avatar

Dereje Agonafer

[Dereje Agonafer]

Professor, Mechanical and Aerospace Engineering
Last Updated: April 14, 2021
about me

Research Interests

Research Interests
o Electronic Packaging: Thermo/Mechanical Challenges in Electronic Systems
o Data Center Cooling
o 3D Packaging
o Thermoelectrics
o Microfluidics with Applications in both BioMEMS and Heat Transfer
o Nanoelectronics Packaging
o Heat Transfer
o Microscale Heat Transfer
o MEMS Packaging
o Refrigeration Cooling
o Reliability
o Solder Science

Teaching Interests

Teaching Interests
Thermal and Fluid Sciences, Electronic Packaging

Biography

Biography

Dereje Agonafer is a Presidential Distinguished Professor in the Department of Mechanical and Aerospace Engineering. He heads two centers and is “Site Director of NSF IUCRC in Energy Efficient Systems” and Director of “Electronics, MEMS and Nanoelectronics Systems Packaging Center.” After receiving his PhD at Howard University, he worked for 15 years at IBM where he eventually was IBM Center of Competence for Computer Aided Thermal Engineering (CATE). In 1991, the value of his contribution to CATE at IBM was recognized by being awarded the "IBM Outstanding Technical Achievement Award in Appreciation for Computer Aided Thermal Modeling.” Since joining UT Arlington in 1999, he has graduated 230 graduate students (a record for the University) including 25 PhDs. Professor Agonafer is currently advising 15 PhDs and 13 MS students. His current primary research areas are in energy efficiency of data centers, heterogeneous integration, 3D packaging and cooling and Reliability Assessment for Micro and Power Electronic Systems. Professor Agonafer has served in several boards including at Howard University, University of Colorado Boulder, City College of New York and Princeton University. He has won several awards for his work in electronic cooling. Each year, SEMI-THERM honors a person as a Significant Contributor to the field of semiconductor thermal management. The THERMI award is intended to recognize a recipient's history of contributions to crucial thermal issues affecting the performance of semiconductor devices and systems. Professor Agonafer received the Thermi Award at the 24th Annual Semi-Therm, March 2008, in San Jose, California. In 2009 he received the InterPACK Excellence Award as cited by the Department Head - "A seal of Dereje’s excellence in research, standing and recognition in electronic packaging and a reflection of UTA’s rise within the international community." In May 2014, he received the ITHERM Achievement, in recognition of significant contributions made in thermal and thermomechanical management of electronics. Professor Agonafer was selected as the 2014 NSBE Golden Torch Award honoree for Golden Torch Legacy Award and was saluted at the “17th Annual Golden Torch Awards (GTA)” on March 29, 2014 in Nashville, TN. In 1998, he received a Distinguished Alum Award from the University of Colorado Boulder and Distinguished PhD Alum Award from Howard University. In 2012, he was the recipient of Howard University College of Engineering, Architecture and Computer Science "Dean's Centennial Award for Distinguished Engineering Scholarship and Service." Professor Agonafer was a Martin Luther King Visiting Professor at MIT during the 2007 academic year. http://mlkscholars.mit.edu/dereje-agonafer-me/ He is a Fellow of The American Association for the Advancement of Science (AAAS), Life Fellow of The American Society of Mechanical Engineers International (ASME) and Life Fellow of the National Academy of Inventors (NAI). In 2019, he received the American Society of Mechanical Engineers prestigious Heat Transfer Memorial Award. The highlight of his professional career was being elected to the National Academy of Engineering. According to Dean Crouch, “the first current faculty member elected to the Academy.” https://www.uta.edu/president/news/messages/2019/02-07-agonafer-nae.php A student centric version of the announcement can be found at https://www.theshorthorn.com/news/uta-engineering-professor-honored-with-national-academy-membership/article_72e863ba-3403-11e9-bfff-1b1df6b51e02.html On March 2020, Professor Agonafer was presented the Howard University Alumni Award for Distinguished Postgraduate Achievement In the field of Engineering at the 153rd Charter Day Dinner. https://www2.howard.edu/2020-achievement-awards Professor Agonafer is married to his wife Carolyn and they have two children; a son, Dr. Damena Agonafer who is Professor of Mechanical Engineering & Materials Science at Washington University in St. Louis, and a daughter, Dr. Senayet Agonafer, a Radiologist, who works at Lennox Hill Radiology in New York City.


Statement on Research Activity
Professor Agonafer is currently advising 14 PhDs and 13 MSc students and has successfully graduated 234 graduate students since he joined UTA in 1999 (a record for the university) including 25 PhD students. Since joining UTA, he has received several million dollars of funding as well as multi-million dollar donations in equipment. His current research areas are and is primarily tied to two centers he directs – Electronics MEMS and Nanoelectronics Systems Packaging Centerfounded by him when he joined UTA in 1999. Shortly after, he established a “Certificate in Electronic Packaging” which continues to thrive and attract numerous students. In 2011 an NSF IUCRC - “NSF Industry University Collaborative Research Consortium (I/UCRC) in the area of Energy Efficient Systems” was established in collaboration with other universities. The NSF Center was recently awarded a Phase II and will continue until 2022. Prior to joining UT Arlington in 1999, Professor Agonafer had a 15-year career at IBM, joining the company immediately after receiving his PhD from Howard University in 1984. As the IBM Center of Competence for Computer Aided Thermal Engineering, he was a pioneer in promoting a concurrent engineering methodology for thermo/mechanical design and modeling of electronic packaging. While in industry, he also taught undergraduate and graduate level courses at CCNY and Columbia University. In the following, a brief summary of his research activities is presented.

Data Center: Data center energy consumption continues to increase with the proliferation in online services such as social networking, banking, entertainment etc. Recent estimates show that associated power consumption accounts for around 2% and 1.8% of electricity production in the United States and worldwide respectively. He was one of the first in academia to address this problem and his first student received an MS on this topic in 2003. Veerendra Mulay, who received both an MS and PhD under his guidance, made quite a bit of contribution in this field. His PhD thesis was entitled “Analysis Of Data Center Cooling Strategies And The Impact of The Dynamic Thermal Management On The Data Center Energy Efficiency.” It was one of the first studies to look into dynamic thermal management in data centers. The concept of “Dynamic Thermal Management” depends on sensing local data and actuating the cooling resources dynamically thereby improving thermodynamic efficiencies. This will result in significant potential energy savings. Dr. Mulay started working at facebook immediately after graduation and has been an active member of the facebook data center thermal design team. The data center work continues to thrive and in 2011, his colleagues from SUNY Binghamton, Villanova, Georgia Tech and he received an NSF Award to establish an NSF IUCRC was formed. The NSF I/UCRC in Energy- Efficient Electronic Systems (E2S) is a National Science Foundation Industry/University Cooperative Research Center started in 2010 and includes UT Arlington, SUNY Binghamton, Villanova and Georgia Tech. ES2 develops methodologies for efficiently operating electronic systems, including data centers, by controlling cooling resources and managing workloads to achieve optimal energy consumption. There are thousands of data centers across the United States that handle a wide spectrum of information and processing needs for the government, military, business and industry. It is quite significant as it enables a collaborative effort between industry and academia with many opportunities for additional NSF funding. One of the highlights of the Center regarding UT Arlington is the fact that Facebook joined the consortium and that the agreement with Facebook is the first such University funded project in the State of Texas. The Phase I agreement expired in 2017, and the center has recently received a Phase II extension to 2022 with a current funding for UTA of $425K / year ($100K/year from NSF). In December 2012, he gave a luncheon talk at the Annual Data Center Dynamics held in Dallas (http://www.datacenterdynamics.com/conferences/2012/dallas-2012). He will also be participating again in December 2013 – (http://www.datacenterdynamics.com/conferences/2013/dallas- 2013?l=programme). CBS-DFW also interviewed his team on the work with Facebook (http://dfw.cbslocal.com/2011/11/23/uta-grad-students-get-grant-to-make-facebook-faster/). In addition, local companies such as CommScope and Mestek are in the consortium with discussions to add Amazon and AT&T. With the help of the University, he has built a data center research facility in Nedderman Hall. In June 2015, he received over 1 million dollars’ worth of servers from Yahoo for the data center: “Yahoo! Labs delivered 480 computer servers to the UT Arlington College of Engineering on Wednesday, June 24, to further research led by mechanical engineering professor Dereje Agonafer into more efficient systems for cooling essential network equipment.” - See more at: http://www.arlington-tx.gov/news/2015/06/25/yahoo-donates-480-servers-to-ut- arlington/. According to Yahoo, “At Yahoo, we are excited to continue bolstering computer science in academia with our largest cumulative server donation ever. Yesterday, Yahoo Labs’ Academic Partnerships team and the Yahoo Data Center Operations group had the pleasure of delivering 480 servers to the University of Texas at Arlington (UTA). Combined with the 250 servers Yahoo donated to UTA in late 2012, the gift amounts to the most servers Yahoo has donated to any individual institution in our YSTAR (Yahoo Servers to Academic Researchers) program since its inception in 2010.” - See more at: http://yahoolabs.tumblr.com/post/122430939166/yahoo- bolsters-computer-science-in-academia-with scheduled to house 250 servers, worth ¾ million dollars from Yahoo (already received), and 180 servers worth ½ million dollars from Facebook (two triplets and 60 servers already received) - making it one of the largest, data center research facility in the nation. It will also serve the computational needs of some other researchers within the University. As Site Director, he has hosted the Industrial Advisory Board Meeting for the NSF I/UCRC Center on Energy Efficient Systems at the UT in 2012, 2014, 2016 and Spring 2018. Attendees included participants from NSF, SUNY Binghamton, Villanova and Georgia Tech and over 18 industries.

Reliability: A major breakthrough in packaging was migrating from peripheral to area array packaging by introducing solder as interconnect (C4, IBM). In the early 2000, the impact of introducing lead-free solder due to the legislation restriction, generated numerous researches to characterize the lead-free alloys and evaluate the interconnect reliability. At the time, Nokia Research Center and INDT funded UTA to work in this area and one of the topics was addressed by Dr. Mohammad Hossain, one of his PhD students at the time and now a Senior Reliability Engineer at Intel, who addressed a research question to develop constitutive equations for SnAgCu alloy and also evaluation of SAC solder interconnects reliability under different loadings. Professor Agonafer received funding in this area from Nokia and a number of papers were published including the first multi-design variable optimization problem related to packaging using ANSYS entitled “Design Optimization and Reliability of PWB Level Electronic Package,” Journal of Electronic Packaging, March 2007, Volume 129, Issue 1, pp. 9-18. In subsequent years, Dr. Nikhil Lakhkar, now at Emerson, studied the "Effect of Structural Design Parameters on Wafer Level CSP Ball Shear Strength and Their Influence on Accelerated Thermal Cycling Reliability.” In spring 2014, he received a 3 year TI sponsored SRC research project entitled “Birth-to-death (from die metal/passivation processing to board assembly) Modeling Methodology for the Optimization of Custom Board-Level Reliability.” As board complexity grows and diversifies, there is an urgent need to develop a system-level methodology for the study and optimization of BLR reliability that is portable to different types of board and package designs. The project will deliver a model to experiment correlation database as well as a hierarchical and modular BLR analysis Ansys tool-box, along with component dependent guidelines. His students in this area have joined and are making contributions in industry including GlobalFoundries, Intel, Micron, Google and Tesla.

3D Packaging: The convergence and miniaturization of computing and communications dictates building up rather than out. Moore’s law will continue but while it is still possible to double the amount of transistors in a single device, beyond 28nm node, it will be difficult to do so at a reduced cost. In Chapter 15 of ITRS 2.0 Heterogeneous Integration, it states that “As traditional Moore’s law scaling becomes more difficult, innovation in assembly and packaging enabling functional diversification through Heterogeneous Integration (HI) and allowing scaling in the third dimension must take the slack.” 3D packaging can be used to delay the onset of a new technology node while leveraging packaging to gain performance with existing nodes. The 3-D arrangement provides opportunities for new circuit architectures based on the geometrical ability to have greater numbers of interconnections among multi-layer active circuits. Presently, stack dice are used widely as low- power memory applications because thermal management of 3D architecture such as high-power processors inherits many thermal challenges. Inadequate thermal management of three-dimensional integrated circuits (3D-ICs) leads to reduction in performance, reliability, and ultimately system catastrophic failure. Since 2005, Professor Agonafer has been advocating addressing the thermal and mechanical challenges in 3D packaging. He started this effort in 2004 when he worked as a consultant at Intel providing guidance on their thermal modeling methodology. He has given numerous short courses and published extensively in this area. In September 2006, he gave the opening keynote seminar entitled “Thermo-Mechanical challenges in stacked packaging” at the 17th International Symposium on Transport Phenomena (ISTP-17) in Toyama, Japan. The presentation was subsequently published in a journal. It is with this background that one of his students came with a question he wanted to address: an innovative approach to cooling of stacked packages. The title of his dissertation was “Development Of An Experimental And Analytical Model Of An Active Cooling Method For High-Power Three-Dimensional Integrated Circuit (3d-Ic) Utilizing Multidimensional Configured Thermoelectric Modules.” Dr. Phan published extensively in this area and they have since patented the idea (Multidimensional heat transfer system for cooling electronic components, US 20120211204 A1). Dr. Phan is now CEO of a company and we continue to collaborate. In 2012, a patent application was filed (Thermal Reliability Testing Systems With Thermal Cycling And Multidimensional Heat Transfer, Application number: 20140103947). I was a Co-PI (Dr. Jain, PI) on an NSF Goali research project “Experimental and Theoretical Investigation of Thermal Transport in Three-Dimensional Integrated Circuits (3D ICs).” The proposed work resulted in key experimental data on heat dissipation in advanced three-dimensional integrated circuits (3D ICs) and led to a better understanding of fundamental inter-die heat transfer mechanisms in 3D ICs. I plan to submit a follow up proposal with Dr. Jain as Co-PI.

Hierarchical thermal modeling: he was one of the pioneers in this area; his paper on compact modeling is a seminal paper in the field, inspiring many other research groups to use this approach. He has always been on the leading edge in forecasting technology and has long been an advocate for the use of computer aided design in electronics cooling and has organized over 50 panels and numerous conference sessions on this subject. In 1994, he organized and led a team of five US speakers to speak on computational fluid dynamics at the World Conference on Computational Mechanics in Chiba, Japan. In 2012, he completed an SRC project entitled “Development of a Best Known Method (BKM) for Design of Microprocessors used in Stacked Packages Based on Power and Thermal-Architectural Co- Design” where he and his colleagues from the University of Toronto and SUNY Binghamton focused on co-design of microprocessors. The co-design topic is now a hot research area.

Publication: Related to publication, he and his team have published over 200 papers. In 2013, he co-authored a book on data centers (Encyclopedia of Thermal Packaging, Set 2: “Volume 1: Energy Optimization and Thermal Management of Data Centers”, ISBN: 978-981-4327-60-
2) and in 2014, I wrote a chapter on 3D Packaging in a book entitled “. He serves as an IEEE CPMT Associate Editor as well as Editor in Chief of ASME Book Series in Electronic Packaging (a book in Electronic Packaging was published in 2011). He is a Fellow of The American Society of Mechanical Engineers International (ASME) and Fellow of The American Association for the Advancement of Science (AAAS). Currently he serves on the Scientific Advisory Board of an NSF Center, Mid- Infrared Technologies for Health and the Environment (MIRTHE) at Princeton University since 2007 as well as on the Dean’s Engineering Advisory Committee at both University of Colorado and Howard University. His biggest pride is from the contributions his students are making at such companies as Delphi, Intel, and Facebook. In 2014, 5 of his PhD students received awards including John Fernandes who received a “Best Poster Award” at The 2014 IEEE ITHERM (1/81) (http://www.uta.edu/engineering/news-events/news- archives/2014/05-itherm-best- poster.php). Furthermore, Fahad Mirza received The ASME EPPD Student of the Year Award, Montreal, Ca (IMECE 2014), http://www.uta.edu/engineering/news-events/news-archives/2014/11-mirza-eppd-award.php). Dr. Mirza received his PhD in December 2014 and is now a Senior Engineer at Global Foundries.

Education

Education

    • 1984 PhD in Mechanical Engineering
      Howard University
    • 1978 MS in Mechanical Engineering
      Howard University
    • 1972 BS in Aerospace Engineering
      University of Colorado Boulder

Appointments

Appointments

    • 1984 to 1999 Director
      IBM
      Directed the development/application of Computer Aided Thermal Engineering (CATE). Also introduced commercial CFD codes to IBM which included 1) training engineers in the use of both finite element and finite control volume commercial codes for solving electronic packaging problems; 2) providing consultation for product design analysis; 3) working with vendors to incorporate electronic cooling models in commercial codes; and 4) creative ideas for electronic cooing as evidenced by 8 patents and over 80 invention disclosures. Developed the IBM Center of Competence for Computer Aided Thermal Engineering. During this time also worked in promoting a concurrent engineering methodology for thermo/mechanical design and modeling of electronic packaging (had a patent issued on the subject matter in July 1997).

