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Dereje Agonafer

Name

[Agonafer, Dereje]
  • Professor

Biography

Dr. Agonafer is the Jenkins Garrett Professor in Mechanical and Aerospace Engineering Department (first endowed chair in the history of the department). He heads two centers and is “Site Director of NSF IUCRC in Energy Efficient Systems” and Director of “Electronics, MEMS and Nanoelectronics Systems Packaging Center.” After receiving he joined IBM and in 1991, the value of his contribution to "Computer Aided Thermal Engineering" was recognized by being awarded the "IBM Outstanding Technical Achievement Award in Appreciation for Computer Aided Thermal Modeling.”  Since joining UTA in 1999, he has successfully advised over 140 graduate students and currently advises 12 PhDs and 32 MSc students. His recent focus has been on data center cooling as “Site Director of NSF IUCRC in Energy Efficient Systems” and 3D packaging/cooling (patents filed). Professor Agonafer serves on the Scientific Advisory Board of a NSF Center, Mid-Infrared Technologies for Health and the Environment (MIRTHE) at Princeton University since 2007. He also serves on advisory boards at Princeton, Colorado, Howard and CCNY. Professor Agonafer has published over 200 papers and 10 issued patents (with several pending), He is a Fellow of ASME and Fellow of The American Association for the Advancement of Science (AAAS).  Professor Agonafer has received numerous awards during his distinguished career including the 2008 Thermi Award for “Significant Contributor to the field of semiconductor thermal management”, and the 2009 InterPACK Excellence Award for leadership in electronic packaging. Professor Agonafer was at MIT as a Dr. Martin Luther King, Jr. Visiting Professor during the 2007 academic year. He has offered courses and given lectures and keynotes internationally including Chiba, Toyama, Puerto Rico, Singapore, Panang, Seoul, Taipei, Shanghai, Tokyo, Osaka, and Capetown, Tufts University, Northeastern University, MIT and Harvard. Professor Agonafer received the 2014 NSBE Golden Torch Award In May 2014, he received the ITHERM Achievement, an award first instituted in 1996, and presented biennially in recognition of significant contributions made in thermal and thermomechanical management of electronics. In 2015, he received over 2 million dollars of servers from Yahoo and Cisco to build his data center lab.

Professional Preparation

    • 1984 Ph.D. in Mechanical EngineeringHoward University
    • 1978 M.S. in Mechanical EngineeringHoward University

Appointments

    • Nov 2015 to Present Plenary Speaker, Certificate of Recognition
      ASME
    • Jan 1999 to Apr 2012 Jenkins Garrett Professor
      University of Texas at Arlington
    • Jan 1984 to Jan 1999 Director of (CATE)
      IBM

Memberships

  • Member
    • Aug 1992 to Present IEEE
  • Fellow
    • May 2006 to Present The American Association for the Advancement of Science (AAAS)
    • May 1995 to Present Member of American Society of Mechanical Engineers (ASME)
  • Lifetime Member
    • Mar 2014 to Present National Society of Black Engineers (NSBE)

Awards and Honors

    • Sep  2015 Opening Keynote Speaker, sponsored by International Microelectronics Assembly and Packaging Society (IMAPS)
      Achievements:

      In September 2015, Professor Agonafer gave an opening keynote seminar at International Microelectronics Assembly and Packaging Society (IMAPS), Los Gatos, California, entitled:  “Thermal and Mechanical Challenges in Data Center.”

      Award Details
    • Jun  2015 Servers from Yahoo Inc sponsored by Yahoo Inc
      Achievements:

      To support the data center effort that I started at UTA (in particular the data center we have built in NH 114&115. At Yahoo, we are excited to continue bolstering computer science in academia with our largest cumulative server donation ever. Yesterday, Yahoo Labs’ Academic Partnerships team and the Yahoo Data Center Operations group had the pleasure of delivering 480 servers to the University of Texas at Arlington (UTA). Combined with the 250 servers Yahoo donated to UTA in late 2012, the gift amounts to the most servers Yahoo has donated to any individual institution in our YSTAR (Yahoo Servers to Academic Researchers) program since its inception in 2010. The capabilities provided by the large clusters comprising these refurbished machines have enabled UTA faculty and grad students to perform more robust research with more computing power than ever before.

      120 of the previously donated servers are deployed in UTA’s Research Modular Data Center used for doing research related to maximizing the use of airside economization, direct and indirect evaporative cooling, direct-to-chip liquid cooling, sustainable water and energy utilization in the cooling of mission-critical facility environments, and more. The remaining previously donated servers are deployed in the on-campus Yahoo Research Data Center Room and make possible and support a variety of research and educational initiatives.

      Award Details
    • Apr  2015 CISCO sponsored by CISCO
      Achievements:

      In Spring 2015, Professor Agonafer received a million dollars’ worth of state of the art liquid cooled servers by Cisco to bolster his efforts in the area of liquid cooling of data centers. Agonafer will investigate liquid cooling, focusing specifically on leakage current related  to warm water cooling and reliability, such as assessing the impact of pump failures on systems. Liquid cooling is attractive to companies because it can be highly efficient and server rooms can occupy less space. According to Cisco’s Zheigami, “We put our findings out there not because of demand, but because we wanted to do the right thing. We decided that more work and research can be done, so we wanted to donate the equipment. Dereje has created a program that competes with a lot of Tier 1 engineering schools. This type of program attracts top-level students who are then trained in how things may be done in the future.”

    • Mar  2015 IBM Faculty Partnership Award sponsored by IBM CorporationUniversity of Texas at Arlington
      Achievements:

      Agonafer is an expert in energy efficiency through cooling of computer servers. One issue facing researchers is how to clean outside air of gaseous and particulate contaminants and especially when using airside economization which is a very energy efficient approach. Agonafer’s lab has taken a leadership role in working with IBM’s P.J. Singh, a world renowned expert in particulate and gaseous contamination, to learn the effects of contaminants on data center hardware, as well as how to mitigate the contaminants..

      In addition, Agonafer and his team have developed a strong relationship with IBM and published numerous papers with Dr. Roger Schmidt, an IBM Fellow.

      “Prof. Agonafer’s research in semiconductor thermal management and electronic packaging bridges the gap between academic research and industry needs. IBM’s superb recognition echoes his standing with Facebook, Microsoft, and CommScope.  His leadership of the NSF/University Cooperative Research Center in Energy Efficient Systems reflects his focus on the relevance of academic research and preparedness of our graduates,” said MAE Department Chair Erian Armanios.

      - See more at: https://www.uta.edu/engineering/news-events/news-archives/2015/03-agonafer-ibm-award.php#sthash.gfscXdti.L1o89Qn0.dpuf

      Award Details
    • May  2014 2014 iTherm Achievement Award sponsored by IEEE
      Achievements:

      The ITherm Achievement Award, first instituted in 1996, is presented biennially in recognition of significant contributions made in thermal and thermomechanical management of electronics. 

      Award Details
    • May  2014 iTherm 2014 Best Poster Award sponsored by IEEE
      Achievements:

      As a common practice in the data center industry, chassis fans are used to direct air flow independent from neighboring servers. In general, smaller fans are less efficient compared to geometrically similar larger fans. In this study, a novel approach is proposed whereby chassis enclosed fans are replaced with a smaller number of larger fans installed behind a stacked array of servers which share airflow. Comparing with the base line experiments, replacing smaller fans with larger units results in a significant decrease in fan power consumption without conceding flow rate and static pressure requirements.

      Award Details
    • Mar  2014 Golden Torch Legacy Award sponsored by National Society of Black Engineers (NSBE)
      Achievements:

      Professor Agonafer was selected as the 2014 NSBE Golden Torch Award honoree for Golden Torch Legacy Award and will be saluted at the “17th Annual Golden Torch Awards (GTA)” to be held on Saturday, March 29, 2014 in Nashville, TN. The award is the highest award given at the annual NSBE conference with a citation: “For selfless dedication and achievements, this award is given to an individual who has had an historical impact on the African-American community on a global basis. This individual has exhibited a spirit of determination and perseverance and has had to overcome and endure many challenges along the way. The honoree is chosen at a national level. Included in this award is a lifetime membership to the National Society of Black Engineers.”

