development of artificial neural network based Black Box Model of a data center as a temperature predicting tool as a function of server location, dissipating server heat and CRAC fan speed
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2014
      Chris Onyiorah, Computational Study of Datacenter Hotspot Mitigation With Snorkels as An Alternative Rack- Level Containment Strategy
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2014
      Hardik Parekh, Multi-objective design optimization of BEoL / fBEol region during chip attachment to substrate
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2014
      Kasturi Rajagopalan, Comparative analysis of widely used air containment systems in commercial data centers for maximum cooling performance
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2014
      Rahul Raghunathan, Experimental study on the effects of gaseous contamination on IT equipment
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2014
      Vishok Amar Kumar, Real time temperature prediction in a data center environment using an adaptive algorithm
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2014
      Zaeem Baig, 3-D Fracture Analysis Of the Cu/Low-k Stack in a Flip Chip Package During Die Attachment to Mitigate CPI Risk
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2013
      Hardik Shah, Gaseous corrosion in hard disk drive : A computational study
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2013
      Harsh Patel, Immersion cooling of high end data center servers and validation through experiments
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2013
      Jeet Shah, Utilization of microencapsulated phase change material for the optimization of evaporative cooling tehcnology
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2013
      P Joshi, Thermal Enhancement of Automobile ECM
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2013
      Shreyas Sampath, Thermal Analysis of High End Servers Based On Development of Detail Model And Experiments
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2013
      Bhargav Nabar, Dissertation: (E.E.)
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2013
      Md. Iqbal Mahmud, Dissertation: (E.E.)
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2012
      (Spring 2012/Summer 2012) “Correlation of Gaseous and Particulate Contamination with Corrosion Rate”
      Senior Design Project Supervision
    • 2012
      Agat Hirachan, Mitigation of hot-spots in highend microprocessors using bulk and thin film thermoelectric coolers [electronic resource]
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2012
      Kushal Aurangabadkar, Impact of louver orientation on air flow distribution and thermal management of data centers[electronic resource]
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2012
      Niket Shah, CDF analysis of direct evaporative cooling zone of air-side economizer for containerized data center
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2012
      Nikhil Dhiman, Application of phase change material in sustainable cooling of data centers
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2012
      Thiagarajan Ramanm, Assessment of the mechanical integrity of Cu/low -k dielectric in a flip chip pachage [electronic resource]
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2012
      Vaidehi Patel, Experimental/computational analysis of active cooling of stacked device using multidimensional configured thermoelectric modules
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2012
      Vijayalayan Pandiyan, Development of detailed computational flow model of high end server and validation using experimental methods [electronic resource]
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2012
      Prashaanth Ravindran, Dissertation: (M.E.)
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2011
      G Gulawani, Non-Thesis Project: “CFD Analysis of Heat Sinks for Data Center Servers”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2011
      B Muralidharan, Thesis: “Multi Objective Thermal and Energy Based Design Optimization of Telecommunication Cabinets/Shelters”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2011
      Bharathkrishnan Muralidharan, Multi Objective Thermal and Energy Based Design Optimization of Telecommunication Cabinets/ Shelters
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2011
      G Gulawani, CFD analysis of heat sinks for Data Centers Servers
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2011
      Govind Gulawani, Non-Thesis Project: “CFD analysis of heat sinks for Data center servers”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2011
      Huy Phan, Development of an experimental and analytical model of an active cooling method for high-power three- dimensional integrated circuit (3D-IC) utilizing multidimensional configured thermoelectric modules
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2011
      Jake Phan, Dissertation: "Development of an Experimental and Analytical Model of an Active Cooling Method for High- Power Three-Dimensional Integrated Circuit (3D-IC) Utilizing a Multidimensional Configured Thermoelectric Modules
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2011
      Kunal Kale, Study of effects of contamination in data center
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2011
      Naveen Kannan, Design and modeling techniques for cooling of telecommunication systems
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2011
      Poornima Mynampati Venkata Naga, Alternative cooling technologies for telecommunication data centers - Air cooling and Rear Door Heat Exchangers
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2011
      Sunil Lingampalli, Performance optimization of multi-core processors using core hopping - thermal and structural
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2011
      Daniel Montrallo Flickinger,
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2011
      Team Thermoelectric Device (Spring 2011/Summer 2011) “Thermoelectric Device Study”
      Senior Design Project Supervision
    • 2010
      A Menon, Thesis: "Thermo-Mechanical Analysis of a 3D Package in Microelectronics and Cooling Technologies for an IGBT Thermal Tester in Power Electronics"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      A Menon, Thesis: "Thermo-Mechanical Analysis of a 3D Package in Microelectronics and Cooling Technologies for an IGBT Thermal Tester in Power Electronics"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      A Raghu, Thesis: "Dynamic Thermal Management of Multi-Core Processors Using Core Hopping"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      F Iqbal Mariam, Thesis: "Thermal Management of Outside Plant Telecommunication Cabinets: Design and CFD Modeling Methodology"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      N Lakhkar, Dissertation: "Effect of Structural Design Parameters on Wafer Level CSP Ball Shear Strength and Their Influence on Accelerated Thermal Cycling Reliability"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      S Karajgikar, Dissertation: "Effective Thermal Management of Electronic Devices From System to Die Level"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      Saket Suhas Karajgikar, Effective thermal management of electronic devices from system to die level
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      T Huynh, Non-Thesis Project: "Terahertz (THz) Quantum Cascade Laser Device-Level Thermal Performance Assessment & Some Aspects of Reliability"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      T Huynh, Terahertz (THz) Quantum Cascade Laser Device-Level Thermal Performance Assessment &Some Aspects of Reliability
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      V Kumar, Optimization of a Micro-Channel Heat Sink for Minimum Pumping Power in High Power Devices
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      V Kumar, Non-Thesis Project: “Optimization of a Micro-Channel Heat Sink for Minimum Pumping Power in High Power Devices”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      V Mynampati, Thesis: “Alternative Cooling Technologies for Telecommunication Data Centers: Air Cooling and Rear Door Heat Exchangers”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      D Kaluvagunta,
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      G Nair, Non-Thesis Project: MEMS Based Wireless and Therapeutic Systems for Bio Medical Applications: Magnetic Analysis of The Cantilever Model in ANSYS
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      R Gaba, Non-Thesis Project: MEMS Based Wireless Sensing and Therapeutic Systems for Biomedical Applications Part A
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      S Galande, Non-Thesis Project: MEMS Based Wireless Sensing and Therapeutic Systems for Biomedical Applications Part B
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2009
      A Banerjee, Thesis: "Multi-Objective Optimization of Graphite Heat Spreader For Portable Systems Application"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2009
      R Lingam, Non-Theses: “Chassis Design &Thermal analysis of Motor Controllers in a Quadruped Robot”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2009
      U Raju, Thesis: “Characterization of Thermal Challenges in Electronics: Leakage Current, Co-Architectural Design and Rack Level Cooling”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2009
      V Mulay, Dissertation: “Development of Guidelines for Dynamic Thermal Management of Data Centers by Monitoring and Control of Cooling Equipment Based on Rack Inlet Temperatures"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2009
      M Noor, Thesis: (E.E.)
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2009
      P Pandojirao- Sunkojirao, Dissertation: (E.E.)