Memberships

    • Feb 2018 to Present National Academy of Engineering
      Fellow
    • Mar 2014 to Present National Society of Black Engineers
      Member
    • May 2006 to Present American Association of the Advancement of Science
      Fellow
    • May 1995 to Present International American Society of Mechanical Engineers
      Member
    • May 1992 to Present Institute of Electrical and Electronics Engineers
      Member
    • Jan 1980 to Present American Society of Mechanical Engineering
      Life Fellow

Awards and Honors

    •  2020 2020 recipients of the Alumni Award sponsored by Howard University
    •  2020 The SEMI-THERM Thermal Hall of Fame sponsored by SEMI-THERM
    •  2019 2019 American Society of Mechanical Engineers recipient of its prestigious Heat Transfer Memorial Award sponsored by American Society of Mechanical Engineers
    •  2019 2019 National Academy of Engineering sponsored by National Academy of Engineering
    •  2017 2017 class of The National Academy of Inventors (NAI) sponsored by The National Academy of Inventors
    •  2016 2016 Compendium: Successful Industry-Nominated Technological Breakthroughs for NSF I/UCRCs in More Efficient Data Centers: Maximizing Airside Cooling sponsored by NSF
    •  2015 2015 IBM Faculty Award sponsored by IBM
    •  2014 2014 iTherm Best Poster Award (1 of 83) sponsored by Institute of Electrical and Electronics Engineers (IEEE)
    • Oct  2014 Best Paper Award sponsored by International Microelectronics Assembly and Packaging Society (IMAPS)
    • Oct  2014 Best Paper Award sponsored by International Microelectronics Assembly and Packaging Society (IMAPS)
    • Oct  2014 Best Paper Award sponsored by International Microelectronics Assembly and Packaging Society (IMAPS)
    • May  2014 2014 iTherm Achievement Award sponsored by Institute of Electrical and Electronics Engineers (IEEE)
    • Mar  2014 Golden Torch Legacy Award sponsored by Annual National Society of Black Engineers
    •  2013 2013 Phi Kappa Phi Recognized Professor sponsored by Phi Kappa Phi
    •  2012 Dean's Centennial Award for Distinguished Engineering Scholarship and Service sponsored by Howard University College of Engineering, Architecture and Computer Science
    •  2012 Jenkins Garrett Endowed Professorship sponsored by University of Texas at Arlington
    • Jul  2012 Certificate of Recognition, Plenary Speaker sponsored by American Society of Mechanical Engineers (ASME) 10th International Conference on Nanochannels, Microchannels and Minichannels (ICNMM 2012),
    • Jul  2009 InterPACK Achievement Award sponsored by InterPACK
    • Mar  2008 THERMI Award for Significant Contributions in the Thermal Sciences sponsored by Institute of Electrical and Electronics Engineers (IEEE)
    •  2006 Research Excellence Award sponsored by College of Engineering (UTA)
    • Oct  2006 Elected Fellow sponsored by The American Association for the Advancement of Science (AAAS)
    •  2005 Research Excellence Award sponsored by College of Engineering (UTA)
    • Jul  2005 Keynote Speaker Chair Recognition Award sponsored by InterPACK
    • Jul  2005 Panel Co-Moderator Recognition Award sponsored by InterPACK
    •  2004 McNair Scholar Mentor sponsored by University of Texas at Arlington
    • May  2004 Keynote Speaker Chair Recognition Award sponsored by Institute of Electrical and Electronics Engineers (IEEE)
    • May  2004 Panel Co-Moderator Recognition Award sponsored by Institute of Electrical and Electronics Engineers (IEEE)
    •  2003 McNair Scholar Mentor sponsored by University of Texas at Arlington
    • May  2003 UT Arlington Libraries Learning Partnership Award sponsored by UT Arlington Libraries
    •  2002 IMECE 2002 Achievement Award For “Outstanding Contributions to the Area of the Application of the Science and Engineering of Heat Transfer to Electronic and Photonic Packaging” sponsored by The American Society of Mechanical Engineers' (ASME) International Mechanical Engineering Congress and Exposition (IMECE)
    •  2002 IMECE 2002 Recognition Award for being Division Chair, 2000-2001 and Executive Committee Member, 1997 - 2002 of the Electronic and Photonic Packaging Division of ASME. sponsored by The American Society of Mechanical Engineers' (ASME) International Mechanical Engineering Congress and Exposition (IMECE)
    • May  2002 Keynote Speaker Chair Recognition Award sponsored by Institute of Electrical and Electronics Engineers (IEEE)
    • Jul  2001 InterPACK ’01 Recognition Award for Moderator sponsored by InterPACK
    • Jul  2001 InterPACK ’01 Recognition Award for Track Co-Chair sponsored by InterPACK
    • Jul  2001 InterPACK ’01 Recognition Award for Track Co-Chair sponsored by InterPACK
    • Jun  1999 General Chair sponsored by InterPACK
    •  1998 ASME K-16/EEPD Clock Award for Outstanding Contribution in Computer Aided Thermal Management of Electronic Packages sponsored by American Society of Mechanical Engineers (ASME)
    •  1998 Distinguished Ph.D. Alumni Award sponsored by Howard University
    • Apr  1998 University of Colorado School of Engineering Distinguished Engineering Alumni Award (DEAA) sponsored by University of Colorado School of Engineering
    • Dec  1997 Industry Advisory Board Member sponsored by University of Texas at Arlington
    • Jul  1997 United Negro College Meritorious Service Award sponsored by United Negro College
    • May  1996 General Chair sponsored by Institute of Electrical and Electronics Engineers (IEEE)
    • Apr  1996 Advisory Council sponsored by Howard University School of Engineering
    • Mar  1996 Alumni Extension Technologist of the Year Award sponsored by National Society of Black Engineers
    •  1995 Fifth Publication Achievement Award sponsored by Unspecified
    •  1995 Sixth Publication Achievement Award sponsored by Unspecified
    • Aug  1995 American Society of Mechanical Engineers International Fellow sponsored by American Society of Mechanical Engineers International
    • Aug  1995 Interim Technical Editor sponsored by ASME Journal of Electronic Packaging
    • Jun  1995 Associate Technical Editor sponsored by Journal of Electronic Packaging
    • Jun  1995 Editor in Chief sponsored by Gordon & Breach Book Series in Electronic Packaging
    •  1994 Fourth Publication Achievement Award sponsored by Unspecified
    • Aug  1994 US Organizer and Invited Lecturer sponsored by World Congress in Computational Mechanics (WCCM)
    • May  1994 Program Chair sponsored by Institute of Electrical and Electronics Engineers (IEEE)
    •  1993 Third Publication Achievement Award sponsored by Unspecified
    •  1992 IBM First Level Invention Achievement Award sponsored by IBM
    •  1992 Informal Awards (Several) sponsored by IBM
    •  1992 Marquis Who's Who in the East sponsored by Marquis Who's Who Ventures LLC
    •  1992 Second Publication Achievement Award sponsored by Unspecified
    • Dec  1991 IBM Outstanding Technical Achievement Award sponsored by IBM
    • Oct  1990 Best Presenter sponsored by Institute of Electrical and Electronics Engineers (IEEE)/National Society of Black Engineers (NSBE)
    •  1989 Certificate of Appreciation sponsored by Poughkeepsie City School District
    •  1984 ASME Most Outstanding Graduate Student sponsored by American Society of Mechanical Engineers (ASME)
    •  1983 Howard University ASME Award, sponsored by American Society of Mechanical Engineers (ASME)

Support & Funding

Support & Funding

This data is entered manually by the author of the profile and may duplicate data in the Sponsored Projects section.
    • Past to Present GOALI: Experimental and Theoretical Investigation of Thermal Transport in Three-Dimensional Integrated Circuits (3D ICs) sponsored by  -  $0
      (Funded)
    • Aug 2017 to July 2022 Phase II IUCRC University of Texas at Arlington: Center for Energy Smart Electronic Systems sponsored by  -  $920606
      Dereje Agonafer (Funded)
    • Aug 2017 to July 2022 Collaborative Center: I/UCRC in Energy-Efficient Electronic Systems E3S sponsored by  -  $25000
      Dereje Agonafer (Funded)
    • July 2019 to July 2020 Testing and Analysis Services on Material Samples sponsored by  -  $30000
      Dereje Agonafer (Funded)
    • Jan 2014 to Nov 2017 7x24 Exchange ES2 Research sponsored by  -  $13750
      Dereje Agonafer (Funded)
    • Jan 2014 to Nov 2017 Collaborative Center I/UCRC: Dynamic Effects Due to Air Flow and Power Variations in Data Center Using Photovoltaic (PV) Technology sponsored by  -  $50000
      Dereje Agonafer (Funded)
    • Aug 2012 to Nov 2017 Membership to NSF I/UCRC sponsored by  -  $125000
      Dereje Agonafer (Funded)
    • June 2012 to Nov 2017 Spray Cooling and PCM Technology for Data Center sponsored by  -  $165000
      Dereje Agonafer (Funded)
    • Aug 2011 to Nov 2017 Collaborative Center: I/UCRC in Energy-Efficient Electronic Systems with Tuition sponsored by  -  $293000
      Dereje Agonafer (Funded)
    • Aug 2011 to Nov 2017 Collaborative Center: I/UCRC in Energy-efficient Electronic Systems- with Tuition (Facebook) sponsored by  -  $312500
      Dereje Agonafer (Funded)
    • Aug 2011 to Nov 2017 Collaborative Center: I/UCRC in Energy-efficient Electronic Systems-with Tuition (CommScope) sponsored by  -  $250000
      Dereje Agonafer (Funded)
    • Feb 2014 to July 2017 Birth-to-death ( from Die Metal/Passivation Processing to Board Assembly) Modeling Methodology for the Optimization of Custom Board-level Reliabilty sponsored by  -  $240000
      Dereje Agonafer (Funded)
    • Feb 2013 to Feb 2015 Concealed RRH Thermal Simulation sponsored by  -  $48000
      Dereje Agonafer (Funded)
    • Jan 2012 to June 2014 I/UCRC for Energy -Efficient Electronics Systems, Project #5 - Dynamic Thermal Management and Controls in a Data Center sponsored by  -  $60000
      Dereje Agonafer (Funded)
    • June 2011 to June 2013 A Wireless Micro Gastro-Stimulator for Treatment of Severe Gastric Dysmotility sponsored by  -  $50000
      (Funded)
    • Oct 2008 to Jan 2012 Experimental and Model Developments of Interfacial Mechanical Integrity of Layered Stacks sponsored by  -  $90760
      Dereje Agonafer (Funded)
    • Aug 2010 to Aug 2011 Collaborative Planning Grant: I/UCRC for Energy Efficient Systems sponsored by  -  $10000
      Dereje Agonafer (Funded)
    • Feb 2008 to Aug 2011 Developing of a Best Known Method (BKM) for Design of Microprocessors used in Stacked Packages Based on Power and Thermal-Architectural Co-Design sponsored by  -  $90000
      Dereje Agonafer (Funded)
    • Sept 2009 to Oct 2010 CommScope Enterprise Cabinets Thermal Program sponsored by  -  $65100
      Dereje Agonafer (Funded)
    • Sept 2008 to Aug 2009 CommScope Enterprise Cabinets Thermal Program sponsored by  -  $67858
      Dereje Agonafer (Funded)
    • Aug 2008 to July 2009 Grand Challenges in Thermal Management of Electronic Systems from Device to Systems Workshop Funding Request sponsored by  -  $10000
      Dereje Agonafer (Funded)
    • Sept 2002 to Nov 2007 Industrial Assessment Center sponsored by  -  $813271
      Dereje Agonafer (Funded)
    • Apr 2005 to Mar 2007 Development of Consititutive Equations and Novel Methodology for Failure Prediction Models for ACS Lead sponsored by  -  $79749
      Dereje Agonafer (Funded)
    • Apr 2002 to May 2005 The Impact of Board Layout and Layup on PWB Warpage during Fabrication and due to Reflow and Wave Soldering Process sponsored by  -  $76000
      Dereje Agonafer (Funded)
    • Sept 2002 to Aug 2004 Application of Masterflux Compressor in Modular Refrigeration Unit sponsored by  -  $50000
      Dereje Agonafer (Funded)
    • Dec 2001 to Nov 2003 Thermochemical and Mechanical Properties of Ag-Cu Sn Lead Free Solder Alloys with the Addition of Minor sponsored by  -  $238887
      (Funded)

Publications


      2016
      • Book
        Thermal Management of Telecommunications Equipment
        ASME Press Book Series on Electronic Packaging
        [Agonafer, Dereje, Tuu, Lian, Richard, C].

      2014
      • Book
        Encyclopedia of Thermal Packaging, Set 2: “Volume 1: Thermal Management of Data Centers,”
        Encyclopedia of Thermal Packaging
        [Sammakia, Bahgat, Joshi, Yogendra, Agonafer, Dereje, Samadiani, Emad].

      2011
      • Book
        Essentials of Electronic Packaging: A Multidisciplinary Approach
        ASME Press Book Series on Electronic Packaging Book Series
        [Puligandla, Viswanadham, Agonafer, Dereje]. New York.

      1993
      • Book
        Computer Aided Thermal Engineering For The Development Of Future Electronic Cooling Systems
        Computers and Computing in Heat Transfer Science and Engineering
        [Agonafer, Dereje, Chu, RC]. "CRC Press".

      1989
      • Book
        Numerical simulation of convection in electronic equipment cooling - Presented at the winter annual meeting of ASME, San Fransisco, California, December 10-15, 1989
        [Ortega, Alfonso, Asme, Amer Soc of Mechanical Engineering, Agonafer, Dereje]. "ASME".
        https://infoscience.epfl.ch/record/60614

      2014
      • Book Chapter
        A REVIEW OF COOLING ROAD MAPS FOR 3D CHIP PACKAGES
        WSPC Series in Advanced Integration and Packaging: Volume 3, Cooling of Microelectronic and Nanoelectronic Equipment Advances and Emerging Research
        [Agonafer, Dereje].

      2002
      • Book Chapter
        Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods, and Design Practices
        ASME Press Book Series on Electronic Packaging
        [Yeh, Lian-Tuu, Chu, RichardC, Agonafer, Dereje].

      2020
      • Conference Proceeding
        Artificial Neural Network Based Prediction of Control Strategies for Multiple Air-Cooling Units in a Raised-floor Data Center
        ITherm
        [Simon, Vibin, Siddarth, Ashwin, Agonafer, Dereje].
      • Conference Proceeding
        CFD Analysis on Liquid Cooled Cold Plate Using Copper Nanoparticles
        ASME InterPACK
        [Shahi, Pardeep , Agarwal, Sarthak, Saini, Satyam, Niazmand, Amirreza, Bansode, Pratik, Agonafer, Dereje].
      • Conference Proceeding
        CFD Modeling of the Distribution of Airborne Particulate Contaminants Inside Data Center Hardware
        ASME InterPACK
        [Saini, Satyam, Adsul, Kaustubh, Shahi, Pardeep, Niazmand, Amirreza, Bansode, Pratik, Agonafer, Dereje].
      • Conference Proceeding
        CFD Simulation of Two-phase Immersion Cooling Using FC-72 Dielectric Fluid
        ASME InterPACK
        [Niazmand, Amirreza , Chauhan, Tushar, Saini, Satyam, Shahi, Pardeep, Bansode, Pratik, Agonafer, Dereje].
      • Conference Proceeding
        Numerical Analysis of Oil immersion Cooling of a Server Using Mineral Oil and Al2O3 Nanofluid
        ASME InterPACK
        [Nizamand, Amirreza , Murthy, Prajwal, Saini, Satyam, Shahi, Pardeep, Bansode, Pratik, Agonafer, Dereje].

      2019
      • Conference Proceeding
        Computational analysis for thermal optimization of server for single phase immersion cooling
        [Gandhi, Dhruvkumar, Chowdhury, Uschas, Chauhan, Tushar, Bansode, Pratik, Saini, Satyam, Shah, Jimil, Agonafer, Dereje].
      • Conference Proceeding
        Computational Form Factor Study of a 3rd Generation Open Compute Server for Single-Phase Immersion Cooling
        [Shah, Jimil, Bhatt, Chinmay, Rachamreddy, Pranavi, Dandamudi, Ravya, Saini, Satyam, Agonafer, Dereje].
      • Conference Proceeding
        Development of A Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center
        ASME InterPACK
        [Shah, Jimil, Anand, Roshan, Saini, Satyam, Cyriac, Rawhan, Agonafer, Dereje, Singh, Prabjit, Kaler, Mike].
      • Conference Proceeding
        Experimental analysis for optimization of thermal performance of a server in single phase immersion cooling
        ASME InterPACK
        [Shinde, Pravin, Bansode, Pratik, Saini, Satyam, Kasukurthy, Rajesh, Chauhan, Tushar, Shah, Jimil, Agonafer, Dereje].
      • Conference Proceeding
        Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization
        Journal of Electronic Packaging
        [Shah, Jimil, Misrak, Abel, Agonafer, Dereje, Kaler, Mike].
      • Conference Proceeding
        Impact of Accelerated Thermal Aging on Thermo-Mechanical Properties of Oil-Immersed FR-4 Printed Circuit Boards
        SMTA International
        [Ramdas, S, Chowdhury, A S M Raufur, Lakshminarayana, A, Bhandari, R, Chauhan, T, Misrak, A, Agonafer, Dereje].
      • Conference Proceeding
        Impact of Immersion Cooling on Thermo-Mechanical Properties of PCB's and Reliability of Electronic Packages
        ASME InterPACK
        [Ramdas, S, Rajmane, P, Chauhan, T, Misrak, A, Agonafer, D].
      • Conference Proceeding
        Impact of Thermal Aging and Cycling on Reliability of Thermal Interface Materials
        SMTA International
        [Chauhan, T, B, R, Misrak, Abel, Rajmane, P, Chowdhury, A S M Raufur, Sivaraju, K, Abdulhasanari, M, Agonafer, Dereje].
      • Conference Proceeding
        Optimal Design and modeling of server cabinets with in-row coolers and air conditioning units in a modular data center
        ASME InterPACK
        [Chowdhury, Uschas, Hendrix, M, Craft, T, James, W, Sutariya, A, Agonafer, Dereje].
      • Conference Proceeding
        Reliability Considerations for Oil Immersion-Cooled Data Centers
        Journal of Electronic Packaging
        [Shah, Jimil, Eiland, Richard, Rajmane, Pavan, Siddarth, Ashwin, Agonafer, Dereje, Mulay, Veerendra].
      • Conference Proceeding
        Reliability Assessment of BGA Solder Joints - Megtron 6 VS FR4 Printed Circuit Boards
        SMTA International
        [Chaudhari, Mugdha, Chowdhury, A S M Raufur, Rahangdale, Unique, Misrak, Abel, Rajmane, Pavan, Doiphode, Aniruddha, Agonafer, Dereje].
      • Conference Proceeding
        Solder Joint Reliability of BGA Package for High Frequency Laminates Under Power Cycling
        SMTA international
        [Lakshminarayana, Akshay, Chaudhari, Mugdha, Rahangdale, Unique, Misrak, Abel, Pallapothu, Mahesh, Agonafer, Dereje].
      • Conference Proceeding
        Neural Network Based Bin Analysis for Indirect/Direct Evaporative Cooling of Modular Data Centers
        Proceedings of the ASME 2018 International Mechanical Engineering Congress and Exposition. Pittsburgh, PA, USA: ASME; 2018
        [Walekar, A, Siddarth, A, Guhe, A, Sukthankar, N, Agonafer, D].