      Award Details
    • May  2013 Dean's Centennial Award for Distinguished Engineering Scholarship and Service sponsored by Howard University School of Engineering, Archtecture and Computer Science
      Achievements:

      Professor Agonafer has had a long and sustained relationship with the CEACS. While a graduate student at Howard, he received the Howard University ASME Award,   "Instructor of the Year”, 1982-1983 and Howard University ASME Award,   "Most Outstanding Undergraduate Teacher", 1982-1983. The year he received his PhD, he was awarded the "ASME Most Outstanding Graduate Student", 1983-1984. Once he joined IBM, he continued his support of CEACS in many fronts. He was invited to join the school’s engineering Advisory Council in the early 90’s and served as Chair, Advisory Council, Howard University School of Engineering, April 1996-2000. In October 1999, he served on Howard University Chemical Engineering Master’s Level Program Review. Professor Agonafer has served and continues to serve on CEACS Board of Visitors since it’s incipience in Spring 2000 and continues to serve as the lone academician on the board and concentrates his efforts in providing guidance related to contemporary research challenges and opportunities. Professor Agonafer has been an active supporter of encouraging minority participation in engineering as evidenced by his service at his University as Co-Chair, LSAMP - Louis Stokes Alliance for Minority Participation (2005-Present), Chair, UTA NSBE Student Section (2004-Present), Chair, ASME Student Section (2003-Present), McNair Scholar Mentor (2003-Present). While at IBM, he spearheaded an effort to raise thousands of dollars for United College Negro College Fund and was awarded the United Negro College Meritorious Service Award", July 1987. Also at IBM, he chaired a "National Engineering Week" and the year he chaired the program, he was able to put together team of IBM engineers to reach over 10,000 K-12 students. Professor Agonafer has served as external advisor to a few MSc students in both Chemical and Mechanical Engineering departments at Howard. He has and continues to be a mentor to many African American Faculty including faculty members at Howard CEACS. In 1998, he received the Howard University Distinguished Ph.D. Alumni Award.

      Award Details
    • Jul  2012 Plenary Speaker, Certificate of Recognition sponsored by American Society of Mechanical Engineers (ASME)
      Achievements:

      Certificate of Recognition, Plenary Speaker, “Thermal Challenges in 3D Packaging,” ASME 10th International Conference on Nanochannels, Microchannels and Minichannels (ICNMM 2012), Puerto Rico, July 8 - 12, 2012.

       

    • Apr  2012 Jenkins Garrett Endowed Professor sponsored by University of Texas at Arlingtn
      Achievements:

      The award is given to a professor who earned distinction and recognition to the institution as a result of academic accomplishments. Jenkins Garrett Professors also have shown excellence in teaching, research and creative scholarship.

      "This distinction demonstrates  Prof. Agonafer's excellence in teaching, research and service as well as his exceptional personal attributes as a superb mentor to our students. We offer our congratulations to him," said department chair Dr. Erian Armanios.

       

      Award Details
    • Jul  2009 InterPACK Excellence Award sponsored by American Society of Mechanical Engineers (ASME)
      Achievements:

      Awardees are selected because they have demonstrated excellence and international recognition in the area of research and development related to electronic packaging, as well as service to the technical community at large.

      Previous winners of this award are Dr. Alan Kraus, Dr. Wataru Nakayama, Dr. Richard Chu, and Prof. Avi Bar-Cohen. Dr. William T. Chen, President of IEEE CPMT Society; and Senior Technical Advisor for ASE will also receive the award.

      InterPACK is an international forum for exchange of state-of-the art knowledge in research, development, manufacturing, and application on the packaging and integration of Electronic and Photonic Systems, MEMS (Micro Electo-Mechanical Systems), and NEMS(Nano-electro Mechanical Systems). This conference will be the 10th in the InterPACK series that began in 1993. It is the flagship technical meeting of the ASME Electronic and Photonic Packaging Division (EPPD), with the participation of JSME, IEEE-CPMT, and iNEMI.

      Award Details
    • Mar  2009 The THERMI award sponsored by IEEE
      Achievements:

      Each year, SEMI-THERM honors a person as a Significant Contributor to the field of semiconductor thermal management. The “THERMI” award is intended to recognize a recipient’s history of contributions to important thermal issues affecting the performance of semiconductor devices. SEMI-THERM is proud to award the 2008 “THERMI” award to Prof. Dereje Agonafer, University of Texas at Arlington, and Director of its Electronics, MEMS, and Nanoelectronics Systems Packaging Center. Past “THERMI” award recipients include: Robert Moffat, Bernie Siegal, Robert Simons, Gordon Ellison, Avi Bar-Cohen, Allan Kraus, Harvey Rosten, Richard Chu, Kaveh Azar, Clemens J.M. Lasance, Alfonso Ortega and Tom Tarter. 

      Award Details
    • Sep  2007 MIT MLK Visiting Professor 2007-2008 sponsored by MIT
      Achievements:

      Dereje Agonafer is a Professor and Director of Electronics, MEMS, and Nanoelectronics Systems Packaging Center at The University of Texas at Arlington. Research interests: multidisciplinary focus on thermo/mechanical issues in microelectronics, MEMS and nanoelectronics with broad applications including computers, telecommunications and bio-fluidics.

      Award Details
    • Nov  2002 ASME IMECE 2002 Achievement Award sponsored by ASME EPPD
      Achievements:

      For “Outstanding Contributions to the Area of the Application of the Science and Engineering of Heat Transfer to Electronic and Photonic Packaging”

       

    • Apr  1995 ASME Fellow sponsored by ASME
      Achievements:

      The ASME Committee of Past Presidents confers the Fellow grade of membership on worthy candidates to recognize their outstanding engineering achievements.

      Nominated by ASME Members and Fellows, an ASME Member has to have 10 or more years of active practice and at least 10 years of active corporate membership in ASME.

News Articles

    • Nov 1999 Achievements Stack Up
      Dereje Agonafer served as editor in chief of "Thermal Management of Microelectronic Equipment," the first book of a series addressing design and cooling in computer electronics
    • UTA Grad Students Get Grant To Make Facebook Faster
      ARLINGTON (CBSDFW.COM) – At the University of Texas at Arlington, where students often meet face to face to discuss an academic phenomenon, a group of students is working on a social phenomenon that’s aimed to change how we communicate. Details on the link. http://dfw.cbslocal.com/2011/11/23/uta-grad-students-get-grant-to-make-facebook-faster/
    • Thermal Challenges in 3D Packaging
      Plenary Speech: ASME 2012 10th International Conference on Nanochannels, Microchannels and Minichannels in Puerto Rico entitled
    • Cool solutions for hot problems - UT Arlington Inquiry Magazine (2012)
      Corporations like Facebook contain massive data centers that must remain cool to operate effectively. Mechanical and aerospace engineering Professor Dereje Agonafer explores how these facilities can become more energy efficient.
    • Agonafer receives electronic packaging award Achievement Award
      Agonafer receives electronic packaging award Achievement Award and presents keynote seminar, July 23, 2009, Westin St Francis Hotel, San Francisco, "Thermal Challenges in Electronics Systems: Devices to Systems."