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2009
      S TakkallaPally, Thesis:
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2009
      AMD (Fall 2008/Spring 2009). “Design and Development of a Foam Heat Sink for High Powered Graphical Processing Units (GPUs).”
      Senior Design Project Supervision
    • 2008
      A Fasoro, Dissertation: “Design for Reliability in Microoptelectromechanical Systems (MOEMS)”
    • 2008
      A Kaisare, Dissertation: “An Analytical and Numerical Model For Design of Non-Uniformly Powered Silicon Chips Based on Both Thermal and Device Clock Performance”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2008
      A Trivedi, Thesis: "Thermo-Mechanical Solutions in Electronic Packaging: Component to System Level
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2008
      E.N. Rodrigo, Thesis: "Analytical Thermal Model of Generic Multi-Layer Spacerless 3D Package"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2008
      K Yasin, Performance of a Masterflux Compressor in a Refrigeration Unit For High End Computer System Application
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2008
      R Gandhi, Thesis: "Review of Thermal Interface Technology"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2008
      R Udakeri, Thesis: "Comparison of Overhead Supply & Under Floor Supply With Rear Door Heat Exchange in High Density Data Center Clusters"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2008
      V Nagaraj, Thesis: "Flip Chip Back End Design Parameters to Reduce Bump Electromigration"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2008
      M Rahman, Dissertation:
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2008
      Team AMD (Fall 2007/Spring 2008) “Design and Development of a Heat Sink for High Powered Graphical Processing Units (GPUs).”
      Senior Design Project Supervision
    • 2008
      Team Siemens (Spring/Summer 08)"Fabrication and Characterization of Mimic Cell Identical to Siemen's Power Cell."
      Senior Design Project Supervision
    • 2007
      Paruchuri Srikar, Thesis: “Flexible Microfluidic Circuit With Embedded in Plane Valve”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2007
      A. R. Patil, Thesis: Complete Stress Analysis for Two Dimensional Inclusion Problem Using Complex Variables”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2007
      C Golsch, Non-Thesis Project: “Magnetically Coupled Substrate Safety Valve”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2007
      G Iyer, Dissertation: “Context Aware Inference System To Capture Design Rationale From Legacy MCAD”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2007
      K Verma, Non-Thesis Project: Stress Simulation Using ANSYS Workbench”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2007
      M Manduva, Non-Thesis Project: "Deflection of plate using Mathematica"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2007
      Mahesh Kailas, Thesis: Stress Analysis of an Ellipsoidal Inclusion
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2007
      R Mitchell, Thesis: Exploratory Studies of Convective Flows Due To Arc Tracking
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2007
      Team AMD, (Summer 2007/Fall 2007) "Optimization and Redesign of Heat Sink for X-1950 Pro Graphics Video Card"
      Senior Design Project Supervision
    • 2006
      A Patil, Thesis: “MEMS Packaging: Fluxless Soldering and Reliability Assessment”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      B Dewan Sandur, Thesis: “Thermal Management of Die Stacking Architectures Memory and Logic Processor”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      Baek Sung, Thermal Enhancement of Stacked Dies Using Thermal Vias
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      C Henderson, Non-Thesis Project: “Solder Joint Fatigue Analysis Using the Disturbed State Concept”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      C Tadepalli, Non-Thesis Project: “Effect of Weight of Heat Sink on Mechanical Reliability of a Wire Bonded Plastic Ball Grid Array Package”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      F Zahedi, Non-Thesis Project: “Reliability of Lead-Free Solder Under Cyclic Bending”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      K Manne, Design and Optimization of Heat Spreaders and Selection of Fan in Laptop
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      M Bhat, Non-Thesis Project: “Implementation of Effective Lean Methodology in the Design and Fabrication of Microprocessor Chip”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      M Hossain, Dissertation: “Development of Constitutive Equations and Methodology for Failure Prediction Models for SAC Lead- free Alloys”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      S. Nikalaje, Generating G code’s / NC Program using CATIA V5 for Student
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      S.A. Joseph, Design methodology of development of Heat Sink for High-end CPUs
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      V Bedekar, Effect of CRAC Location On A Fixed Rack Layout of a Data Center
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      Y.J. Lee, Non-Thesis Project: “Thermal Reliability of 3D Stack Packaging in Finite Element Method”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      A Elliott, Non-Thesis Project: “Formula SAE Vehicle Aerodynamics: Under Tray Optimization Study”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      A Mahmood, Dissertation: “Device Level Vacuum Packaged Microbolometers on Flexible Substrates”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      B Kumar, Non-Thesis Project: “Thermal Analysis of a Standard Stacked Die Package With Thermal Vias Using Substructuring”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      R Basavanahalli, Thesis: “Finite Element Modeling of Carbon Nanotube Reinforced Polymer Composites and Evaluating Its Thermal Conductivities”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      Team Lockheed (Fall 2005/Spring 2006): “Electronic Packaging of Irregular PCB – Part II”
      Senior Design Project Supervision
    • 2005
      B Shah, Non-Thesis Project
      Masters Student Advisor
    • 2005
      A Kole, Thesis: “Polymer Tube Embedded in-Plane Micropump: Design, Analysis and Fabrication”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2005
      M Bhat, Non-Thesis Project: “Implementation of Lean Methodology in the Design and Manufacturing of Microprocessors”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2005
      N Lakhakar, Thesis: “Development of High Performance Cold Plate Tester”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2005
      S Bhopte, Thesis: “Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2005
      S Sethuraman, Non-Thesis Project: “Optimization of a Finned Heat Sink for Microprocessor Cooling”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2005
      Y Challa, Non-Thesis Project: “Single Wafer Encapsulation of MEMS Device”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2005
      Y Prasad, Non-Thesis Project: “Simulation Methodologies for the Solder Joint Crack Growth and Fatigue Life Prediction”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2005
      K Bushan, MEMS Microfluidic System
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2005
      Y Dubey, Non-Thesis Project
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2005
      Team Nokia (Fall 2003/Spring 2004): “Heat Pipe Assisted Heat Sink for Nokia Base Station,”
      Senior Design Project Supervision
    • 2005
      Team Lockheed (Fall2004/Spring2005): “Electronic Packaging of Irregular PCB – Part I”
      Senior Design Project Supervision
    • 2004
