Zeynep Celik-Butler
Name
[Celik-Butler, Zeynep]
- Professor & Director
Professional Preparation
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- 1987 Ph.D. in Electrical Engineering , University of Rochester
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- 1984 M.S. in Electrical Engineering , University of Rochester
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- 1982 B.S. in electrical engineering and physics , Bogaziçi University, Istanbul, Turkey
Appointments
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Jan 2002 to
Jan 2013
Professor
University of Texas at Arlington
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Jan 2002 to
Jan 2013
Professor
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Jan 1996 to
Jan 1999
Assistant Dean of Graduate Studies and Research
Southern Methodist University
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Jan 1996 to
Jan 1999
Assistant Dean of Graduate Studies and Research
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Jan 1993 to
Jan 1996
Assoc Prof
Southern Methodist University
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Jan 1993 to
Jan 1996
Assoc Prof
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Jan 1990 to
Jan 1993
J. Lindsay Embrey Trustee Assistant Professorship
Southern Methodist University
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Jan 1990 to
Jan 1993
J. Lindsay Embrey Trustee Assistant Professorship
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Jan 1987 to
Jan 1993
Assist Professor
Southern Methodist University
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Jan 1987 to
Jan 1993
Assist Professor
News Articles
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Dec 2001 Detect and Defend,"
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Research and Expertise
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Uncooled Infrared DetectorsA radiation detector is a device that produces an output signal, which depends on the amount of radiation hitting the active region of the detector. In general, infrared (IR) sensors can be classified as thermal or photon type of detectors. Photon type detectors such as photovoltaic or photoconductive sensors operate on the principles of direct electron - photon interaction. They provide superior sensitivity and response speed. However, photon detectors typically require costly cryogenic operation to minimize the noise sources to obtain the high relative sensitivity. On the other hand, thermal detectors convert incident radiation into heat, thereby raising the temperature of the detector element. This change in temperature is then converted to an electrical signal that can be amplified and displayed. Thermal detectors are capable of responding to a wide range of wavelengths without appreciable variation in responsivity. Thermal detectors display high sensitivity at room temperature to permit imaging and radiometry applications.
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Noise and Reliability in Electronic DevicesAs the devices scale down, even though the absolute noise magnitude gets smaller, since the voltages also scale down, the signal-to-noise ratio decreases. Noise models developed for large area devices based on the large-number-electron averaging theories break down. In addition, in sub-micron devices, as the device dimensions approach electron mean-free path, quantum effects start to play an important role. Since noise has important implications on the reliability and performance of the device, beyond a certain limit of scaling down, with existing models, it becomes impossible to predict the noise performance of an individual transistor, specifically a MOSFET. The lack of accurate models leads the process and circuit designer either to adapt large area-transistor models with high errors or to use a trial-and-error method leading to significant waste of valuable time. As the Semiconductor Research Corporation (SRC) has correctly concluded that there is an urgent need to measure, analyze, and model the noise characteristics of next generation sub-micron transistors.
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Superconductive DevicesThe primary objective of this project was to fabricate YBa2Cu3O7-x thin-film microbridges for the purpose of millimeter-wave detection and mixing. Reactive sputtering and hot oxygen jet sputter fabrication techniques were employed to produce high-quality YBa2Cu3O7-x thin-films. After the initial investigation of the composition, microstructure and the DC electrical properties, these films were patterned into variable thickness microbridges for millimeter-wave detection and mixing applications. Special emphasis was given to the repeatability of the fabrication process as it applied to the transition temperature, critical current, and noise properties.
Publications
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“MEMS on Flexible Substrates,” Z. Celik-Butler and D. P. Butler, Encyclopedia of Nanotechnology, to be published.{Book Chapter} [Refereed/Juried]
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“Investigation of Degradation in Medium and High Voltage RESURF LDMOS by Means of Low Frequency Noise Analysis,” M. I.Mahmud, Z. Çelik-Butler, M. S. Rahman, Semiconductor Research Corporation TECHCON, Austin, TX, September 11-13, 2011.{Conference Paper} [Refereed/Juried]
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“The Low-frequency Noise and Stress-Induced Degradation in LDMOS,” M. I. Mahmud, Z. Çelik-Butler, P. Hao, T. Khan, F. Hou, and W. Huang, Proc. 21stInternational Conference on Noise and Fluctuations, pp. 352 – 355, June 12-16, 2011, Toronto Ontario, Canada.{Conference Proceeding} [Refereed/Juried]
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“MEMS Relative Pressure Sensor on Flexible Substrate,” M. Ahmed, D. P. Butler, and Z. Celik-Butler, Proc. of IEEE Sensors Conference, October 28-31, 2011, Limerick, Ireland.{Conference Proceeding} [Non-refereed/non-juried]
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“The Flicker Noise in Amorphous Silicon Based Temperature Sensors in Flexible Substrates,” M. Ahmed, D. P. Butler and Z. Celik-Butler, Proc. 21stInternational Conference on Noise and Fluctuations, pp. 154-157, June 12-16, 2011, Toronto Ontario, Canada.{Conference Proceeding} [Refereed/Juried]
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“Surface Micromachined MEMS Accelerometers on Flexible Polyimide Substrate,” I. E. Gonenli, D. P. Butler and Z. Çelik-Butler, IEEE Sensors Journal, vol. 11, pp. 2318-2325, 2011.{Journal Article} [Refereed/Juried]
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Temperature Sensor in a Flexible Substrate,” M. Ahmed, M. Chitteboyina, D. P. Butler, and Z. Celik-Butler, accepted for publication in IEEE Sensors Journal.{Journal Article} [Refereed/Juried]
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“Smart Skin: Multifunctional Sensor Arrays on Flexible Substrates,” Invited, Zeynep Celik-Butler and Donald P. Butler, Encyclopedia of Nanoscience and Nanotechnology, Edited by H.S. Nalwa, American Scientific Publishing, American Scientific Publishers, 2010, ISBN: 1-58883-159-0v.{Book Chapter} [Refereed/Juried]