      2018
      • Conference Proceeding
        A Thermo-Mechanical Study on Vertically Split Distribution-Wet Cooling Media Used in Data Centers
        ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
        [Varadharasan, Mullaivendhan, Agonafer, Dereje, Al Khazraji, Ahmed, Shah, Jimil, Siddarth, Ashwin, Hoverson, James, Kaler, Mike]. "ASME". DOI: http://dx.doi.org/10.1115/ipack2018-8378
        http://dx.doi.org/10.1115/ipack2018-8378
      • Conference Proceeding
        Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a High-Density Data Center Utilizing Airside Economization
        ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
        [Thirunavakkarasu, Gautham, Saini, Satyam, Shah, Jimil, Agonafer, Dereje]. "ASME". DOI: http://dx.doi.org/10.1115/ipack2018-8436
        http://dx.doi.org/10.1115/ipack2018-8436
      • Conference Proceeding
        Measurement of the Thermal Performance of a Single-Phase Immersion Cooled Server at Elevated Temperatures for Prolonged Time
        ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
        [Bansode, PratikV., Shah, JimilM., Gupta, Gautam, Agonafer, Dereje, Patel, Harsh, Roe, David, Tufty, Rick]. "ASME". DOI: http://dx.doi.org/10.1115/ipack2018-8432
        http://dx.doi.org/10.1115/ipack2018-8432
      • Conference Proceeding
        Rack-Level Study of Hybrid Cooled Servers Using Warm Water Cooling With Variable Pumping for Centralized Coolant System
        ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
        [Sahini, Manasa, Kshirsagar, Chinmay, McGinn, Patrick, Agonafer, Dereje]. "ASME". DOI: http://dx.doi.org/10.1115/ipack2018-8255
        http://dx.doi.org/10.1115/ipack2018-8255
      • Conference Proceeding
        Experimental Characterization of Vertically Split Distribution Wet- Cooling Media Used in the Direct Evaporative Cooling of Data Centers
        2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
        [Al Khazraji, Ahmed, Siddarth, Ashwin, Varadharasan, Mullaivendhan, Guhe, Abhishek, Agonafer, Dereje, Hoverson, James, Kaler, Mike]. "IEEE". DOI: http://dx.doi.org/10.1109/itherm.2018.8419611
        http://dx.doi.org/10.1109/itherm.2018.8419611

      2017
      • Conference Proceeding
        A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing with Package Power Supply
        Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
        [Rahangdale, Unique, Rajmane, Pavan, Misrak, Abel, Agonafer, Dereje].
      • Conference Proceeding
        CHARACTERIZATION OF AN ISOLATED HYBRID COOLED SERVER WITH FAILURE SCENARIOS USING WARM WATER COOLING
        Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
        [Chowdhury, Uschas, Sahini, Manasa, Siddarth, Ashwin, Agonafer, Dereje, Branton, Steve].
      • Conference Proceeding
        A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply
        ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
        [Rahangdale, Unique, Rajmane, Pavan, Misrak, Abel, Agonafer, Dereje]. "ASME". DOI: http://dx.doi.org/10.1115/ipack2017-74278
        http://dx.doi.org/10.1115/ipack2017-74278
      • Conference Proceeding
        Characterization of an Isolated Hybrid Cooled Server With Failure Scenarios Using Warm Water Cooling
        ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
        [Chowdhury, Uschas, Sahini, Manasa, Siddarth, Ashwin, Agonafer, Dereje, Branton, Steve]. "ASME". DOI: http://dx.doi.org/10.1115/ipack2017-74028
        http://dx.doi.org/10.1115/ipack2017-74028
      • Conference Proceeding
        Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading
        ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
        [Rahangdale, Unique, Rajmane, Pavan, Misrak, Abel, Agonafer, Dereje]. "ASME". DOI: http://dx.doi.org/10.1115/ipack2017-74279
        http://dx.doi.org/10.1115/ipack2017-74279
      • Conference Proceeding
        Comparative Study of High Ambient Inlet Temperature Effects on the Performance of Air vs. Liquid Cooled IT Equipment
        Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
        [Sahini, Manasa, Chowdhury, Uschas, Siddarth, Ashwin, Pradip, Tanmay, Agonafer, Dereje, Zeighami, Roy, Metcalf, Jeff, Branton, Steve]. 544-+.
      • Conference Proceeding
        Comparative study of high ambient inlet temperature effects on the performance of air vs. liquid cooled IT equipment
        2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
        [Sahini, Manasa, Chowdhury, Uschas, Siddarth, Ashwin, Pradip, Tanmay, Agonafer, Dereje, Zeigham, Roy, Metcalf, Jeff, Branton, Steve]. "IEEE". DOI: http://dx.doi.org/10.1109/itherm.2017.7992534
        http://dx.doi.org/10.1109/itherm.2017.7992534
      • Conference Proceeding
        Comparison of the Effect of Elastic and Viscoelastic Modeling of PCBs on the Assessment of Board Level Reliability
        Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
        [Misrak, Abel, Anaskure, Avinash, Sakib, A. R. Nazmus, Rahangdale, Unique, Lohia, Alok, Agonafer, Dereje]. 1106-1110.
      • Conference Proceeding
        Damage Progression Study of 3D TSV Package during Reflow, Thermal Shocks and Thermal Cycling
        Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
        [Rahangdale, Unique, Rajmane, Pavan, Doiphode, Aniruddha, Sakib, A.R., Misrak, Abel, Lohia, Alok, Agonafer, Dereje]. 1119-1125.
      • Conference Proceeding
        Design Considerations Relating to Non-Thermal Aspects of Oil Immersion Cooling
        [Shah, JimilM., Rizvi, Syed Haider I., Kota, InduSravani, Nagilla, SahithiReddy, Thakkar, Dhaval, Agonafer, Dereje].
      • Conference Proceeding
        Mechanical characterization of RCC and FR4 laminated PCBs and assessment of their board level reliability
        2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
        [Rahangdale, Unique, Sakib, AR, Chaudhari, Mugdha, Misrak, Abel, Dave, Chaitanya, Agonafer, Dereje, Lohia, Alok, Kummerl, Steven, Nguyen, LuuT.]. "IEEE". DOI: http://dx.doi.org/10.1109/itherm.2017.7992613
        http://dx.doi.org/10.1109/itherm.2017.7992613
      • Conference Proceeding
        Solder ball reliability assessment of WLCSP — Power cycling versus thermal cycling
        2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
        [Rahangdale, Unique, Conjeevaram, B., Doiphode, Aniruddha, Rajmane, Pavan, Misrak, Abel, Sakib, A.R., Agonafer, Dereje, Nguyen, LuuT., Lohia, Alok, Kummerl, Steven]. "IEEE". DOI: http://dx.doi.org/10.1109/itherm.2017.7992640
        http://dx.doi.org/10.1109/itherm.2017.7992640
      • Conference Proceeding
        Effect of PCB thickness on solder joint reliability of Quad Flat no-lead assembly under Power Cycling and Thermal Cycling
        2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)
        [Rahangdale, Unique, Srinivas, Rahul, Krishnamurthy, S., Rajmane, Pavan, Misrak, Abel, Sakib, A.R., Agonafer, Dereje, Lohia, Alok, Kummerl, Steven, Nguyen, LuuT.]. "IEEE". DOI: http://dx.doi.org/10.1109/semi-therm.2017.7896911
        http://dx.doi.org/10.1109/semi-therm.2017.7896911
      • Conference Proceeding
        Effect of PCB Thickness on Solder Joint Reliability of Quad Flat No-Lead Assembly under Power Cycling and Thermal Cycling
        Proceedings IEEE Semiconductor Thermal Measurement and Management Symposium
        [Rahangdale, Unique, Srinivas, Rahul, Krishnamurthy, S., Rajmane, Pavan, Misrak, Abel, Sakib, A.R., Agonafer, Dereje, Lohia, Alok, Kummerl, Steven, Nguyen, LuuT.]. 70-76.
      • Conference Proceeding
        Failure Mechanisms of Boards in a Thin Wafer Level Chip Scale Package
        Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
        [Rajmane, Pavan, Khan, HassaanAhmad, Doiphode, Aniruddha, Rahangdale, Unique, Agonafer, Dereje, Lohia, Alok, Kummerl, Steven, Nguyen, Luu]. 1099-1105.
      • Conference Proceeding
        Mechanical Characterization of RCC and FR4 Laminated PCBs and Assessment of their Board Level Reliability
        Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
        [Rahangdale, Unique, Sakib, A.R., Chaudhari, Mugdha, Misrak, Abel, Dave, Chaitanya, Agonafer, Dereje, Lohia, Alok, Kummerl, Steven, Nguyen, LuuT.]. 1111-1118.
      • Conference Proceeding
        NiyanTron - An Approach to Develop a Control System App for Data Center Cooling
        Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
        [Rahul, Varun, Darekar, Anay, Kasukurthy, Rajesh, Sidharth, Ashwin, Agonafer, Dereje]. 952-959.
      • Conference Proceeding
        Power Consumption Minimization in Hybrid Cooled Server by Fan Reduction
        Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
        [Islam, MdMalekkul, Chowdhury, Uschas, Inamdar, Neha, Agonafer, Dereje]. 850-856.
      • Conference Proceeding
        Qualitative Study of Cumulative Corrosion Damage of IT Equipment in a Data Center Utilizing Air-side Economizer
        [Shah, JimilM., Awe, Oluwaseun, Agarwal, Pavan, Akhigbe, Iziren, Agonafer, Dereje, Singh, Prabjit, Kannan, Naveen, Kaler, Mike].
      • Conference Proceeding
        Rack-Level Study of Hybrid Cooled Servers using Warm Water Cooling For Distributed vs. Centralized Pumping Systems
        Proceedings IEEE Semiconductor Thermal Measurement and Management Symposium
        [Sahini, Manasa, Kshirsagar, Chinmay, Kumar, Mathan, Agonafer, Dereje, Fernandes, John, Na, Jacob, Mulay, Veerendra, McGinn, Patrick, Soares, Michael]. 155-162.
      • Conference Proceeding
        Reliability Analysis of Ultra-Low-k Large-Die Package & Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading
        Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
        [Rahangdale, Unique, Rajmane, Pavan, Misrak, Abel, Agonafer, Dereje].
      • Conference Proceeding
        Solder Ball Reliability Assessment of WLCSP - Power Cycling Versus Thermal Cycling
        Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
        [Rahangdale, Unique, Conjeevaram, B., Doiphode, Aniruddha, Rajmane, Pavan, Misrak, Abel, Sakib, A.R., Agonafer, Dereje, Nguyen, LuuT., Lohia, Alok, Kummerl, Steven]. 1361-1368.
      • Conference Proceeding
        THERMAL PERFORMANCE EVALUATION OF THREE TYPES OF NOVEL END-OF AISLE COOLING SYSTEMS
        Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
        [Sahini, Manasa, Agonafer, Dereje, Pandiyan, Vijayalan].

      2016
      • Conference Proceeding
        IMPACT OF PCB LAYER ORIENTATION ON THE DROP RELIABILITY OF WCSP BOARDS
        Electronic Components and Technology Conference
        [Mahmood, Anik, Barua, Trina, Sakib, A. R. Nazmus, Agonafer, Dereje]. 2040-2045. DOI: http://dx.doi.org/10.1109/ECTC.2016.236
      • Conference Proceeding
        A Computational Study of PCB Layer Orientation of WCSP Assembly under Temperature Dependent Drop Impact Loading
        IEEE ITherm Conference
        [Mahmood, Anik, Barua, Trina, Sabne, Sayalee, Sakib, AR Nazmus, Agonafer, Dereje]. Las Vegas, NV.
      • Conference Proceeding
        Costs and Benefits of Thermal Energy Storage for Augmenting Indirect/Direct Evaporative Cooling Systems
        IEEE ITherm Conference
        [Luttrell, Jeff, Guhe, Abhishek, Agonafer, Dereje]. Las Vegas, NV.
      • Conference Proceeding
        Effect of Removal of Layers of WCSP Assembly under Thermal Cyclic Loading: A Computational Approach
        IEEE ITherm Conference
        [Barua, Trina, Mahmood, Anik, Rajashekar, Karthik, Sabne, Sayalee, Sakib, A R Nazmus, Agonafer, Dereje]. Las Vegas, NV.
      • Conference Proceeding
        Effects of Mineral Oil Immersion Cooling on IT Equipment Reliability and Reliability Enhancements to Data Center Operations
        IEEE ITherm Conference
        [Shah, Jimil, Eiland, Richard , Siddarth, Ashwin, Agonafer, Dereje]. Las Vegas, NV.
      • Conference Proceeding
        Multi Design Variable Optimization of QFN Package on Thick Boards for Enhanced Board Level Reliability
        IEEE ITherm Conference
        [Krishnamurthy, Sumanth, Deshpande, Abhishek, Islam, Md Malekkul, Agonafer, Dereje]. Las Vegas, NV.
      • Conference Proceeding
        Parametric Study of the QFN Mounted PCB-Cu Layer Thickness Effect on the Stress Induced During Drop Testing
        IEEE ITherm Conference
        [Sabne, Sayalee , Mahmood, Anik , Barua, Trina, Agonafer, Dereje, Kansara, Nachiket]. Las Vegas, NV.
      • Conference Proceeding
        Expanding the envelope for indirect/direct evaporative data center cooling using thermal energy storage
        32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)
        [Luttrell, Jeff, Guhe, Abhishek, Agonafer, Dereje].

      2015
      • Conference Proceeding
        Computational Study of Behavior of Gas Absorption in Data Center Equipment and Its Effects on The Rate of Corrosion/Contamination
        [Bagul, Tejeshkumar, Pujara, Kanan, Shah, Jimil, Awe, Oluwaseun, Agonafer, Dereje].
      • Conference Proceeding
        Effect of Relative Humidity, Temperature and Gaseous and Particulate Contaminations on Information Technology Equipment Reliability
        [Singh, Prabjit, Klein, Levente, Agonafer, Dereje, Shah, JimilM., Pujara, KananD.].
      • Conference Proceeding
        Factors that Affect the Performance Characteristics of Wet Cooling Pads for Data Center Applications
        Proceedings IEEE Semiconductor Thermal Measurement and Management Symposium
        [Sreeram, Vishnu, Gebrehiwot, Betsegaw, Sathyanarayan, Suhas, Sawant, Digvijay, Agonafer, Dereje, Kannan, Naveen, Hoverson, James, Kaler, Mike]. 195-202.
      • Conference Proceeding
        Steady State CFD Modeling of an IT Pod and its Cooling System
        Proceedings IEEE Semiconductor Thermal Measurement and Management Symposium
        [Sathyanarayan, Suhas, Gebrehiwot, Betsegaw, Sreeram, Vishnu, Sawant, Digvijay, Agonafer, Dereje, Kannan, Naveen, Hoverson, James, Kaler, Mike]. 189-194.
      • Conference Proceeding
        THERMAL MODELING OF REMOTE RADIO HEAD UNITS
        [Sahini, Manasa, Gebrehiwot, Betsegaw, Agonafer, Dereje, Colapietro, Rocky].
      • Conference Proceeding
        Effect of Relative Humidity, Temperature and Gaseous and Particulate Contaminations on IT Equipment Reliability
        International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
        [Singh, P, Klein, L, Agonafer, Dereje, Pujara, K, Shah , JM]. San Francisco, CA.
      • Conference Proceeding
        Chip Package Interaction Study to Analyze the Mechanical Integrity of a 3-D TSV Package
        International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
        [Rajmane, P, Mirza, F, Khan, HA, Agonafer, Dereje]. San Francisco , CA.
      • Conference Proceeding
        Computational Study of Behaviour of Gas Absorption In Data Center Equipment and Its Effects on the Rate of Corrosion/Contamination
        International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
        [Bagul, T, Pujara, K, Agonafer, Dereje, Shah, JM, Awe, O]. San Francisco , CA.
      • Conference Proceeding
        Design of the Next Generation Antenna Mounts
        In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK2015
        [Puthota Dominic Savi, R, Gebrehiwot, B, Agonafer, Dereje, Skrepcinski, A, Palmer, T].