      A Halvi, Thesis: “Simulation of PWB Warpage During Fabrication and due to reflow”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      A Jupudi, Non-Thesis Project: “Heat Analysis of Data Center”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      A Shah, Non-Thesis Project: “Heat Pipe Assisted Heat Sink Optimization of Spacing Between Heat Pipes – A CFD Study”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      D Roberts, Non-Thesis Project: “3-D Cooling Case Study: Tessera, Inc’s PyxisTM Platform”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      O Puppala, Non-Thesis Project: “Thermal Analysis of Flip Chip BGA package”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      R Akhter, Thesis: “Optimal Thermal Management of Stacked Die Package: Design for Stackability”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      S Devireddy, Non-Thesis Project: “Role of Electronic Packages in Cell phones & Future Direction of Cell phone”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      S Karajgikar, Thesis: “Effect of Area Contact on the Stability of Modular Refrigeration Unit and Effect of Continuous and Discontinuous Fabrication and Reflow Process on PWB Warpage”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      S Kuravi, Thesis: “Estimation of Evaporation Rates in Humid Cavities”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      S Riaz, Thesis: “Microchannel Liquid Cooling System for High Heat Flux Integrated Circuits”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      W Ahn, Dissertation: “Development of a Design Tool to Assist Layout/Layup Design to Minimize Warpage of a PWB During Fabrication and Reflow Solder Processes "
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      A Morrison, Dissertation – “Enhancement of Condensation Heat Transfer for Steam at Near Atmospheric Pressure”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      Non-Thesis Project
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      D Kurusamy, Moiré Interferometric Investigation of Strain Fields in the Vicinity of Piezoceramic Patches
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      N Sivakumar, Leakage Current: Static Power Consumption
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      S Chandra, Non-Thesis Project
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      Team Nokia (Fall 2003/Spring 2004): “Heat Pipe Assisted Heat Sink for Nokia Base Station,”
      Senior Design Project Supervision
    • 2003
      A Kulkarni, Thesis: “A Thermal Simulation of a Thin Small Outline Package, Using Compact Components, and a Study of Effect of Change in TXV Bulb Location on the Stability of a Refrigeration System”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2003
      K Ramaswamy, Non-Thesis Project: “Facility and Equipment Thermal Guidelines for Data Center and Other Data Processing Environments”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2003
      M Al-Shuqairi, Thesis: “Mixed Convection of Impinging Air Cooling Over a Parallel Plate Heat Sink”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2003
      R Veluswamy, Thesis: “Thermal Design and Modeling of an Improved Circuit Spot Cooler.”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2003
      S Guggari, Thesis: “A Hybrid Methodology for Optimization of the Data Center Room Layout”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2003
      S Jagarkal, Thesis: “Optimization and Reliability of Electronic Packages”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2003
      V Mulay, Thesis: “An Experimental Study of Effects of Thermophysical Properties of Thermostatic Expansion Valve Sensor Bulb on Stability of Refrigeration System”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2003
      Y Makwana, Thesis: “Stability, Efficiency and Control System of a Masterflux Compressor in a Refrigeration Unit of a High End Computer”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2003
      Team Nokia (Spring/Summer 2003): “Heat Pipe Assisted Heat Sink for Nokia Base Station,”
      Senior Design Project Supervision
    • 2003
      Team Hewlett-Packard (Fall/Spring 2002-2003): “Optimization of Serial Heat Sinks for Hewlett-Packard Superdome Computer,”
      Senior Design Project Supervision
    • 2002
      A Kaisare, Thesis: “A 3-Dimensional Thermo-Mechanical Analysis of a Ball Grid Array Package”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2002
      R Rodney, Non-Thesis Project: “An Investigation of Friction Factors for Printed Circuit Card Assemblies”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2002
      V Bondili, Non-Thesis Project: “Computational Characterization of Impingement Flow in Parallel Plate Heat Sinks”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2002
      W Mustafa, Non-Thesis Project: “Fracture Mechanics Analysis of Kovar Leads”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2002
      G Agwu Nnanna, Dissertation – “Phase Change Phenomena in Porous Medium: A Local Thermal Non-Equilibrium Study”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2002
      G Morales, Simulating the Thermal Hysteresis Curve of a Pressure Sensor Produced by the Package Stresses
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2001
      F Oprea, Non-Thesis Project: “Thermoelectric Breakdown of CMOS Devices”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2001
      J Han Kim, Mechanism of Nucleate Boiling Heat Transfer
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2001
      K Rainey, Pool and Flow Boiling Heat Transfer from Microporous Flat and Finned Surfaces in FC-72
    • 2001
      Team Nokia (Fall/Spring 2000-2001): “Thermo-Mechanical Characteristics of a Ball Grid Array Package Resulting in Heat Sink Design for Telecommunication Applications,”
      Senior Design Project Supervision
    • 2001
      Team Motorola (Fall/Spring 2000-2001): “Investigate and Engineer a Linear Power Amplifier Heat Sink,”
      Senior Design Project Supervision
    • 2001
      Team Hewlett-Packard (Fall/Spring 2000-2001): “Project Superdome,”
      Senior Design Project Supervision
    • 2000
      Team Thermalloy (Spring/Summer 2000): “Numerical/Experimental Characterization and Improvement of Microprocessor Heat Sinks for Thermalloy Corporation,”
      Senior Design Project Supervision

Courses

      • AE 6196-029 AEROSPACE ENGR INTERNSHIP
        (Course Id: 111774)
        Fall - Regular Academic Session - 2019
      • ME 6399-029 DISSERTATION
        (Course Id: 103486)
        Fall - Regular Academic Session - 2019
      • ME 6699-029 DISSERTATION
        (Course Id: 103490)
        Fall - Regular Academic Session - 2019
      • ME 7399-029 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Fall - Regular Academic Session - 2019
      • ME 5352-001 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2019
      • ME 5352-002 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2019
      • ME 5352-003 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2019
      • MAE 4305-001 FUND OF ELECTRONIC PACKAGING
        (Course Id: 113096)
        Fall - Regular Academic Session - 2019
      • ME 6297-029 RESEARCH
        (Course Id: 103464)
        Fall - Regular Academic Session - 2019
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2019
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Fall - Regular Academic Session - 2019
      • AE 6297-029 RESEARCH AEROSPACE ENGINEERING
        (Course Id: 101985)
        Fall - Regular Academic Session - 2019
      • MAE 3311-001 THERMODYNAMICS II
        (Course Id: 103632)
        Fall - Regular Academic Session - 2019
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Fall - Regular Academic Session - 2019
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Fall - Regular Academic Session - 2019
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2019
      • ME 6197-029 RESEARCH
        (Course Id: 103463)
        Summer - 2019
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Summer - 2019
      • ME 5197-029 RESEARCH IN MECH ENGINEERING
        (Course Id: 113182)
        Summer - 2019
      • ME 5353-001 COMP TECH ELECTRONIC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2019
      • ME 5353-002 COMP TECH ELECTRONIC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2019
      • ME 6399-029 DISSERTATION
        (Course Id: 103486)
        Spring - Regular Academic Session - 2019
      • MAE 4305-001 FUND OF ELECTRONIC PACKAGING
        (Course Id: 113096)
        Spring - Regular Academic Session - 2019
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Spring - Regular Academic Session - 2019
      • ME 6297-029 RESEARCH
        (Course Id: 103464)
        Spring - Regular Academic Session - 2019
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2019
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2019
      • AE 6297-029 RESEARCH AEROSPACE ENGINEERING
        (Course Id: 101985)
        Spring - Regular Academic Session - 2019
      • AE 6397-029 RESEARCH AEROSPACE ENGINEERING
        (Course Id: 101994)
        Spring - Regular Academic Session - 2019
      • AE 5397-029 RESEARCH IN AEROSPACE ENGINEER