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“Degradation in MOSFET Multi-stack High-k Gate Dielectrics due to Hot Carrier and Constant Voltage Stress,” Z. Çelik-Butler, and M. S. Shahriar, INVITED, 217thElectrochemical Society Meeting, Dielectrics for Nanosystems 4: Materials Science, Processing, Reliability, and Manufacturing, April, 26-18, 2010, Vancouver, BC Canada.{Conference Paper} [Refereed/Juried]
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“Self packaged MEMS Device,” M. S. Rahman, M. Chitteboyina, Z. Çelik-Butler, D. P. Butler, S. Pacheco, and R. McBean, Int. Microelectronics Packaging Society, 6th Int. Conf. and Exhib..on Device Packaging, March 8 – 11, 2010, Scottsdale, AZ.{Conference Paper} [Refereed/Juried]
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“Integrated Flexible Sensors (Smart Skin) for Structural Health Monitoring,” Z. Çelik-Butler and D. P. Butler, CONTACT (Consortium for Nanomaterials for Aerospace Commerce and Technology) Annual Review Meeting, Houston, TX, October 13-14, 2010.{Conference Paper} [Non-refereed/non-juried]
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“MEMS Accelerometers on Polyimides for Failure Assessment in Aerospace Systems,” ?. E. Gönenli, Z. Çelik-Butler, and D. P. Butler, Proc. of IEEE Sensors Conference, Nov. 1-4, 2010, Waikoloa, HI.{Conference Proceeding} [Refereed/Juried]
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“MEMS-Based Conformal Sensors for Real-Time Structural Health Monitoring,” Z. Celik-Butler, D. P. Butler, Z. Çelik-Butler, and D. P. Butler, Proc. Of ONR Naval Science and Technology Partnership Conference, Nov. 8 – 10, 2010, Washington DC.{Conference Proceeding} [Refereed/Juried]
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“Characterization of MEMS Piezoresistive Pressure Sensor using AFM,” S. K. Patil, Z. Çelik-Butler, and D. P Butler, Ultramicroscopy, vol. 110, pp. 1154-1160, 2010.{Journal Article} [Refereed/Juried]
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“Nanocrystalline Piezoresistive Polysilicon Film by Aluminum Induced Crystallization for Pressure Sensing Applications,” S. K. Patil, Z. Çelik-Butler and D. P Butler, IEEE Transactions on Nanotechnology, vol. 9, pp. 640-646, 2010.{Journal Article} [Refereed/Juried]
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“Device Level Vacuum Packaging for RF MEMS,” M. S. Rahman, M. Chitteboyina, Z. Çelik-Butler, D. P. Butler, S. P. Pacheco and R. V. McBean, IEEE Journal of Microelectromechanical Systems, vol. 19, pp. 911-918, 2010.{Journal Article} [Refereed/Juried]
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“Degradation in MOSFET Multistack High-k Gate Dielectrics Due to Hot Carrier and Constant Voltage Stress," Z. Çelik-Butler and M. S. Rahman, ECS Transactions, vol. 28, pp. 273 – 286, 2010.{Journal Article} [Refereed/Juried]
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“Piezoresistive Polysilicon Film Obtained by Low-Temperature Aluminum Induced Crystallization,” S. K. Patil, Z. Çelik-Butler, and D. P Butler, Thin Solid Films, vol. 519, pp. 479–486, 2010.{Journal Article} [Refereed/Juried]
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Self Packaged MEMS Device”, M. S. Rahman, M. Chitteboyina, Z. Celik-Butler, D. P. Butler, S. Pacheco, and R. McBean, “Special Feature in Electronic Parts & Components Magazine, Korea, pp. 42-46, November, 2010.{Journal Article} [Refereed/Juried]
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“Cost Effective RF MEMS Packaging,” M. S.Rahman, M. M. Chitteboyina, D. P. Butler, Z. Celik-Butler, S. P. Pacheco, R. V. McBean, Semiconductor Research Corporation TECHCON, Austin, TX, September 14-15, 2009.{Conference Paper} [Refereed/Juried]
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“A New 1/f Noise Model for Multi-Stack Gate Dielectric MOSFETs,” Z. Çelik-Butler, INVITED, Proc. 20th International Conference on Noise and Fluctuations, p. 249, June 14-19, 2009; Pisa, Italy.{Conference Proceeding} [Refereed/Juried]
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“A Low Frequency Noise Degradation in 45 nm High-k nMOSFETs due to Hot Carrier and Constant Voltage Stress,’ M. S. Rahman, Z. Çelik-Butler, M.A. Quevedo-Lopez, A. Shanware, and L.Colombo, Proc. 20th International Conference on Noise and Fluctuations, p. 263, June 14-19, 2009; Pisa, Italy.{Conference Proceeding} [Refereed/Juried]
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“Failure Assessment in Aerospace Systems via Integrated Multi-Functional Sensors,”İ. E. Gönenli, Z. Çelik-Butler, and D. Butler, Proc. Nanoelectronics Devices for Defense and Security Conference, Sept 27 – Oct 2, 2009, Fort Lauderdale, FL.{Conference Proceeding} [Refereed/Juried]
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“Nanocrystalline Piezoresistive Polysilicon Film By Aluminum Induced Crystallization For Pressure Sensing Applications,” S. Kumar Patil, Z. Çelik-Butler, and D. P. Butler, Proc. Nanoelectronics Devices for Defense and Security Conference, Sept 27 – Oct 2, 2009, Fort Lauderdale, FL.{Conference Proceeding} [Refereed/Juried]
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“Hot Carrier and Constant Voltage Stress Induced Low Frequency Noise in Nitrided High-k Dielectric MOSFETs,” M. S. Rahman, Z. Çelik-Butler, Tanvir Morshed, M. A. Quevedo-Lopez, A. Shanware and L. Colombo, IEEE Transactions on Device and Materials Reliability, vol. 9, pp. 203-208, 2009 .{Journal Article} [Refereed/Juried]
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“A Low Frequency Noise Model for Multi-Stack Gate MOSFETs,” S. V. Devireddy, Z. Çelik-Butler, H.-H. Tseng, P. Tobin, and A. Zlotnicka, Microelectronics Reliability, vol. 49, pp. 103–112, 2009.{Journal Article} [Refereed/Juried]
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“Microcrystalline Piezoresistive Polysilicon Film Obtained by Aluminum Induced Crystallization,” S. K. Patil, Z. Çelik-Butler and D. P. Butler, Proc. IEEE 8th Int. Conference on Nanotechnology, August 18-21, 2008; Arlington, TX.{Conference Proceeding} [Refereed/Juried]
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“Micromachined Nanoporous Membranes for Blood Oxygenation Systems,” V. Ambravaneswaran, S. Uttamaraj, Z. Çelik-Butler, R. C. Eberhart, C. J. Chuong, R. E. Billo and M. A. Savitt, Proc. IEEE 8th Int. Conference on Nanotechnology, August 18-21, 2008; Arlington, TX.{Conference Proceeding} [Refereed/Juried]
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“Physics-Based 1/f Noise Model for MOSFETs with Nitrided High‑κ Gate Dielectrics,” T. H. Morshed, S. P. Devireddy, Z. Çelik-Butler, A. Shanware, K. Green, J. J. Chambers, M. R. Visokay and L. Colombo, Solid-State Electronics, vol. 52, pp 711–724, 2008.{Journal Article} [Refereed/Juried]
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“Effect of Nitrogen Incorporation on 1/f Noise Performance of MOSFETs with HfSiON Dielectric,” M. S. Rahman, T. Morshed, S. P. Devireddy, Z. Çelik-Butler, M. A. Quevedo-Lopez, A. Shanware and L. Colombo, Journal of Applied Physics, vol. 103, p. 033706, 2008.{Journal Article} [Refereed/Juried]
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“Physics-Based 1/f Noise Model for MOSFETs with Nitrided High‑κ Gate Dielectrics,” T. H. Morshed, S. P. Devireddy, Z. Çelik-Butler, A. Shanware, K. Green, J. J. Chambers, M. R. Visokay and L. Colombo, Solid-State Electronics, vol. 52, pp 711–724, 2008.{Journal Article} [Refereed/Juried]