      2014
      • Conference Proceeding
        Effectiveness of Rack-Level Containment in Removing Data Center Hot-spots
        InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
        [Onyiorah, Chris, Eiland, Richard, Agonafer, Dereje, Schmidt, Roger]. 798-806.
      • Conference Proceeding
        Flow Rate and Inlet Temperature Considerations for Direct Immersion of a Single Server in Mineral Oil
        InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
        [Eiland, Richard, Fernandes, John, Vallejo, Marianna, Agonafer, Dereje, Mulay, Veerendra]. 706-714.
      • Conference Proceeding
        Global-Local Finite Element Optimization Study to Minimize BGA Damage Under Thermal Cycling
        InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
        [Deshpande, Abhishek, Khan, Hassan, Mirza, Fahad, Agonafer, Dereje]. 483-502.
      • Conference Proceeding
        Impact of Replacing Sn-Ag Bumps with Cu Pillars on the BEoL Cu/Low-k Fracture Under Reflow - A Computational Study
        InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
        [Baig, Zaeem, Shetty, TejasS., Sakib, A. R. Nazmus, Mirza, Fahad, Agonafer, Dereje]. 473-477.
      • Conference Proceeding
        Improving Cooling Efficiency of Servers by Replacing Smaller Chassis Enclosed Fans with Larger Rack-Mount Fans
        InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
        [Nagendran, Bharath, Nagaraj, Shreyas, Fernandes, John, Eiland, Richard, Agonafer, Dereje, Mulay, Veerendra]. 574-582.
      • Conference Proceeding
        Multi Objective Optimization of BEoL and fBEOL Structure in Flip Chip Package During Die Attach Process
        InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
        [Parekh, Hardik, Mirza, Fahad, Agonafer, Dereje]. 478-482.
      • Conference Proceeding
        Feasibility study of Cu wire bonds in 3D Wire Bonded Packages
        IPC Electronic System Technologies Conference
        [Naware, G, Mirza, F, Agonafer, Dereje]. Raleigh , North Carolina.
      • Conference Proceeding
        Improved Thermal Path in 3D Packages Using Higher Conductivity Molding Compounds
        IPC Electronic System Technologies Conference
        [Mirza, F, Shetty, T, Akhter, R, Hossain, M, Agonafer, Dereje]. Raleigh , North Carolina.
      • Conference Proceeding
        Finite Element Study to Analyze the Effect of Solder Ball Depopulation on the Thermo-Mechanical Damage in Pb-Free Assemblies
        Electronic System Technology Conference
        [Khan, HA, Deshpande, A, Mirza, F, Agonafer, Dereje]. Raleigh , NC.
      • Conference Proceeding
        Assessment of the Mechanical Integrity of the Si/TSV Interfacial Region in 3D Stacked Die Packages – A Hierarchical Approach
        IMAPS 2014
        [Mirza, F, Sakib, AR, Rajamane, P, Agonafer, Dereje]. Los Gatos , California.
      • Conference Proceeding
        Effect of Warm Water Cooling for an Isolated Hybrid Liquid Cooled Server
        IMAPS 2014
        [Addagatla, A, Mani, D, Fernandes, J, Eiland, R, Agonafer, Dereje, Mulay, V]. Los Gatos, California.
      • Conference Proceeding
        Evaluating Liquid Cooling at the Rack: Comparing Distributed and Centralized Pumping
        IMAPS 2014
        [Fernandes, J, Sahini, M, Agonafer, Dereje, Mulay, V, Na, J, Soares, M, Turner, C]. Los Gatos, California.
      • Conference Proceeding
        Improving Ducting to Increase Cooling Performance of High-End Web Servers subjected to significant Thermal Shadowing An Experimental and Computational Study
        IMAPS 2014
        [Mani, D, Fernandes, J, Eiland, R, Agonafer, Dereje, Mulay, V]. Los Gatos, California.
      • Conference Proceeding
        Thermal Performance of a High Density Mineral Oil Immersion Cooled Server System
        IMAPS 2014
        [Eiland, R, Vallejo, M, Fernandes, J, Agonafer, Dereje, Mulay, V]. Los Gatos, California.
      • Conference Proceeding
        Thermodynamic Analysis of Data Center Power and Water Utilization Across ASHRAE Environmental Envelopes for Different Cooling Technologies
        IMAPS 2014
        [Vallejo, M, Fernandes, J, Eiland, R, Agonafer, Dereje, Mulay, V]. Los Gatos, California.
      • Conference Proceeding
        Global-local finite element optimization study to minimize BGA damage under thermal cycling
        IEEE ITHERM Conference
        [Deshpande, A., Khan, H., Mirza, F., Agonafer, Dereje]. 483-487. DOI: http://dx.doi.org/10.1109/ITHERM.2014.6892321
      • Conference Proceeding
        Multi-Objective Design Optimization of BEoL and fBEOL Structure in Flip Chip Package During Die Attach Process
        IEEE ITHERM conference
        [Parekh, H., Mirza, F., Agonafer, Dereje]. 478-482. DOI: http://dx.doi.org/10.1109/ITHERM.2014.6892320

      In Process
      • Conference Proceeding
        A Comparative Study of Larger Rack-Mount Fans and Chassis Enclosed Fans to reduce Server Cooling Power
        14th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
        [Agonafer, Dereje, Nagendran, B, Nagaraj, S, Fernandes, J, Eiland, R, Mulay, V]. Orlando, FL. Submitted.
      • Conference Proceeding
        Methodology for Detailed CFD Modeling of High-End Web Servers
        14th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
        [Agonafer, Dereje, Mani, D, Fernandes, J, Eiland, R, Mulay, V]. Orlando, FL. Published.
      • Conference Proceeding
        Comparative analysis of different air containment configurations widely used in commercial datacenters
        Proceedings of IMECE 2013
        [Agonafer, Dereje, Rajagopalan, K, Gebrehiwot, B]. San Diego , CA. Published.
      • Conference Proceeding
        Gaseous Corrosion in Hard Disk Drive: A Computational Study
        Proceedings of IMECE
        [Agonafer, Dereje, Shah, H, Seun, A]. San Diego , CA. Published.
      • Conference Proceeding
        Utilization of Phase Change Material for the Optimization of Evaporative Cooling Technology
        Proceedings of IMECE 2013
        [Agonafer, Dereje, Shah, J, Dhiman, N, Kaler, M, Kannan, N, Hoverson, J]. San Diego ,CA. Published.
      • Conference Proceeding
        Characterizing metal-dielectric Interfacial Delamination Failure in the Die BEoL Using Molecular Dynamics and Finite Element Method
        The Intersociety Conference on Thermal and Thermo-mechanical Phenomena in Electronic Systems
        [Agonafer, Dereje, Sakib, A, Mirza, F, Shetty, T, Mohan, M]. Orlando, FL. Published.
      • Conference Proceeding
        Feasibility Study of Solder Bump Depopulation on the BEoL Thermo-mechanical Response for a Flip-Chip Package
        Electronic System Technologies Conference & Exhibition
        [Agonafer, Dereje, Baig, Z, Parekh, H, Mirza, F]. Las Vegas, NV. Published.
      • Conference Proceeding
        Coupled Thermal and Structural Parametric Analysis of Through Silicon Vias in 3D Electronics
        Proceedings of IMECE 2010
        [Agonafer, Dereje]. Vancouver, British Columbia. Published.
      • Conference Proceeding
        Novel Approaches for Extending Air Cooling Limits for Processors
        ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK
        [Agonafer, Dereje, Tran, A, Avila, M, Dekeyser, N, Wang, M, Lam, T, Karajgikar, S, Refai-Ahmed, G]. Published.
      • Conference Proceeding
        Solder Joint Reliability of Package on Package
        ASME/JSME Thermal Engineering and Summer Heat Transfer Conferences & InterPACK ’09
        [Agonafer, Dereje, Menon, A, Lakhakar, N, Karajgikar, S]. Published.
      • Conference Proceeding
        Rapid Thermo-cycling using Thermoelectric Device: Part I - Hot spot cooling
        ITherm 2008
        [Agonafer, Dereje, Lakhakar, N, Hossain, M]. Orlando, FL. Published.
      • Conference Proceeding
        Analytical Approach To Temperature Distribution Of A First Level Package With A Non-Uniformly Powered Die
        International Mechanical Engineering Congress and Exposition
        [Agonafer, Dereje, Kaisare, A, Haji-Sheikh, A, Chrysler, G, Mahajan, R]. Published.
      • Conference Proceeding
        Flexible PDMS Chip with Embedded In-plane Valves for Microfluidic Manipulations
        5th International Conference on Nanochannels, Microchannels and Minichannels
        [Agonafer, Dereje, Paruchuri, Srikar, Sin, Jeoungsik, Graff, Mason]. Pueblo , Mexico. Published.
      • Conference Proceeding
        Analytical approach to temperature distribution of a first level package with a non- uniformly powered processor
        ITHERM
        [Agonafer, Dereje, Kaisare, A, Haji-Sheik, A, Mahajan, Ravi, Chrysler, Greg]. Sheraton San Diego Hotel and Marina. Published.
      • Conference Proceeding
        Design of Polymer Tube Embedded In-Plane Micropump
        Sheraton San Diego Hotel and Marina, San Diego, CA.
        [Agonafer, Dereje, Kole, Ashutosh, Sin, Jeongsik, Lee, WooHo, Popa, Dan]. Sheraton San Diego Hotel and Marina, San Diego, CA. Published.
      • Conference Proceeding
        Effect of Under-Floor Blockages on Data Center Performance
        [Agonafer, Dereje, Bhopte, Siddharth, Sammakia, Bahgat, Iyengar, Madhusudan, Schmidt, Roger ]. Sheraton San Diego Hotel and Marina , San Diego, CA. Published.
      • Conference Proceeding
        Robust Multiphysics FEA Methodology for Extracting a Reduced-Order Model of MEMS Thermal Actuators
        ECTC
        [Agonafer, Dereje, Borovic, Bruno, Lewis, Frank L, Hossain, MM]. Sheraton San Diego Hotel and Marina, San Diego, CA.. Published.
      • Conference Proceeding
        Thermal Management of Stacked Die that Includes Memory and Logic Processors
        ITHERM
        [Agonafer, Dereje, Sandur, Bhavani, Kaisare, Abhijit]. Sheraton San Diego Hotel and Marina, San Diego, CA.. Published.
      • Conference Proceeding
        A Parametric Multi-Level Finite Element Study to Minimize BEoL Damage in a Flip Chip Package
        Surface Mount Technology Association International Conference
        [Agonafer, Dereje, Parekh, H, Mirza, F, Baig, Z]. Fort Worth ,TX. Published.
      • Conference Proceeding
        Multi-Physics Optimization of TSV Placement in Low-Powered 3D ICs to Mitigate Effects of Joule Heating and Temperature Gradients
        IEEE ECTC Conference
        [Agonafer, Dereje, Mirza, F, Ali, W, Iqbal, S]. Orlando, FL. Published.

      2013
      • Conference Proceeding
        Feasibility of Non-Linear Analysis of the BEoL Structure in a Flip Chip Package under Thermal Shock
        Proceedings IEEE Semiconductor Thermal Measurement and Management Symposium
        [Raman, Thiagarajan, Mirza, Fahad, Agonafer, Dereje, Lawrence, KentL]. 130-136.
      • Conference Proceeding
        REMOVING THE HOT-SPOTS IN HIGH POWER DEVICES USING THE THERMOELECTRIC COOLER AND MICRO HEAT PIPE
        [Hirachan, Agat, Agonafer, Dereje]. 1189-1195.
      • Conference Proceeding
        Fracture Analysis of the BEoL Region of a Package Subjected to Accelerated Thermal Cycling
        Surface Mount technology Association International Conference (SMTAi)
        [Agonafer, Dereje, Baig, Z, Parekh, H, Mirza, F]. Fort Worth, TX .
      • Conference Proceeding
        Experimental Validation of Detailed Server Level CFD Model
        ASME 2013 International Technical Conference and Exposition on Packaging and Integration of Electronic and Photonic Microsystems
        [Agonafer, Dereje, Sampath, S, Pandiyan, V, Eiland, R, Fernandes, J, Mulay, V]. Burlingame, CA.

      2012
      • Conference Proceeding
        Coupled Thermal and Structural Parametric Analysis of TSVs in 3D Electronics
        [Mirza, Fahad, Muralidharan, Bharathkrishnan, Mynampati, Poornima, Karajgikar, Saket, Agonafer, Dereje]. 675-680.
      • Conference Proceeding
        DESIGN, OPTIMIZATION AND THERMAL ANALYSIS OF MOTOR-CONTROLLERS IN A QUADRUPED ROBOT
        [Kannan, Naveen, Shah, Niket, Agonafer, Dereje, Bowling, AlanP]. 257-262.
      • Conference Proceeding
        Multi-Design Variable Optimization for a Fixed Pumping Power of a Water-Cooled Cold Plate for High Power Electronics Applications
        InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
        [Fernandes, John, Ghalambor, Saeed, Agonafer, Dereje, Kamath, Vinod, Schmidt, Roger]. 684-692.
      • Conference Proceeding
        REAR DOOR HEAT EXCHANGER COOLING PERFORMANCE IN TELECOMMUNICATION DATA CENTERS
        [Mynampati, Venkata Naga Poornima, Karajgikar, Saket, Sheerah, Ibraheem, Agonafer, Dereje, Novotny, Shlomo, Schmidt, Roger]. 417-+.
      • Conference Proceeding
        SINGLE-PHASE LIQUID COOLING OF A QUAD-CORE PROCESSOR
        [Chauhan, Anjali, Sammakia, Bahgat, Afram, FuratF., Ghose, Kanad, Refai-Ahmed, Gamal, Agonafer, Dereje]. 235-+.
      • Conference Proceeding
        SINGLE-PHASE MICROCHANNEL COOLING FOR STACKED SINGLE CORE CHIP AND DRAM
        [Chauhan, Anjali, Sammakia, Bahgat, Ghose, Kanad, Refai-Ahmed, Gamal, Agonafer, Dereje]. 225-+.
      • Conference Proceeding
        THERMAL-AWARE POWER MIGRATION IN MANY-CORE PROCESSORS
        [Raghu, Avinash, Karajgikar, Saket, Agonafer, Dereje, Sammakia, Bahgat]. 397-404.
      • Conference Proceeding
        THERMALLY BASED DESIGN OPTIMIZATION OF TELECOMMUNICATION SHELTER
        [Mynampati, Venkata Naga Poornima, Mariam, Feroz Ahamed Iqbal, Muralidharan, Bharathkrishnan, Menon, AbhilashRamachandran, Agonafer, Dereje, Hendrix, Mark]. 433-+.

      2010
      • Conference Proceeding
        Electro-thermal Analysis of In-plane Micropump
        IEEE Transactions on Components and Packaging Technologies
        [Agonafer, Dereje, Karajgikar, S, Rao, S, Sin, J, Popa, D, Chiao, JC]. 33(2), 329-339.

      2009
      • Conference Proceeding
        Optimized Chimney Designs for Effective Server Cabinets
        IMECE 2009
        [Agonafer, Dereje, Mulay, V, Iqbal Mariam, F.A., Irwin, G, Patell, D]. Orlando, FL.
      • Conference Proceeding
        Thermal Design Considerations of Air-Cooled High Powered Telecommunication Cabinets
        SemiTHERM 2009
        [Agonafer, Dereje, Mariam, FerozAhmed Iqbal, Raju, Uthaman, Mulay, Veerendra, Sivanandan, Deepak, Hendrix, Mark]. San Jose , CA.

      2008
      • Conference Proceeding
        CFD modeling of a thermoelectric device for electronics cooling applications
        Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
        [Lakhkar, Nikhil, Hossain, Mohammad, Agonafer, Dereje]. 889-+.
      • Conference Proceeding
        Comparison of overhead supply and underfloor supply with rear heat exchanger in high density data center clusters
        [Udakeri, Ravi, Mulay, Veerendra, Agonafer, Dereje]. 166-173.
      • Conference Proceeding
        Development of an analytical model to a temperature distribution of first level package with a non-uniformly powered die
        [Kaisare, Abhijit, Agonafer, Dereje, Haji-Sheikh, Abdolhossein, Chrysler, Greg, Mahajan, Ravi]. 443-449.
      • Conference Proceeding
        Multi-objective optimization entailing computer architecture and thermal design for non-uniformly powered microprocessors
        Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
        [Raju, Uthaman, Kaisare, Abhijit, Agonafer, Dereje, Haji-Sheikh, Abdolhossein, Chrysler, Greg, Mahajan, Ravi]. 432-+.
      • Conference Proceeding
        Multi-objective parametrization of graphite heat spreader for portable systems applications
        [Banerjee, Arijit, Lakhkar, Nikhil, Riaz, Shahi, Refai-Ahmed, Gamal, Agonafer, Dereje]. 79-85.
      • Conference Proceeding
        Thermomechanical Challenges in Electronic Packaging
        SemiTHERM 2008
        [Agonafer, Dereje, Kaisare, A, Mulay, V, Karajgikar, S, Lakhkar, N]. San jose , CA.

      2006
      • Conference Proceeding
        Computational modeling of the reliability of stacked low density interconnects devices
        [Hossain, MohammadM., Lee, Yongje, Akhter, Roksana, Agonafer, Dereje, Dishongh, Terry]. 1088-+.
      • Conference Proceeding
        Development of constitutive equations and novel methodology for failure prediction models for SAC lead-free alloys
        [Agonafer, Dereje, Hossain, MohammadMasum]. 13-+.
      • Conference Proceeding
        Effect of CRAC location on fixed rack layout
        [Bedekar, Vishwas, Karajgikar, Saket, Agonafer, Dereje, Iyyengar, Madhusudan, Schmidt, Roger]. 421-+.
      • Conference Proceeding
        Fluxless optical fiber attachment for hermetic MOEMS applications
        [Fasoro, AbiodunA., Popa, Dan, Beardsley, Heather, Sin, Jeongsik, Agonafer, Dereje, Stephanou, HarryE., Deeds, MichaelA.]. 1365-+.
      • Conference Proceeding
        Reliability of lead (Pb) free SAC solder interconnects with different PWB surface finishes under mechanical loading
        [Hossain, MohammadM., Zahedi, Fahad, Agonafer, Dereje, Viswanadham, Puligandla, Dunford, StevenO.]. 1038-+. DOI: http://dx.doi.org/10.1109/ITHERM.2006.1645459
      • Conference Proceeding
        Thermal management of die stacking architecture that includes memory and logic processor
        Electronic Components and Technology Conference
        [Dewan-Sandur, BhavaniP., Kaisare, Abhijit, Agonafer, Dereje, Agonafer, Damena, Amon, Cristina, Pekin, Senol, Dishongh, Terry]. 1963-+.

      2005
      • Conference Proceeding
        Optimization of data center room layout to minimize rack inlet air temperature
        [Bhopte, Siddharth, Agonafer, Dereje, Schmidt, Roger, Sammakia, Bahgat]. 33-41.