Other Activities

    • Uncategorized
      • Awards & Honors

Publications

      Journal Article 2013
      • A. Free, D. Kehmeier, and D. Agonafer. "Driving PCA thermal analysis using IDF 4.0 data exchange," American Society of Mechanical Engineers, EEP, vol. 26, no. 2, pp. 2191-2197,.
        {Journal Article }

      Conference Paper 2010
      • A. Raghu, S. Karajgikar, D. Agonafer, B. Sammakia, and G. Refai-Ahmed. "Thermal Aware Power Migration in Many Core Processors," presented at IMECE, Vancouver, British Columbia, 2010.
        {Conference Paper }
      2010
      • V. N. P. Mynampati, F. A. I. Mariam, B. Muralidharan, A. R. Menon, D. Agonafer, and M. Hendrix. "Thermally based design optimization of telecommunication shelter," presented at IMECE, Vancouver, British Columbia, 2010.
        {Conference Paper }
      2010
      • V. N. P. Mynampati, S. Karajgikar, I. Sheerah, D. Agonafer, S. Novotny, and R. Schmidt. "Rear Door Heat Exchanger cooling performance in telecommunication data centers," presented at IMECE, Vancouver, British Columbia, 2010.
        {Conference Paper }
      2010
      • F. Mirza, B. Muralidharan, P. Mynampati, S. Karajgikar, and D. Agonafer. "Coupled Thermal and Structural Parametric Analysis of Through Silicon Vias in 3D Electronics," presented at IMECE, Vancouver, British Columbia, 2010.
        {Conference Paper }
      2010
      • B. Muralidharan, F. A. Mariam, V. N. P. Mynampati, and A. R. Menon. "CFD Modeling of Environmental System Options Used for Cooling of Telecommunication Shelters," presented at International Heat Transfer Conference, Wahington,D.C, 2010.
        {Conference Paper }
      2010
      • B. Muralidharan, F. A. Mariam, S. Karajgikar, D. Agonafer, and M. Hendrix. "Energy Minimization Based fan Configuration for Double Walled Telecommunication Cabinet with Solar Load," presented at Semi-Therm, Santa Clara, CA, 2010.
        {Conference Paper }

      Journal Article 2010
      • S. Karajgikar, D. Agonafer, K. Ghose, B. Sammakia, C. Amon, and G. Refai-Ahmed. "Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture," Journal of Electronic Packaging, vol. 132, no. 2, 2010.
        {Journal Article }
      2010
      • S. Karajgikar, S. Rao, J. Sin, D. Popa, J. C. Chiao, and D. Agonafer. "Electro-thermal Analysis of In-plane Micropump," IEEE Components and Packaging Technologies, vol. 33, no. 2, pp. 329-339, June 2010.
        {Journal Article }

      Conference Paper 2009
      • V. Mulay, D. Agonafer, and G. Irwin. "Cooling of Data Centers Using Airside Economizers," presented at ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK, San Francisco, CA, 2009.
        {Conference Paper }
      2009
      • V. Mulay, D. Agonafer, and G. Irwin. "Effective Thermal Management of Data Centers Using Efficient Cabinet Designs," presented at ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK, San Francisco, CA, 2009.
        {Conference Paper }
      2009
      • A. Tran, M. Avila, N. Dekeyser, M. Wang, T. Lam, S. Karajgikar, D. Agonafer, and G. Refai-Ahmed. "Novel Approaches for Extending Air Cooling Limits for Processors," presented at ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK, San Francisco, CA, 2009.
        {Conference Paper }
      2009
      • N. R. Lakhkar, A. Banerjee, S. Riaz, G. Refai-Ahmed, and D. Agonafer. "Multi-Objective Optimization of a Graphite Heat spreader for Portable systems applications," presented at ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK, San Francisco, CA, 2009.
        {Conference Paper }
      2009
      • A. Menon, N. Lakhakar, S. Karajgikar, and D. Agonafer. "Solder Joint Reliability of Package on Package," presented at ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK, San Francisco, CA, 2009.
        {Conference Paper }
      2009
      • S. Karajgikar, A. Menon, D. Agoanfer, and J. Zhang. "Optimization of Location of Power Cell For Energy Efficient Operation of Air Cool Drives," presented at ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK, San Francisco, CA, 2009.
        {Conference Paper }
      2009
      • S. Karajgikar, D. Agonafer, K. Ghose, B. Sammakia, and G. Refai-Ahmed. "Development of a Numerical Model for Non-uniformly Powered Die to Improve both Device Clock and Thermal Performance," presented at ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK, San Francisco, CA, 2009.
        {Conference Paper }
      2009
      • P. Mynampati, B. Muralidharan, F. Iqbal, and D. Agonafer. "Review of Reliability of Cooling Technologies in the Telecommunications System," presented at IMECE, Orlando,FL, 2009.
        {Conference Paper }
      2009
      • A. Tran, M. Avila, N. Dekeyser, M. Wang, T. Lam, S. Karajgikar, D. Agonafer, and G. Refai-Ahmed. "Novel Approaches for Extending Air Cooling Limits for Processors," presented at IMECE, Orlando,Fl, 2009.
        {Conference Paper }
      2009
      • F. Mariam, V. Mulay, S. Karajgikar, D. Agonafer, and A. Hendrix. "Thermal Management of Telecommunication Cabinets Using Thermoelectric Coolers," presented at IMECE, Orlando,FL, 2009.
        {Conference Paper }
      2009
      • V. Mulay, F. A. Mariam, D. Agonafer, G. Irwin, and D. Patell. "Optimized Chimney Designs for Effective Server Cabinets," presented at IMECE, Orlando,FL, 2009.
        {Conference Paper }
      2009
      • F. A. Iqbal, U. R. Mariam, D. A. Mulay, D. Sivanandan, and M. Hendrix. "Thermal Design Considerations of Air-Cooled High Powered Telecommunication Cabinets," presented at Semi-Therm, San Jose,CA, 2009.
        {Conference Paper }
      2009
      • R. Abhilash, S. K. Menon, and D. Agonafer. "Thermal Design Optimization of a Package on Package," presented at Semi-Therm, San Jose,CA, 2009.
        {Conference Paper }
      2009
      • B. Muralidharan, F. Iqbal-Ahmed, V. Mulay, D. Agonafer, and M. Hendrix. "Impact of double walled telecommunication cabinet on solar load - natural and forced convection," presented at ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK, San Francisco, CA, 2009.
        {Conference Paper }

      Journal Article 2009
      • A. Kaisare, D. Agonafer, A. Haji-Sheikh, G. Chrysler, and R. Mahajan. "Development of an analytical model to a temperature distribution of first level package with a non-uniformly powered die," Journal of Electronic Packaging, vol. 131, no. 1, 2009.
        {Journal Article }

      Conference Paper 2008
      • R. Uthaman, A. Kaisare, A. Haji-Sheikh, D. Agonafer, R. Mahajan, and G. Chrysler. "Multi-objective Optimization Entailing Computer Architecture and Thermal Design for Non-uniformly Powered Microprocessors," presented at ITHERM, Orlando,FL, 2008.
        {Conference Paper }
      2008
      • N. Lakhakar, M. Hossain, and D. Agonafer. "Rapid Thermo-cycling using Thermoelectric Device: Part I - Hot spot cooling," presented at ITHERM, Orlando,FL, 2008.
        {Conference Paper }
      2008
      • M. Mohammad, F. Z. Hossain, P. V. Lakhkar, S. O. Dunford, and D. Agonafer. "Reliability of Tin-Silver-Copper Lead-Free Solder Interconnects Under Mechanical Loading with Different PWB Surface Finishes," presented at SMTA, Orlando,FL, 2008.
        {Conference Paper }
      2008
      • V. Mulay, D. Agonafer, and R. Schmidt. "Liquid Cooling for Thermal Management of Data Centers," presented at International Mechanical Engineering Congress and Exposition, Boston,MA, 2008.
        {Conference Paper }
      2008
      • A. Trivedi, D. A. Sivanandan, M. Hendrix, and A. Sahrapour. "Compact Modeling of a Telecommunication Cabinet," presented at International Mechanical Engineering Congress and Exposition, Boston,MA, 2008.
        {Conference Paper }
      2008
      • D. Agonafer, A. Kaisare, V. Mulay, S. Karajgikar, and N. Lakhkar. "Thermomechanical Challenges in Electronic Packaging," presented at Semi-Therm, San Jose, CA, 2008.
        {Conference Paper }
      2008
      • R. Udakeri, V. Mulay, D. Agonafer, and R. Schmidt. "Comparison of Overhead Supply and Underfloor Supply with Rear Door Heat Exchanger in High Density Data Center Clusters," presented at Semi-Therm, San Jose, CA, 2008.
        {Conference Paper }
      2008
      • S. Karajgikar, V. Nagaraj, D. Agonafer, and S. Pekin. "Flip Chip Back End Design Parameters to Reduce Bump Electromigration," presented at 58th Electronic Component and Technology Conference, Orlando,FL, 2008.
        {Conference Paper }