        (Course Id: 112457)
        Spring - 2019
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2019
      • ME 5352-001 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2018
      • ME 5352-002 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2018
      • ME 5352-003 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2018
      • MAE 4305-001 FUND OF ELECTRONIC PACKAGING
        (Course Id: 113096)
        Fall - Regular Academic Session - 2018
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Fall - Regular Academic Session - 2018
      • ME 6297-029 RESEARCH
        (Course Id: 103464)
        Fall - Regular Academic Session - 2018
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2018
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Fall - Regular Academic Session - 2018
      • AE 6297-029 RESEARCH AEROSPACE ENGINEERING
        (Course Id: 101985)
        Fall - Regular Academic Session - 2018
      • MAE 3311-001 THERMODYNAMICS II
        (Course Id: 103632)
        Fall - Regular Academic Session - 2018
      • MAE 3311-002 THERMODYNAMICS II
        (Course Id: 103632)
        Fall - Regular Academic Session - 2018
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Fall - Regular Academic Session - 2018
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Fall - Regular Academic Session - 2018
      • ME 6399-029 DISSERTATION
        (Course Id: 103486)
        Summer - Eleven Week - 2018
      • ME 7399-029 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Summer - Eleven Week - 2018
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2018
      • ME 5353-001 COMPUT TECHS ELEC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2018 Download Syllabus
      • ME 5353-002 COMPUT TECHS ELEC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2018
      • ME 6399-029 DISSERTATION
        (Course Id: 103486)
        Spring - Regular Academic Session - 2018
      • ME 6699-029 DISSERTATION
        (Course Id: 103490)
        Spring - Regular Academic Session - 2018
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Spring - Regular Academic Session - 2018
      • ME 6297-029 RESEARCH
        (Course Id: 103464)
        Spring - Regular Academic Session - 2018
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2018
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2018
      • AE 6697-029 RESEARCH IN AEROSPACE ENGRG
        (Course Id: 101998)
        Spring - Regular Academic Session - 2018
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: Apply Computat Technq ElecPkg | Course Id: 103659)
        Spring - Regular Academic Session - 2018
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Spring - Regular Academic Session - 2018
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2018
      • ME 5352-001 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2017 Download Syllabus
      • ME 5352-002 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2017
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Fall - Regular Academic Session - 2017
      • ME 6297-029 RESEARCH
        (Course Id: 103464)
        Fall - Regular Academic Session - 2017
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2017
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Fall - Regular Academic Session - 2017
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: Fund of Electronic Packaging | Course Id: 103659)
        Fall - Regular Academic Session - 2017
      • MAE 3311-001 THERMODYNAMICS II
        (Course Id: 103632)
        Fall - Regular Academic Session - 2017 Download Syllabus
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Fall - Regular Academic Session - 2017
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Fall - Regular Academic Session - 2017
      • ME 7399-029 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Summer - Eleven Week - 2017
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2017
      • ME 6197-029 RESEARCH
        (Course Id: 103463)
        Summer - Eleven Week - 2017
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Summer - Summer Intersession - 2017
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Summer - Eleven Week - 2017
      • ME 5353-001 COMPUT TECHS ELEC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2017
      • ME 5353-002 COMPUT TECHS ELEC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2017
      • ME 6999-029 DISSERTATION
        (Course Id: 103494)
        Spring - Regular Academic Session - 2017
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2017
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2017
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Spring - Winter Intersession - 2017
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Spring - Regular Academic Session - 2017
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2017
      • ME 5352-001 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2016
      • ME 5352-002 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2016
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Fall - Regular Academic Session - 2016
      • ME 5191-029 PROJECT STUDIES MECHANICAL ENG
        (Course Id: 103389)
        Fall - Regular Academic Session - 2016
      • ME 6297-029 RESEARCH
        (Course Id: 103464)
        Fall - Regular Academic Session - 2016
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2016
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Fall - Regular Academic Session - 2016
      • MAE 4301-010 SPEC TOPICS MECH & AERO ENGR
        (Topic: Fund. of Electronic Packaging | Course Id: 103659)
        Fall - Regular Academic Session - 2016
      • MAE 3311-001 THERMODYNAMICS II
        (Course Id: 103632)
        Fall - Regular Academic Session - 2016
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Fall - Regular Academic Session - 2016
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Fall - Regular Academic Session - 2016
      • ME 7399-029 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Summer - Eleven Week - 2016
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2016
      • ME 5191-029 PROJECT STUDIES MECHANICAL ENG
        (Course Id: 103389)
        Summer - Eleven Week - 2016
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Summer - Summer Intersession - 2016
      • ME 5391-029 ADV STUDIES MECH ENGR
        (Course Id: 103457)
        Spring - Regular Academic Session - 2016
      • ME 5353-001 COMPUT TECHS ELEC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2016
      • ME 5353-002 COMPUT TECHS ELEC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2016
      • ME 6999-029 DISSERTATION
        (Course Id: 103494)
        Spring - Regular Academic Session - 2016
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Spring - Regular Academic Session - 2016
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2016
      • ME 6997-029 RESEARCH
        (Course Id: 103493)
        Spring - Regular Academic Session - 2016
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Spring - Winter Intersession - 2016
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Spring - Regular Academic Session - 2016
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2016
      • ME 7399-029 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Fall - Regular Academic Session - 2015
      • ME 5352-001 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2015
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Fall - Regular Academic Session - 2015
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2015
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Fall - Regular Academic Session - 2015
      • ME 6997-029 RESEARCH
        (Course Id: 103493)
        Fall - Regular Academic Session - 2015
      • MAE 3311-001 THERMODYNAMICS II
        (Course Id: 103632)
        Fall - Regular Academic Session - 2015
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Fall - Regular Academic Session - 2015
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Fall - Regular Academic Session - 2015
      • ME 5391-029 ADV STUDIES MECH ENGR
        (Course Id: 103457)
        Summer - Eleven Week - 2015
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2015
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Summer - Eleven Week - 2015
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Summer - Eleven Week - 2015
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Summer - Summer Intersession - 2015
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Summer - Eleven Week - 2015