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“Smart Skin,” Z. Çelik-Butler and D. P. Butler, Invited in McGraw-Hill 2007 Yearbook of Science & Technology. ISBN-10: 007148647X ISBN-13: 978-0071486477{Book Chapter} [Refereed/Juried]
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“Integrated Multi-functional Sensors for Failure Prognosis in Aerospace Systems,” Z. Çelik-Butler, D. P. Butler and J. R. Lackey, Strategic Partnership for Research in Nanotechnology (SPRING) Workshop IV, University of Houston, Houston, TX, Feb. 6-7, 2007.{Conference Paper} [Non-refereed/non-juried]
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“A Nanoscale Membrane Oxygenator: Rationale, Design and Preliminary Findings,” R. C. Eberhart, K. Ambravaneswaran, B. Thomas, J. Wright, C. Chapman, Z. Çelik-Butler, C. Chuong, R. Billo, R. Timmons, Society for Biomaterials Annual Meeting, Chicago, IL, April 18-21, 2007.{Conference Paper} [Refereed/Juried]
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“Nano-Bio Research at UTA,” Z. Çelik-Butler, Texas-Korea Nano Workshop, University of Texas at Dallas, Dallas, TX, August 6-8, 2007.{Conference Paper} [Non-refereed/non-juried]
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“Vacuum Packaged RF MEMS Resonator,” M. M. Chitteboyina, D. P. Butler, S. P. Pacheco, R. V. McBean, Semiconductor Research Corporation TECHCON, Austin, TX, September 10-12, 2007.{Conference Paper} [Refereed/Juried]
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Self-Packaged Flexible MEMS,” Z. Çelik-Butler and D. P. Butler, 2007 Transpacific Workshop on Flexible Electronics,” University of Texas at Dallas, Dallas TX, December 3, 2007.{Conference Paper} [Refereed/Juried]
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“Low Frequency Noise Characterization of TaSiN/HfO2 MOSFETs Below Room Temperature,” Z. Çelik-Butler, S. V. Devireddy, T. Morshed, S. Rahman, H.-H. Tseng, P. Tobin and A. Zlotnicka, INVITED, Proc. 19th International Conference on Noise and Fluctuations, p. 19, September 9-14, 2007; Tokyo, Japan.{Conference Proceeding} [Refereed/Juried]
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“Variable Temperature Characteristics of Devices With HfSiON as The High-κ Dielectric on Nitrided Silicate (SiON) Interfacial Layer,” T. H. Morshed, Z. Çelik-Butler, S. P. Devireddy, M. S. Rahman, A. Shanware, K. Green, J. J. Chambers, M. R. Visokay and L. Colombo,, Proc. 19th International Conference on Noise and Fluctuations, p. 281, September 9-14, 2007; Tokyo, Japan.{Conference Proceeding} [Refereed/Juried]
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“Effect of Nitrogen Incorporation Methods on 1/f Noise and Mobility Characteristics in HfSiON NMOSFETs,” M. S. Rahman, T. Morshed, S. P. Devireddy, M.A. Quevedo-Lopez, A. Shanware, L. Colombo, and Z. Çelik-Butler, Proc. 19th International Conference on Noise and Fluctuations, p. 25, September 9-14, 2007; Tokyo, Japan.{Conference Proceeding} [Refereed/Juried]
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“A New Model for 1/f Noise in High-κ MOSFETs,” T. Morshed, S. P. Devireddy, M. S. Rahman, Z. Çelik-Butler, H.-H. Tseng, A. Zlotnicka, A. Shanware, K. Green, J. J. Chambers, M. R. Visokay, M.A. Quevedo-Lopez and Luigi Colombo, IEEE 2007 International Electron Devices Meeting (IEDM) Technical Digest, pp. 561-564 , 2007.{Conference Proceeding} [Refereed/Juried]
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“Improved Low Frequency Noise Characteristics of Sub-micron MOSFETs with TaSiN/TiN Gate on ALD HfO2 Dielectric,” S. P. Devireddy, B. Min and Z. Çelik-Butler, F. Wang, A. Zlotnicka, H. H. Tseng and P. J. Tobin, Microelectronics Reliability,vol. 47, pp. 1228-1232, 2007.{Journal Article} [Refereed/Juried]
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“A device-level vacuum-packaging scheme for microbolometers on rigid and flexible substrates,” A. Mahmood, D. P. Butler and Z. Çelik-Butler, IEEE Sensors Journal, vol. 7, pp. 1012-1019, 2007.{Journal Article} [Refereed/Juried]
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“Low frequency noise and mobility degradation mechanisms in high-k MOSFETs,” S. P. Devireddy, Z. Çelik-Butler, H.-H Tseng, and A. Zlotnicka, 3rd Int. Symp. Advanced Gate Stack Technology, Austin TX, Sept. 27-29, 2006.{Conference Paper} [Refereed/Juried]
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“Fabrication of a Nanoscale, Nanoporous Membrane Oxygenator,” C.-Y. Ko1, V. Ambravaneswaran, Z. Çelik-Butler, R. E. Billo, C-J. Chuong, R. B. Timmons and R. C. Eberhart, Southwestern Medical Center, Dallas, TX, June 7, 2006.{Conference Paper} [Non-refereed/non-juried]
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“Micromachined Bolometers on Polyimide,” A. Mahmood, Z. Çelik-Butler, and D. Butler, Sensors and Actuators A, vol. 132, pp. 452-459, 2006.{Journal Article} [Refereed/Juried]
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“Flexible Sensors: a Review,” Z. Çelik-Butler and D. P. Butler, J. Nanoelectronics and Optoelectronics,vol. 1, pp. 194-202, 2006.{Journal Article} [Refereed/Juried]
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“Low Frequency Noise in TaSiN/ HfO2 nMOSFETs and the Effect of Stress Relieved Pre-Oxide Interfacial Layer” S. P. Devireddy, B. Min, Z. Çelik-Butler, H.-H. Tseng, P. Tobin, F. Wang and A. Zlotnicka, IEEE Transactions on Electron Devices, vol. 53, pp. 538-544, 2006.{Journal Article} [Refereed/Juried]
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“Micromachined Integrated Pressure-Thermal Sensors on Flexible Substrates,”V. Shamanna, S. Das, Z. Çelik-Butler, D. P. Butler, and K. L. Lawrence, Journal of Micromechanics and Microengineering vol. 16, 1984-1992, 2006.{Journal Article} [Refereed/Juried]
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“Impact of Interfacial Layer on Low Frequency Noise of HfSiON Dielectric MOSFETs,” B. Min, S. P. Devireddy, Z. Çelik-Butler, A. Shanware, L. Colombo, K. Green, J. J. Chambers, M. R. Visokay, and A.L.P. Rotondaro, IEEE Transactions on Electron Devices, vol. 53, pp. 1459-1466, 2006.{Journal Article} [Refereed/Juried]
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“Dependence of Low Frequency Noise in SiGe Heterojunction Bipolar Transistors on the Dimensional and Structural Features of Extrinsic Regions,” M. M. Ul Hoque, Z. Çelik-Butler, S. Martin, C. Knorr and C. Bulucea, Solid State Electronics, vol. 50, pp. 1430-1439, 2006.{Journal Article} [Refereed/Juried]
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D. P. B. Dayeh and Z. Çelik-Butler. "Micromachined Infrared Bolometers on Flexible Polyimide Substrates," Sensors and Actuators, vol. A118, pp. 49-56, 2005.{Journal Article} [Refereed/Juried]
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S. P. D. Min, L. C. Çelik-Butler, K. G. Shanware, J. J. Chambers, and M. R. Visokay. "Low Frequency Noise Characteristics of HfSiON Gate-Dielectric MOSFETs," Applied Physics Letters, vol. 86, pp. 082102, 2005.{Journal Article} [Refereed/Juried]
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“Origin of 1/f Noise in Lateral PNP Bipolar Transistors,” E. Zhao, Z. Çelik-Butler, F. Thiel and R. Dutta, Microelectronics Reliability, vol. 44, pp. 89-94, 2004.{Journal Article} [Refereed/Juried]