      Journal Article 2008
      • M. M. Fasoro, D. A. A. Popa, and H. E. Stephanou. "Design for Reliability Applied to Packaging of a MOEMS Switch," ASME Journal of Electronic Packaging, September 2008.
        {Journal Article }
      2008
      • D. Agonafer, A. Kaisare, M. M. Hossain, Y. Lee, B. P. Dewan-Sandur, T. Dishongh, and S. Pekin. "Thermo-Mechanical challenges in stacked packaging," Heat Transfer Engineering, vol. 29, no. 2, pp. 134-148, 2008.
        {Journal Article }

      Conference Paper 2007
      • V. Mulay, S. Karajgikar, M. I. B. Iyengar, D. Agonafer, and R. Schmidt. "Computational study of hybrid cooling solution for thermal management of data centers," presented at ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK, 2007.
        {Conference Paper }
      2007
      • A. Kaisare, D. Agonafer, A. Haji-sheikh, G. I. N. Chrysler, and R. Mahajan. "Numerical model for design of non uniform powered microprocessors using multi-objective optimization based on both thermal and device clock performance," presented at ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK, 2007.
        {Conference Paper }
      2007
      • A. Trivedi, C. Tadepalli, A. Kaisare, D. Agonafer, and G. Refai-Ahmed. "Effect of weight of Heat Sink Assembly on Mechanical Reliability of a Wire Bonded Plastic Ball Grid Array package," presented at ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK, 2007.
        {Conference Paper }
      2007
      • R. Uthaman and D. Agonafer. "Static Power Consumption – Silicon On Insulator Metal Oxide Semiconductor Field Effect Transistor," presented at International Mechanical Engineering Congress and Exposition, 2007.
        {Conference Paper }
      2007
      • V. Mulay, S. Karajgikar, D. Agonafer, M. Iyengar, and R. Schmidt. "Parametric Study of Hybrid Cooling Solution for Thermal Management of Data Centers," presented at International Mechanical Engineering Congress and Exposition, 2007.
        {Conference Paper }
      2007
      • V. Nagaraj, S. Karajgikar, D. Agonafer, and S. Pekin. "Bump Electromigration and Back End Design Rules," presented at International Mechanical Engineering Congress and Exposition, 2007.
        {Conference Paper }
      2007
      • A. Kaisare, D. Agonafer, A. Haji-Sheikh, G. Chrysler, and R. Mahajan. "Analytical Approach To Temperature Distribution Of A First Level Package With A Non-Uniformly Powered Die," presented at International Mechanical Engineering Congress and Exposition, 2007.
        {Conference Paper }
      2007
      • N. L. Banerjee, D. A. Riaz, and G. Refai-Ahmed. "Multi-Objective parametization of graphite heat spreaders for portable systems applications," presented at International Mechanical Engineering Congress and Exposition, 2007.
        {Conference Paper }
      2007
      • S. Paruchuri, J. Sin, M. Graff, and D. Agonafer. "Flexible PDMS Chip with Embedded In-plane Valves for Microfluidic Manipulations," presented at 5th International Conference on Nanochannels, Microchannels and Minichannels, Puebla, Mexico, 2007.
        {Conference Paper }
      2007
      • A. Fasoro, P. Pandojirao, W. H. Lee, D. Popa, H. Stephanou, and D. Agonafer. "die and wafer-level hermetic for MEMS applications," presented at ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK, 2007.
        {Conference Paper }
      2007
      • N. Lakhkar, M. Hossain, V. Puligandla, and D. Agonafer. "Mechanical characterization of lead SAC lead free solder with gold addition under tensile loading," presented at ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK, 2007.
        {Conference Paper }
      2007
      • A. Trivedi, N. Lakhkar, D. Agonafer, M. Iyengar, M. J. Ellsworth, and R. Schmidt. "Experimental and Computational Characterization of a Heat sink Tester," presented at ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK, 2007.
        {Conference Paper }
      2007
      • N. Lakhkar, A. Fasoro, A. Patil, W. H. Lee, D. Popa, H. Stephanou, and D. Agonafer. "Process development and die shear testing in MOEMS packaging," presented at ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK, 2007.
        {Conference Paper }

      Journal Article 2007
      • M. M. Hossain, D. A. Jagarkal, M. Lulu, and S. Reh. "Design Optimization and Reliability of PWB Level Electronic Package," Journal of Electronic Packaging, vol. 129, no. 1, pp. 9-18, 2007.
        {Journal Article }

      Conference Paper 2006
      • S. Bhopte, M. I. Sammakia, R. Schmidt, and D. Agonafer. "Effect of Under-Floor Blockages on Data Center Performance," presented at ITHERM, San Diego, CA, 2006.
        {Conference Paper }
      2006
      • A. Kaisare, A. H. S. Agonafer, R. Mahajan, and G. Chrysler. "Analytical approach to temperature distribution of a first level package with a non-uniformly powered processor," presented at ITHERM, San Diego, CA, 2006.
        {Conference Paper }
      2006
      • S. Bhopte, B. S. Iyengar, R. Schmidt, and D. Agonafer. "Effect of Under Floor Parameters on Data Center Performance," presented at Honorary Symposium for Dr. Suhas V. Patankar, International Mechanical Engineering Congress and Exposition, Chicago,IL, 2006.
        {Conference Paper }
      2006
      • S. Bhopte, K. Madhusudan, B. S. Iyengar, R. Schmidt, and D. Agonafer. "Numerical Modeling of Data Center Clusters – Impact of Model Complexity," presented at Honorary Symposium for Dr. Suhas V. Patankar, International Mechanical Engineering Congress and Exposition, Chicago,IL, 2006.
        {Conference Paper }
      2006
      • B. Sung, C. Krishna, V. Teja, D. A. Lee, D. Agonafer, and C. Amon. "Thermal Enhancement of Stacked Dies Using Thermal Vias," presented at .” International Mechanical Engineering Congress and Exposition, Chicago,IL, 2006.
        {Conference Paper }
      2006
      • M. Hossain, V. P. Agonafer, and T. Reinikainen. "Deformation Characteristics and Constitutive Relationship of SnAgCu Lead Free Solder Alloys under Thermo-mechanical and Mechanical Loading," presented at .” International Mechanical Engineering Congress and Exposition, Chicago,IL, 2006.
        {Conference Paper }
      2006
      • A. Kaisare, A. H. S. Agonafer, G. Chrysler, and R. Mahajan. "Approximate Analytical Model for a First Level Package with Non-Uniformly Powered Die," presented at International Mechanical Engineering Congress and Exposition, Chicago,IL, 2006.
        {Conference Paper }
      2006
      • A. Kaisare, A. H. S. Agonafer, R. Mahajan, and G. Chrysler. "Design Rule For Minimizing Thermal Resistance In A Non–uniformly Powered Microprocessor," presented at Semi-Therm, Dallas TX, 2006.
        {Conference Paper }
      2006
      • M. M. Hossain, R. A. Lee, S. P. Agonafer, and T. Dishongh. "Reliability of Stack Packaging Varying the Die Stacking Architectures for Flash Memory Applications," presented at Semi-Therm, Dallas TX, 2006.
        {Conference Paper }
      2006
      • B. Borovic, L. Frank, H. Lewis, and D. Agonafer. "Robust Multiphysics FEA Methodology for Extracting a Reduced-Order Model of MEMS Thermal Actuators," presented at ECTC, San Diego,CA, 2006.
        {Conference Paper }
      2006
      • A. Kole, W. H. L. Sin, D. A. Popa, and H. Stephanou. "Design of Polymer Tube Embedded In-Plane Micropump," presented at ITHERM, San Diego, CA, 2006.
        {Conference Paper }
      2006
      • V. Bedekar, D. A. Karajgikar, M. Iyengar, and R. Schmidt. "Effect of Crac Location on Fixed Rack Layout," presented at ITHERM, San Diego, CA, 2006.
        {Conference Paper }
      2006
      • A. Abiodun, D. O. P. Fasoro, J. S. Beardsley, H. E. S. Agonafer, and M. A. Deeds. "Fluxless Optical Fiber Attachment for Hermetic MOEMS Applications," presented at ITHERM, San Diego, CA, 2006.
        {Conference Paper }
      2006
      • M. M. Hossain, R. A. Lee, S. P. Agonafer, and T. Dishongh. "Solder Joint Fatigue Life Predictions varying the Die Stacking Architectures for Flash Memory Applications," presented at ITHERM, San Diego, CA, 2006.
        {Conference Paper }
      2006
      • M. M. F. Hossain, D. A. Zahedi, T. R. Puligandla, and S. Dunford. "Reliability of lead free SAC solder interconnects under mechanical loading with different PWB surface finishes," presented at ITHERM, San Diego, CA, 2006.
        {Conference Paper }
      2006
      • B. P. D. Sandur, D. A. Kaisare, U. S. A. Texas-Arlington, C. A. Agonafer, C. M. University, and T. Dishongh. "Thermal Management of Stacked Die that Includes Memory and Logic Processors," presented at ITHERM, San Diego, CA, 2006.
        {Conference Paper }