      • ME 5391-029 ADV STUDIES MECH ENGR
        (Course Id: 103457)
        Spring - Regular Academic Session - 2015
      • ME 5353-001 COMPUT TECHS ELEC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2015
      • ME 5353-002 COMPUT TECHS ELEC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2015
      • ME 6699-029 DISSERTATION
        (Course Id: 103490)
        Spring - Regular Academic Session - 2015
      • ME 7399-029 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Spring - Regular Academic Session - 2015
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Spring - Regular Academic Session - 2015
      • ME 6297-029 RESEARCH
        (Course Id: 103464)
        Spring - Regular Academic Session - 2015
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2015
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2015
      • ME 6997-029 RESEARCH
        (Course Id: 103493)
        Spring - Regular Academic Session - 2015
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Spring - Winter Intersession - 2015
      • AE 5398-029 THESIS
        (Course Id: 101981)
        Spring - Regular Academic Session - 2015
      • AE 5698-029 THESIS
        (Course Id: 101982)
        Spring - Regular Academic Session - 2015
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Spring - Regular Academic Session - 2015
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2015
      • ME 5391-029 ADV STUDIES MECH ENGR
        (Course Id: 103457)
        Fall - Regular Academic Session - 2014
      • ME 6399-029 DISSERTATION
        (Course Id: 103486)
        Fall - Regular Academic Session - 2014
      • ME 6699-029 DISSERTATION
        (Course Id: 103490)
        Fall - Regular Academic Session - 2014
      • ME 7399-029 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Fall - Regular Academic Session - 2014
      • ME 5352-001 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2014
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Fall - Regular Academic Session - 2014
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2014
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Fall - Regular Academic Session - 2014
      • ME 6997-029 RESEARCH
        (Course Id: 103493)
        Fall - Regular Academic Session - 2014
      • MAE 3311-001 THERMODYNAMICS II
        (Course Id: 103632)
        Fall - Regular Academic Session - 2014
      • AE 5398-029 THESIS
        (Course Id: 101981)
        Fall - Regular Academic Session - 2014
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Fall - Regular Academic Session - 2014
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Fall - Regular Academic Session - 2014
      • ME 6399-029 DISSERTATION
        (Course Id: 103486)
        Summer - Eleven Week - 2014
      • ME 6699-029 DISSERTATION
        (Course Id: 103490)
        Summer - Eleven Week - 2014
      • ME 7399-029 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Summer - Eleven Week - 2014
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2014
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Summer - Eleven Week - 2014
      • MAE 4391-029 SPEC PROB MECH & AERO ENGR
        (Course Id: 103689)
        Summer - Eleven Week - 2014
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Summer - Summer Intersession - 2014
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Summer - Eleven Week - 2014
      • ME 5391-029 ADV STUDIES MECH ENGR
        (Course Id: 103457)
        Spring - Regular Academic Session - 2014
      • ME 5353-001 COMPUT TECHS ELEC PACKAGING
        (Topic: CFD in Electronic Packaging | Course Id: 103446)
        Spring - Regular Academic Session - 2014
      • ME 6399-029 DISSERTATION
        (Course Id: 103486)
        Spring - Regular Academic Session - 2014
      • ME 6699-029 DISSERTATION
        (Course Id: 103490)
        Spring - Regular Academic Session - 2014
      • AE 5101-001 GRADUATE SEMINAR
        (Course Id: 101917)
        Spring - Regular Academic Session - 2014
      • AE 5101-002 GRADUATE SEMINAR
        (Course Id: 101917)
        Spring - Regular Academic Session - 2014
      • ME 5101-001 GRADUATE SEMINAR
        (Course Id: 101917)
        Spring - Regular Academic Session - 2014
      • ME 5101-002 GRADUATE SEMINAR
        (Course Id: 101917)
        Spring - Regular Academic Session - 2014
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Spring - Regular Academic Session - 2014
      • ME 6297-029 RESEARCH
        (Course Id: 103464)
        Spring - Regular Academic Session - 2014
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2014
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2014
      • ME 6997-029 RESEARCH
        (Course Id: 103493)
        Spring - Regular Academic Session - 2014
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Spring - Winter Intersession - 2014
      • AE 5698-029 THESIS
        (Course Id: 101982)
        Spring - Regular Academic Session - 2014
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Spring - Regular Academic Session - 2014
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2014
      • ME 5998-029 THESIS
        (Course Id: 103462)
        Spring - Regular Academic Session - 2014
      • ME 5391-029 ADV STUDIES MECH ENGR
        (Course Id: 103457)
        Fall - Regular Academic Session - 2013
      • ME 6699-029 DISSERTATION
        (Course Id: 103490)
        Fall - Regular Academic Session - 2013
      • ME 5352-001 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2013
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Fall - Regular Academic Session - 2013
      • ME 6297-029 RESEARCH
        (Course Id: 103464)
        Fall - Regular Academic Session - 2013
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2013
      • ME 6997-029 RESEARCH
        (Course Id: 103493)
        Fall - Regular Academic Session - 2013
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: Fund of Electronic Packaging | Course Id: 103659)
        Fall - Regular Academic Session - 2013
      • MAE 3311-002 THERMODYNAMICS II
        (Course Id: 103632)
        Fall - Regular Academic Session - 2013
      • AE 5698-029 THESIS
        (Course Id: 101982)
        Fall - Regular Academic Session - 2013
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Fall - Regular Academic Session - 2013
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Fall - Regular Academic Session - 2013
      • ME 5391-029 ADV STUDIES MECH ENGR
        (Course Id: 103457)
        Summer - Eleven Week - 2013
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2013
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Summer - Eleven Week - 2013
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Summer - Eleven Week - 2013
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Summer - Summer Intersession - 2013
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Summer - Eleven Week - 2013
      • ME 5391-029 ADV STUDIES MECH ENGR
        (Course Id: 103457)
        Spring - Regular Academic Session - 2013
      • ME 5353-001 COMPUT TECHS ELEC PACKAGING
        (Topic: CFD in Electronic Packaging | Course Id: 103446)
        Spring - Regular Academic Session - 2013
      • AE 5101-001 GRADUATE SEMINAR
        (Course Id: 101917)
        Spring - Regular Academic Session - 2013
      • AE 5101-002 GRADUATE SEMINAR
        (Course Id: 101917)
        Spring - Regular Academic Session - 2013
      • ME 5101-001 GRADUATE SEMINAR
        (Course Id: 101917)
        Spring - Regular Academic Session - 2013
      • ME 5101-002 GRADUATE SEMINAR
        (Course Id: 101917)
        Spring - Regular Academic Session - 2013
      • ME 6297-029 RESEARCH
        (Course Id: 103464)
        Spring - Regular Academic Session - 2013
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2013
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2013
      • ME 6997-029 RESEARCH
        (Course Id: 103493)
        Spring - Regular Academic Session - 2013
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Spring - Winter Intersession - 2013
      • AE 5698-029 THESIS
        (Course Id: 101982)
        Spring - Regular Academic Session - 2013
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Spring - Regular Academic Session - 2013
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2013
      • ME 5391-029 ADV STUDIES MECH ENGR
        (Course Id: 103457)
        Fall - Regular Academic Session - 2012
      • ME 5352-001 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2012