      2002
      • Conference Proceeding
        Prediction of effect of heat sink adhesive on mechanical reliability of a wire bonded plastic ball grid array package
        [Kaisare, A., Han, Zhenxue, Agonager, D., Ramakrishna, K.]. 926-931. DOI: http://dx.doi.org/10.1109/ITHERM.2002.1012555

      2015
      • Other
        A Brief Overview of Recent Developments in Thermal Management in Data Centers
        [Alkharabsheh, Sami, Fernandes, John, Gebrehiwot, Betsegaw, Agonafer, Dereje, Ghose, Kanad, Ortega, Alfonso, Joshi, Yogendra, Sammakia, Bahgat]. Journal of Electronic Packaging. 137(4), DOI: http://dx.doi.org/10.1115/1.4031326

      2014
      1996
      • Other
        Application of CAE/CAD To Electronic Systems
        ASME Publication 96-EEP-Vol. 18
        [Agonafer, Dereje, Fulton, R, Kowalski, G].

      1995
      • Other
        IEEE CPMT-A
        [Agonafer, Dereje, Bhavnani, SH, Fitch, J].

      1994
      • Other
        Heat Transfer in Electronic Equipment - 1994
        ASME HTD-Vol. 292
        [Agonafer, Dereje, Amon, C, Wirtz, R].
      • Other
        CAE/CAD Application to Electronic Packaging
        ASME Publication 94-EEP-Vol. 9
        [Agonafer, Dereje, Fulton, RE].

      1993
      • Other
        Solutions to CFD Benchmark Problems in Electronic Packaging
        ASME Publication HTD-Vol. 255
        [Agonafer, Dereje, Amon, C].

      1992
      • Other
        Computer Aided Design in Electronic Packaging
        ASME Publication 92-EEP-Vol. 3
        [Agonafer, Dereje, Fulton, RE].

      1991
      • Other
        Heat Transfer in Electronic Equipment - 1991
        ASME HTD-Vol. 171
        [Agonafer, Dereje, Ortega, A, Webb, B].

      1990
      • Other
        Numerical and Experimental Investigationof Heat Transfer Phenomena Over an Electronic Module
        [D. A International Business Machines Corp. Advanced Thermal Laboratory PO, 390, B, Poughkeepsie, B, 12602, NY]. DOI: http://dx.doi.org/10.1109/STHERM.1990.68498

      1989
      • Other
        Numerical Simulation of Convection in Electronic Cooling Equipment
        ASME Publication HTD-Vol. 121
        [Agonafer, Dereje, Ortega, A].

      2014
      • Technical Report
        Influence of variation in CPU utilization on the rack level fan configuration as a cooling technique for high end servers
        14th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
        [Nagaraj, S, Nagendran, B, Fernandes, J, Eiland, R, Agonafer, Dereje, Mulay, V]. Orlando, FL.

      2009
      • Textbook
        Novel Approaches for Extending Air Cooling Limits for Processors
        IMECE
        [Agonafer, Dereje, Tran, A, Avila, M, Dekeyser, N, Wang, M, Lam, T, Karajgikar, S, Refai-Ahmed, G]. Orlando, FL.

Presentations

    • December  2019
      Agonafer, Dereje, "Thermal and Control Design for Dynamic Air and Liquid Cooling in Data Centers", Maui, HI. (December , 2019).
    • October  2019
      Agonafer, Dereje, "The Future of Digital Infrastructure for Colo, Telco, Cloud & MSP", Dallas, TX. (October , 2019).
    • January  2019
      Agonafer, Dereje, "Intelligent, Efficient and Resilient Data Centers: What is Needed? Rules of Thumb, Science or Just Technology", Atlanta, GA. (January , 2019).
    • June  2018
      Agonafer, Dereje (Panelist), "The Coming of Age of Data Centers Built Using Stock Components: Intelligent Self-Sensing, Self-Regulating Data Centers", Orlando, FL. (June 6, 2018).
    • November  2017
      Agonafer, Dereje, "Thermal and Reliability Challenges of Immersion Cooling", Huawei Japan, Tokyo, Japan. (November 1, 2017).
    • October  2017
      Agonafer, Dereje, "Experimental and Computational Thermal and Reliability Considerations in Containerized Data Center", http://www.impact.org.tw/, Taiwan. (October 24, 2017).
    • November  2016
      Agonafer, Dereje, "“Birth-to-death (from Die Metal/Passivation Processing to Board Assembly) Modeling Methodology for the Optimization of Custom Board-Level Reliability.”". (November , 2016).
    • September  2016
      Agonafer, Dereje, "“Experimental and Computational Thermal and Reliability Considerations in Data Centers.”". (September 23, 2016).
    • June  2016
      Agonafer, Dereje, "“Air-Side Economization, Direct And Indirect Evaporative Cooling For Energy Efficient Data Centers: Thermal Management and Contamination Challenges.”". (June , 2016).
    • September  2015
      Agonafer, Dereje, "“Thermal and Mechanical Challenges in Data Center.”", Los Gatos, California. (September , 2015).
    • May  2014
      Agonafer, Dereje, ""Thermal and Mechanical Challenges in Microelectronics: From Device to Data-Center-Room Level."", May 28, 2014, Walt Disney World Swan & Dolphin Hotel, Lake Buena Vista (Orlando), FL. (May 28, 2014).
    • July  2012
      Agonafer, Dereje, "“Thermal Challenges in 3D Packaging”", Puerto Rico. (July , 2012).
    • October  2011
      Agonafer, Dereje, "“Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers,”", Binghamton University. (October , 2011).
    • July  2009
      Agonafer, Dereje, ""Thermal Challenges in Electronics Systems: Devices to Systems."", Westin St Francis Hotel, San Francisco. (July 23, 2009).
    • August  2008
      Agonafer, Dereje, "“Challenges in Thermal Management of Electronic Systems”". (August 20, 2008).
    • July  2008
      Agonafer, Dereje, "“Thermomechanical Challenges In Electronic Packaging: Part II Lytron Seminar”", Lytron Inc.. (July 17, 2008).
    • June  2008
      Agonafer, Dereje, "“Electronics Cooling: Challenges at the Device and System Level.”", Harvard School of Engineering and Applied Sciences, Harvard University. (June 18, 2008).
    • March  2008
      Agonafer, Dereje, ""Thermomechanical Challenges in Electronic Packaging."", IEEE. (March 20, 2008).
    • February  2008
      Agonafer, Dereje, "Challenges in Microelectronics Systems", MIT Mechanical Engineering Department. (February 29, 2008).
    • February  2008
      Agonafer, Dereje, "“Challenges in Electronic Cooling.”", Tufts University Medford/Somerville. (February 7, 2008).
    • October  2007
      Agonafer, Dereje, "“Challenges in Electronic Cooling.”". (October 10, 2007).
    • October  2006
      Agonafer, Dereje, "“Thermo-Mechanical Reliability Challenges in Stacked Packaging”", GE Global Research Center, Niskayuna, NY. (October , 2006).
    • September  2006
      Agonafer, Dereje, "Keynote Address", Toyama, Japan. (September , 2006).
    • September  2006
      Agonafer, Dereje, "Oral Presentation Not Otherwise Specified", Santa Clara, CA. (September 1, 2006).
    • August  2006
      Agonafer, Dereje, "Challenges in Electronic Packaging", ATI Technologies, Toronto, Canada. (August , 2006).
    • August  2006
      Agonafer, Dereje, "Invited Seminar on microelectronics, cooling and energy related issues", Raytheon, Co.. (August 25, 2006).
    • December  2005
      Agonafer, Dereje, "Electronic Packaging", American Society of Mechanical Engineers, Plano, TX. (December 6, 2005).
    • October  2005
      Agonafer, Dereje, "Opportunities Around Computer Sciences and High Tech", The College of Engineering, Architecture and Computer Sciences, Howard University, Washington, D.C.. (October 14, 2005).
    • October  2005
      Agonafer, Dereje, Hossain, MdSahadat, "Effect of Surface Finish on Lead Free Solder Joint", Surface Mount Technology Association, Dallas, TX. (October 11, 2005).
    • January  2005
      Agonafer, Dereje, "Electronic Packaging", Cape Town, South Africa. (January , 2005).
    • May  2002
      Agonafer, Dereje, "Computer Aided Thermo/Mechanical Modeling of Electronic Systems", International Microelectronics And Packaging Society (IMAPS) & Surface Mount Technology Association (SMTA). (May 16, 2002).
    • August  2001
      Agonafer, Dereje, "Keynote Address". (August , 2001).
    •  1997
      Agonafer, Dereje, "Keynote Address", Brooklyn, New York. ( , 1997).
    • September  1997
      Agonafer, Dereje, "Cooling Requirements for Future High Performance Electronic Components", Stuggart, Germany. (September 25, 1997).
    • September  1997
      Agonafer, Dereje, "Thermo-Mechanical Analysis in Electronic Packaging", Cannes, France. (September 23, 1997).
    • April  1995
      Agonafer, Dereje, "Application of Computational Techniques To Electronic Cooling", Aspen, Colorado. (April 22, 1995).
    • August  1994
      Agonafer, Dereje, "Application of Computational Modeling to Large Scale Computer Systems", International Association for Computational Mechanics (IACM), Chiba, Japan. (August , 1994).

Students Supervised

    • Present
      Postdoctoral Research Supervision
      (Mech and Aero Engineering)
    • Present
      Dissertation Committee Chair

      PhD Student Dissertation Committee Advisor
    • Present
      Graduate Supervised Research