      Journal Article 2006
      • D. A. Bhopte, R. Schmidt, and B. Sammakia. "Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature," Journal of Electronic Packaging, Transactions of the ASME, vol. 128, no. 4, pp. 380-387, 2006.
        {Journal Article }

      Conference Paper 2005
      • N. R. Lakhkar, M. Iyengar, J. Ellsworth, and D. Agonafer. "Design of a cold plate tester for accurate measurement of thermal performance," presented at IMECE- 81553 International Mechanical Engineering Congress and Exposition-05, Orlando, FL, November 11, 2005.
        {Conference Paper }
      2005
      • A. Kole, J. Sin, W. H. Lee, D. Popa, D. Agonafer, and H. Stephanou. "Polymer tube embedded in-plane micropump: design, analysis and fabrication," presented at IMECE-05, Orlando, FL, November 5, 2005.
        {Conference Paper }
      2005
      • R. Akhter, B. P. D. Sandur, M. Hossain, A. Kaisare, and D. Agonafer. "Design for Stackability of Flash Memory Devices Based on Thermal Optimization," presented at 24th Digital Avionics Systems Conference, Washington, D.C., October 30, 2005.
        {Conference Paper }
      2005
      • A. Kole, J. Sin, W. H. Lee, D. Popa, and D. Agonafer. "Polymer Tube Embedded In-Plane Micropump for Low Flow Rate," presented at 24th Digital Avionics Systems Conference, Washington, D.C., November 3, 2005.
        {Conference Paper }
      2005
      • S. Bhopte, D. Agonafer, R. Schmidt, and B. Sammakia. "Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature," presented at InterPACK-05 Conference, San Francisco, CA, July 17, 2005.
        {Conference Paper }
      2005
      • S. Karajgikar, W. Ahn, and D. Agonafer. "Effect of Continuous and Discontinuous Fabrication and Reflow Process on PWB Warpage," presented at InterPACK-05 Conference, San Francisco, CA, July 17, 2005.
        {Conference Paper }
      2005
      • A. Kaisare, D. Agonafer, A. Haji-Sheikh, G. Chrysler, and R. Mahajan. "Thermal Based Optimization of Functional Block Distributions in a Non-Uniformly Powered Die," presented at InterPACK-05, San Francisco, CA, July 17, 2005.
        {Conference Paper }
      2005
      • M. Hossain, D. Agonafer, V. Puligandla, and T. Reinikainen. "Lead-Free and Sn/Pb Solders Alloy Behavior under Cyclic Bending," presented at InterPACK-05, San Francisco, CA, July 17, 2005.
        {Conference Paper }

      Journal Article 2005
      • V. Mulay, A. Kulkarni, D. Agonafer, and R. Schmidt. "Effect of the location and the properties of thermostatic expansion valve sensor bulb on the stability of a refrigeration system," Journal of Heat Transfer, vol. 127, no. 1, pp. 85-94, January 2005.
        {Journal Article }
      2005
      • C. Amon and D. Agonafer. "Foreword: Special issue on electronic cooling," Journal of Heat Transfer, vol. 127, no. 1, pp. 1, January 2005.
        {Journal Article }
      2005
      • F. L. L. Borovic, E. S. K. Agonafer, and D. O. P. Hossain. "Method for Determining a Dynamical State Space Model for Control of Thermal MEMS Devices," Journal of Microelectromechanical Systems, vol. 14, no. 5, November 2005.
        {Journal Article }
      2005
      • G. Refai-Ahmed and D. Agonafer. "Thermal Road map for Telecom Equipment," ASHRAE Transactions, vol. 111, no. 1, pp. 913-920, 2005.
        {Journal Article }
      2005
      • S. Karajgikar, N. Lakhkar, D. Agonafer, and R. Schmidt. "Impact of area contact between sensor bulb and evaporator return line on modular refrigeration unit: Computational and experimental," Journal of Heat Transfer, vol. 127, no. 1, pp. 95-100, January 2005.
        {Journal Article }

      Conference Paper 2004
      • A. S. Halvi, W. Ahn, D. Agonafer, and S. Novotny. "Simulation of PWB warpage during fabrication and due to reflow," presented at Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, v 2, ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2004.
        {Conference Paper }
      2004
      • S. Karajgikar, N. Lakhkar, D. Agonafer, and R. Schmidt. "Impact of area contact between sensor bulb and evaporator return line on MRU - Part II, experimental work," presented at Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, v 1, ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2004.
        {Conference Paper }
      2004
      • D. Agonafer, J. Markell, B. Sammakia, and G. Lehmann. "Numerical investigation of enclosure effects on spot cooling devices," presented at Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, v 1, ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2004.
        {Conference Paper }
      2004
      • M. M. Hossain, D. Agonafer, P. Viswanadham, and T. Reinikainen. "Strain based approach for predicting the solder joint fatigue life with the addition of intermetallic compound using finite element modeling," presented at Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, v 2, ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2004.
        {Conference Paper }
      2004
      • S. G. Jagarkal, M. M. Hossain, D. Agonafer, M. Lulu, and S. Reh. "Design optimization and reliability of PWB level electronic package," presented at Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, v 2, ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2004.
        {Conference Paper }
      2004
      • B. Borovic, F. L. Lewis, M. M. Hossain, D. Agonafer, and E. S. Kolesar. "Experimentally verified procedure for determining dynamical model of the ETM MEMS structures," presented at Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, v 2, ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2004.
        {Conference Paper }