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Fall - Regular Academic Session - 2012
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2012
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Fall - Regular Academic Session - 2012
      • ME 6997-029 RESEARCH
        (Course Id: 103493)
        Fall - Regular Academic Session - 2012
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: Fund. of Electronic Packaging | Course Id: 103659)
        Fall - Regular Academic Session - 2012
      • MAE 3311-001 THERMODYNAMICS II
        (Course Id: 103632)
        Fall - Regular Academic Session - 2012
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Fall - Regular Academic Session - 2012
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Fall - Regular Academic Session - 2012
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2012
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Summer - Eleven Week - 2012
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Summer - Eleven Week - 2012
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Summer - Summer Intersession - 2012
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Summer - Eleven Week - 2012
      • ME 5353-001 COMPUT TECHS ELEC PACKAGING
        (Topic: CFD in Electronic Packaging | Course Id: 103446)
        Spring - Regular Academic Session - 2012
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2012
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2012
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Spring - Winter Intersession - 2012
      • AE 5698-029 THESIS
        (Course Id: 101982)
        Spring - Regular Academic Session - 2012
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Spring - Regular Academic Session - 2012
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2012
      • ME 5391-029 ADV STUDIES MECH ENGR
        (Course Id: 103457)
        Fall - Regular Academic Session - 2011
      • ME 5352-001 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2011
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Fall - Regular Academic Session - 2011
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2011
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Fall - Regular Academic Session - 2011
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: Fund. of Electronic Packaging | Course Id: 103659)
        Fall - Regular Academic Session - 2011
      • MAE 3311-001 THERMODYNAMICS II
        (Course Id: 103632)
        Fall - Regular Academic Session - 2011
      • AE 5698-029 THESIS
        (Course Id: 101982)
        Fall - Regular Academic Session - 2011
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Fall - Regular Academic Session - 2011
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Fall - Regular Academic Session - 2011
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2011
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Summer - Eleven Week - 2011
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Summer - Eleven Week - 2011
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Summer - Summer Intersession - 2011
      • AE 5698-029 THESIS
        (Course Id: 101982)
        Summer - Eleven Week - 2011
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Summer - Eleven Week - 2011
      • AE 5391-029 ADV STUDIES AEROSPACE ENGR
        (Course Id: 101980)
        Spring - Regular Academic Session - 2011
      • ME 5391-029 ADV STUDIES MECH ENGR
        (Course Id: 103457)
        Spring - Regular Academic Session - 2011
      • ME 5353-001 COMPUT TECHS ELEC PACKAGING
        (Topic: CFD in Electronic Packaging | Course Id: 103446)
        Spring - Regular Academic Session - 2011
      • ME 6999-029 DISSERTATION
        (Course Id: 103494)
        Spring - Regular Academic Session - 2011
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2011
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2011
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Spring - Winter Intersession - 2011
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2011
      • ME 5352-001 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2010
      • ME 6197-029 RESEARCH
        (Course Id: 103463)
        Fall - Regular Academic Session - 2010
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2010
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: Fundamentals of Elec Packaging | Course Id: 103659)
        Fall - Regular Academic Session - 2010
      • MAE 3311-001 THERMODYNAMICS II
        (Course Id: 103632)
        Fall - Regular Academic Session - 2010
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Fall - Regular Academic Session - 2010
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Summer - Eleven Week - 2010
      • MAE 4301-002 SPEC TOPICS MECH & AERO ENGR
        (Topic: Catia | Course Id: 103659)
        Summer - Summer Intersession - 2010
      • AE 5698-029 THESIS
        (Course Id: 101982)
        Summer - Five Week - Second - 2010
      • AE 5391-029 ADV STUDIES AEROSPACE ENGR
        (Course Id: 101980)
        Spring - Regular Academic Session - 2010
      • ME 5353-001 COMPUT TECHS ELEC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2010
      • ME 6999-029 DISSERTATION
        (Course Id: 103494)
        Spring - Regular Academic Session - 2010
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Spring - Regular Academic Session - 2010
      • ME 6197-029 RESEARCH
        (Course Id: 103463)
        Spring - Regular Academic Session - 2010
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2010
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CFD in Electronic Packaging | Course Id: 103659)
        Spring - Regular Academic Session - 2010
      • MAE 4301-002 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Spring - Winter Intersession - 2010
      • AE 5698-029 THESIS
        (Course Id: 101982)
        Spring - Regular Academic Session - 2010
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2010
      • ME 5391-029 ADV STUDIES MECH ENGR
        (Course Id: 103457)
        Fall - Regular Academic Session - 2009
      • ME 6999-029 DISSERTATION
        (Course Id: 103494)
        Fall - Regular Academic Session - 2009
      • ME 5352-001 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2009
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2009
      • MAE 4301-001 SPEC TOPICS MECH & AEROSP ENGR
        (Topic: Fund. of Electronic Packaging | Course Id: 103659)
        Fall - Regular Academic Session - 2009
      • MAE 3311-001 THERMODYNAMICS II
        (Course Id: 103632)
        Fall - Regular Academic Session - 2009
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Fall - Regular Academic Session - 2009

Service to the University

    • Jan 2017 to  Present Faculty Advisor
      7x24 Exchange Student Chapter
    • Jan 2015 to  Present Faculty Advisor
      SMTA
      https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=128
    • Jan 2007 to  Present Scientific Advisory Board
      Princeton University
    • Jan 2006 to  Present Engineering Advisory Council
      University of Colorado Boulder
    • Jan 2004 to  Present Faculty Advisor
      NSBE Student Section
    • Jan 2003 to  Present Faculty Advisor
      ASME Student Section
    • Jan 2000 to  Present Member
      Industrial Relations Committee - MAE
    • Jan 2000 to  2015 Board of Visitors
      Howard University
    • Jan 2000 to  2010 Member
      Intellectual Property Committee
    • Jan 2003 to  2008 Mentor
      McNair Scholar
    • Jan 2005 to  2005 Member
      Grade Appeal Committee
    • Jan 2005 to  2005 Member
      MAE ABET Committee
    • Jan 2005 to  2005 Member
      MAE Promotion and Tenure Committee
    • Jan 2001 to  2001 Chair
      Faculty Search Committee
    • Apr 1996 to  2000 Chair
      Advisory Council, Howard University School of Engineering

Service to the Profession

    • Past to  May 2016
      Panelist (Las Vegas, NV,
      IEEE ITherm Conference
      Panelists: Professor Mehmet Arik, Ozyegin University, Don Le, Qualcomm, Professor Dereje Agonafer, University of Texas – Arlington, Dr. Terry O'Shea, Hewlett Packard, Dr. Angel Han, Huawei Technologies, and Bradley Urban, Lab126, “Thermal and Mechanical Design Challenges in Internet of Things – IoT,” IEEE ITherm Conference, May 2016, Las Vegas, NV.
    • Oct 2001 to  2015
      Board of Visitors
      Howard University
    • May 2014 to  May 2014
      Session Chair (Orlando, FL,
      IEEE ITHERM Conference
    • Past to  July 2013