      Masters Student Advisor
    • May 2018
      Master's Thesis Committee Chair
    • Apr 2018
      Master's Thesis Committee Member
    • 2017
      Master's Thesis Committee Chair
      (Mech and Aero Engineering)
    • 2016
      Supervisory Committee Chair
      Jeff Luttrell, Thermal Energy Storage for Expanded Use of Data Center Indirect/Direct Evaporative Cooling
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Aug 2016
      Supervisory Committee Chair
      A R Nazmus Sakib, On the Enhancement of Thermo-Mechanical and Impact Reliability of Passive and Active Microelectronic Devices
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Aug 2016
      Supervisory Committee Chair
      Awe Oluwaseun, Exposure of Legacy and Future Hardware, under Real Data Center Conditions in an ANSI/ISA Classified G2 Environment
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Dissertation Committee Member
      Yasir Modak, CFD Analysis of Vapor Chamber with Micro Pillars as Heat Spreader for High Power Electronic Devices
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Graduate Supervised Research
      Neha Inamdar,
      Masters Student Advisor
    • May 2016
      Supervisory Committee Chair
      Abhishek Guhe, Control Strategies for Air-side Economization, Direct & Indirect Evaporative Cooling And Artificial Neural Network Applications For Energy Efficient Data Centers
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Supervisory Committee Chair
      Anik Mahmood, Computational Analysis of Impact Loading on Wafer Level Chip Scale Packages Mounted on Two Boards of Varying Thickness
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Supervisory Committee Chair
      Avinash Kumar Ray, Design And Optimizing Louver Blade Angles To Enhance Better Air Flow Distribution And Improve Thermal Efficiency In Data Centers Using CFD Analysis
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Supervisory Committee Chair
      Avinash Veluturla, Design and parametric analysis of flow control device for dynamic cold plate to optimize the temperature fluctuations of the Multi-chip module
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Supervisory Committee Chair
      Betsegaw Gebrehiwot, MAXIMIZING USE OF AIR-SIDE ECONOMIZATION, DIRECT AND INDIRECT EVAPORATIVE COOLING FOR ENERGY EFFICIENT DATA CENTERS
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Supervisory Committee Chair
      Dhaval Thakkar, Performance Enhancement of Raspberry Pi Server for The Application Of Oil Immersion Cooling
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Supervisory Committee Chair
      Dhruva Chandra Gaibola,
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Supervisory Committee Chair
      Jaykishankumar Patel, Evaluation of cooling architectures and control strategies in airflow provisioning of a modular data center
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Supervisory Committee Chair
      Jimil Shah, RELIABILITY CHALLENGES IN AIRSIDE ECONOMIZATION AND OIL IMMERSION COOLING
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Supervisory Committee Chair
      Koushik Epuri, CFD Analysis and Design optimization of parallel plate heat sink for immersion cooling
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Supervisory Committee Chair
      MD Malekkul Islam, Experimental Characterization of Hybrid Cooled Cisco Servers Including the Effect of Warm Water Cooling
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Supervisory Committee Chair
      Parth Soni, Performance evaluation of plate fin and pin fin heat sinks and design optimization of cold plate
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Supervisory Committee Chair
      Rajesh Kasukurthy, Developing and Validating Energy Models for (Direct/ Indirect) Evaporative Cooling used for Data Centres
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Supervisory Committee Chair
      Shivang Desai, CFD modelling of wet cooling pad and customization of parallel plate heat sink for data center application
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Supervisory Committee Chair
      Subramanian Ramachandran Gowtham,
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Supervisory Committee Chair
      Sumanth Krishnamurthy, Experimental and Computational Board Level Reliability Assessment of Thick Board QFN Assemblies Under Power Cycling
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2016
      Supervisory Committee Chair
      Trina Barua, A comparative study of the thermo-mechanical behavior of WCSP assembly due to difference in PCBs’ layer thickness
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Supervisory Committee Chair
      Aniket Ram Kalambe, Two Phase Flow CFD Analysis of Refrigerants in a Condenser Pipe for Prediction of Pressure Drop & Pumping Power
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Supervisory Committee Chair
      Deekshith Pittala, Computational Analysis of Enhancing Heat Transfer in 3-D Stacked Die Using Different Finned Heat Sink
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Supervisory Committee Chair
      Dhanraj Arun Patil, CFD MODELING AND PARAMETRIC STUDY OF VAPOR CHAMBER FOR HIGH-POWER ELECTRONIC DEVICES
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Supervisory Committee Chair
      FRAMROZ BHARUCHA, COMPUTATIONAL ANALYSIS OF I.T. RACK UNDER VIBRATION LOAD
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Supervisory Committee Chair
      Guruprasad Shrikant Shinde, Board level reliability and failure analysis of custom printed circuit boards with WCSP packages
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Supervisory Committee Chair
      Kanan Pujara, Experimental Study to find the Effect of Temperature and Humidity on the Corrosion rates of Copper and Silver in an IT Equipment
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Supervisory Committee Chair
      Karthik Rajashekar, Impact of Viscoelastic Material Characterization of PCBs on the Thermo-Mechanical and Solder Joint Reliability of QFN Thick Package
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Supervisory Committee Chair
      Kota Venkata Naga Indu Sravani, DEVELOPMENT OF A METHODOLOGY AND SAMPLE PREPARATION TO EVALUATE RELIABILITY OF OIL COOLED DATA CENTER
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Supervisory Committee Chair
      Marianna Vallejo, Energy and Water Impacts of Data Center Cooling Systems: A Triple Bottom Line Assessment for Facility Design
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Supervisory Committee Chair
      Monisha Mohan, Benchmarking of modified bend test fixture and the relationship of life prediction between monotonic cyclic bending test and thermal cycling test for QFN package
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Supervisory Committee Chair
      Niravkumar Dodia, Developing and Validating Thermodynamic Models For Evaporative Cooling Employed In Data Centers
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Supervisory Committee Chair
      PRITAM KARMOKAR, A Study on Evaporative Cooling for Data Centers & Artificial Neural Network Modeling.
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Supervisory Committee Chair
      Ruturaj Kiran Kokate, Experimental Analysis Validating a Control Scheme to Develop a Dynamic Cooling Solution for Non-Uniform High Powered Electronic Devices in Data Center.
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Supervisory Committee Chair
      Sahithi Reddy Nagilla, NON-THERMAL DESIGN CONSIDERATION FOR OIL COOLED DATA-CENTERS AND ITS SERVICEABILITY
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Supervisory Committee Chair
      SAYALEE PRADEEP SABNE, EXPERIMENTAL STUDY TO FIND THE EFFECT OF TEMPERATURE AND HUMIDITY ON THE CORROSION RATES OF COPPER AND SILVER IN AN IT EQUIPMENT
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2015
      Supervisory Committee Chair
      Shiva Keralapura, CAE ANALYSIS ON A FORD ECOBOOST MUSTANG CONNECTING ROD FOR STRUCTURAL STEEL, ALUMINUM ALLOY
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2015
      Supervisory Committee Chair
      ASHWIN SIDDARTH, EXPERIMENTAL STUDY ON EFFECTS OF SEGREGATED COOLING PROVISIONING ON THERMAL PERFORMANCE OF INFORMATION TECHNOLOGY
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2015
      Supervisory Committee Chair
      Devi Prasad Gorrepati, CFD BASED DESIGN AND MODELLING OF WIND FENCE TO MITIGATE HIGHSPEED WIND LOADING ON A MODULAR DATA CENTER
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2015
      Supervisory Committee Chair
      John Fernandes, Minimizing Power Consumption at Module, Server and Rack-Levels within a Data Center through Design and Energy-Efficient Operation of Dynamic Cooling Solutions
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2015
      Supervisory Committee Chair
      Krishna Desai, Efficient Method to cool the datacenter using Solar Energy
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2015
      Supervisory Committee Chair
      Mohammed Shahid Ali, ESTIMATION OF FRACTURE MECHANICS PARAMETERS IN 3D TSV PACKAGE DURING CHIP ATTACHMENT PROCESS
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2015
      Supervisory Committee Chair
      Palak Patel, Optimal Design of Cooling and Ventilation of a Telecommunication Shelter at High Altitude
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2015
      Supervisory Committee Chair
      Parinda Patel, Structural Integrity of TSVs in 3D Package Under Thermal Loading
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2015
      Supervisory Committee Chair
      Richard Eiland, Thermo-Mechanical Design Considerations at the Server and Rack Level to Achieve Maximum Data Center Energy Efficiency
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2015
      Supervisory Committee Chair
      Sanjay Revathi, Methodology to determine the Effect of PCB layer Copper Thickness and Prepreg layer stiffness on Solder Joint Reliability
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2015
      Supervisory Committee Chair
      Vignesh Balasubramanian, Sustainable Methodology for the Use of Fuel Cells in Data Centers
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Dissertation Committee Co-Chair
      Aakash Patel, Thermal Analysis of QFN Package
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Dissertation Committee Co-Chair
      Gowtham Pedapudi, Performance study of thermal interface material in Generation-3 Intel server motherboard
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Supervisory Committee Chair
      Alekhya Addagatla, Effect of warm water cooling for an isolated hybrid liquid cooled server
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Supervisory Committee Chair
      Divya Mani, Improving Ducting to Increase Cooling Performance of High-End Web Servers Subjected to Significant Thermal Shadowing - An Experimental and Computational Study
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Supervisory Committee Chair
      Fahad Mirza, Compact modeling methodology development for thermomechanical assessment in high-end mobile applications-planar and 3D TSV packages
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Supervisory Committee Chair
      G Naware, Thermo-Mechanical Study of Copper And Gold Wirebonds in 3D Electronic Package
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Supervisory Committee Chair
      Harshal Gujarathi, Use of Nanoparticle Enhanced Phase change Material(NEPCM) For Data Center Cooling Improving ducting to increase cooling performance
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Supervisory Committee Chair
      Prasad Revankar, Use Of A Windbreaker To Mitigate High Speed Wind Loading On A Modular Data Center
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Supervisory Committee Chair
      Pratik Kekre, Multi-variable design optimization of a contemporary cold plate for a fixed pumping power forminimizing the thermal resistance
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Supervisory Committee Chair
      Ravi Mutyala, Improving air cooling efficiency of 2OU High-end server by using bigger rack level fans and controlling flow using bimetallic strips
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Supervisory Committee Chair
      Ruddhi Deshmukh, Data center cooling augmentation using micro-encapsulated phase change material
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Supervisory Committee Chair
      Saeed Ghalambor, Analytical solutions of steady-state heat conduction in multi-layer stack packaging
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Supervisory Committee Chair
      Shreyas Nagara, Influence of variation in CPU utilization on the rack level fan configuration as a cooling technique for high end servers
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Supervisory Committee Chair
      Suhas Sathyanarayan, Experimental And Computational Study Of An It Pod And Its Cooling System
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Supervisory Committee Chair
      Tejas Shetty, Board level reliability assessment of thick FR-4 QFN assemblies under thermal cycling
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Supervisory Committee Chair
      Tejeshkumar Bagul, Computational study of behavior of gas absorption in data center equipment and its effects on the rateof corrosion/contamination
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Supervisory Committee Chair
      Trevor McWilliams, Evaluating heat sink performance in an immersion -cooled server system
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • Dec 2014
      Supervisory Committee Chair
      Vishnu Sreeram, Factors Affecting The Performance Characteristics Of Wet Cooling Pads For Data Center Applications
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2014
      Supervisory Committee Member
      Mahdi Haghshenas-Jaryani, Dissertation: A New Multiscale Approach For Dynamic Modeling and Simulation of Micro-Nano Biomolecular Systems Characterized By A Low Reynolds Number
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2014
      Supervisory Committee Member
      Moinuddin Ahmed, Dissertation: (EE) “Flexible MEMS Sensors and Pyroelectric Thin Film”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2014
      Supervisory Committee Member
      Namrata Kamte, Thesis: Microwave-Based Navigation of Femtosatellites Using On-Off Keying
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2014
      Supervisory Committee Chair
      Bharat Nagendran, Improving Server Efficiency by Replacing Smaller Chassis Enclosed Fans with Larger Rack-Mount Fans : An Experimental and Computational Study
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2014
      Supervisory Committee Chair
      Chinmay Date, Development of artificial neural network based Black Box Model of a data center as a temperature predicting tool as a function of server location, dissipating server heat and CRAC fan speed
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2014
      Supervisory Committee Chair
      Chris Onyiorah, Computational Study of Datacenter Hotspot Mitigation With Snorkels as An Alternative Rack- Level Containment Strategy
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2014
      Supervisory Committee Chair
      Hardik Parekh, Multi-objective design optimization of BEoL / fBEol region during chip attachment to substrate
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2014
      Supervisory Committee Chair
      Kasturi Rajagopalan, Comparative analysis of widely used air containment systems in commercial data centers for maximum cooling performance
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2014
      Supervisory Committee Chair
      Rahul Raghunathan, Experimental study on the effects of gaseous contamination on IT equipment
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2014
      Supervisory Committee Chair
      Vishok Amar Kumar, Real time temperature prediction in a data center environment using an adaptive algorithm
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • May 2014
      Supervisory Committee Chair
      Zaeem Baig, 3-D Fracture Analysis Of the Cu/Low-k Stack in a Flip Chip Package During Die Attachment to Mitigate CPI Risk
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2013
      Supervisory Committee Chair
      Hardik Shah, Gaseous corrosion in hard disk drive : A computational study
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2013
      Supervisory Committee Chair
      Harsh Patel, Immersion cooling of high end data center servers and validation through experiments
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2013
      Supervisory Committee Chair
      Jeet Shah, Utilization of microencapsulated phase change material for the optimization of evaporative cooling tehcnology
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2013
      Supervisory Committee Chair
      P Joshi, Thermal Enhancement of Automobile ECM
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2013
      Supervisory Committee Chair
      Shreyas Sampath, Thermal Analysis of High End Servers Based On Development of Detail Model And Experiments
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2013
      Supervisory Committee Member
      Bhargav Nabar, Dissertation: (E.E.)
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2013
      Supervisory Committee Member
      Md. Iqbal Mahmud, Dissertation: (E.E.)
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2012
      Dissertation Committee Co-Chair
      (Spring 2012/Summer 2012) “Correlation of Gaseous and Particulate Contamination with Corrosion Rate”
      Senior Design Project Supervision
    • 2012
      Supervisory Committee Chair
      Agat Hirachan, Mitigation of hot-spots in highend microprocessors using bulk and thin film thermoelectric coolers [electronic resource]
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2012
      Supervisory Committee Chair
      Kushal Aurangabadkar, Impact of louver orientation on air flow distribution and thermal management of data centers[electronic resource]
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2012
      Supervisory Committee Chair
      Niket Shah, CDF analysis of direct evaporative cooling zone of air-side economizer for containerized data center
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2012
      Supervisory Committee Chair
      Nikhil Dhiman, Application of phase change material in sustainable cooling of data centers
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2012
      Supervisory Committee Chair
      Thiagarajan Ramanm, Assessment of the mechanical integrity of Cu/low -k dielectric in a flip chip pachage [electronic resource]
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2012
      Supervisory Committee Chair
      Vaidehi Patel, Experimental/computational analysis of active cooling of stacked device using multidimensional configured thermoelectric modules
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2012
      Supervisory Committee Chair
      Vijayalayan Pandiyan, Development of detailed computational flow model of high end server and validation using experimental methods [electronic resource]
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2012
      Supervisory Committee Member
      Prashaanth Ravindran, Dissertation: (M.E.)
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2011
      Master's Thesis Committee Member
      G Gulawani, Non-Thesis Project: “CFD Analysis of Heat Sinks for Data Center Servers”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2011
      Supervisory Committee Chair
      B Muralidharan, Thesis: “Multi Objective Thermal and Energy Based Design Optimization of Telecommunication Cabinets/Shelters”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2011
      Supervisory Committee Chair
      Bharathkrishnan Muralidharan, Multi Objective Thermal and Energy Based Design Optimization of Telecommunication Cabinets/ Shelters
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2011
      Supervisory Committee Chair
      G Gulawani, CFD analysis of heat sinks for Data Centers Servers
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2011
      Supervisory Committee Chair
      Govind Gulawani, Non-Thesis Project: “CFD analysis of heat sinks for Data center servers”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2011
      Supervisory Committee Chair
      Huy Phan, Development of an experimental and analytical model of an active cooling method for high-power three- dimensional integrated circuit (3D-IC) utilizing multidimensional configured thermoelectric modules
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2011
      Supervisory Committee Chair
      Jake Phan, Dissertation: "Development of an Experimental and Analytical Model of an Active Cooling Method for High- Power Three-Dimensional Integrated Circuit (3D-IC) Utilizing a Multidimensional Configured Thermoelectric Modules
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2011
      Supervisory Committee Chair
      Kunal Kale, Study of effects of contamination in data center
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2011
      Supervisory Committee Chair
      Naveen Kannan, Design and modeling techniques for cooling of telecommunication systems
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2011
      Supervisory Committee Chair
      Poornima Mynampati Venkata Naga, Alternative cooling technologies for telecommunication data centers - Air cooling and Rear Door Heat Exchangers
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2011
      Supervisory Committee Chair
      Sunil Lingampalli, Performance optimization of multi-core processors using core hopping - thermal and structural
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2011
      Supervisory Committee Member
      Daniel Montrallo Flickinger,
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2011
      Undergraduate Capstone/Senior Project