      Journal Article 2004
      • S. Bhopte, M. S. Alshuqairi, D. Agonafer, and G. Refai-Ahmed. "Mixed convection of impinging air cooling over heat sink in telecom system application," Transactions of the ASME, vol. 126, no. 4, December 2004.
        {Journal Article }
      2004
      • W. Ahn, D. Agonafer, and S. Novotny. "Methodology for an integrated (electrical/mechanical) design of PWBA," Journal of Electronic Packaging, Transactions of the ASME, vol. 126, no. 4, December 2004.
        {Journal Article }
      2004
      • Y. Makwana, D. Agonafer, and D. Manole. "Impact of TXV and compressor in the stability of a high-end computer refrigeration system," Journal of Electronic Packaging, Transactions of the ASME, vol. 126, no. 4, December 2004.
        {Journal Article }
      2004
      • B. Sammakia and D. Agonafer. "Journal of Electronic Packaging, Transactions of the ASME: Foreword," Journal of Electronic Packaging, Transactions of the ASME, vol. 126, no. 4, December 2004.
        {Journal Article }
      2004
      • D. Agonafer, J. Ibarra, K. McGee, F. Platt, K. Harris, and D. Agonafer. "Heat pipe optimization team the heat pipe assisted heat sink project," Innovations in Engineering Education 2004: Mechanical Engineering Education, Mechanical Engineering Technology Department Heads, Innovations in Engineering Education 2004:Mechanical Engineering Education, Mechanical Engineering Technology Department Heads, pp. 363-372, 2004.
        {Journal Article }
      2004
      • S. Kuravi and D. Agonafer. "Validation of ASHRAE equation to find evaporation rates in humid cavity," American Society of Mechanical Engineers, Heat Transfer Division, vol. 375, no. 2, pp. 109-116, 2004.
        {Journal Article }
      2004
      • L. Xu, T. Reinikainen, W. Ren, B. P. Wang, Z. Han, and D. Agonafer. "A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending," Microelectronics Reliability, vol. 44, no. 12, pp. 1977-1983, December 2004.
        {Journal Article }

      Journal Article 2003
      • A. Kulkarni, D. Agonafer, S. Groothuis, H. Kabir, and S. Johnson. "Package and board level study for a thin small outline package (TSOP) using compact components," Advances in Electronic Packaging, v 2, Advances in Electronic Packaging 2003, vol. 2, pp. 867-873, 2003.
        {Journal Article }
      2003
      • V. Mulay, D. Agonafer, and R. Schmidt. "Effect of the thermostatic expansion valve characteristics on the stability of a refrigeration system," American Society of Mechanical Engineers, Heat Transfer Division, vol. 374, no. 2, 2003.
        {Journal Article }
      2003
      • A. G. A. Nnanna, A. Haji-Sheikh, and D. Agonafer. "Effect of variable heat transfer coefficient, fin geometry, and curvature on the thermal performance of extended surfaces," Journal of Electronic Packaging, Transactions of the ASME, vol. 125, no. 3, pp. 456-460, September 2003.
        {Journal Article }
      2003
      • A. Haji-Sheikh, J. V. Beck, and D. Agonafer. "Steady-state heat conduction in multi-layer bodies," International Journal of Heat and Mass Transfer, vol. 46, no. 13, June 2003.
        {Journal Article }
      2003
      • W. Ahn, D. Agonafer, and S. Novotny. "The Impact of Board Layout and Layup on PWB Warpage during fabrication and due to Reflow Solder Process: A Review of Literature," Advances in Electronic Packaging, v 1, Advances in Electronic Packaging, vol. 1, pp. 863-877, 2003.
        {Journal Article }
      2003
      • S. Gagarin, D. Agonafer, C. Beady, and L. Stahl. "A hybrid methodology for the optimization of data center room layout," Advances in Electronic Packaging, v 2, Advances in Electronic Packaging, vol. 2, pp. 605-612, 2003.
        {Journal Article }
      2003
      • A. Kulkarni, D. Agonafer, and R. Schmidt. "Effect of the thermostatic expansion valve characteristics on the stability of a refrigeration system - Part II," Advances in Electronic Packaging, v 2, Advances in Electronic Packaging 2003, vol. 2, pp. 613-619, 2003.
        {Journal Article }

      Conference Paper 2003
      • Y. Makwana, D. Agonafer, and D. Manole. "Performance of a Masterflux Compressor in a Refrigeration Unit For High End Computer System Application," presented at American Society of Mechanical Engineers, EEP, v 3, Electronic and Photonic Packing, Electrical Systems and Photonic Design, and Nanotechnology, 2003.
        {Conference Paper }
      2003
      • N. Lakhkar, S. Karajgikar, D. Agonafer, and R. Schmidt. "The impact of Area Contact Between Sensor Bulb and Evaporator Return Line in a Modular Refrigeration Unit - Part I, Computational Study," presented at American Society of Mechanical Engineers, EEP, v 3, Electronic and Photonic Packing, Electrical Systems and Photonic Design, and Nanotechnology, 2003.
        {Conference Paper }
      2003
      • S. Novotny, W. Ahn, and D. Agonafer. "A Methodology for an Integrated (Electrical/Mechanical) Design of PWBA," presented at American Society of Mechanical Engineers, EEP, v 3, Electronic and Photonic Packing, Electrical Systems and Photonic Design, and Nanotechnology, 2003.
        {Conference Paper }
      2003
      • M. S. Alshuqairi, G. Refai-Ahmed, and D. Agonafer. "Mixed Convection of Impinging Air Cooling over Heat Sink in Telecom System Application," presented at American Society of Mechanical Engineers, EEP, v 3, Electronic and Photonic Packing, Electrical Systems and Photonic Design, and Nanotechnology, 2003.
        {Conference Paper }
      2003
      • M. M. Hossain, D. Agonafer, P. Viswanadham, and T. Reinikainen. "The effect of intermetallic compound in solder joint fatigue life prediction using finite element modeling," presented at Advances in Electronic Packaging, v 1, Advances in Electronic Packaging, 2003.
        {Conference Paper }

      Conference Paper 2002
      • A. G. Agwu-Nnanna, A. Haji-Sheikh, and D. Agonafer. "Effects of variable heat transfer coefficient, fin geometry, and curvature on the thermal performance of extended surfaces," presented at Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, 2002.
        {Conference Paper }
      2002
      • A. Kulkarni, V. Mulay, D. Agonafer, and R. Schmidt. "Effect of the thermostatic expansion valve characteristics on the stability of a refrigeration system - Part I," presented at Thermomechanical Phenomena in Electronic Systems -Proceedings of The Intersociety Conference, 2002.
        {Conference Paper }
      2002
      • A. Kaisare, Z. Han, D. Agonafer, and K. Ramakrishna. "Prediction of effect of heat sink adhesive on mechanical reliability of a wire bonded plastic ball grid array package," presented at Thermomechanical Phenomena in Electronic Systems - Intersociety Conference, 2002.
        {Conference Paper }

      Journal Article 2002
      • D. Agonafer. "Foreword," Thermal Management of Microelectronic Equipment, pp. xxiii, 2002.
        {Journal Article }

      Journal Article 2001
      • A. G. Nnanna, D. Agonafer, and M. T. North. "Optimization of heat pipe spacing in heat sinks: A computational fluid dynamics study," Advances in Electronic Packaging, v 3, Advances in Electronic Packaging; Manufacturing, Microelectronics Systems and Exploratory Topics, Optoelectronics and Photonic Packaging, pp. 1763-1768, 2001.
        {Journal Article }
      2001
      • Z. Han and D. Agonafer. "Numerical studies on chimney-enhanced natural convection," Advances in Electronic Packaging, v 3, Advances in Electronic Packaging; Manufacturing, Microelectronics Systems and Exploratory Topics, Optoelectronics and Photonic Packaging, pp. 1769-1774, 2001.
        {Journal Article }
      2001
      • Z. Han and D. Agonafer. "Numerical simulations of the natural convective heat transfer inside an electronic device," Advances in Electronic Packaging, v 3, Advances in Electronic Packaging; Manufacturing, Microelectronics Systems and Exploratory Topics, Optoelectronics and Photonic Packaging, pp. 1775-1780, 2001.
        {Journal Article }
      2001
      • A. D. Kaisare, D. Agonafer, and P. Lam. "A three dimensional thermo-mechanical analysis of a BGA package," Advances in Electronic Packaging, v 3, Advances in Electronic Packaging; Manufacturing, Microelectronics Systems and Exploratory Topics, Optoelectronics and Photonic Packaging, pp. 1781-1785, 2001.
        {Journal Article }
      2001
      • D. Agonafer. "Message from the: Electronics and Photonics Packaging Division Chair," Advances in Electronic Packaging, vol. 1, pp. ii, 2001.
        {Journal Article }
      2001
      • D. Agonafer. "Message from the Electronics and Photonics Packaging Division Chair," Advances in Electronic Packaging, vol. 2, pp. ii, 2001.
        {Journal Article }
      2001
      • D. Agonafer. "Message from the Electronics and Photonics Packaging Division Chair," Advances in Electronic Packaging, vol. 3, pp. ii, 2001.
        {Journal Article }
      2001
      • D. Agonafer, Z. X. Han, and R. Schmidt. "Numerical prediction of the thermal resistance of cold plate," Advances in Electronic Packaging; Thermal Management Reliability, vol. 2, pp. 983-987, 2001.
        {Journal Article }