      Panels Track Organizer (Burlingame, CA,
      ASME 2013 International Technical Conference and Exposition on Packaging and Integration of Electronic and Photonic Microsystems
    • Past to  Nov 2012
      Topic Co-Organizer (Houston, TX,
      IMECE’12,
      Thermal Management Challenges in Energy Conversion & Conservation
    • Past to  Nov 2011
      Topic Co-Organizer
      IMECE’11
      Workshop on Careers in Industry and Academia
    • Past to  Nov 2011
      Session Co-Organizer (Denver, CO,
      IMECE '11
      Thermal Management Challenges in Energy Conversion and Conservation
    • Past to  July 2011
      Panelist
      Integration of Simulation Technology into Engineering Curricula: a university - industry workshop
      Cornell University, Recommendations for overcoming barriers and institutionalizing best practices: CFD, FEA
    • June 2010 to  June 2010
      Keynote Speaker Chair (Las Vegas, NV,
      ITHERM’10
    • June 2010 to  June 2010
      Panel Moderator (Las Vegas, NV,
      ITHERM’10
      Cooling of 3D Packaging (Sponsored by NSF)
    • June 2010 to  June 2010
      Panel Moderator (Las Vegas, NV,
      ITHERM’10
      Cooling of 3D Packaging (Sponsored by NSF)
    • Past to  Nov 2009
      Panelist
      IMECE’09
      CFD/EFD Choice --A Dilemma for Industries
    • Past to  Nov 2009
      Panelist (Orlando, FL,
      IMECE ’09
      Workshop on Careers in Industry and Academia
    • Past to  Nov 2009
      Co-Moderator (Orlando, FL,
      IMECE’09
      New Challenges in Thermal Management
    • Past to  July 2009
      Keynote Speaker Co-Chair (San Francisco, CA,
      InterPACK’09
    • Past to  July 2009
      Panel Moderator (San Francisco, CA,
      InterPACK’09
      Identifying the Challenges in the Next Generation of Microprocessors – Part 1
    • Past to  July 2009
      Session Chair (San Francisco, CA,
      InterPACK’09
      IP 12-8: Data Center Thermal Management – III
    • Past to  July 2009
      Session Chair (San Fransisco, CA,
      InterPACK’09
      IP 12-8: Data Center Thermal Management – IV
    • Mar 2009 to  Mar 2009
      Moderator (San Diego, CA,
      SemiTherm’09
      Thermal Markets and Technology Drivers for the Future
    • Apr 2002 to  2008
      NSF Reviewer
      Virginia Tech Packaging Center
    • Oct 2008 to  Nov 2008
      Panelist (Boston, MA,
      IMECE’08
      Grand Challenges in Thermal Management of Electronics: From Device to Systems
    • Jan 2005 to  2007
      Board Member
      NSF CREST Center for Mesoscopic Modeling and Simulation
    • 2003 to  2007
      Editor, Associate Editor
      Journal of Electronic Packaging
    • Nov 2007 to  Nov 2007
      Panelist
      IMECE’07
      Careers in Academia
    • Nov 2007 to  Nov 2007
      Session Chair (Seattle, WA,
      IMECE’07
      Thermal and Fluid Sciences Education: Keeping it Current
    • Nov 2007 to  Nov 2007
      Session Chair (Seattle, WA,
      IMECE’07
    • Nov 2007 to  Nov 2007
      Panel Co-Chair (San Diego, CA,
      ITHERM 2006
      Thermo/Mechanical Challenges in 3D Packaging
    • July 2007 to  July 2007
      Chair
      ASME Keynote Speaker Committee, InterPACK
    • May 2006 to  June 2006
      Chair
      ASME Keynote Speaker Committee, ITherm
    • May 2006 to  June 2006
      Panel Co-Chair (San Diego, CA,
      ITHERM '06
      Challenges in Chip/Processor Level Thermal Engineering
    • May 2006 to  June 2006
      Co-Chair (San Diego, CA,
      ITHERM’06
      Challenges in Chip/Processor Level Thermal Engineering
    • May 2006 to  June 2006
      Panel Co-Chair (San Diego, CA,
      ITHERM’06
      Integration Issues in 3D Packaging
    • May 2006 to  June 2006
      Session Chair (San Diego, CA,
      ITHERM’06
      Integration Issues in 3D Packaging
    • Nov 2005 to  Nov 2005
      Panel Moderator (Orlando, FL,
      IMECE ’05
      Thermal and Mechanical Issues in Three- D Packaging
    • Nov 2005 to  Nov 2005
      Panel Moderator (Orlando, FL,
      IMECE ’05
      JEDEC Thermal Standards for Multi-Chip (Lateral and Stacked) Packaging
    • Nov 2005 to  Nov 2005
      Panelist (Orlando, FL,
      IMECE ’05
      Challenges in Harsh Environment Packaging Issues
    • Nov 2005 to  Nov 2005
      Moderator (Orlando, FL,
      IMECE’05
      NanoTechnology in Electronics Thermal Management: Opportunities and Challenges
    • Nov 2005 to  Nov 2005
      Moderator (Orlando, FL,
      IMECE’05
      Challenges in the Thermo-Mechanical Packaging of the Next Generation of PC Systems
    • Nov 2005 to  Nov 2005
      Moderator (Orlando, FL,
      IMECE’05
      JEDEC Thermal Standards for Multi-Chip (Lateral and Stacked) Packaging
    • Nov 2005 to  Nov 2005
      Session Organizer (Orlando, FL,
      IMECE’05
      Single and Two-phase Heat Transfer in a Low-density, 3- Dimensional Microchannel
    • Nov 2005 to  Nov 2005
      Session Organizer (Orlando, FL,
      IMECE’05
      Thermal and Mechanical Issues in Three-D Packaging
    • Nov 2005 to  Nov 2005
      Session Organizer (Orlando, FL,
      IMECE’05
      JEDEC Thermal Standards for Multi-Chip (Lateral and Stacked) Packaging
    • Sept 2005 to  Sept 2005
      Member
      ABET Program Evaluation Visit
    • Oct 2000 to  Sept 2005
      NSF Reviewer
      Georgia Tech Packaging Program
    • July 2005 to  July 2005
      Chair
      ASME Keynote Speaker Committee, InterPACK
    • July 2005 to  July 2005
      Moderator (San Francisco, CA,
      InterPACK’05
      Challenges in the Thermo-Mechanical Packaging of the Next Generation of PC Systems
    • July 2005 to  July 2005
      Moderator (San Francisco, CA,
      InterPACK’05
      NanoTechnology in Electronics Thermal Management: Opportunities and Challenges
    • Mar 2005 to  Mar 2005
      Member
      NSBE National Society of Black Engineers Conference & Golden Torch Awards
    • Past to  Jan 2005
      Editor, Journal Editor
      Journal of Heat Transfer
      v 127, n 1
    • Past to  Dec 2004
      Editor, Journal Editor
      Journal of Electronic Packaging
      Transactions of the ASME, v 126, n 4
    • Oct 2000 to  2004
      Program Evaluator
      ABET
    • Nov 2004 to  Nov 2004
      Session Chair (Anaheim, CA,
      IMECE ’04
      Seminal Contributions to the Heat Sink. Cold Plate Compact Heat Exchangers Panel
    • Nov 2004 to  Nov 2004
      Session Organizer
      IMECE ’04
      Thermo-Mechanical Challenges in 3D Packaging
    • Nov 2004 to  Nov 2004
      Topic Organizer (Anaheim, CA,
      IMECE ’04
      Three-Dimensional Packaging Issues
    • Past to  Oct 2004
      Invited PanelistJuarez, Mexico)
      The United States-Mexico Foundation for Science Border Office & The Institute for Policy and Economic Development
      The Institute for Policy and Economic Development
    • June 2004 to  June 2004
      Member
      ASME Technical Executive Committee
    • June 2004 to  June 2004
      Co-Chair
      ASME Keynote Speaker Committee
    • June 2004 to  June 2004
      Moderator (Las Vegas, NV,
      ITHERM 2004
      Challenges in Chip/Processor Level Thermal Engineering
    • June 2004 to  June 2004
      Panelist
      ITHERM 2004
      Thermal Design of Electronic Systems: From Portables to Mainframes
    • June 2004 to  June 2004
      Session Chair (Las Vegas, NV,
      ITHERM2004
      MEMS Modeling and Packaging
    • Past to  Feb 2004
      Chair (Washington, D. C.,
      Graduate Research NSF Fellowship Program
    • Jan 2003 to  2003
      Member
      ASME InterPACK Advisory Committee
    • Nov 2003 to  Nov 2003
      Session Chair
      IMECE ’03
      Symposium on Cooling of Microelectronics, MEMS Photonics, and Nano Devices: in Honor of R.C. Chu’s Sustained Contribution to Electronic Cooling: IX
    • Nov 2003 to  Nov 2003
      Session Chair (Washington, D. C.,
      IMECE ’03
      Innovations in Heat Transfer Education: Integrating Thermal Sciences into the Capstone Design Experience
    • Nov 2003 to  Nov 2003
      Session Chair (Washington, D. C.,
      IMECE ’03
      Symposium on Cooling of Microelectronics, MEMS Photonics, and Nano Devices: in Honor of R.C. Chu’s Sustained Contribution to Electronic Cooling: VIII
    • Nov 2003 to  Nov 2003
      Session Organizer (Washington, DC,
      American Society of Mechanical Engineers (ASME)
      ASME Session Organizer “Symposium on Cooling of Microelectronics, MEMS, Photonics, and Nano Devices: In Honor of R.C. Chu’s Sustained Contribution to Electronic Cooling – IX”, IMECE’03, Washington, D.C. November 15 – 21, 2003.