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D. P. B. Mahmood and Z. Çelik-Butler. "Flexible Microbolometers Promise Smart Fabrics with Imbedded Sensors,”," Laser Focus World, pp. 99-103, 2004.{Journal Article} [Refereed/Juried]
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Min, S. P. D.; Çelik-Butler, F. W.; Zlotnicka, H. H. T.; Tobin, P. J. Low-Frequency Noise in Sub-Micron MOSFETs with HfOx, HfO2/Al2O3 and HfAlOx Gate Stacks,. IEEE Transactions on Electron Devices 2004, 51, 1679 - 1687.{Journal Article} [Refereed/Juried]
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“Effect of Interfacial Oxide Thickness on 1/f Noise in Polysilicon Emitter BJTs,” M. M. Hoque, Z. Çelik-Butler, D. Lan, D. Weiser, J. Trogolo, and K. Green, IEEE Transactions on Electron Devices vol. 51, pp. 1504-1513, 2004.{Journal Article} [Refereed/Juried]
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“Microbolometers on a Flexible Substrate for Infrared Detection,” A. Yildiz, Z. Çelik-Butler, D. P. Butler, IEEE Sensors Journal, vol. 4, pp. 112-117, 2004.{Journal Article} [Refereed/Juried]
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“Model for Random Telegraph Signals in Sub-Micron MOSFETs,” N. V. Amarasinghe, Z. Çelik-Butler, F. Wang and A. Zlotnicka, Solid State Electronics, vol. 47, pp. 1443-1449, 2003.{Journal Article} [Non-refereed/non-juried]
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“Crystallization and Pyroelectric Effect of Semiconducting YBaCuO Thin Films Deposited on Substrates at Different Temperatures,” A. Yildiz, D. Butler, Z. Çelik-Butler and, C.-U. Kim, Journal of Vacuum Science and Technology B, vol. 21, pp. 837-842, 2003{Journal Article} [Refereed/Juried]
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Çelik-Butler, Z. and Amarasinghe, N. V., "Random Telegraph Signals in Deep Sub-Micron MOSFETs," Noise and Fluctuation Control in Electronic Devices, Eds. Balandin, A., , 2002.{Book Chapter} [Refereed/Juried]
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Çelik-Butler, Z., "Low-Frequency Noise In Deep-Submicron Metal-Oxide Semiconductor Field-Effect Transistors," Special Topics on Noise in Semiconductors, IEE Proceedings on Circuits, Devices and Systems, 2002, pp. 23-31.{Conference Paper} [Non-refereed/non-juried]
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Yildiz, D. P. B. and Çelik-Butler, C. U. K., "Investigation of Temperature Coefficient of Resistance and Crystallization of Semiconducting YBaCuO Thin Films Using Pulsed Laser Annealing," Journal of Vacuum Science and Technology B, Vol. 20, 2002, 548-553.{Journal Article} [Refereed/Juried]
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Almasri, Z.{Journal Article} [Refereed/Juried]
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Zhao, Z. C. B., Thiel, F., and Dutta, R., "Temperature Dependence of 1/f Noise in Polysilicon Emitter Bipolar Transistors," IEEE Transactions on Electron Devices, Vol. 49, 2002,.{Journal Article} [Refereed/Juried]
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Çelik-Butler, Z. & Butler, D. P. (2001). IR Detector Arrays, Uncooled. In Peter J. Lee. (Eds.), Engineering Superconductivity, Wiley-Interscience.{Book Chapter} [Refereed/Juried]
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Amarasinghe, Z. C. B. and Keshavarz, A., "Extraction of Oxide Trap Properties Using Temperature Dependence of Random Telegraph Signals in Sub-micron MOSFETs," Journal of Applied Physics, Vol. 89, 2001, 5526-5532.{Journal Article} [Refereed/Juried]
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Almasri, D. P. B. and Çelik-Butler, Z., "Self-Supporting Infrared Microbolometers With Low-Thermal Mass," IEEE/ASME Journal of Microelectromechanical Systems, Vol. 10, 2001, 469-476.{Journal Article} [Refereed/Juried]
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Leonov, D. P. B., Çelik-Butler, K. R. U., Hanson, C. M., and Beratan, H. R., "Dielectric loss and related noise of pyroelectric modified lead titanate arrays," Solid State Electronics, Vol. 45, 2001, 735-741.{Journal Article} [Refereed/Juried]
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Çelik-Butler, D. P. B. & Sobolewski, R. (2000). Yttrium Barium Copper Oxide as an Infrared Radiation Sensing Material. In H. S. Nalwa. (Eds.), Handbook of Advanced Electronic and Photonic Materials Vol. 3. Academic Press.{Book Chapter} [Refereed/Juried]
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"Pyroelectric Effect in Y-Ba-Cu-O Thin Films Under Laser Illumination," D. P. Butler, Z. Çelik-Butler, R. Adam, and R. Sobolewski, Journal of Applied Physics, vol. 85, pp. 1075-1079, 1999.{Journal Article} [Non-refereed/non-juried]
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“MgO Sacrificial Layer for Micromachining Uncooled Y-Ba-Cu-O IR Microbolometers on Si3N4 Bridges," J. Gray, Z. Çelik-Butler, and D. P. Butler, IEEE Journal of Microelectromechanical Systems, vol. 8, pp. 192-199, 1999.{Journal Article} [Non-refereed/non-juried]
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“Channel Length Scaling of 1/f Noise in 0.18 mm Technology MDD n-MOSFETs,” Z. Çelik-Butler, P. Vasina, Solid State Electronics, vol. 43, pp. 1695-1701, 1999.{Journal Article} [Non-refereed/non-juried]
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“Cryogenic Performance of Semiconducting Y-Ba-Cu-O for Infrared Detection,” M. Almasri, D. P. Butler, Z. Çelik-Butler, R. Adam, R. Sobolewski, Superconductor Science and Technology, vol. 12, pp. 751-754, 1999.{Journal Article} [Non-refereed/non-juried]
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Çelik-Butler, Z. and Butler, D. P., "Uncooled IR Detector Arrays," Wiley Encyclopedia of Electrical and Electronics Engineering, Eds. Webster, J. G., , 1998.{Book Chapter} [Refereed/Juried]
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Butler, A. J., Shan, C. M. T., and Çelik-Butler, Z., "IR Detection at Room Temperature Using Semiconducting YBaCuO," SPIE CD-ROM series, Vol 1: Infrared Technology, 1998,.{Journal Article} [Refereed/Juried]
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Çelik-Butler, D. P. B., Jahanzeb, C. M. T., and Gray, J. E., "Room Temperature Operation of a YBaCuO Microbolometer," SPIE CD-ROM series, Vol 1: Infrared Technology, 1998,.{Journal Article} [Refereed/Juried]
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“Strong Pyroelectric Response in Semiconducting Y-Ba-Cu-O and its Application to Uncooled Infrared Detection,” A. Jahanzeb, C. M. Travers, D. P. Butler, Z. Çelik-Butler, J. E. Gray. Applied Physics Letters, vol. 70, pp. 3495-3497, 1997.{Journal Article} [Non-refereed/non-juried]
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"Charge Transport in Amorphous and Tetragonal Semiconducting YBaCuO Thin Films," Z. Çelik-Butler, P. C. Shan, D. P. Butler, A. Jahanzeb, C. M. Travers, W. Kula, R. Sobolewski, Solid-State Electronics, vol. 41, pp. 895-899, 1997.{Journal Article} [Non-refereed/non-juried]
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"Hall-Effect in Semiconducting Epitaxial and Amorphous Y-Ba-Cu-O Thin Films," P. C. Shan, A. Jahanzeb, D. P. Butler, Z. Çelik-Butler, W. Kula, and R. Sobolewski, Journal of Applied Physics, vol. 81, pp. 6866-6873, 1997.{Journal Article} [Non-refereed/non-juried]