      Conference Paper 1999
      • D. Agonafer. "Advances in Electronic Packaging," presented at Pacific Rim/Asme International Intersociety Electronic & Photonic Packaging Conference, 1999.
        {Conference Paper }

      Journal Article 1998
      • A. M. Khounsary, J. R. Mondt, T. Simon, D. Agonafer, D. P. DeWitt, R. S. Figliola, W. L. Grosshandler, and F. Kreith. "Heat transfer education: Keeping it relevant and vibrant," American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, v 361-3, Heat Transfer Division - 3, pp. 17-23, 1998.
        {Journal Article }

      Conference Paper 1997
      • D. Agonafer. "Cae/CAD and Thermal Management Issues in Electronic Systems," presented at 1997 Asme International Mechanical Engineering Congress and Exposition, Dallas, Texas, November 16, 1997.
        {Conference Paper }

      Journal Article 1997
      • D. Agonafer and A. Vimba. "Solid model based preprocessor to CFD code for applications to electronic cooling systems," Journal of Electronic Packaging, Transactions of the ASME, vol. 119, no. 2, pp. 138-143, 1997.
        {Journal Article }

      Conference Paper 1996
      • D. Agonafer, R. E. Fulton, and G. Kowalski. "Application of CAE/CAD to Electronic Systems," presented at 1996 ASME International Mechanical Engineering Congress and Exposition, 1996.
        {Conference Paper }

      Journal Article 1996
      • D. Agonafer, L. Gan-Li, and D. B. Spalding. "LVEL turbulence model for conjugate heat transfer at low Reynolds numbers," American Society of Mechanical Engineers, EEP, v 18, Application of CAE/CAD to Electronic Systems, pp. 23-26, 1996.
        {Journal Article }

      Conference Paper 1995
      • C. H. Amon, R. Fulton, J. Humphrey, D. Agonafer, A. Ghajar, and G. Kowalski. "Cooling and Thermal Design of Electronic Systems," presented at 1995 ASME International Mechanical Engineering Congress and Exposition, 1995.
        {Conference Paper }
      1995
      • D. Agonafer, S. H. Bhavnani, and J. S. Fitch. "IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A," presented at 4th Intersociety Conference on Thermal and Thermo Mechanical Phenomena in Electronic Systems, 1995.
        {Conference Paper }

      Journal Article 1995
      • D. Agonafer and J. A. Free. "Numerical modeling of an entire Thermal Conduction Module using a thermal coupling methodology," American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, v 319, Cooling and Thermal Design of Electronic Systems, pp. 195-200, 1995.
        {Journal Article }
      1995
      • R. L. Linton and D. Agonafer. "Coarse and detailed CFD modeling of a finned heat sink," IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A, vol. 18, no. 3, pp. 517-520, September 1995.
        {Journal Article }

      Journal Article 1994
      • “Coarse and detailed CFD modeling of a finned heat sink”, Linton, Ronald L. (Risc System); Agonafer, Dereje, Proceedings of the Intersociety Conference on Thermal Phenomena in Electronic Systems,  Concurrent Engineering and Thermal Phenomena, 1994, p 156-162
        {Journal Article }
      1994
      • “Solution of a system-level benchmark problem in electronics cooling”, Linton, Ronald L; Agonafer, Dereje ,American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, v 292, Heat Transfer in Electronic Systems, 1994, p 49-54
        {Journal Article }
      1994
      • “Multi-scale thermal analysis of electronics packaging”, Przekwas, A.J. Lai, Y.G.; Agonafer, D., American Society of Mechanical Engineers, EEP, v 9, CAE/CAD Application to Electronic Packaging, 1994, p 7-14
        {Journal Article }
      1994
      • Proceedings of the 1994 International Mechanical Engineering Congress and Exposition, Agonafer, D.; Fulton, R.E. eds., American Society of Mechanical Engineers, EEP, v 9, CAE/CAD Application to Electronic Packaging,1994, 88p
        {Journal Article }
      1994
      • Proceedings of the 1994 International Mechanical Engineering Congress and Exposition, Wirtz, R.A.; Agonafer, D.; Amon, C.H.; Lee, S.; Yeh, L.-T. eds., American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, v 292, Heat Transfer in Electronic Systems, 1994, 152p
        {Journal Article }

      Journal Article 1993
      • “Benchmark problems for system-level electronics cooling”, Linton, Ronald L.; Agonafer, D., American Society of Mechanical Engineers, Heat Transfer Division,(Publication) HTD, v 255, Solutions to CFD Benchmark Problems in Electronic Packaging, 1993, p 37-43
        {Journal Article }
      1993
      • “Solutions to CFD Benchmark Problems in Electronic Packaging”, Agonafer, Dereje; Amon, Cristina eds., American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, v 255, Solutions to CFD Benchmark Problems in Electronic Packaging, 1993, 56p
        {Journal Article }
      1993
      • “Numerical model of the heat transport phenomena in the entrance region of a heated channel”, Green, Mary C; Agonafer, Dereje; Lehmann, Gary L., American Society of Mechanical Engineers (Paper), 1993, 93-WA/EEP-25, p 1-11
        {Journal Article }
      1993
      • “Application of the integrated volume visualization system (IVS) to electronic cooling”, Koyamada, Koji; Agonafer, D., American Society of Mechanical Engineers, EEP, v 4-2, Advances in Electronic Packaging, 1993, p 735-743
        {Journal Article }

      Journal Article 1992
      • “Computer Aided Design in Electronic Packaging”, Agonafer, Dereje; Fulton, Robert E. eds., American Society of Mechanical Engineers, EEP, v 3, Computer Aided Design in Electronic Packaging, 1992, 83p
        {Journal Article }
      1992
      • “Integrated (electrical/mechanical) design methodology for modeling of electronic cooling systems”, Agonafer, D.; Kugel, L., American Society of Mechanical Engineers, EEP, v 3, Computer Aided Design in Electronic Packaging, 1992, p 1-7
        {Journal Article }

      Journal Article 1991
      • “Heat Transfer in Electronic Equipment – 1991”,Ortega, A.; Agonafer, D.; Webb, B.W. eds., American Society of Mechanical Engineers, Heat Transfer Division,(Publication) HTD, v 171, Heat Transfer in Electronic Equipment - 1991, 143p
        {Journal Article }
      1991
      • “Solid model (CATIA) based pre-processor to CFD code for applications to electronic cooling systems”, Agonafer, D; Vimba, A., American Society of Mechanical Engineers (Paper), 1991, 91-WA-EEP-45, p 1-8
        {Journal Article }

      Conference Paper 1990
      • “Numerical and experimental investigation of heat transfer phenomena over an electronic module”, Agonafer, D., Furkay, S., Proceedings - IEEE Semiconductor Thermal and Temperature Measurement Symposium, 1990, p 103
        {Conference Paper }

      Journal Article 1990
      • “Numerical methodology for analysis of card on board packages”, Agonafer, D.; Chu, R.C., American Society of Mechanical Engineers (Paper), 1990, 90-WA/EEP-42, 6p
        {Journal Article }