    • Nov 2003 to  Nov 2003
      Session Organizer (Washington, DC,
      American Society of Mechanical Engineers (ASME)
      ASME Session Organizer “Emerging Problems in Thermal Management”, IMECE’03, Washington, D.C. November 15 – 21, 2003
    • Nov 2003 to  Nov 2003
      Track Manager (Washington, D. C.,
      American Society of Mechanical Engineers (ASME) International Mechanical Engineering Congress and Exposition (IMECE)
      Track Manager “Electrical Systems and Photonic Design”, IMECE’03, Washington, D.C., November 15-21, 2003
    • Sept 2003 to  Sept 2003
      Program Committee MemberAix-en-Provence, France)
      9th International Workshop on THERMAL INVESTIGATIONS of ICs and MICROSTRUCTURES
    • July 2003 to  July 2003
      Co-Chair (Kauai, HI,
      American Society of Mechanical Engineers (ASME) InterPACK’03 Exhibit
      ASME Exhibit Co-Chair, InterPACK’03, Kauai, HI, July 6 – 11, 2003
    • July 2003 to  July 2003
      Member (Kauai, HI,
      ASME Keynote Speaker Committee, InterPACK
    • July 2003 to  July 2003
      Member (Kauai, HI,
      ASME Tutorial Planning Committee, InterPACK’03
    • July 2003 to  July 2003
      Panel Moderator (Maui, HI,
      InterPACK ‘03
      MEMS and Nanoelectronics Cooling: Lessons from Microelectronics Cooling and Beyond
    • July 2003 to  July 2003
      Panel Moderator (Maui, HI,
      InterPACK ‘03
      Cooling Technologies for High Heat Flux Applications
    • July 2003 to  July 2003
      Panel Moderator (Maui, HI,
      InterPACK ‘03
      Advances in Heat Sink and Heat Spreader Design
    • July 2003 to  July 2003
      Panelist (Maui, HI,
      InterPACK ‘03
      What Educational Topics Are Relevant for Micro-Nano Systems Integration?
    • July 2003 to  July 2003
      Session Chair (Maui, HI,
      InterPACK ’03
      Cooling Technologies for High Heat Flux Applications
    • July 2003 to  July 2003
      Session Chair (Maui, HI,
      InterPACK ’03
      Packaging Reliability
    • Past to  June 2003
      Member
      Panel Review Team for New Millennium Program Space Technology-8 (NASA)
    • June 2003 to  June 2003
      Member
      NSF – Special Panel Committee of Visitors (COV) Report for the National Science Foundation (NSF) Graduate Research Fellowship Program (GRFP)
      NSF – Special Panel Committee of Visitors (COV) Report for the National Science Foundation (NSF) Graduate Research Fellowship Program (GRFP), June 17-18, 2003
    • Past to  May 2003
      Panelist
      University of Colorado at Boulder College of Engineering and Applied Science’s Centennial Anniversary Celebration Forum
      Mechanical Engineering Research in the Coming Decades: Challenges and Opportunities
    • Past to  Feb 2003
      Chair (Washington, D. C.,
      Graduate Research NSF Fellowship Program
    • Past to  2002
      Member
      ASME Technical Executive Committee
    • Past to  2002
      Member
      International Conference on Parallel Computing in Electrical Engineering 2002, Programme Committee
    • Nov 2002 to  Nov 2002
      Panel Moderator (New Orleans, LA,
      IMECE ’02
      Challenges in Cooling High Heat Flux Electronics Systems
    • Nov 2002 to  Nov 2002
      Panel Moderators (New Orleans, LA,
      IMECE ’02
      Limits of Air Cooling
    • Nov 2002 to  Nov 2002
      Session Chair (New Orleans, LA,
      IMECE ’02
      Thermo/Mechanical Modeling in Electronic Packaging
    • Oct 2002 to  Oct 2002
      Program Committee Member (Madrid, Spain)
      8th International Workshop on THERMAL INVESTIGATIONS of ICs and MICROSTRUCTURES
    • Past to  July 2002
      Member (Montreux, Switzerland,
      ESDA 2000 Program Committee
    • Past to  June 2002
      Session Chair (San Diego, CA,
      ITHERM 02
      Phase Change Materials and Thermosyphons
    • Past to  June 2002
      Session Chair (San Diego, CA,
      ITHERM 02
    • May 2002 to  June 2002
      Co-Chair
      ASME ITHERM’02 Keynote Speaker Committee
    • May 2002 to  June 2002
      Member (San Diego, CA,
      ASME Program Committee, ITherm '02
    • July 2001 to  2001
      Chair
      InterPACK ’01 Keynote Speaker Committee
    • Sept 2001 to  Sept 2001
      Program Committee Member (Paris, France)
      7th International Workshop on thermal investigations of ICs and microstructures
    • July 2000 to  2000
      Chair
      ASME International Electrical and Electronic Packaging Division
    • Sept 2000 to  2000
      NSF Reviewer
      Small Business Innovation Research - SBIR
    • Past to  Oct 2000
      Editor in Chief
      ASME Book Series in Electronic Packaging
    • Sept 2000 to  Sept 2000
      Program Committee Member (Budapest, Hungary)
      6th International Workshop on thermal investigations ofICs and microstructures
    • July 1997 to  July 2000
      Chair
      ASME Heat Transfer Division, K-16 Committee in Electronic Cooling
    • June 1995 to  June 2000
      Editor, Book
      Gordon & Breach Book Series in Electronic Packaging
    • Past to  May 2000
      Panelist (Las Vegas, NV,
      2000 ITHERM International Conference
      Computational Thermal Modeling Challenges at the System Level
    • Oct 1999 to  1999
      Member
      Howard University Chemical Engineering Master's Level Program Review
    • Past to  1999
      Panel Moderator (Nashville, TN,
      International Mechanical Engineering Congress and Exposition Meeting
    • June 1984 to  1999
      Director
      IBM
    • Oct 1999 to  Oct 1999
      Program Committee Member (Rome, Italy)
      5th International Workshop on thermal investigations of ICs and microstructures
    • Past to  June 1999
      General Chair (Maui, Hawaii,
      ASME InterPACK '99 Conference
    • Past to  1998
      Editor in Chief
      ASME Book Series in Electronic Packaging Project
    • Sept 1998 to  Sept 1998
      Program Committee Member (Cannes, France)
      4th International Workshop on thermal investigations of ICs and microstructures
    • Past to  1997
      Member
      International Workshop on Thermal Investigations of ICs and Microstructures (THERMINIC) Program Committee
    • Jan 1995 to  1997
      Representative
      ASME Electronic and Photonic Packaging Division WAM Program
    • Past to  Nov 1997
      Panel Moderator (Dallas, TX, United States)
      1997 ASME Intl Mech Engr Congress and Exposition
      Challenges in cooling, cost, manufacturing, and performance of Heat Sinks for Computer Systems