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"Fabrication of Semiconducting YBaCuO Surface Micromachined Bolometer Arrays, " C. M. Travers, A. Jahanzeb, D. P. Butler, Z. Çelik-Butler, IEEE/ASME Journal of Microelectromechanical Systems, vol. 6, pp. 271-276, 1997.{Journal Article} [Non-refereed/non-juried]
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"A Semiconductor YBaCuO Microbolometer for Room Temperature IR Imaging," A. Jahanzeb, C. M. Travers, Z. Çelik-Butler, D. P. Butler, and S. Tan, IEEE Transactions on Electron Devices, vol. 44, pp. 1795-1801, 1997.{Journal Article} [Non-refereed/non-juried]
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"1/f Noise and Dark Current Components in HgCdTe MIS Detectors," W. He, and Z. Çelik-Butler, Solid-State Electronics, vol. 39, p. 127, 1996.{Journal Article} [Non-refereed/non-juried]
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"1/f Noise and Electromigration in Multi-layered Via Structures," R. Zhang, Z. Çelik-Butler, N. Patel, Solid-State Electronics, vol. 39, p. 281, 1996.{Journal Article} [Non-refereed/non-juried]
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"1/f Noise as an Electromigration Characterization Tool for W-plug Vias Between TiN/Al-Cu/TiN Metallizations," Z. Çelik-Butler, Solid-State Electronics, vol. 39, p. 999, 1996.{Journal Article} [Non-refereed/non-juried]
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"The Investigation of Semiconducting YBaCuO Thin Films: A New Room Temperature Bolometer," P. C. Shan, Z. Çelik-Butler, D. P. Butler, A. Jahanzeb, C. Travers, W. Kula, and R. Sobolewski, Journal of Applied Physics, vol. 80, pp 7118-7123, 1996.{Journal Article} [Non-refereed/non-juried]
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Jahanzeb, P. C. S., Çelik-Butler, Z., and Butler, D. P., "Low-Frequency Fluctuations in Semiconducting and Superconducting YBa2Cu3Ox Thin Films," Proc. 13th International Conf. on Noise in Physical Systems and 1/f Fluctuations, 1995, pp. 115-118.{Conference Paper} [Refereed/Juried]
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Jahanzeb, P. C. S., Çelik-Butler, Z., and Butler, D. P., "Studies and Implications of the Hall-Effect in Superconducting and Semiconducting YBa2Cu3O7-δ Thin Films," Journal of Applied Physics, Vol. 78, 1995, 6658.{Journal Article} [Refereed/Juried]
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Jahanzeb, A. and Çelik-Butler, Z., "Low-Frequency Noise and Hall Effect Studies on YBa2Cu3O7-δ Thin Films," IEEE Tran. on Applied Superconductivity, Vol. 5, 1995, 1416.{Journal Article} [Refereed/Juried]
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"Modeling of High-Tc Superconductor Parametric Amplifiers and Mixers," J. Wang, D. P. Butler, and Z. Çelik-Butler, Physica C, vol. 231, p. 272, 1994.{Journal Article} [Non-refereed/non-juried]
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"1/f Noise in HgCdTe Metal-Insulator-Semiconductor Infrared Detectors," W. He and Z. Çelik-Butler, J. Vacuum Science Technology B, vol. 11, p. 1833, 1993.{Journal Article} [Non-refereed/non-juried]
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"A 1/f Noise Model Based on Fluctuating Defect States," S. R. Borrello and Z. Çelik-Butler, Solid-State Electronics, vol. 36, p. 407, 1993.{Journal Article} [Non-refereed/non-juried]
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"Two-Level Noise Switching in YBa2Cu3O7 Microbridges," D. P. Butler, Z. Çelik-Butler and J. Wang, Solid-State Electronics, vol. 36, p. 1507, 1993.{Journal Article} [Non-refereed/non-juried]
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"Conversion Gain and Noise of YBa2Cu3O7 Weak-Link Mixers" D. P. Butler, J. Wang, A. Bhandari and Z. Çelik-Butler, IEEE Transactions on Applied Superconductivity, vol. 3, p. 2269, 1993.{Journal Article} [Non-refereed/non-juried]
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"Measurements of Noise and Temperature Coefficient of Resistance on YBaCuO Thin Films in Magnetic Field," Z. Çelik-Butler, W. Yang and D. P. Butler, Applied Physics Letters, vol. 60, p. 246, 1992.{Journal Article} [Non-refereed/non-juried]
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"Prediction of Electromigration Failure in W / Al-Cu VLSI Interconnections by 1/f Noise Measurements," Z. Çelik-Butler and M. Ye, Solid-State Electronics, vol. 35, p. 1209, 1992.{Journal Article} [Non-refereed/non-juried]
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"Conversion Loss of a YBa2Cu3O7 Grain Boundary Mixer at 20 GHz," D. P. Butler, J. Wang, W. Yang, A. Bhandari and Z. Çelik-Butler, Applied Physics Letters, vol. 61, p. 333, 1992.{Journal Article} [Non-refereed/non-juried]
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"Characterization of Electromigration Parameters in VLSI Metallizations by 1/f Noise Measurements," Z. Çelik-Butler, W. Yang, H. H. Hoang and W. R. Hunter, Solid State Electronics, vol. 34, p. 185, 1991.{Journal Article} [Non-refereed/non-juried]
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"A Model for Electromigration and Low-Frequency Noise in Thin Metal Films," Z. Çelik-Butler and W. Yang, Solid State Electronics, vol. 34, p. 911, 1991.{Journal Article} [Non-refereed/non-juried]
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"1/f Noise in HgCdTe Field-Effect Transistors," Z. Çelik-Butler, S. Alamgir and S. R. Borrello, Solid State Electronics, vol. 33, p. 585, 1990.{Journal Article} [Non-refereed/non-juried]
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"Reply to 'Comments on 'Determination of Si-SiO2 Interface Trap Density by 1/f Noise Measurements''," Z. Çelik-Butler and T. Y. Hsiang, IEEE Tran. Electron Devices, vol. 37, p. 825, 1990.{Journal Article} [Non-refereed/non-juried]
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"Uncooled IR Detector Arrays,” Z. Çelik-Butler and D. P. Butler, Invited, Wiley Encyclopedia of Electrical and Electronics Engineering, 1998 Edition, Editor: John G. Webster, ISBN: 0-471-13946-7.{Book Chapter} [Non-refereed/non-juried]
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"Spatial Correlation Measurements of 1/f Noise in Semiconductors," Z. Çelik-Butler and T. Y. Hsiang, Solid-State Electronics, vol. 31, p. 241, 1988.{Journal Article} [Non-refereed/non-juried]
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"Determination of Si-SiO2 Interface Trap Density by 1/f Noise Measurements," Z. Çelik-Butler and T. Y. Hsiang, IEEE Tran. Electron Devices, vol. 35, p. 1651, 1988.{Journal Article} [Non-refereed/non-juried]
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"Spectral Dependence of 1/fg Noise on Gate Bias in N-MOSFETs," Z. Çelik-Butler and T. Y. Hsiang, Solid-State Electronics, vol. 30, p. 419, 1987.{Journal Article} [Non-refereed/non-juried]
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"Study of 1/f Noise in N-MOSFETs: Linear Region," Z. Çelik and T. Y. Hsiang, IEEE Tran. Electron Devices, vol. ED-32, p. 2797, 1985.{Journal Article} [Non-refereed/non-juried]
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2007
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2002
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2001
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1990