      Journal Article 1989
      • “Thermal model of a PC”, Linton, R.L. (IBM Corp); Agonafer, D., American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, v 121, 1989, p 69-72
        {Journal Article }
      1989
      • “Numerical Simulation of Convection in Electronic Equipment Cooling: Presented at the Winter Annual Meeting of the ASME”, Ortega, Alfonso; Agonafer, Dereje eds., American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, v 121, 1989, 72p
        {Journal Article }
      1989
      • “Numerical modeling of forced convection heat transfer for modules mounted on circuit boards”, Agonafer, D.; Moffatt, D.F., American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, v 121, 1989, p 1-5
        {Journal Article }

      Journal Article 1988
      • “Prediction of natural convection in horizontal annular enclosures at high Rayleigh numbers”, Thornhill, Ashley M.; Glakpe, E. Kobla; Agonafer, Dereje, International Communications in Heat and Mass Transfer, v 15,n 6, Nov-Dec, 1988, p 785-797
        {Journal Article }
      1988
      • “Numerical and experimental investigation of heat transfer phenomena over an electronic module”, Agonafer, D.; Furkay, S., Intersoc Conf Therm Phenom Fabr Oper Electron Compon, 1988, p 85
        {Journal Article }

      Journal Article 1987
      • “Unsteady Buoyancy Induced Flow In An Enclosure”, Coleman, Michael; Sammakia, Bahgat G.; Agonafer, Dereje, American Society of Mechanical Engineers (Paper),1987, 87-WA/EEP-10, 10p
        {Journal Article }

      Journal Article 1986
      • “Optimization Trade-off Analyses On A Thermal Conduction Module Package Using CAEDS”, Agonafer, D.; Simons, R. E., American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, v 57, 1986, p 231-237
        {Journal Article }

      Journal Article 1985
      • “Computation Of Steady Flow In A Two-Dimensional Arterial Model”, Agonafer, D.; Watkins, C. B.; Cannon, J. N., Journal of Biomechanics, v 18, n 9, 1985, p 695-701
        {Journal Article }

      Journal Article 1984
      • “Numerical Solution Of Natural Convection Between Diverging Plates”, Agonafer, D.; Watkins, C. B., American Society of Mechanical Engineers (Paper), 1984, 84-WA/HT-32, 7pn
        {Journal Article }

Presentations

    • December  2013
      An Integrated Design Approach for Cooling of Electronic Packaging
      Invited Lecture,  Carnegie Mellon University, Pittsburgh, PA
    • December  2013
      Application of Computational Fluid Mechanics to Electronic Cooling
      City College of New York, Graduate Student Seminar
    • December  2013
      Computer Aided Thermal Engineering
      Presented at a Graduate Student Seminar,  Georgia Tech, Atlanta, Ga.
    • October  2013
      Application of Computational Techniques to Electronic Packaging
      Rutgers University
    • September  2013
      Electronic Packaging
      Invited Guest Lecture to UTA College of Engineering Mid-Cities Technical Club
    • September  2013
      Numerical Modeling of the Internal and External Resistance of a TCM
      Seminar Presentation, West Point, NY.
    • July  2013
      The Role of Engineers in an Industrial Setting
      Howard University, Washington, D.C.
    • May  2013
      Computational Fluid Mechanics Applications for High End Systems
      Applied Mathematics Department, SUNY, New Paltz, NY.
    • April  2013
      Application of Computational Techniques to Electronic Packaging
      Invited Lecture, University of Texas, Arlington
    • April  2013
      Computer Aided Thermal Engineering
      Invited Lecture, University of Colorado,  Boulder, Colorado
    • April  2013
      Application of Finite Element Modeling to Cooling of Electronic Packaging
      Invited Lecture, Penn State University, Harrisburg
    • April  2013
      A Concurrent Engineering Based CFD Modeling Methodology For Computer Packaging Applications
      Invited Lecture, Penn State University, College Park
    • April  2013
      Application of Computational Techniques to Electronic Packaging
      Cornell University
    • April  2013
      Applications of PHOENICS to Electronic Cooling
      Stevens Institute of Technology
    • March  2013
      An Integrated Thermo/Mechanical Modeling Approach
      University of Rhode Island, Graduate Student Seminar
    • February  2013
      “Packaging of MEMS”
      Invited Presentation to Denso International Ltd
    • February  2013
      The Use of Computational Algorithms In The Design Of Electronic Thermal Control Systems
      Short Course, University of Nevada, Reno
    • February  2013
      Computational Fluid Mechanics Applications for High End Systems
      Alabama A&M University
    • January  2013
      Mathematical Modeling in an Industrial Setting
      Mathematical Modeling of Materials Processing Operations, Winter Symposium, Massachusetts Institute of Technology
    • January  2009
      Interpack, July 23, 2009, Westin St Francis Hotel, San Francisco
      Agonafer receives electronic packaging award Achievement Award and presents keynote seminar, July 23, 2009, Westin St Francis Hotel, San Francisco, "Thermal Challenges in Electronics Systems: Devices to Systems." http://www.uta.edu/ucomm/internalcommunications/mavwire/2009/jul29.php
    • January  2008
      Harvard University
      Invited Harvard School of Engineering and Applied Sciences, Harvard University, June 18, 2008, “Electronics Cooling: Challenges at the Device and System Level.”
    • January  2008
      SemiTherm, San Jose, CA
      Agonafer receives the Significant Contributor “THERMI” Award, March 20, 2008, Keynote: "Thermomechanical Challenges in Electronic Packaging."
    • January  2008
      MIT Invited MechE Department Seminar Series
      Invited MechE Department Seminar Series, MIT, February 29, 2008, Thermomechanical “Challenges in Microelectronics Systems.”
    • January  2008
      Invited Luncheon Speaker, Lytron Inc.
      Invited Luncheon Speaker, Lytron Inc., July 17, 2008, “Thermomechanical Challenges In Electronic Packaging: Part II Lytron Seminar”
    • January  2006
      ATI
      Invited Seminar, “Challenges in Electronic Packaging”, ATI Technologies, Inc., Toronto, Canada, August, 2006.
    • January  2002
      Invited Guest Speaker
      Tau Beta Pi Initiation Banquet
    • January  2002
      Electronic Packaging
      Invited Guest Lecture to UTA Honors College

Other Service Activities

  • Uncategorized
    • Dec  Director
      Electronics, MEMS, and Nanoelectronics Systems Packaging Center Industrial Assessment Center at UTA
    • Dec  Chair, Co-Chair
      MAE Industrial Relations Committee UTA ASME Student Section UTA NSBE Student Section ASME Keynote Speaker ASME International Electrical and Electronic Packaging Division Mechanical Engineering, Graduate Research NSF Fellowship Program ASME Exhibit InterPACk ASME Heat Transfer Division ITHERM V, Orlando, FL ASME Electronic and Photonic Packaging Division ASME Mid-Hudson Valley LSAMP - Louis Stokes Alliance for Minority Participation Faculty Search Committee Advisory Council, Howard University School of Engineering
    • Dec  Editor in Chief
      • Gordon and Breach Book Series in Electronic Packaging
      • Computer Aided Design in Electronic Packaging Committee
      • ASME Heat Transfer Division
      • ASME Book Series in Electronic Packaging
    • Dec  Past Technical Editor
      ASME Journal of Electronic Packaging
    • Dec  Member
      • UTA Intellectual Property Committee (assigned by President of UTA)
      • IEEE (Institute of Electrical and Electronics Engineers)
      • ASEE (American Association of the Advancement of Science)
      • National Society of Black Engineers
      • American Society for Engineering Education
      • ASME Heat Transfer Division
      • ITHERM III, Austin Texas
      • Team Canada
      • ASME Program Committee
      • NSF CREST Center for Mesoscopic Modeling and Simulation
      • Industry Advisory Board, University of Texas at Arlington
      • MAE ABET Committee
      • McNair Scholar Mentor
      • Industrial Relations Committee
      • Intellectual Property Committee
      • Howard University, Board of Visitors
    • Dec  NSF IUCRC
      Site Director, NSF IUCRC in Energey Efficient Systems