      Team Thermoelectric Device (Spring 2011/Summer 2011) “Thermoelectric Device Study”
      Senior Design Project Supervision
    • 2010
      Supervisory Committee Chair
      A Menon, Thesis: "Thermo-Mechanical Analysis of a 3D Package in Microelectronics and Cooling Technologies for an IGBT Thermal Tester in Power Electronics"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      Supervisory Committee Chair
      A Menon, Thesis: "Thermo-Mechanical Analysis of a 3D Package in Microelectronics and Cooling Technologies for an IGBT Thermal Tester in Power Electronics"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      Supervisory Committee Chair
      A Raghu, Thesis: "Dynamic Thermal Management of Multi-Core Processors Using Core Hopping"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      Supervisory Committee Chair
      F Iqbal Mariam, Thesis: "Thermal Management of Outside Plant Telecommunication Cabinets: Design and CFD Modeling Methodology"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      Supervisory Committee Chair
      N Lakhkar, Dissertation: "Effect of Structural Design Parameters on Wafer Level CSP Ball Shear Strength and Their Influence on Accelerated Thermal Cycling Reliability"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      Supervisory Committee Chair
      S Karajgikar, Dissertation: "Effective Thermal Management of Electronic Devices From System to Die Level"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      Supervisory Committee Chair
      Saket Suhas Karajgikar, Effective thermal management of electronic devices from system to die level
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      Supervisory Committee Chair
      T Huynh, Non-Thesis Project: "Terahertz (THz) Quantum Cascade Laser Device-Level Thermal Performance Assessment & Some Aspects of Reliability"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      Supervisory Committee Chair
      T Huynh, Terahertz (THz) Quantum Cascade Laser Device-Level Thermal Performance Assessment &Some Aspects of Reliability
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      Supervisory Committee Chair
      V Kumar, Optimization of a Micro-Channel Heat Sink for Minimum Pumping Power in High Power Devices
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      Supervisory Committee Chair
      V Kumar, Non-Thesis Project: “Optimization of a Micro-Channel Heat Sink for Minimum Pumping Power in High Power Devices”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      Supervisory Committee Chair
      V Mynampati, Thesis: “Alternative Cooling Technologies for Telecommunication Data Centers: Air Cooling and Rear Door Heat Exchangers”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      Supervisory Committee Member
      D Kaluvagunta,
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      Supervisory Committee Member
      G Nair, Non-Thesis Project: MEMS Based Wireless and Therapeutic Systems for Bio Medical Applications: Magnetic Analysis of The Cantilever Model in ANSYS
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      Supervisory Committee Member
      R Gaba, Non-Thesis Project: MEMS Based Wireless Sensing and Therapeutic Systems for Biomedical Applications Part A
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2010
      Supervisory Committee Member
      S Galande, Non-Thesis Project: MEMS Based Wireless Sensing and Therapeutic Systems for Biomedical Applications Part B
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2009
      Supervisory Committee Chair
      A Banerjee, Thesis: "Multi-Objective Optimization of Graphite Heat Spreader For Portable Systems Application"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2009
      Supervisory Committee Chair
      R Lingam, Non-Theses: “Chassis Design &Thermal analysis of Motor Controllers in a Quadruped Robot”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2009
      Supervisory Committee Chair
      U Raju, Thesis: “Characterization of Thermal Challenges in Electronics: Leakage Current, Co-Architectural Design and Rack Level Cooling”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2009
      Supervisory Committee Chair
      V Mulay, Dissertation: “Development of Guidelines for Dynamic Thermal Management of Data Centers by Monitoring and Control of Cooling Equipment Based on Rack Inlet Temperatures"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2009
      Supervisory Committee Member
      M Noor, Thesis: (E.E.)
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2009
      Supervisory Committee Member
      P Pandojirao- Sunkojirao, Dissertation: (E.E.)
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2009
      Supervisory Committee Member
      S TakkallaPally, Thesis:
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2009
      Undergraduate Capstone/Senior Project
      AMD (Fall 2008/Spring 2009). “Design and Development of a Foam Heat Sink for High Powered Graphical Processing Units (GPUs).”
      Senior Design Project Supervision
    • 2008
      Dissertation Committee Co-Chair
      A Fasoro, Dissertation: “Design for Reliability in Microoptelectromechanical Systems (MOEMS)”
    • 2008
      Supervisory Committee Chair
      A Kaisare, Dissertation: “An Analytical and Numerical Model For Design of Non-Uniformly Powered Silicon Chips Based on Both Thermal and Device Clock Performance”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2008
      Supervisory Committee Chair
      A Trivedi, Thesis: "Thermo-Mechanical Solutions in Electronic Packaging: Component to System Level
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2008
      Supervisory Committee Chair
      E.N. Rodrigo, Thesis: "Analytical Thermal Model of Generic Multi-Layer Spacerless 3D Package"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2008
      Supervisory Committee Chair
      K Yasin, Performance of a Masterflux Compressor in a Refrigeration Unit For High End Computer System Application
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2008
      Supervisory Committee Chair
      R Gandhi, Thesis: "Review of Thermal Interface Technology"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2008
      Supervisory Committee Chair
      R Udakeri, Thesis: "Comparison of Overhead Supply & Under Floor Supply With Rear Door Heat Exchange in High Density Data Center Clusters"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2008
      Supervisory Committee Chair
      V Nagaraj, Thesis: "Flip Chip Back End Design Parameters to Reduce Bump Electromigration"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2008
      Supervisory Committee Member
      M Rahman, Dissertation:
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2008
      Undergraduate Capstone/Senior Project
      Team AMD (Fall 2007/Spring 2008) “Design and Development of a Heat Sink for High Powered Graphical Processing Units (GPUs).”
      Senior Design Project Supervision
    • 2008
      Undergraduate Capstone/Senior Project
      Team Siemens (Spring/Summer 08)"Fabrication and Characterization of Mimic Cell Identical to Siemen's Power Cell."
      Senior Design Project Supervision
    • 2007
      Supervisory Committee Chair
      Paruchuri Srikar, Thesis: “Flexible Microfluidic Circuit With Embedded in Plane Valve”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2007
      Supervisory Committee Member
      A. R. Patil, Thesis: Complete Stress Analysis for Two Dimensional Inclusion Problem Using Complex Variables”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2007
      Supervisory Committee Member
      C Golsch, Non-Thesis Project: “Magnetically Coupled Substrate Safety Valve”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2007
      Supervisory Committee Member
      G Iyer, Dissertation: “Context Aware Inference System To Capture Design Rationale From Legacy MCAD”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2007
      Supervisory Committee Member
      K Verma, Non-Thesis Project: Stress Simulation Using ANSYS Workbench”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2007
      Supervisory Committee Member
      M Manduva, Non-Thesis Project: "Deflection of plate using Mathematica"
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2007
      Supervisory Committee Member
      Mahesh Kailas, Thesis: Stress Analysis of an Ellipsoidal Inclusion
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2007
      Supervisory Committee Member
      R Mitchell, Thesis: Exploratory Studies of Convective Flows Due To Arc Tracking
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2007
      Undergraduate Capstone/Senior Project
      Team AMD, (Summer 2007/Fall 2007) "Optimization and Redesign of Heat Sink for X-1950 Pro Graphics Video Card"
      Senior Design Project Supervision
    • 2006
      Supervisory Committee Chair
      A Patil, Thesis: “MEMS Packaging: Fluxless Soldering and Reliability Assessment”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      Supervisory Committee Chair
      B Dewan Sandur, Thesis: “Thermal Management of Die Stacking Architectures Memory and Logic Processor”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      Supervisory Committee Chair
      Baek Sung, Thermal Enhancement of Stacked Dies Using Thermal Vias
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      Supervisory Committee Chair
      C Henderson, Non-Thesis Project: “Solder Joint Fatigue Analysis Using the Disturbed State Concept”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      Supervisory Committee Chair
      C Tadepalli, Non-Thesis Project: “Effect of Weight of Heat Sink on Mechanical Reliability of a Wire Bonded Plastic Ball Grid Array Package”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      Supervisory Committee Chair
      F Zahedi, Non-Thesis Project: “Reliability of Lead-Free Solder Under Cyclic Bending”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      Supervisory Committee Chair
      K Manne, Design and Optimization of Heat Spreaders and Selection of Fan in Laptop
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      Supervisory Committee Chair
      M Bhat, Non-Thesis Project: “Implementation of Effective Lean Methodology in the Design and Fabrication of Microprocessor Chip”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      Supervisory Committee Chair
      M Hossain, Dissertation: “Development of Constitutive Equations and Methodology for Failure Prediction Models for SAC Lead- free Alloys”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      Supervisory Committee Chair
      S. Nikalaje, Generating G code’s / NC Program using CATIA V5 for Student
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      Supervisory Committee Chair
      S.A. Joseph, Design methodology of development of Heat Sink for High-end CPUs
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      Supervisory Committee Chair
      V Bedekar, Effect of CRAC Location On A Fixed Rack Layout of a Data Center
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      Supervisory Committee Chair
      Y.J. Lee, Non-Thesis Project: “Thermal Reliability of 3D Stack Packaging in Finite Element Method”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      Supervisory Committee Member
      A Elliott, Non-Thesis Project: “Formula SAE Vehicle Aerodynamics: Under Tray Optimization Study”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      Supervisory Committee Member
      A Mahmood, Dissertation: “Device Level Vacuum Packaged Microbolometers on Flexible Substrates”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      Supervisory Committee Member
      B Kumar, Non-Thesis Project: “Thermal Analysis of a Standard Stacked Die Package With Thermal Vias Using Substructuring”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      Supervisory Committee Member
      R Basavanahalli, Thesis: “Finite Element Modeling of Carbon Nanotube Reinforced Polymer Composites and Evaluating Its Thermal Conductivities”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2006
      Undergraduate Capstone/Senior Project
      Team Lockheed (Fall 2005/Spring 2006): “Electronic Packaging of Irregular PCB – Part II”
      Senior Design Project Supervision
    • 2005
      Graduate Supervised Research
      B Shah, Non-Thesis Project
      Masters Student Advisor
    • 2005
      Supervisory Committee Chair
      A Kole, Thesis: “Polymer Tube Embedded in-Plane Micropump: Design, Analysis and Fabrication”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2005
      Supervisory Committee Chair
      M Bhat, Non-Thesis Project: “Implementation of Lean Methodology in the Design and Manufacturing of Microprocessors”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2005
      Supervisory Committee Chair
      N Lakhakar, Thesis: “Development of High Performance Cold Plate Tester”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2005
      Supervisory Committee Chair
      S Bhopte, Thesis: “Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2005
      Supervisory Committee Chair
      S Sethuraman, Non-Thesis Project: “Optimization of a Finned Heat Sink for Microprocessor Cooling”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2005
      Supervisory Committee Chair
      Y Challa, Non-Thesis Project: “Single Wafer Encapsulation of MEMS Device”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2005
      Supervisory Committee Chair
      Y Prasad, Non-Thesis Project: “Simulation Methodologies for the Solder Joint Crack Growth and Fatigue Life Prediction”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2005
      Supervisory Committee Member
      K Bushan, MEMS Microfluidic System
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2005
      Supervisory Committee Member
      Y Dubey, Non-Thesis Project
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2005
      Undergraduate Capstone/Senior Project
      Team Nokia (Fall 2003/Spring 2004): “Heat Pipe Assisted Heat Sink for Nokia Base Station,”
      Senior Design Project Supervision
    • 2005
      Undergraduate Capstone/Senior Project
      Team Lockheed (Fall2004/Spring2005): “Electronic Packaging of Irregular PCB – Part I”
      Senior Design Project Supervision
    • 2004
      Supervisory Committee Chair
      A Halvi, Thesis: “Simulation of PWB Warpage During Fabrication and due to reflow”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      Supervisory Committee Chair
      A Jupudi, Non-Thesis Project: “Heat Analysis of Data Center”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      Supervisory Committee Chair
      A Shah, Non-Thesis Project: “Heat Pipe Assisted Heat Sink Optimization of Spacing Between Heat Pipes – A CFD Study”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      Supervisory Committee Chair
      D Roberts, Non-Thesis Project: “3-D Cooling Case Study: Tessera, Inc’s PyxisTM Platform”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      Supervisory Committee Chair
      O Puppala, Non-Thesis Project: “Thermal Analysis of Flip Chip BGA package”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      Supervisory Committee Chair
      R Akhter, Thesis: “Optimal Thermal Management of Stacked Die Package: Design for Stackability”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      Supervisory Committee Chair
      S Devireddy, Non-Thesis Project: “Role of Electronic Packages in Cell phones & Future Direction of Cell phone”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      Supervisory Committee Chair
      S Karajgikar, Thesis: “Effect of Area Contact on the Stability of Modular Refrigeration Unit and Effect of Continuous and Discontinuous Fabrication and Reflow Process on PWB Warpage”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      Supervisory Committee Chair
      S Kuravi, Thesis: “Estimation of Evaporation Rates in Humid Cavities”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      Supervisory Committee Chair
      S Riaz, Thesis: “Microchannel Liquid Cooling System for High Heat Flux Integrated Circuits”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      Supervisory Committee Chair
      W Ahn, Dissertation: “Development of a Design Tool to Assist Layout/Layup Design to Minimize Warpage of a PWB During Fabrication and Reflow Solder Processes "
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      Supervisory Committee Member
      A Morrison, Dissertation – “Enhancement of Condensation Heat Transfer for Steam at Near Atmospheric Pressure”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      Supervisory Committee Member
      Non-Thesis Project
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      Supervisory Committee Member
      D Kurusamy, Moiré Interferometric Investigation of Strain Fields in the Vicinity of Piezoceramic Patches
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      Supervisory Committee Member
      N Sivakumar, Leakage Current: Static Power Consumption
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      Supervisory Committee Member
      S Chandra, Non-Thesis Project
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2004
      Undergraduate Capstone/Senior Project
      Team Nokia (Fall 2003/Spring 2004): “Heat Pipe Assisted Heat Sink for Nokia Base Station,”
      Senior Design Project Supervision
    • 2003
      Supervisory Committee Chair
      A Kulkarni, Thesis: “A Thermal Simulation of a Thin Small Outline Package, Using Compact Components, and a Study of Effect of Change in TXV Bulb Location on the Stability of a Refrigeration System”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2003
      Supervisory Committee Chair
      K Ramaswamy, Non-Thesis Project: “Facility and Equipment Thermal Guidelines for Data Center and Other Data Processing Environments”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2003
      Supervisory Committee Chair
      M Al-Shuqairi, Thesis: “Mixed Convection of Impinging Air Cooling Over a Parallel Plate Heat Sink”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2003
      Supervisory Committee Chair
      R Veluswamy, Thesis: “Thermal Design and Modeling of an Improved Circuit Spot Cooler.”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2003
      Supervisory Committee Chair
      S Guggari, Thesis: “A Hybrid Methodology for Optimization of the Data Center Room Layout”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2003
      Supervisory Committee Chair
      S Jagarkal, Thesis: “Optimization and Reliability of Electronic Packages”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2003
      Supervisory Committee Chair
      V Mulay, Thesis: “An Experimental Study of Effects of Thermophysical Properties of Thermostatic Expansion Valve Sensor Bulb on Stability of Refrigeration System”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2003
      Supervisory Committee Chair
      Y Makwana, Thesis: “Stability, Efficiency and Control System of a Masterflux Compressor in a Refrigeration Unit of a High End Computer”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2003
      Undergraduate Capstone/Senior Project
      Team Nokia (Spring/Summer 2003): “Heat Pipe Assisted Heat Sink for Nokia Base Station,”
      Senior Design Project Supervision
    • 2003
      Undergraduate Capstone/Senior Project
      Team Hewlett-Packard (Fall/Spring 2002-2003): “Optimization of Serial Heat Sinks for Hewlett-Packard Superdome Computer,”
      Senior Design Project Supervision
    • 2002
      Supervisory Committee Chair
      A Kaisare, Thesis: “A 3-Dimensional Thermo-Mechanical Analysis of a Ball Grid Array Package”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2002
      Supervisory Committee Chair
      R Rodney, Non-Thesis Project: “An Investigation of Friction Factors for Printed Circuit Card Assemblies”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2002
      Supervisory Committee Chair
      V Bondili, Non-Thesis Project: “Computational Characterization of Impingement Flow in Parallel Plate Heat Sinks”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2002
      Supervisory Committee Chair
      W Mustafa, Non-Thesis Project: “Fracture Mechanics Analysis of Kovar Leads”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2002
      Supervisory Committee Member
      G Agwu Nnanna, Dissertation – “Phase Change Phenomena in Porous Medium: A Local Thermal Non-Equilibrium Study”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2002
      Supervisory Committee Member
      G Morales, Simulating the Thermal Hysteresis Curve of a Pressure Sensor Produced by the Package Stresses
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2001
      Supervisory Committee Member
      F Oprea, Non-Thesis Project: “Thermoelectric Breakdown of CMOS Devices”
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2001
      Supervisory Committee Member
      J Han Kim, Mechanism of Nucleate Boiling Heat Transfer
      Graduate Student Dissertation/Thesis/Project Committee Advisor
    • 2001
      Supervisory Committee Member
      K Rainey, Pool and Flow Boiling Heat Transfer from Microporous Flat and Finned Surfaces in FC-72
    • 2001
      Undergraduate Capstone/Senior Project
      Team Nokia (Fall/Spring 2000-2001): “Thermo-Mechanical Characteristics of a Ball Grid Array Package Resulting in Heat Sink Design for Telecommunication Applications,”
      Senior Design Project Supervision
    • 2001
      Undergraduate Capstone/Senior Project
      Team Motorola (Fall/Spring 2000-2001): “Investigate and Engineer a Linear Power Amplifier Heat Sink,”
      Senior Design Project Supervision
    • 2001
      Undergraduate Capstone/Senior Project
      Team Hewlett-Packard (Fall/Spring 2000-2001): “Project Superdome,”
      Senior Design Project Supervision
    • 2000
      Undergraduate Capstone/Senior Project
      Team Thermalloy (Spring/Summer 2000): “Numerical/Experimental Characterization and Improvement of Microprocessor Heat Sinks for Thermalloy Corporation,”
      Senior Design Project Supervision