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1989
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1988
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1987
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1985
Support & Funding
This data is entered manually by the author of the profile and may duplicate data in the Sponsored Projects section.-
- Jan 2002 to Dec 2003 Compact, Scalable Computer Models for Noise in Advanced CMOS sponsored by - $148290
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- Oct 2001 to Mar 2002 Small Grants for Exploratory Research sponsored by - $70000
- Sept 2001 to Aug 2002 Broad-Band Pyroelectric IR Detectors sponsored by - $261000
- Aug 2001 to Aug 2004 Measurements and Modeling of Noise in Advanced Bipolar sponsored by - $210000
- Aug 2001 to July 2004 Micromachined Infrared Sensors on Flexible Substrates sponsored by - $300000
- Mar 2001 to Dec 2002 Noise Performance and Modeling of Bipolar Transistors sponsored by - $47263
Sponsored Projects
This data is automatically updated by the Office of Grants & Contracts.- Past
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Apr 2012
to
Dec 2015
Measurement and Modeling of Semiconductor/ Gate Dielectric Defects using Random Telegraph Signals sponsored by Moore Foundation - $269,842 PIBACKGROUND & NEEDS: Proposed work addresses the following high priority research needs: Reliability/Variability and Stress and Defects: Understanding and modeling of (1) physical mechanisms for defect formation in the semiconductor/gate dielectric interface; (2) the effect of process (such as random doping fluctuations, annealing steps and others) on defect formation and charge trapping / detrapping by these defects; (3) formation and / or activation of defects by hot-carrier stressing (HCS) and shallow trench isolation (STI) induced mechanical stress.OBJECTIVE / OUTCOME: A physics-based, measurement-driven, statistical model for charge carrier trapping/de-trapping at the semiconductor / gate dielectric interface that incorporates the effects of selected fabrication process variations and electrical / mechanical stress. For this purpose, we will (1) devise a methodology for individually identifying and characterizing electrically active defects (traps), specifically carrier trapping and scattering states, in MOS structures; (2) extract each trap?s 3D location, capture and emission time constants, capture cross-section, screened scattering coefficient and type (acceptor/donor); (3) develop statistical models for the above properties associated with the traps. (3) understand and incorporate into the model, the effect of selected fabrication process variations and mechanical / electrical stress (by HCS, STI for example) on creation and activation of these defects as charge carrier traps.read more...
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Jul 2011
to
Jun 2014
Individual Defect Characterization and Modeling by Variable Temperature Random Telegraph Signal Measurements in Analog MOS Devices sponsored by Semiconductor Research Corporation (SRC) - $45,000 PIProposed work addresses the following high priority research needs for AMSD: 1(a) MOSFET general analog transistor performance, 1(e) MOSFET Reliability 3(a) MOSFET power amplifier reliability.Device scaling in RF and AMS CMOS has brought about significant reliability issues. Although some of these have been shared and solved by high-performance logic CMOS, there are several unique problems. The goal is (1) to devise a methodology for individually identifying and characterizing electrically active defects, specifically carrier trapping and scattering states, in MOS structures; (2) to extract each trap?s 3D location, capture and emission activation energies, capture cross-section and type (acceptor/donor); (3) to develop a statistical model for predicting the above properties associated with traps.read more...
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Jun 2011
to
Dec 2012
Cerebrospinal Fluid (CSF) Flow Measurement and Monitoring for Ventricular Shunts sponsored by Texas Medical Research Collaborative (TxMRC) - $45,000In this proposal, we offer to design and implement a proof-of-concept prototype by which such monitoring becomes a reality.
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Oct 2010
to
Feb 2013
Integrated Flexible Sensors (Smart Skin) for Structural Health Monitoring sponsored by Rice University - $212,999The objective is to develop integrated MEMS sensors on flexible substrates for structural health monitoring of aircraft.The sensors include accelerometers, pressure sensors, temperature sensors, and acoustic sensors. These MEMS based embedded structural sensor strips will support the realization of a reliable system, capable of sensing material changes that may affect aircraft structural integrity. This is a CONTACT proposal for funding from AFOSR through Rice University.read more...
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Feb 2010
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Apr 2012
ARRA - MRI-R2: Acquisition of Precision Wafer Aligner / Bonder for 3-D Integrated Nano-Opto-Electromechanical Systems (NOEMS) sponsored by National Science Foundation (NSF) - $535,000A wafer aligner and bonder system is requested for precision alignment and bonding of a diverse set of substrates including silicon, glass, gallium arsenide and others.Temporary and permanent bonding methods of anodic, glass frit, eutectic metal and thermocompression metal layers wiuth accuracy down to 1m is reuired. Multiple layers of wafers will need to be precisely aligned from either top side or bottom side with optical or infrared means, such that opaque substrates can also be bonded. Nanoimprint lithography and embossing will enable definition and pattering of geometries in nanometer scale with no limitation from UV wavelength interference.read more...
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Jan 2010
to
Aug 2011
Nanoporous Membrane Based Blood Oxygenator and Monitoring Device - $42,140A multi-disciplinary team project brings expertise from UTA, UTD, and THMIT to address a critical need in the area of cardiovascular disorders.Support for this project will prepare the team for major funding from federal resources and the eventual success will affect ives of millions of people that suffer from cardiovascular disorders.read more...
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Jul 2009
to
Dec 2011
Investigation of Degradation in Medium and High voltage MOS Transistors. - $160,884 PIWe will determine different deredation mechanisms in medium- and high-voltage Mos transistors, especially LDMOS and its different ?flavors? Such as reduced surface field (RESURF), floating RESURF and others.Once possible physical causes for the degradation mechanisms are dientified, highly accurate, nondestructive and relatively fast diagnostic methodologies will be developed for health assessments such as elevated temperatures (as in automotive industry), the device reliability and life-time will be assessed up to 375 K. Although the specific aim is to look at LDMOS, other novel integrated power MOS, such as Trench-Based configurations will also be considered if silicon becomes avaliable from partner companies.read more...
- Jan 2009 to Aug 2011 MRCEDM:Nanoporous Membranes for Defense and Medical Applications - $56,310 PI
- Jan 2009 to Aug 2011 MRCEDM: Metal Etcher Repair and Restoration - $6,807 PI
- Jul 2008 to Nov 2009 Prosthetic Skin sponsored by University of Texas System (UT System) - $50,000 PI
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May 2007
to
Nov 2009
Multi-Sensor Design and Fabrication Technology sponsored by Lockheed Martin Corporation - $40,000UTA shall develop designs, integration and technologies for multi-sensor develipment and fabrication.These tasks will continually consider the eventual ability to integrate with RF (wireless) communication and the ability to be self powered through energy harvesting technologies. The multi-sensor design shall incorporate the sensing capability for temperature, pressure, strain, vibration. The packaging will be conformal to a radius of o.2 inches. Alternate designs will be documented and presented in the report. UTA will draft a plan for characterizing sensor capabilities.read more...
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Jan 2007
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May 2009
Nanoporous Membrane Blood Oxygenator sponsored by Aurora Health Care Foundation - $173,915Experimental characterization of membrane permeability to gas and membrane mechanical strengths will be carried out.With these measurements, we are able to refine the candidate oxygenator designs in the pressure-flow characteristics for blood, gas and the amounts of gas exchange.read more...
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Nov 2006
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May 2009
"UTA Spring Seed Research and Instrument Acquisition FY06" - Integrated Multi-Functional Sensors for Failure Prognosis in Aerospace Systems - $149,402Prognosis is predictive diagnostics which includes estimating the health state and remaining useful life or time span of proper operation of a component.Condition Based Logistics (CBL) is a well-recognized cost mitigation method to counter the wasteful phase maintenance paradigm in use for aging aircraft. In addition, this technology supports the Global Sustainment Initiative (GSI) by providing the monitoring systems retrofitable into current and older aircraft platforms. The Operations and Support (O&S) cost is a major government concern ($100B per year cost in 10 years as estimated by the government) and this proposal addresses the cost mitigation by providing a non-intrusive, lightweight, multi-sensor package system that supports the CBL because ti is a vital ingredient for in-situ system health monitoring and management. We will design analyze and prototype various configurations for multi-sensors that can provide temperature, acceleration, pressure, and strain information in one package within a 1x1x0.1 cm3 dimension; including sufficient volume allocation for energy hervesting and RF communication sections for future development. Although not part of this two-year project, the ultimate goal of this program is to develop self-powered, self-packaged, conformal, multi-sensory systems on plastics with wireless communication capability. We propose to develop integrated temperature, pressure, acceleration and strain sensors on a singel flexible substrae and self-packaged with another flexible superstarate, such that the sensors and the supporting electronics will be on the plane of minimal strain. The integrates sensors will be prototyped and lab tested for figures fo meris at UTA's Nanotechnology Research and Teaching facility and field-tested at Lockheed Martin Aeronautics Company by their Advanced Design Program (Skunkworks) Technology Development and Integration Department.read more...
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Sep 2006
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Aug 2007
Rapid Biodiesel Production via Microchannel - Based Transestrification of Cottonseed Oil sponsored by Texas Department of Agriculture - $29,667This purpose of this project is to investigate the production of biodiesel from cottonseed oil using microchannels.Since mixing takes place at a small scale, the amount of biodiesel production can be dramatically increased. This project will involve the development of a mathematical model for the chemical process, a computer simulation, design on the microchannel device, and manufacturing of the device. Experiments will be performed using the device and the results will be compared with those obtained through simulation and those available in the open literature.read more...
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Aug 2006
to
Jul 2009
Devices and Materials for a Biodiesel Microreactor (MRCEDM Matching Fund) - $60,000This proposal is a grant from MRCEDM meant to match funding received by BioTech Ventures, LLC
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Aug 2006
to
Apr 2008
Biodiesel Production via Microchannel-based Transestrification of Agricultural Vegetable Oils sponsored by Biotech Ventures, LLC - $150,000This purpose of this project is to investigate the production of biodiesel from cottonseed oil using microchannels,.Since mixing takes place at a small scale, the amount of biodiesel production can be dramatically increased. The project will involve the development of a mathematical model for the chemical process, a computer simulation, design of the microchannel device, and manufacturing of the device. Experiments will be performed using device and the results will be compared with those obtained through simulation and those available in the open literature.read more...
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Jun 2006
to
Aug 2009
Self-packaged MEMS Devices - $180,000This proposal addresses a high risk, high pay-off new concept in packing.ITRS2005 stresses the specific requirements for MEMS packaging.read more...
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Mar 2006
to
Nov 2009
Pre-Concept Design and Manufacturing Cost Study of Smart CPR Sensors sponsored by Laerdal Medical Corporation - $372,741The objective of the proposed project is to estimate the manufacturing costs for new MEMs type sensor and identify potential manufactuerer.Our intention is for provide Laerdal the manufacturing cost information necessary for making future funding decisions.read more...
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Nov 2004
to
May 2005
Antenna-Coupled Y-Ba-Cu-O Microbolometers sponsored by Lockheed Martin Corporation - $30,370The purpose of this program will be to develop Antenna Coupled Infrared Detectors using YBaCuO for MWIR (mid wave infrared wavelengths)(3-5 um).The antenna is designed to seonate at the wavelength: 3-5 um. The following subcontractor tasks are to be accomplished: (1a) Using the appropiate software, a design of antenna coupled Infrared Detectors with YBaCuO as the absorption material will be carried out (1b) A simulation of the designed device will be conducted. (1c) At least one iteration of the design=simulation will be conducted. (1d) A preliminary layout of the device will be created.read more...
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Aug 2004
to
Jul 2008
Electronic Sensitive Skin with Integrated Tactile, Infrared, Flow Sensors on Flexible Substrates sponsored by National Science Foundation (NSF) - $211,449 PIThe objectives of this research are to integrate thermometers, micromachined infrared detectors, pressure sensors and "Hair-like" microstructures onto flexible substrates such as commercially available Kapton, Ultem, PEEK, Supec and Mylar as well as custom made inorganic polymers developed under the current NSF grant.This research will enable comprehensive sensing of temperature, pressure and touch by distributed sensors on low cost, rollable, foldable substrates.read more...
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Apr 2004
to
Aug 2007
Noise Modeling at Quantum Level for Advanced CMOS Technologies. - $180,000 PIWe propose to investigate and model single electron switching events (RTS) and low-frequency noise in advanced CMOS devices.The final deliverables to the industry will be modeling equations that accurately predict the circuit noise behavior of the advanced CMOS devices, the associated code that can be easily incorporated into BSIM and the related documentation.read more...
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Jan 2004
to
Aug 2006
ATP: Analysis and Modeling of Interface Generated Noise in High K Dielectric Gate Stacks sponsored by Texas Higher Education Coordinating Board - $135,930 PIWe propose to investigate and model singel electron switching events (RTS) and low-frequency noise in advanced CMOS devices.The final deliverables to the industry will be modeling equations that accurately predict the circuit noise behavior of the advanced CMOS devvices, the associated code that can be easily incorporated into BSIM and the related documentation.read more...
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Jan 2003
to
Dec 2005
Semicondicting YBaCuO Uncooled Focal Plane Arrays sponsored by Air Force Office of Scientific Research - $181,806Uncooled infrared detectors utilize MEMS thermal sensors to detect infrared radiation.These microsensors have applications in imaging for nightvision and thermography, radiometry for remote temperature sensing, and spectroscopy for spectroscopic analysis. This research iinvestigates improvements in microsensor design through the development of laminated supporting arms to reduce the thermal conductance and increase responsivity. Further a readout curcuit will be disigned and fabricated at the MOSIS foundry to integrate the microsensors with on-chip readout.read more...