Courses

      • MAE 4306-001 COMP TECH ELECTRONIC PACKAGING
        (Course Id: 113097)
        Spring - Regular Academic Session - 2021
      • ME 5353-001 COMP TECH ELECTRONIC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2021 Download Syllabus
      • ME 5353-002 COMP TECH ELECTRONIC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2021
      • ME 5353-003 COMP TECH ELECTRONIC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2021
      • AE 6999-029 DISSERTATION
        (Course Id: 102003)
        Spring - Regular Academic Session - 2021
      • ME 6399-029 DISSERTATION
        (Course Id: 103486)
        Spring - Regular Academic Session - 2021
      • ME 6699-029 DISSERTATION
        (Course Id: 103490)
        Spring - Regular Academic Session - 2021
      • ME 6999-029 DISSERTATION
        (Course Id: 103494)
        Spring - Regular Academic Session - 2021
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Spring - Regular Academic Session - 2021
      • ME 6197-029 RESEARCH
        (Course Id: 103463)
        Spring - Regular Academic Session - 2021
      • ME 6297-029 RESEARCH
        (Course Id: 103464)
        Spring - Regular Academic Session - 2021
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2021
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2021
      • ME 6997-029 RESEARCH
        (Course Id: 103493)
        Spring - Regular Academic Session - 2021
      • AE 5397-029 RESEARCH IN AEROSPACE ENGINEER
        (Course Id: 112457)
        Spring - Regular Academic Session - 2021
      • AE 5398-029 THESIS
        (Course Id: 101981)
        Spring - Regular Academic Session - 2021
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Spring - Regular Academic Session - 2021
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2021
      • ME 7399-029 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Fall - Regular Academic Session - 2020
      • ME 5352-001 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2020 Download Syllabus
      • ME 5352-002 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2020
      • ME 5352-900 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2020
      • MAE 4305-001 FUND OF ELECTRONIC PACKAGING
        (Course Id: 113096)
        Fall - Regular Academic Session - 2020
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Fall - Regular Academic Session - 2020
      • ME 6297-029 RESEARCH
        (Course Id: 103464)
        Fall - Regular Academic Session - 2020
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2020
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Fall - Regular Academic Session - 2020
      • AE 6297-029 RESEARCH AEROSPACE ENGINEERING
        (Course Id: 101985)
        Fall - Regular Academic Session - 2020
      • AE 6397-029 RESEARCH AEROSPACE ENGINEERING
        (Course Id: 101994)
        Fall - Regular Academic Session - 2020
      • AE 6697-029 RESEARCH IN AEROSPACE ENGRG
        (Course Id: 101998)
        Fall - Regular Academic Session - 2020
      • MAE 3311-001 THERMODYNAMICS II
        (Course Id: 103632)
        Fall - Regular Academic Session - 2020 Download Syllabus
      • AE 5698-029 THESIS
        (Course Id: 101982)
        Fall - Regular Academic Session - 2020
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Fall - Regular Academic Session - 2020
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Fall - Regular Academic Session - 2020
      • ME 6399-029 DISSERTATION
        (Course Id: 103486)
        Summer - Eleven Week - 2020
      • ME 7399-029 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Summer - Eleven Week - 2020
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2020
      • ME 6197-029 RESEARCH
        (Course Id: 103463)
        Summer - 2020
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Summer - Eleven Week - 2020
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Summer - 2020
      • MAE 4000-029 UNDERGRADUATE RESEARCH
        (Course Id: 111531)
        Summer - 2020
      • AE 6196-029 AEROSPACE ENGR INTERNSHIP
        (Course Id: 111774)
        Spring - Regular Academic Session - 2020
      • MAE 4306-001 COMP TECH ELECTRONIC PACKAGING
        (Course Id: 113097)
        Spring - Regular Academic Session - 2020
      • ME 5353-001 COMP TECH ELECTRONIC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2020 Download Syllabus
      • ME 5353-002 COMP TECH ELECTRONIC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2020
      • ME 6699-029 DISSERTATION
        (Course Id: 103490)
        Spring - Regular Academic Session - 2020
      • ME 6297-029 RESEARCH
        (Course Id: 103464)
        Spring - Regular Academic Session - 2020
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2020
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2020
      • ME 6997-029 RESEARCH
        (Course Id: 103493)
        Spring - Regular Academic Session - 2020
      • AE 5397-029 RESEARCH IN AEROSPACE ENGINEER
        (Course Id: 112457)
        Spring - Regular Academic Session - 2020
      • AE 5698-029 THESIS
        (Course Id: 101982)
        Spring - Regular Academic Session - 2020
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2020
      • AE 6196-029 AEROSPACE ENGR INTERNSHIP
        (Course Id: 111774)
        Fall - Regular Academic Session - 2019
      • ME 6399-029 DISSERTATION
        (Course Id: 103486)
        Fall - Regular Academic Session - 2019
      • ME 6699-029 DISSERTATION
        (Course Id: 103490)
        Fall - Regular Academic Session - 2019
      • ME 7399-029 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Fall - Regular Academic Session - 2019
      • ME 5352-001 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2019
      • ME 5352-002 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2019
      • ME 5352-003 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2019
      • MAE 4305-001 FUND OF ELECTRONIC PACKAGING
        (Course Id: 113096)
        Fall - Regular Academic Session - 2019
      • ME 6297-029 RESEARCH
        (Course Id: 103464)
        Fall - Regular Academic Session - 2019
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2019
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Fall - Regular Academic Session - 2019
      • AE 6297-029 RESEARCH AEROSPACE ENGINEERING
        (Course Id: 101985)
        Fall - Regular Academic Session - 2019
      • MAE 3311-001 THERMODYNAMICS II
        (Course Id: 103632)
        Fall - Regular Academic Session - 2019
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Fall - Regular Academic Session - 2019
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Fall - Regular Academic Session - 2019
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2019
      • ME 6197-029 RESEARCH
        (Course Id: 103463)
        Summer - 2019
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Summer - 2019
      • ME 5197-029 RESEARCH IN MECH ENGINEERING
        (Course Id: 113182)
        Summer - 2019
      • ME 5353-001 COMP TECH ELECTRONIC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2019
      • ME 5353-002 COMP TECH ELECTRONIC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2019
      • ME 6399-029 DISSERTATION
        (Course Id: 103486)
        Spring - Regular Academic Session - 2019
      • MAE 4305-001 FUND OF ELECTRONIC PACKAGING
        (Course Id: 113096)
        Spring - Regular Academic Session - 2019
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Spring - Regular Academic Session - 2019
      • ME 6297-029 RESEARCH
        (Course Id: 103464)
        Spring - Regular Academic Session - 2019
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2019
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2019
      • AE 6297-029 RESEARCH AEROSPACE ENGINEERING
        (Course Id: 101985)
        Spring - Regular Academic Session - 2019
      • AE 6397-029 RESEARCH AEROSPACE ENGINEERING
        (Course Id: 101994)
        Spring - Regular Academic Session - 2019
      • AE 5397-029 RESEARCH IN AEROSPACE ENGINEER
        (Course Id: 112457)
        Spring - 2019
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2019
      • ME 5352-001 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2018
      • ME 5352-002 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2018
      • ME 5352-003 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2018
      • MAE 4305-001 FUND OF ELECTRONIC PACKAGING
        (Course Id: 113096)
        Fall - Regular Academic Session - 2018
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Fall - Regular Academic Session - 2018
      • ME 6297-029 RESEARCH
        (Course Id: 103464)
        Fall - Regular Academic Session - 2018
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2018
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Fall - Regular Academic Session - 2018
      • AE 6297-029 RESEARCH AEROSPACE ENGINEERING
        (Course Id: 101985)
        Fall - Regular Academic Session - 2018
      • MAE 3311-001 THERMODYNAMICS II
        (Course Id: 103632)
        Fall - Regular Academic Session - 2018
      • MAE 3311-002 THERMODYNAMICS II
        (Course Id: 103632)
        Fall - Regular Academic Session - 2018
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Fall - Regular Academic Session - 2018
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Fall - Regular Academic Session - 2018
      • ME 6399-029 DISSERTATION
        (Course Id: 103486)
        Summer - Eleven Week - 2018
      • ME 7399-029 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Summer - Eleven Week - 2018
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2018
      • ME 5353-001 COMPUT TECHS ELEC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2018 Download Syllabus
      • ME 5353-002 COMPUT TECHS ELEC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2018
      • ME 6399-029 DISSERTATION
        (Course Id: 103486)
        Spring - Regular Academic Session - 2018
      • ME 6699-029 DISSERTATION
        (Course Id: 103490)
        Spring - Regular Academic Session - 2018
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Spring - Regular Academic Session - 2018
      • ME 6297-029 RESEARCH
        (Course Id: 103464)
        Spring - Regular Academic Session - 2018
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2018
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2018
      • AE 6697-029 RESEARCH IN AEROSPACE ENGRG
        (Course Id: 101998)
        Spring - Regular Academic Session - 2018
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: Apply Computat Technq ElecPkg | Course Id: 103659)
        Spring - Regular Academic Session - 2018
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Spring - Regular Academic Session - 2018
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2018
      • ME 5352-001 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2017 Download Syllabus
      • ME 5352-002 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2017
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Fall - Regular Academic Session - 2017
      • ME 6297-029 RESEARCH
        (Course Id: 103464)
        Fall - Regular Academic Session - 2017
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2017
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Fall - Regular Academic Session - 2017
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: Fund of Electronic Packaging | Course Id: 103659)
        Fall - Regular Academic Session - 2017
      • MAE 3311-001 THERMODYNAMICS II
        (Course Id: 103632)
        Fall - Regular Academic Session - 2017 Download Syllabus
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Fall - Regular Academic Session - 2017
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Fall - Regular Academic Session - 2017
      • ME 7399-029 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Summer - Eleven Week - 2017
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2017
      • ME 6197-029 RESEARCH
        (Course Id: 103463)
        Summer - Eleven Week - 2017
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Summer - Summer Intersession - 2017
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Summer - Eleven Week - 2017
      • ME 5353-001 COMPUT TECHS ELEC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2017
      • ME 5353-002 COMPUT TECHS ELEC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2017
      • ME 6999-029 DISSERTATION
        (Course Id: 103494)
        Spring - Regular Academic Session - 2017
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2017
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2017
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Spring - Winter Intersession - 2017
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Spring - Regular Academic Session - 2017
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2017
      • ME 5352-001 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2016
      • ME 5352-002 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2016
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Fall - Regular Academic Session - 2016
      • ME 5191-029 PROJECT STUDIES MECHANICAL ENG
        (Course Id: 103389)
        Fall - Regular Academic Session - 2016
      • ME 6297-029 RESEARCH
        (Course Id: 103464)
        Fall - Regular Academic Session - 2016
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2016
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Fall - Regular Academic Session - 2016
      • MAE 4301-010 SPEC TOPICS MECH & AERO ENGR
        (Topic: Fund. of Electronic Packaging | Course Id: 103659)
        Fall - Regular Academic Session - 2016
      • MAE 3311-001 THERMODYNAMICS II
        (Course Id: 103632)
        Fall - Regular Academic Session - 2016
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Fall - Regular Academic Session - 2016
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Fall - Regular Academic Session - 2016
      • ME 7399-029 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Summer - Eleven Week - 2016
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2016
      • ME 5191-029 PROJECT STUDIES MECHANICAL ENG
        (Course Id: 103389)
        Summer - Eleven Week - 2016
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Summer - Summer Intersession - 2016
      • ME 5391-029 ADV STUDIES MECH ENGR
        (Course Id: 103457)
        Spring - Regular Academic Session - 2016
      • ME 5353-001 COMPUT TECHS ELEC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2016
      • ME 5353-002 COMPUT TECHS ELEC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2016
      • ME 6999-029 DISSERTATION
        (Course Id: 103494)
        Spring - Regular Academic Session - 2016
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Spring - Regular Academic Session - 2016
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2016
      • ME 6997-029 RESEARCH
        (Course Id: 103493)
        Spring - Regular Academic Session - 2016
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Spring - Winter Intersession - 2016
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Spring - Regular Academic Session - 2016
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2016
      • ME 7399-029 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Fall - Regular Academic Session - 2015
      • ME 5352-001 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2015
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Fall - Regular Academic Session - 2015
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2015
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Fall - Regular Academic Session - 2015
      • ME 6997-029 RESEARCH
        (Course Id: 103493)
        Fall - Regular Academic Session - 2015
      • MAE 3311-001 THERMODYNAMICS II
        (Course Id: 103632)
        Fall - Regular Academic Session - 2015
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Fall - Regular Academic Session - 2015
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Fall - Regular Academic Session - 2015
      • ME 5391-029 ADV STUDIES MECH ENGR
        (Course Id: 103457)
        Summer - Eleven Week - 2015
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2015
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Summer - Eleven Week - 2015
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Summer - Eleven Week - 2015
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Summer - Summer Intersession - 2015
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Summer - Eleven Week - 2015
      • ME 5391-029 ADV STUDIES MECH ENGR
        (Course Id: 103457)
        Spring - Regular Academic Session - 2015
      • ME 5353-001 COMPUT TECHS ELEC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2015
      • ME 5353-002 COMPUT TECHS ELEC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2015
      • ME 6699-029 DISSERTATION
        (Course Id: 103490)
        Spring - Regular Academic Session - 2015
      • ME 7399-029 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Spring - Regular Academic Session - 2015
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Spring - Regular Academic Session - 2015
      • ME 6297-029 RESEARCH
        (Course Id: 103464)
        Spring - Regular Academic Session - 2015
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2015
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2015
      • ME 6997-029 RESEARCH
        (Course Id: 103493)
        Spring - Regular Academic Session - 2015
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Spring - Winter Intersession - 2015
      • AE 5398-029 THESIS
        (Course Id: 101981)
        Spring - Regular Academic Session - 2015
      • AE 5698-029 THESIS
        (Course Id: 101982)
        Spring - Regular Academic Session - 2015
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Spring - Regular Academic Session - 2015
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2015
      • ME 5391-029 ADV STUDIES MECH ENGR
        (Course Id: 103457)
        Fall - Regular Academic Session - 2014
      • ME 6399-029 DISSERTATION
        (Course Id: 103486)
        Fall - Regular Academic Session - 2014
      • ME 6699-029 DISSERTATION
        (Course Id: 103490)
        Fall - Regular Academic Session - 2014
      • ME 7399-029 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Fall - Regular Academic Session - 2014
      • ME 5352-001 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2014
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Fall - Regular Academic Session - 2014
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2014
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Fall - Regular Academic Session - 2014
      • ME 6997-029 RESEARCH
        (Course Id: 103493)
        Fall - Regular Academic Session - 2014
      • MAE 3311-001 THERMODYNAMICS II
        (Course Id: 103632)
        Fall - Regular Academic Session - 2014
      • AE 5398-029 THESIS
        (Course Id: 101981)
        Fall - Regular Academic Session - 2014
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Fall - Regular Academic Session - 2014
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Fall - Regular Academic Session - 2014
      • ME 6399-029 DISSERTATION
        (Course Id: 103486)
        Summer - Eleven Week - 2014
      • ME 6699-029 DISSERTATION
        (Course Id: 103490)
        Summer - Eleven Week - 2014
      • ME 7399-029 DOCTORAL DEGREE COMPLETION
        (Course Id: 111647)
        Summer - Eleven Week - 2014
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2014
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Summer - Eleven Week - 2014
      • MAE 4391-029 SPEC PROB MECH & AERO ENGR
        (Course Id: 103689)
        Summer - Eleven Week - 2014
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Summer - Summer Intersession - 2014
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Summer - Eleven Week - 2014
      • ME 5391-029 ADV STUDIES MECH ENGR
        (Course Id: 103457)
        Spring - Regular Academic Session - 2014
      • ME 5353-001 COMPUT TECHS ELEC PACKAGING
        (Topic: CFD in Electronic Packaging | Course Id: 103446)
        Spring - Regular Academic Session - 2014
      • ME 6399-029 DISSERTATION
        (Course Id: 103486)
        Spring - Regular Academic Session - 2014
      • ME 6699-029 DISSERTATION
        (Course Id: 103490)
        Spring - Regular Academic Session - 2014
      • AE 5101-001 GRADUATE SEMINAR
        (Course Id: 101917)
        Spring - Regular Academic Session - 2014
      • AE 5101-002 GRADUATE SEMINAR
        (Course Id: 101917)
        Spring - Regular Academic Session - 2014
      • ME 5101-001 GRADUATE SEMINAR
        (Course Id: 101917)
        Spring - Regular Academic Session - 2014
      • ME 5101-002 GRADUATE SEMINAR
        (Course Id: 101917)
        Spring - Regular Academic Session - 2014
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Spring - Regular Academic Session - 2014
      • ME 6297-029 RESEARCH
        (Course Id: 103464)
        Spring - Regular Academic Session - 2014
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2014
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2014
      • ME 6997-029 RESEARCH
        (Course Id: 103493)
        Spring - Regular Academic Session - 2014
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Spring - Winter Intersession - 2014
      • AE 5698-029 THESIS
        (Course Id: 101982)
        Spring - Regular Academic Session - 2014
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Spring - Regular Academic Session - 2014
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2014
      • ME 5998-029 THESIS
        (Course Id: 103462)
        Spring - Regular Academic Session - 2014
      • ME 5391-029 ADV STUDIES MECH ENGR
        (Course Id: 103457)
        Fall - Regular Academic Session - 2013
      • ME 6699-029 DISSERTATION
        (Course Id: 103490)
        Fall - Regular Academic Session - 2013
      • ME 5352-001 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2013
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Fall - Regular Academic Session - 2013
      • ME 6297-029 RESEARCH
        (Course Id: 103464)
        Fall - Regular Academic Session - 2013
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2013
      • ME 6997-029 RESEARCH
        (Course Id: 103493)
        Fall - Regular Academic Session - 2013
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: Fund of Electronic Packaging | Course Id: 103659)
        Fall - Regular Academic Session - 2013
      • MAE 3311-002 THERMODYNAMICS II
        (Course Id: 103632)
        Fall - Regular Academic Session - 2013
      • AE 5698-029 THESIS
        (Course Id: 101982)
        Fall - Regular Academic Session - 2013
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Fall - Regular Academic Session - 2013
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Fall - Regular Academic Session - 2013
      • ME 5391-029 ADV STUDIES MECH ENGR
        (Course Id: 103457)
        Summer - Eleven Week - 2013
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2013
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Summer - Eleven Week - 2013
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Summer - Eleven Week - 2013
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Summer - Summer Intersession - 2013
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Summer - Eleven Week - 2013
      • ME 5391-029 ADV STUDIES MECH ENGR
        (Course Id: 103457)
        Spring - Regular Academic Session - 2013
      • ME 5353-001 COMPUT TECHS ELEC PACKAGING
        (Topic: CFD in Electronic Packaging | Course Id: 103446)
        Spring - Regular Academic Session - 2013
      • AE 5101-001 GRADUATE SEMINAR
        (Course Id: 101917)
        Spring - Regular Academic Session - 2013
      • AE 5101-002 GRADUATE SEMINAR
        (Course Id: 101917)
        Spring - Regular Academic Session - 2013
      • ME 5101-001 GRADUATE SEMINAR
        (Course Id: 101917)
        Spring - Regular Academic Session - 2013
      • ME 5101-002 GRADUATE SEMINAR
        (Course Id: 101917)
        Spring - Regular Academic Session - 2013
      • ME 6297-029 RESEARCH
        (Course Id: 103464)
        Spring - Regular Academic Session - 2013
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2013
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2013
      • ME 6997-029 RESEARCH
        (Course Id: 103493)
        Spring - Regular Academic Session - 2013
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Spring - Winter Intersession - 2013
      • AE 5698-029 THESIS
        (Course Id: 101982)
        Spring - Regular Academic Session - 2013
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Spring - Regular Academic Session - 2013
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2013
      • ME 5391-029 ADV STUDIES MECH ENGR
        (Course Id: 103457)
        Fall - Regular Academic Session - 2012
      • ME 5352-001 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2012
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Fall - Regular Academic Session - 2012
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2012
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Fall - Regular Academic Session - 2012
      • ME 6997-029 RESEARCH
        (Course Id: 103493)
        Fall - Regular Academic Session - 2012
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: Fund. of Electronic Packaging | Course Id: 103659)
        Fall - Regular Academic Session - 2012
      • MAE 3311-001 THERMODYNAMICS II
        (Course Id: 103632)
        Fall - Regular Academic Session - 2012
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Fall - Regular Academic Session - 2012
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Fall - Regular Academic Session - 2012
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2012
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Summer - Eleven Week - 2012
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Summer - Eleven Week - 2012
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Summer - Summer Intersession - 2012
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Summer - Eleven Week - 2012
      • ME 5353-001 COMPUT TECHS ELEC PACKAGING
        (Topic: CFD in Electronic Packaging | Course Id: 103446)
        Spring - Regular Academic Session - 2012
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2012
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2012
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Spring - Winter Intersession - 2012
      • AE 5698-029 THESIS
        (Course Id: 101982)
        Spring - Regular Academic Session - 2012
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Spring - Regular Academic Session - 2012
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2012
      • ME 5391-029 ADV STUDIES MECH ENGR
        (Course Id: 103457)
        Fall - Regular Academic Session - 2011
      • ME 5352-001 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2011
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Fall - Regular Academic Session - 2011
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2011
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Fall - Regular Academic Session - 2011
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: Fund. of Electronic Packaging | Course Id: 103659)
        Fall - Regular Academic Session - 2011
      • MAE 3311-001 THERMODYNAMICS II
        (Course Id: 103632)
        Fall - Regular Academic Session - 2011
      • AE 5698-029 THESIS
        (Course Id: 101982)
        Fall - Regular Academic Session - 2011
      • ME 5398-029 THESIS
        (Course Id: 103460)
        Fall - Regular Academic Session - 2011
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Fall - Regular Academic Session - 2011
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Summer - Eleven Week - 2011
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Summer - Eleven Week - 2011
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Summer - Eleven Week - 2011
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Summer - Summer Intersession - 2011
      • AE 5698-029 THESIS
        (Course Id: 101982)
        Summer - Eleven Week - 2011
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Summer - Eleven Week - 2011
      • AE 5391-029 ADV STUDIES AEROSPACE ENGR
        (Course Id: 101980)
        Spring - Regular Academic Session - 2011
      • ME 5391-029 ADV STUDIES MECH ENGR
        (Course Id: 103457)
        Spring - Regular Academic Session - 2011
      • ME 5353-001 COMPUT TECHS ELEC PACKAGING
        (Topic: CFD in Electronic Packaging | Course Id: 103446)
        Spring - Regular Academic Session - 2011
      • ME 6999-029 DISSERTATION
        (Course Id: 103494)
        Spring - Regular Academic Session - 2011
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2011
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Spring - Regular Academic Session - 2011
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Spring - Winter Intersession - 2011
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2011
      • ME 5352-001 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2010
      • ME 6197-029 RESEARCH
        (Course Id: 103463)
        Fall - Regular Academic Session - 2010
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2010
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: Fundamentals of Elec Packaging | Course Id: 103659)
        Fall - Regular Academic Session - 2010
      • MAE 3311-001 THERMODYNAMICS II
        (Course Id: 103632)
        Fall - Regular Academic Session - 2010
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Fall - Regular Academic Session - 2010
      • ME 6697-029 RESEARCH
        (Course Id: 103489)
        Summer - Eleven Week - 2010
      • MAE 4301-002 SPEC TOPICS MECH & AERO ENGR
        (Topic: Catia | Course Id: 103659)
        Summer - Summer Intersession - 2010
      • AE 5698-029 THESIS
        (Course Id: 101982)
        Summer - Five Week - Second - 2010
      • AE 5391-029 ADV STUDIES AEROSPACE ENGR
        (Course Id: 101980)
        Spring - Regular Academic Session - 2010
      • ME 5353-001 COMPUT TECHS ELEC PACKAGING
        (Course Id: 103446)
        Spring - Regular Academic Session - 2010
      • ME 6999-029 DISSERTATION
        (Course Id: 103494)
        Spring - Regular Academic Session - 2010
      • ME 6196-029 MECHANICAL ENGR INTERNSHIP
        (Course Id: 110864)
        Spring - Regular Academic Session - 2010
      • ME 6197-029 RESEARCH
        (Course Id: 103463)
        Spring - Regular Academic Session - 2010
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Spring - Regular Academic Session - 2010
      • MAE 4301-001 SPEC TOPICS MECH & AERO ENGR
        (Topic: CFD in Electronic Packaging | Course Id: 103659)
        Spring - Regular Academic Session - 2010
      • MAE 4301-002 SPEC TOPICS MECH & AERO ENGR
        (Topic: CATIA | Course Id: 103659)
        Spring - Winter Intersession - 2010
      • AE 5698-029 THESIS
        (Course Id: 101982)
        Spring - Regular Academic Session - 2010
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Spring - Regular Academic Session - 2010
      • ME 5391-029 ADV STUDIES MECH ENGR
        (Course Id: 103457)
        Fall - Regular Academic Session - 2009
      • ME 6999-029 DISSERTATION
        (Course Id: 103494)
        Fall - Regular Academic Session - 2009
      • ME 5352-001 FDMTLS ELECTRONIC PACKAGING
        (Course Id: 103445)
        Fall - Regular Academic Session - 2009
      • ME 6397-029 RESEARCH
        (Course Id: 103485)
        Fall - Regular Academic Session - 2009
      • MAE 4301-001 SPEC TOPICS MECH & AEROSP ENGR
        (Topic: Fund. of Electronic Packaging | Course Id: 103659)
        Fall - Regular Academic Session - 2009
      • MAE 3311-001 THERMODYNAMICS II
        (Course Id: 103632)
        Fall - Regular Academic Session - 2009
      • ME 5698-029 THESIS
        (Course Id: 103461)
        Fall - Regular Academic Session - 2009

Service to the University

    • Jan 2017 to  Present Faculty Advisor
      7x24 Exchange Student Chapter
    • Jan 2015 to  Present Faculty Advisor
      SMTA
      https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=128
    • Jan 2007 to  Present Scientific Advisory Board
      Princeton University
    • Jan 2006 to  Present Engineering Advisory Council
      University of Colorado Boulder
    • Jan 2004 to  Present Faculty Advisor
      NSBE Student Section
    • Jan 2003 to  Present Faculty Advisor
      ASME Student Section
    • Jan 2000 to  Present Member
      Industrial Relations Committee - MAE
    • Jan 2000 to  2015 Board of Visitors
      Howard Univ