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Sep 2002
to
Dec 2005
Measurements and Modeling of Noise in Advanced Bipolar Technologies sponsored by Semiconductor Research Corporation (SRC) - $216,072 PITask 1013 is a customized funding for Texas Instruments on measurements, analysis and modeling of low-frequency noise on advanced Bipolar technologies.Since it is TI-customized, it has mainly focused on TI's needs, primarily poly-silicon emitter BJTs. However, the models and computer codes developed under this program are available to all SRC members. Recently, we have started performing noise measurements on HBTs supplied by National Semiconductor. The funding for this work has been obtained internally. Our initial measurements show that the mechanisms responsible for the noise in these HBTs are different from those in poly-silicon emitter BJTs. Therefore, funding is requested to supplement the Task 1013. In addition, an extension is requested until December 31, 2004, upon which time we intend to submit a proposal for NS-customized proposal on noise modeling in HBTs.read more...
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Sep 2002
to
Dec 2004
Micomachined Infrared Sensors for Flexible Substrates sponsored by National Science Foundation (NSF) - $221,803We propose to investigate the development of a flexible skin that incorporates distributed sensor arrays to provide a greater measurement of the environment by measuring pressure, temperature, and radiant energy over the surface of the of the artificial skin.The use of conventional microelectronic materials and organic semiconductors will be investigated. The ability to flex would allow the device to be incorporated in gloves for humans and machines to provide operators a remote sense of touch. The technical aspects to be addressed in this research are the materials and devices that would enable a flexible sensitive skin to be produced with sensors integrated on a micro-scale using microfabrication techniqqes.read more...
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Sep 2002
to
Dec 2003
Compact, Scalable Computer Models for Noise in Advanced CMOS and Bipolar Technologies sponsored by Texas Higher Education Coordinating Board - $135,920 PIThis is a transfer of grant from SMU.The grant started onJanuary 1, 2002. The research objectives fo this proposal address each one of the problems outlined in the proposal. We will: (1) Fully characterize the low-frequency noise behavior of advanced bipolar devices, (2) Based on obrtained data, identify and analyze the mechanisms leading to Random telegraph signals (both simple and complex) and 1/f noise in these technologies. (3) Develop scalable, compact noise models for bipolar, CMOS and BICMOS technologies that will be incorporated into existing free-domain modeling software such as BSIM, VBIC and MEXTRAM. The project is in collaboration with TI, Motorola, ST-Microelectronics and Legerity.read more...
Courses
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EE 5344-001INTRODUCTION TO MICROELECTROMECHANICAL SYSTEMS (MEMS) AND DEVICESThis course develops the basics for microelectromechanical devices and systems including microactuators, microsensors, and micromotors, principles of operation, different micromachining techniques (surface and bulk micromachining), IC-derived microfabrication techniques, thin-film technologies as they apply to MEMS.
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EE 5343-001SILICON INTEGRATED CIRCUIT FABRICATION TECHNOLOGYCourse comprises of lectures and labs. Introduction to the basic steps and processes of fabricating integrated circuit semiconductor devices: crystal growth (thin film and bulk), thermal oxidation, dopant diffusion/implantation, thin film deposition/etching, and lithography. Introduction to process simulators, such as SUPREM. Fabrication and characterization of resistors, MOS capacitors, junction diodes and MOSFET devices.
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EE 5343-002SILICON INTEGRATED CIRCUIT FABRICATION TECHNOLOGYCourse comprises of lectures and labs. Introduction to the basic steps and processes of fabricating integrated circuit semiconductor devices: crystal growth (thin film and bulk), thermal oxidation, dopant diffusion/implantation, thin film deposition/etching, and lithography. Introduction to process simulators, such as SUPREM. Fabrication and characterization of resistors, MOS capacitors, junction diodes and MOSFET devices.
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EE 5343-001SILICON INTEGRATED CIRCUIT FABRICATION TECHNOLOGYCourse comprises of lectures and labs. Introduction to the basic steps and processes of fabricating integrated circuit semiconductor devices: crystal growth (thin film and bulk), thermal oxidation, dopant diffusion/implantation, thin film deposition/etching, and lithography. Introduction to process simulators, such as SUPREM. Fabrication and characterization of resistors, MOS capacitors, junction diodes and MOSFET devices.
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EE 5343-002SILICON INTEGRATED CIRCUIT FABRICATION TECHNOLOGYCourse comprises of lectures and labs. Introduction to the basic steps and processes of fabricating integrated circuit semiconductor devices: crystal growth (thin film and bulk), thermal oxidation, dopant diffusion/implantation, thin film deposition/etching, and lithography. Introduction to process simulators, such as SUPREM. Fabrication and characterization of resistors, MOS capacitors, junction diodes and MOSFET devices.
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EE 5343-102SILICON INTEGRATED CIRCUIT FABRICATION TECHNOLOGYCourse comprises of lectures and labs. Introduction to the basic steps and processes of fabricating integrated circuit semiconductor devices: crystal growth (thin film and bulk), thermal oxidation, dopant diffusion/implantation, thin film deposition/etching, and lithography. Introduction to process simulators, such as SUPREM. Fabrication and characterization of resistors, MOS capacitors, junction diodes and MOSFET devices.
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EE 5343-101SILICON INTEGRATED CIRCUIT FABRICATION TECHNOLOGYCourse comprises of lectures and labs. Introduction to the basic steps and processes of fabricating integrated circuit semiconductor devices: crystal growth (thin film and bulk), thermal oxidation, dopant diffusion/implantation, thin film deposition/etching, and lithography. Introduction to process simulators, such as SUPREM. Fabrication and characterization of resistors, MOS capacitors, junction diodes and MOSFET devices.
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EE 5344-001INTRODUCTION TO MICROELECTROMECHANICAL SYSTEMS (MEMS) AND DEVICESThis course develops the basics for microelectromechanical devices and systems including microactuators, microsensors, and micromotors, principles of operation, different micromachining techniques (surface and bulk micromachining), IC-derived microfabrication techniques, thin-film technologies as they apply to MEMS.
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EE 5344-002INTRODUCTION TO MICROELECTROMECHANICAL SYSTEMS (MEMS) AND DEVICESThis course develops the basics for microelectromechanical devices and systems including microactuators, microsensors, and micromotors, principles of operation, different micromachining techniques (surface and bulk micromachining), IC-derived microfabrication techniques, thin-film technologies as they apply to MEMS.
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EE 5344-001INTRODUCTION TO MICROELECTROMECHANICAL SYSTEMS (MEMS) AND DEVICESNo Description Provided. -
EE 5344-001INTRODUCTION TO MICROELECTROMECHANICAL SYSTEMS (MEMS) AND DEVICESNo Description Provided.
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Other Service Activities
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Uncategorized
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Dec Membership1988, 1989 IEEE-IEDM's and Annual Symposia on Electronic Materials, Processing and Characterization (1989 - 1992) and International Conference on Noise in Physical Systems and 1/f Fluctuations (1993, 1999, 2001, 2003); General Chair of TEXMEMS II Workshop
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